CN104604352B - 具有热沉施压装置的机顶盒 - Google Patents
具有热沉施压装置的机顶盒 Download PDFInfo
- Publication number
- CN104604352B CN104604352B CN201380046619.XA CN201380046619A CN104604352B CN 104604352 B CN104604352 B CN 104604352B CN 201380046619 A CN201380046619 A CN 201380046619A CN 104604352 B CN104604352 B CN 104604352B
- Authority
- CN
- China
- Prior art keywords
- heat sink
- spring
- circuit board
- conducting strip
- underframe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
Claims (6)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261698077P | 2012-09-07 | 2012-09-07 | |
US61/698,077 | 2012-09-07 | ||
PCT/US2013/051624 WO2014039173A1 (en) | 2012-09-07 | 2013-07-23 | Set top box having heat sink pressure applying means |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104604352A CN104604352A (zh) | 2015-05-06 |
CN104604352B true CN104604352B (zh) | 2016-11-30 |
Family
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5758634Y2 (zh) * | 1978-11-09 | 1982-12-15 | ||
JPH08161067A (ja) * | 1994-11-30 | 1996-06-21 | Nissin Kogyo Kk | 操作レバーの支持構造 |
US6226184B1 (en) * | 1999-10-22 | 2001-05-01 | Sun Microsystems, Inc. | Enclosure mounted heat sink |
JP2003157646A (ja) * | 2001-04-05 | 2003-05-30 | Fuji Photo Film Co Ltd | 磁気テープカセットおよびこれに用いるテープリールならびに樹脂製板ばねおよびその製造方法 |
CN1826046A (zh) * | 2005-02-23 | 2006-08-30 | 株式会社东芝 | 用于电子设备的散热装置 |
CN102438432A (zh) * | 2011-11-15 | 2012-05-02 | 华为终端有限公司 | 芯片散热装置及电子设备 |
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5758634Y2 (zh) * | 1978-11-09 | 1982-12-15 | ||
JPH08161067A (ja) * | 1994-11-30 | 1996-06-21 | Nissin Kogyo Kk | 操作レバーの支持構造 |
US6226184B1 (en) * | 1999-10-22 | 2001-05-01 | Sun Microsystems, Inc. | Enclosure mounted heat sink |
JP2003157646A (ja) * | 2001-04-05 | 2003-05-30 | Fuji Photo Film Co Ltd | 磁気テープカセットおよびこれに用いるテープリールならびに樹脂製板ばねおよびその製造方法 |
CN1826046A (zh) * | 2005-02-23 | 2006-08-30 | 株式会社东芝 | 用于电子设备的散热装置 |
CN102438432A (zh) * | 2011-11-15 | 2012-05-02 | 华为终端有限公司 | 芯片散热装置及电子设备 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190522 Address after: France Patentee after: Interactive Digital CE Patent Holding Company Address before: I Si Eli Murli Nor, France Patentee before: Thomson Licensing SA |
|
TR01 | Transfer of patent right |
Effective date of registration: 20201222 Address after: Fa Guobali Patentee after: Interactive Digital Madison Patent Holdings Address before: Fa Guobali Patentee before: Interactive Digital CE Patent Holding Co. |