CN104589761A - Method for realizing permanent bonding between silicone rubber membrane and metal titanium Ti layer - Google Patents
Method for realizing permanent bonding between silicone rubber membrane and metal titanium Ti layer Download PDFInfo
- Publication number
- CN104589761A CN104589761A CN201410843556.7A CN201410843556A CN104589761A CN 104589761 A CN104589761 A CN 104589761A CN 201410843556 A CN201410843556 A CN 201410843556A CN 104589761 A CN104589761 A CN 104589761A
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- CN
- China
- Prior art keywords
- silicone rubber
- rubber membrane
- layer
- metal
- titanium
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
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- Laminated Bodies (AREA)
Abstract
The invention discloses a method for realizing permanent bonding between a silicone rubber membrane and a metal titanium Ti layer. The method comprises the following steps: adding a clean silicone rubber membrane and a metal Ti layer into a reactive ion etching machine, and performing etching processing on the surfaces of the silicone rubber membrane and the metal Ti layer by adopting oxygen plasma; attaching the etched surface of the etched silicone rubber membrane and the etched surface of the metal Ti layer together; performing heating treatment on the silicone rubber membrane and the metal Ti layer which are attached together in a drying oven; taking the silicone rubber membrane and metal Ti out of the drying oven after the heating operation is finished, thereby finishing permanent bonding between the silicone rubber membrane and the metal Ti. According to the bonding method provided by the invention, an extra adhesive is not needed; only the silicone rubber membrane and the Ti layer need to be subjected to surface treatment, namely reactive ion etching and are attached together, and finally the silicone rubber membrane and the Ti layer are subjected to heating treatment.
Description
[technical field]
The invention belongs to materials processing technology field, particularly a kind of method of silicone rubber membrane simply and easily and Titanium Ti layer permanent bond.
[background technology]
Silicon rubber, such as polydimethylsiloxane rubber PDMS, have a lot of outstanding advantages, as the high grade of transparency and pliability, wide operating temperature range (-50 DEG C---200 DEG C) and the strong tolerance level etc. to soda acid.These advantages make it can be used widely in micro-system and flexible electronic device.But the surface energy of silicon rubber is very low causes silicone rubber membrane and other inorganic material, and especially the adhesive property of metal material is very poor.The main bonding adopting binding agent to carry out silicone rubber membrane and metal at present, but its bond effect is poor, intensity is low, causes silicone rubber membrane and metal to be easy to come off.
[summary of the invention]
The object of the invention is to propose one silicone rubber membrane and Titanium Ti layer adhesive method simply and easily, the permanent adhesive of high strength can be formed between silicone rubber membrane and metal Ti, its adhesion strength depends on the tearing strength of silicone rubber membrane, and namely the damage of tack coat only just there will be after silicone rubber membrane is destroyed.
To achieve these goals, the present invention has following beneficial effect:
A kind of method realizing silicone rubber membrane and Titanium Ti layer permanent bond, comprise the following steps: the silicone rubber membrane of cleaning, metal Ti layer are put into reactive ion etching machine, adopt the surface of oxygen gas plasma to silicone rubber membrane, metal Ti layer to carry out lithography; The etched surface of silicone rubber membrane after etching and the etched surface of metal Ti layer are fit together; Then the silicone rubber membrane fit together and metal Ti are put into baking oven to heat; After having heated, take out silicone rubber membrane and metal Ti from baking oven, complete the permanent bond of silicone rubber membrane and metal Ti.
Preferably, silicone rubber membrane cleans by the following method to cleaning: silicone rubber membrane is put into acetone, ethanol and deionized water solution successively respectively, and adopt the surface of mode to silicone rubber membrane of ultrasonic cleaning to clean, each ultrasonic time is 10 minutes; After end, clean nitrogen is adopted to be dried up by silicone rubber membrane.
Preferably, metal Ti layer cleans by the following method to cleaning: metal Ti layer is put into acetone, ethanol and deionized water solution successively respectively, and adopt the surface of mode to Ti layer of ultrasonic cleaning to clean, each ultrasonic time can be 10 minutes; After end, clean nitrogen is adopted to be dried up by metal Ti layer.
Preferably, described silicone rubber membrane is PDMS film.
Preferably, in etching process, the power of etching machine is 1W-600W, oxygen pressure is 10Pa-1000Pa, etch period is 10-600S.
Preferably, in baking oven is 80 DEG C-160 DEG C, and heat treatment time is 40 minutes-100 minutes.
Relative to prior art, the present invention has following beneficial effect: the adhesive method that the present invention proposes does not need extra binding agent, only needing to carry out surface treatment to silicone rubber membrane and Ti layer---then they are fit together by reactive ion etching, finally carry out heating.
[accompanying drawing explanation]
Fig. 1 is the manufacturing process flow diagram of silicone rubber membrane and Titanium Ti layer permanent bond.
[detailed description of the invention]
Refer to shown in Fig. 1, a kind of method realizing silicone rubber membrane and Titanium Ti layer permanent bond of the present invention, comprises the following steps:
(1) silicone rubber membrane (as polydimethylsiloxane rubber PDMS film) is put into acetone, ethanol and deionized water solution (three kinds of solution can be commercially available) successively respectively, adopt the surface of mode to silicone rubber membrane of ultrasonic cleaning to clean, each ultrasonic time can be 10 minutes.After end, clean nitrogen is adopted to be dried up by silicone rubber membrane;
(2) metal Ti layer (the Ti film as commercially available metal Ti plate or deposition) is put into acetone, ethanol and deionized water solution (three kinds of solution can be commercially available) successively respectively, adopt the surface of mode to Ti layer of ultrasonic cleaning to clean, each ultrasonic time can be 10 minutes.After end, clean nitrogen is adopted to be dried up by metal Ti layer;
(3) silicone rubber membrane after cleaning, metal Ti layer are put into reactive ion etching machine (commercially available), adopt the surface of oxygen gas plasma to silicone rubber membrane, metal Ti layer to carry out lithography.In etching process, power can 1W-600W, oxygen pressure can at 10Pa-1000Pa, etch period can at 10S-600S;
(4) silicone rubber membrane after etching and metal Ti laminating are combined, note making their etched surface bonded to each other.
(5) silicone rubber membrane fit together and metal Ti are put into baking oven to heat, heating-up temperature is 80 DEG C-160 DEG C, and the heat time is 40 minutes-100 minutes.
(6), after having heated, take out silicone rubber membrane and metal Ti from baking oven, now both completed the permanent bond of silicone rubber membrane and metal Ti.
Claims (6)
1. one kind realizes the method for silicone rubber membrane and Titanium Ti layer permanent bond, it is characterized in that, comprise the following steps: the silicone rubber membrane of cleaning, metal Ti layer are put into reactive ion etching machine, adopt the surface of oxygen gas plasma to silicone rubber membrane, metal Ti layer to carry out lithography; The etched surface of silicone rubber membrane after etching and the etched surface of metal Ti layer are fit together; Then the silicone rubber membrane fit together and metal Ti are put into baking oven to heat; After having heated, take out silicone rubber membrane and metal Ti from baking oven, complete the permanent bond of silicone rubber membrane and metal Ti.
2. a kind of method realizing silicone rubber membrane and Titanium Ti layer permanent bond according to claim 1, it is characterized in that, silicone rubber membrane cleans by the following method to cleaning: silicone rubber membrane is put into acetone, ethanol and deionized water solution successively respectively, adopt the surface of mode to silicone rubber membrane of ultrasonic cleaning to clean, each ultrasonic time is 10 minutes; After end, clean nitrogen is adopted to be dried up by silicone rubber membrane.
3. a kind of method realizing silicone rubber membrane and Titanium Ti layer permanent bond according to claim 1, it is characterized in that, metal Ti layer cleans by the following method to cleaning: metal Ti layer is put into acetone, ethanol and deionized water solution successively respectively, adopt the surface of mode to Ti layer of ultrasonic cleaning to clean, each ultrasonic time can be 10 minutes; After end, clean nitrogen is adopted to be dried up by metal Ti layer.
4. a kind of method realizing silicone rubber membrane and Titanium Ti layer permanent bond according to claim 1, it is characterized in that, described silicone rubber membrane is PDMS film.
5. a kind of method realizing silicone rubber membrane and Titanium Ti layer permanent bond according to claim 1, is characterized in that, in etching process, the power of etching machine is 1W-600W, oxygen pressure is 10Pa-1000Pa, etch period is 10-600S.
6. a kind of method realizing silicone rubber membrane and Titanium Ti layer permanent bond according to claim 1, it is characterized in that, in baking oven is 80 DEG C-160 DEG C, and heat treatment time is 40 minutes-100 minutes.
Priority Applications (1)
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CN201410843556.7A CN104589761A (en) | 2014-12-30 | 2014-12-30 | Method for realizing permanent bonding between silicone rubber membrane and metal titanium Ti layer |
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CN201410843556.7A CN104589761A (en) | 2014-12-30 | 2014-12-30 | Method for realizing permanent bonding between silicone rubber membrane and metal titanium Ti layer |
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CN201410843556.7A Pending CN104589761A (en) | 2014-12-30 | 2014-12-30 | Method for realizing permanent bonding between silicone rubber membrane and metal titanium Ti layer |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109571855A (en) * | 2018-10-29 | 2019-04-05 | 歌尔股份有限公司 | A kind of preparation method and injection mold of inserts fixing tool |
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CN1693183A (en) * | 2005-06-09 | 2005-11-09 | 上海交通大学 | Method for mfg. single sheet pneumatic gel mini valve |
CN101488435A (en) * | 2008-01-18 | 2009-07-22 | 西安东旺精细化学有限公司 | Production and installation method for graphite composite sheet |
CN102190283A (en) * | 2010-03-12 | 2011-09-21 | 国家纳米技术与工程研究院 | Microfluidic chip preparation method capable of realizing microsphere discretization |
CN103023371A (en) * | 2012-12-10 | 2013-04-03 | 北京大学 | Micro-nano integrated generator and manufacturing method thereof |
US20130137169A1 (en) * | 2011-11-28 | 2013-05-30 | Sony Corporation | Microchip and method of producing the same |
-
2014
- 2014-12-30 CN CN201410843556.7A patent/CN104589761A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1693183A (en) * | 2005-06-09 | 2005-11-09 | 上海交通大学 | Method for mfg. single sheet pneumatic gel mini valve |
CN101488435A (en) * | 2008-01-18 | 2009-07-22 | 西安东旺精细化学有限公司 | Production and installation method for graphite composite sheet |
CN102190283A (en) * | 2010-03-12 | 2011-09-21 | 国家纳米技术与工程研究院 | Microfluidic chip preparation method capable of realizing microsphere discretization |
US20130137169A1 (en) * | 2011-11-28 | 2013-05-30 | Sony Corporation | Microchip and method of producing the same |
CN103023371A (en) * | 2012-12-10 | 2013-04-03 | 北京大学 | Micro-nano integrated generator and manufacturing method thereof |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109571855A (en) * | 2018-10-29 | 2019-04-05 | 歌尔股份有限公司 | A kind of preparation method and injection mold of inserts fixing tool |
CN109571855B (en) * | 2018-10-29 | 2020-12-01 | 歌尔光学科技有限公司 | Preparation method of insert fixing tool and injection mold |
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