CN104593843B - Chip multilayer ceramic capacitor electroplates normal temperature pre-treating method - Google Patents
Chip multilayer ceramic capacitor electroplates normal temperature pre-treating method Download PDFInfo
- Publication number
- CN104593843B CN104593843B CN201510081684.7A CN201510081684A CN104593843B CN 104593843 B CN104593843 B CN 104593843B CN 201510081684 A CN201510081684 A CN 201510081684A CN 104593843 B CN104593843 B CN 104593843B
- Authority
- CN
- China
- Prior art keywords
- multilayer ceramic
- ceramic capacitor
- chip multilayer
- normal temperature
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 18
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000002203 pretreatment Methods 0.000 abstract description 9
- 238000009713 electroplating Methods 0.000 abstract description 7
- 238000007747 plating Methods 0.000 abstract description 5
- 238000010304 firing Methods 0.000 abstract description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- 230000004913 activation Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid group Chemical class S(N)(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 3
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910000403 monosodium phosphate Inorganic materials 0.000 description 2
- 235000019799 monosodium phosphate Nutrition 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- PSDYQSWHANEKRV-UHFFFAOYSA-N [S]N Chemical compound [S]N PSDYQSWHANEKRV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
Abstract
The invention discloses a kind of chip multilayer ceramic capacitor plating normal temperature pre-treating method, it under normal temperature condition, is processed chip multilayer ceramic capacitor before the flow for entering electronickelling using sulfamic acid.The present invention carries out pre-treatment using a kind of new pre-treatment formula to chip multilayer ceramic capacitor, simplify the technological process of chip multilayer ceramic capacitor pre-electroplating treatment, firing equipment need not be used, makes chip multilayer ceramic capacitor pre-electroplating treatment operation more convenient and quicker.
Description
Technical field
The present invention relates to field of electroplating, and in particular to a kind of chip multilayer ceramic capacitor electroplates normal temperature pre-treating method.
Background technology
Present chip multilayer ceramic capacitor (MLCC) electroplating technology is generally comprised：Pre-treatment, electronickelling, electrotinning, after
Treatment.And electronic component pre-treatment typically now includes 2 steps of oil removing and activation, wherein oil removing is at 50 DEG C -55 DEG C
Under conditions of, clean chip multilayer ceramic capacitor 3-5 minutes using the sodium dihydrogen phosphate of 30g/L；Activation is in normal temperature
In the case of clean chip multilayer ceramic capacitor 2-3 minutes using the ammonium chloride solution of 30Gg/L, subsequently into electronickelling work
Skill.Not only technique is cumbersome for existing chip multilayer ceramic capacitor pre-treatment, and operation difficulty is big, equipment requirement is high.
The content of the invention
It is an object of the invention to provide a kind of chip multilayer ceramic capacitor plating normal temperature pre-treating method, which simplify piece
The pre-treating technology of formula multilayer ceramic capacitor, pre-treatment does not need 2 steps, it is not necessary to heat, convenient and swift.
The object of the present invention is achieved like this：A kind of chip multilayer ceramic capacitor electroplates normal temperature pre-treating method, its
It is characterised by：Enter electronickelling flow before, under normal temperature condition, using sulfamic acid to chip multilayer ceramic capacitor at
Reason.
The concentration of described sulfamic acid is 4-6wt%.
Described process time is 1-3 minutes.
The present invention carries out pre-treatment using a kind of new pre-treatment formula to chip multilayer ceramic capacitor, simplifies piece
The technological process of formula multilayer ceramic capacitor pre-electroplating treatment, it is not necessary to use firing equipment, make chip multilayer ceramic capacitor
Pre-electroplating treatment operation more convenient and quicker.
Specific embodiment
The present invention is a kind of chip multilayer ceramic capacitor plating normal temperature pre-treating method, and it is entering the flow of electronickelling
Before, under normal temperature condition, using sulfamic acid to chip multilayer ceramic capacitor treatment.Preferably, described amino sulphur
The concentration of acid is 4-6wt%.Preferably, described process time is 1-3 minutes.
Embodiment 1
Before the flow for entering electronickelling, under normal temperature condition, using 4wt% sulfamic acids to sheet type multi-layer ceramic capacitance
Device is processed 3 minutes.
Embodiment 2
Before the flow for entering electronickelling, under normal temperature condition, using 5wt% sulfamic acids to sheet type multi-layer ceramic capacitance
Device is processed 2 minutes.
Embodiment 3
Before the flow for entering electronickelling, under normal temperature condition, using 6wt% sulfamic acids to sheet type multi-layer ceramic capacitance
Device is processed 2 minutes.
Comparative example
Electronic component pre-treatment include oil removing and activation 2 steps, wherein oil removing be under conditions of 50 DEG C -55 DEG C,
Chip multilayer ceramic capacitor is cleaned using the sodium dihydrogen phosphate of 30g/L 3-5 minutes；Activation is made in the case of normal temperature
Cleaned with the ammonium chloride solution of 30Gg/L chip multilayer ceramic capacitor 2-3 minutes, subsequently into electro-nickel process.
Experimental data：
Using 6 batch chip multilayer ceramic capacitors, embodiment 2 is respectively adopted and comparative example method is processed, then
The step such as nickel plating, tin plating is carried out using same process, each experimental data of products obtained therefrom is shown in Table 1.
Table 1.
This invention simplifies the technological process of chip multilayer ceramic capacitor pre-electroplating treatment, it is not necessary to set using heating
It is standby, but the performance of electroplated product coating is equally reached technical requirements.
Claims (1)
1. a kind of chip multilayer ceramic capacitor electroplates normal temperature pre-treating method, it is characterised in that：Entering the flow of electronickelling
Before, under normal temperature condition, using sulfamic acid to chip multilayer ceramic capacitor treatment, the concentration of described sulfamic acid
It is 4-6wt%, process time is 1-3 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510081684.7A CN104593843B (en) | 2015-02-04 | 2015-02-04 | Chip multilayer ceramic capacitor electroplates normal temperature pre-treating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510081684.7A CN104593843B (en) | 2015-02-04 | 2015-02-04 | Chip multilayer ceramic capacitor electroplates normal temperature pre-treating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104593843A CN104593843A (en) | 2015-05-06 |
| CN104593843B true CN104593843B (en) | 2017-06-30 |
Family
ID=53119886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510081684.7A Active CN104593843B (en) | 2015-02-04 | 2015-02-04 | Chip multilayer ceramic capacitor electroplates normal temperature pre-treating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104593843B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111041531A (en) * | 2019-11-28 | 2020-04-21 | 广东羚光新材料股份有限公司 | Capacitor nickel electroplating solution, electroplating method and application |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101906635A (en) * | 2010-07-23 | 2010-12-08 | 上海电力学院 | Carbon steel sulfamic acid pickling compound corrosion inhibitor and preparation method thereof |
| CN103484909A (en) * | 2013-10-08 | 2014-01-01 | 昆山纯柏精密五金有限公司 | Pretreatment method for iron-based hardware electroplating |
| CN103540969A (en) * | 2012-07-12 | 2014-01-29 | 上海中劢磁业有限公司 | Method for improving surface of iron-boron permanent magnet material |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7037405B2 (en) * | 2003-05-14 | 2006-05-02 | International Paper Company | Surface treatment with texturized microcrystalline cellulose microfibrils for improved paper and paper board |
| KR101472634B1 (en) * | 2012-10-29 | 2014-12-15 | 삼성전기주식회사 | Metal nano particle, and method for surface treating the same |
-
2015
- 2015-02-04 CN CN201510081684.7A patent/CN104593843B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101906635A (en) * | 2010-07-23 | 2010-12-08 | 上海电力学院 | Carbon steel sulfamic acid pickling compound corrosion inhibitor and preparation method thereof |
| CN103540969A (en) * | 2012-07-12 | 2014-01-29 | 上海中劢磁业有限公司 | Method for improving surface of iron-boron permanent magnet material |
| CN103484909A (en) * | 2013-10-08 | 2014-01-01 | 昆山纯柏精密五金有限公司 | Pretreatment method for iron-based hardware electroplating |
Non-Patent Citations (1)
| Title |
|---|
| 片式叠层陶瓷电容器（MLCC）中纯锡可焊镀层的研究;娄红涛;《广东技术师范学院学报（自然科学）》;20140731(第7期);第16-18,51页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104593843A (en) | 2015-05-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG11201806156VA (en) | Alternating current motor controller, laminated busbar assembly and manufacturing method thereof | |
| CN104593843B (en) | Chip multilayer ceramic capacitor electroplates normal temperature pre-treating method | |
| CN204727953U (en) | A kind of useless tin Water Sproading recycles production line | |
| EP2597670A3 (en) | Method for permanently connecting two metal surfaces | |
| CN104599845A (en) | Production method of low voltage aluminum anode foil for electrolytic condenser | |
| CN102230177A (en) | Magnesium alloy stripping solution and its stripping method | |
| CN108315791A (en) | A kind of electronic connector electroplating technology | |
| CN105671541A (en) | Stainless steel passivating technique | |
| CN103646793B (en) | A kind of ageing method that improves solid electrolyte Ta capacitor breakdown voltage | |
| AT520249A5 (en) | Method for producing a conductive multi-substrate stack | |
| CN210432096U (en) | Chip component and surface treatment system thereof | |
| CN105648488A (en) | Tin-lead plating process | |
| CN208549060U (en) | Pcb board etching machine | |
| CN108866550B (en) | Process flow for manufacturing electrolytic copper foil by using internal circulation etching solution | |
| CN110938091A (en) | High-efficiency extraction method of egg yolk lecithin | |
| CN104888536A (en) | Metal sintered mesh filter element | |
| CN109321350A (en) | A kind of method of additive in removing waste lubricating oil | |
| CN105499929B (en) | Processing method before compressor supporting plate punching press | |
| CN109023330A (en) | A kind of process of precision copper piece passivation | |
| KR101472634B1 (en) | Metal nano particle, and method for surface treating the same | |
| CN205569792U (en) | Outer heating device of high temperature negative pressure rectifying still | |
| CN109623264A (en) | A kind of process for processing PVDF, VIRGIN material parts | |
| CN107916425A (en) | A kind of hydraulic tube piece anti-corrosive technology | |
| MX2018010248A (en) | Conveyor frame treatment for suppressing phosphate dragging resulting from the plant design in a dip coating process sequence. | |
| CN110267456A (en) | A kind of chemical pre-processing method for wiring board production internal layer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Normal temperature pretreatment method for electroplating chip multilayer ceramic capacitor Effective date of registration: 20200426 Granted publication date: 20170630 Pledgee: China Co. truction Bank Corp Zhaoqing branch Pledgor: GUANGDONG LINGGUANG NEW MATERIAL Co.,Ltd. Registration number: Y2020440000098 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20170630 Pledgee: China Co. truction Bank Corp Zhaoqing branch Pledgor: GUANGDONG LINGGUANG NEW MATERIAL Co.,Ltd. Registration number: Y2020440000098 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |