CN104588810A - Welding method of aluminum target assembly - Google Patents
Welding method of aluminum target assembly Download PDFInfo
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- CN104588810A CN104588810A CN201310529667.6A CN201310529667A CN104588810A CN 104588810 A CN104588810 A CN 104588810A CN 201310529667 A CN201310529667 A CN 201310529667A CN 104588810 A CN104588810 A CN 104588810A
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- Prior art keywords
- aluminium
- solder
- welded
- target
- backboard
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/021—Isostatic pressure welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
- B23K20/026—Thermo-compression bonding with diffusion of soldering material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/14—Preventing or minimising gas access, or using protective gases or vacuum during welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
- B23K20/2336—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer both layers being aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/24—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention provides a welding method of an aluminum target assembly. The welding method comprises the steps that an aluminum target and an aluminum back plate are provided; a brazing filler metal wetting layer is formed on the surface, to be welded, of the aluminum target or the surface, to be welded, of the aluminum back plate; the aluminum back plate and the aluminum target with the formed brazing filler metal wetting layer are placed in a vacuum packaging sleeve, and the surface, to be welded, of the aluminum back plate makes contact with the brazing filler metal wetting layer, or, the aluminum target and the aluminum back plate with the formed brazing filler metal wetting layer are placed in the vacuum packaging sleeve, and the surface, to be welded, of the aluminum target makes contact with the brazing filler metal wetting layer; the aluminum target, the brazing filler metal wetting layer and the aluminum back plate are welded together through a hot isostatic pressing technology so as to form the aluminum target assembly; after welding is accomplished, the vacuum packaging sleeve is cooled and removed to obtain the aluminum target assembly. By means of the welding method, welding between the aluminum target and the aluminum back plate can be achieved, the welding efficiency is high, the formed aluminum target assembly is high in welding strength and low in deformation, and the demand of long-term stable production and usage of targets can be met.
Description
Technical field
The present invention relates to semiconductor sputtering target material and manufacture field, particularly relate to a kind of welding method of aluminium target material assembly.
Background technology
In the semiconductor industry, target material assembly is made up of the target meeting sputtering performance, the backboard that is combined with target.Backboard plays a supportive role in target material assembly, and has effect of heat conduction.
In sputter procedure, the working environment residing for target material assembly is more severe.Be specially: the environment temperature residing for target material assembly is higher, such as 300 DEG C to 600 DEG C; In addition, a side blow of target material assembly is cold by force with cooling water, and opposite side is then in 10
-9under the high vacuum environment of Pa, therefore form huge pressure differential in relative two sides of target material assembly; Moreover target material assembly is in high voltage electric field, magnetic field, can be subject to the bombardment of various particle.Under rugged environment like this, if the weld strength in target material assembly between target and backboard is poor, target will be caused to be out of shape under heating condition, ftracture, make sputtering cannot reach the uniform effect of sputtering, time serious, target can come off in backboard and cause damage to sputtering base station.
For the target material assembly be made up of aluminium target and aluminium backboard, in prior art, conventional soldering processes realize welding of aluminium target and aluminium backboard, but even if aluminium target and aluminium backboard are also very easily oxidized at normal temperature, can form fine and close pellumina on the surface of aluminium target and aluminium backboard.When welding above-mentioned aluminium target and aluminium backboard formation target material assembly by existing welding method, welding efficiency is low, and the weld strength of the target material assembly of formation is low, deflection is large.If when aluminium target and aluminium backboard are oxidized serious, welding even cannot be realized, the needs produced and use aluminium target material assembly steady in a long-term therefore can not be met.
Summary of the invention
When the technical problem to be solved in the present invention is with existing welding method welding of aluminum target and aluminium backboard, welding efficiency is low, the weld strength of the target material assembly formed is low, deflection large, even cannot realize welding, therefore can not meet the needs produced and use aluminium target material assembly steady in a long-term.
For solving the problems of the technologies described above, the invention provides a kind of welding method of aluminium target material assembly, comprising following methods step:
Aluminium target, aluminium backboard are provided;
The junction to be welded of described aluminium target is formed solder soakage layer or form solder soakage layer in the junction to be welded of described aluminium backboard;
Be placed in vacuum canning by aluminium backboard, the aluminium target that is formed with solder soakage layer, the junction to be welded of described aluminium backboard contacts with described solder soakage layer, or,
Be placed in vacuum canning by aluminium target, the aluminium backboard that is formed with solder soakage layer, the junction to be welded of described aluminium target contacts with described solder soakage layer;
Heat and other static pressuring processes is utilized described aluminium target, solder soakage layer, aluminium backboard to be welded together to form aluminium target material assembly;
After having welded, described vacuum canning is cooled, remove described vacuum canning to obtain described aluminium target material assembly.
Optionally, described solder is for containing tin solder.
Optionally, described aluminium backboard, the aluminium target that is formed with solder soakage layer are placed in vacuum canning before further comprising the steps of:
Adopt the to be welded junction of method to described aluminium backboard of machining to carry out patterned process and form bulge-structure.
Optionally, be formed in the aluminium target of solder soakage layer described in described bulge-structure insertion.
Optionally, the thickness of described solder soakage layer is for being greater than 0 micron and being less than or equal to 10 microns.
Optionally, the step that aluminium target, solder soakage layer, aluminium backboard weld together comprises by the described heat and other static pressuring processes that utilizes:
Make inside be provided with described aluminium target, solder soakage layer, aluminium backboard the ambient temperature of vacuum canning be 200 DEG C ~ 300 DEG C, external environment condition pressure is for being more than or equal to 100Mpa;
The described vacuum canning be positioned under described environment temperature, environmental stress is incubated, pressurize 2 ~ 5 hours, so that described aluminium target, solder soakage layer, aluminium backboard are welded together.
Optionally, described vacuum canning is that the aluminum welding being 1.0mm ~ 3.0mm by thickness is formed;
After described aluminium target, solder soakage layer, aluminium backboard are placed in vacuum canning, described vacuum canning are evacuated to vacuum and are at least 10
-3pa, more described vacuum canning is sealed.
Optionally, before being placed in vacuum canning after forming described bulge-structure, by described aluminium backboard, the aluminium target that is formed with solder soakage layer, cleaning treatment is carried out to the junction to be welded of described aluminium backboard.
Compared with prior art, the advantage of technical scheme of the present invention is:
Whole welding process can be made to carry out under vacuum conditions by arranging of vacuum canning, thus prevent the surface of aluminium target and aluminium backboard oxidized, and, in welding process, the junction to be welded of aluminium target is formed solder soakage layer or form solder soakage layer in the junction to be welded of described backboard, be easy to realize the junction to be welded of aluminium target or the wetting of aluminium backboard junction to be welded, thus the diffusion of aluminium atom and aluminium atom can be realized.Therefore, technical scheme of the present invention can not only realize welding of aluminium target and aluminium backboard, and welding efficiency is higher, and the aluminium target material assembly that welding is formed has higher weld strength; In addition, solder soakage layer can also be avoided or reduce welding stress, the aluminium target material assembly of formation is not easily out of shape and can meets the needs produced and use aluminium target material assembly steady in a long-term.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the welding method of the aluminium target material assembly of the specific embodiment of the invention;
Fig. 2 is the structural representation of the aluminium target material assembly part of embodiments of the invention one;
Fig. 3 is the plane enlarged diagram of the thread pattern that the junction to be welded of the aluminium backboard of the embodiment of the present invention one is formed;
Fig. 4 is the cross section enlarged diagram of Fig. 3 along AA direction;
Fig. 5 is that the aluminium target material assembly of the embodiment of the present invention one is placed in the schematic diagram carrying out heat and other static pressuring processes in vacuum canning.
Detailed description of the invention
When the technical problem to be solved in the present invention is with existing welding method welding of aluminum target and aluminium backboard, welding efficiency is low, the weld strength of the target material assembly formed is low, deflection large, even cannot realize welding, therefore can not meet the needs produced and use aluminium target material assembly steady in a long-term.
Present invention obtains a kind of welding method of aluminium target material assembly, above-mentioned technical problem can be avoided.
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.Set forth a lot of detail in the following description so that fully understand the present invention, but the present invention can also adopt other to be different from alternate manner described here to implement, therefore the present invention is not by the restriction of following public specific embodiment.
Embodiment one
Fig. 1 is the schematic flow sheet of the welding method of the aluminium target material assembly of the specific embodiment of the invention.Comprise the following steps:
Perform step S11, aluminium target, aluminium backboard are provided;
Perform step S12, the junction to be welded of described aluminium target is formed solder soakage layer or form solder soakage layer in the junction to be welded of described backboard;
Perform step S13, aluminium backboard, the aluminium target that is formed with solder soakage layer are placed in vacuum canning, the junction to be welded of described aluminium backboard contacts with described solder soakage layer, or, be placed in vacuum canning by aluminium target, the aluminium backboard that is formed with solder soakage layer, the junction to be welded of described aluminium target contacts with described solder soakage layer;
Perform step S14, utilize heat and other static pressuring processes described aluminium target, solder soakage layer, aluminium backboard to be welded together to form aluminium target material assembly;
Perform step S15, after having welded, described vacuum canning is cooled, remove described vacuum canning to obtain described aluminium target material assembly.
With reference to figure 2, first, perform step S11, aluminium target 11, aluminium backboard 12 are provided.
In the present embodiment, the purity of aluminium target 11 is at least 99.9995%.According to the actual requirement of applied environment, sputtering equipment, the shape of aluminium target 11 can be cylinder, cuboid, square, cone, and cross section is annular, the cylinder of any one in triangle or other analogous shapes (comprise regular shape and irregularly shaped).Aluminium target 11 in the present embodiment is cylinder.The diameter dimension of aluminium target is the allowance adding 2mm ~ 5mm in design size, and gauge is the allowance adding 1mm ~ 3mm in design size.The object arranging allowance is for aluminium target 11 provides well-to-do processing space to obtain satisfactory aluminium target material assembly in follow-up machining.
In the present embodiment, the material of aluminium backboard 12 is aluminium alloy.Such as, be 6061 aluminium alloys, 5083 aluminium alloys or 2a14 aluminium alloy.Why adopting above-mentioned aluminium alloy as backboard, be because above-mentioned aluminium alloy has enough hardness, intensity, and heat conduction, electric conductivity is also higher, the better performances of the aluminium target material assembly formed with aluminium target, otherwise affects sputter rate.According to the actual requirement of applied environment, sputtering equipment, the shape of described aluminium backboard 12 can be cylinder, cuboid, square, and cross section is annular, the cylinder of any one in triangle or other analogous shapes (comprise regular shape and irregularly shaped).In the present embodiment, the shape of aluminium backboard 12 is cylinder.Aluminium backboard 12 has the groove 121 holding aluminium target 11, and the maximum gauge of aluminium backboard 12 is 2 ~ 4 times of aluminium its thickness, if aluminium backboard 12 is too thin, does not reach support strength; If aluminium backboard 12 is too thick, be not easy to be installed on sputtering base station.The diameter of backboard can add the surplus of 2mm ~ 5mm in design size, and thickness is the surplus adding 1mm ~ 3mm in target size.Increase the object of surplus be to follow-up formation aluminium target material assembly after procedure of processing well-to-do processing space is provided.
Then, perform step S12, the junction to be welded of described aluminium target is formed solder soakage layer or form solder soakage layer in the junction to be welded of described backboard.
Continue with reference to figure 2, described aluminium target 11 comprises junction I to be welded, sputter face III and side IV.Described junction I to be welded is the face that aluminium target 11 will weld with aluminium backboard 12, and sputter face III is the face relative with junction I to be welded, and side IV is the surface between junction I to be welded and sputter face III.
Before the junction to be welded of aluminium target 11 forms solder soakage layer, need to adopt the to be welded junction I of cleaning procedure to described aluminium target 11 to clean, be conducive to forming solder soakage layer on the junction I to be welded of aluminium target 11, otherwise solder can conglobulate in the junction to be welded of aluminium target 11 and be difficult to sprawl and comes.
The concrete steps that the junction I to be welded of aluminium target 11 cleans being comprised: grinding process is carried out to the junction I to be welded of aluminium target 11, for removing the oxide layer of the junction I to be welded of aluminium target 11, and making the junction I to be welded of aluminium target 11 have certain roughness.The junction I to be welded of aluminium target 11 why is made to have the reason of certain roughness as follows: in subsequent technique, one deck solder can be smeared at the junction place to be welded of aluminium target 11, solder can melt through heating, the solder of fusing sucks in aluminium target 11 by capillarity, solder and the aluminium target 11 of fusing soak mutually at junction place to be welded, form solder soakage layer.Coarse junction I to be welded can increase capillarity, aluminium target 11 is strengthened with the wetting effect of solder, can improve the efficiency of subsequent soldering processes, solder bond intensity.Specifically first slightly can polish with the junction I to be welded of 80 order sand paper to aluminium target 11, then adopt the to be welded junction of 800 object sand paper to aluminium target 11 to carry out summary carefully polishing, finally, adopt the to be welded junction of the sand paper of 1000 molybdenums to aluminium target 11 carefully to polish.Can also polish to all surface of aluminium target 11 in bruting process.Then clean the junction I to be welded of aluminium target 11, the present embodiment adopts isopropyl alcohol IPA.Scavenging period is 50min ~ 70min, the pollutant formed during for removing polishing.Vacuum drying chamber inner drying 15min is put into after cleaning.
Continue with reference to figure 2, the junction I to be welded of aluminium target 11 is coated with solder and forms solder soakage layer 110.Specific as follows:
Be placed on by solder on the junction I to be welded of aluminium target 11, then heat aluminium target 11, preferred temperature is 100 DEG C ~ 300 DEG C.Heating-up temperature is higher than the fusing point of solder, and solder can melt, and the solder of fusing sucks in aluminium target 11 by capillarity, and the solder of fusing and aluminium target 11 soak mutually at junction place to be welded, forms solder soakage layer 110.When heating-up temperature is greater than 300 DEG C, the wetting effect of the solder of fusing is very good easily causes brazing filler metal erosion on the contrary, produces corrode phenomenon at the junction I to be welded of aluminium target 11.
Can directly put on heated tray by aluminium target 11, the shape of heated tray be identical with aluminium target 11, is dimensioned slightly smaller than aluminium target 11, and heated tray contacts with the sputter face III of aluminium target 11.Also can put on the pallet of heating cabinet by aluminium target in other embodiments, the shape and size of pallet are now identical with heated tray, the function just do not heated.Described pallet is Steel material, such as mould steel.
On the junction I to be welded of aluminium target 11, add solder, brazing filler metal melts becomes liquid, and liquid solder also can flow down from junction I to be welded, the side IV of aluminium coating target 11, is formed equally be coated with very thin one deck liquid solder at the side IV of aluminium target 11.When the solder flowed down from junction I to be welded soon can not the side IV of aluminium coating target 11 time, need to continue to add solder on junction I to be welded, liquid solder is ceaselessly flowed down from junction I to be welded, the side IV of aluminium coating target 11 can be continued, prevent aluminium target 11 surface oxidized.
The temperature keeping aluminium target 11 to heat is 100 DEG C ~ 300 DEG C, the liquid solder layer rubbed on the junction I to be welded of aluminium target 11 with steel brush 3 ~ 4 times, capillarity can be strengthened, thus the upper speed forming solder soakage layer 110 of the junction I to be welded improving aluminium target 11, and the solder soakage layer 110 that can make formation continuously, smooth surface, thickness are even and internal organizational structure is even.Be specially, the heating-up temperature keeping aluminium target 11 is 100 DEG C ~ 300 DEG C, the bottom surface temperature of the liquid solder layer now contacted with the junction I to be welded of aluminium target 11 is the highest, when adopting steel brush friction liquid solder layer, the bottom surface of the liquid solder layer contacted with the junction I to be welded of aluminium target 11 is dug and is transferred to other position of junction I to be welded, thus heat is passed to other position of liquid solder layer, therefore the effect of stirring liquid solder layer is played in steel brush friction, solder can be made to be fused into liquid state as early as possible, and the homogeneous temperature of whole liquid solder layer, be conducive to strengthening capillarity, form the uniform solder soakage layer 110 of internal organizational structure.The thickness of described solder soakage layer is for being greater than 0 micron and being less than or equal to 10 microns.If solder soakage layer is too thick, unnecessary solder easily flows in jacket in follow-up welding procedure, forms aluminium target, aluminium backboard and welding between jacket.If solder soakage layer is too thin, the weld strength of the aluminium target material assembly of follow-up formation is not high.In addition, in the present embodiment, the method forming solder soakage layer, relative to the soldering of routine, can save the consumption of solder.
In the present embodiment, after the junction I to be welded of aluminium target 11 forms solder soakage layer 110, the solder that aluminium target 11 side IV covers is struck off.Reason is as follows: if not by this position solder strike off, the solder amount of welding with aluminium backboard for aluminium target can be had more than needed, and aluminium target, aluminium backboard easily weld with jacket by this solder more than needed in follow-up welding procedure.
Continue with reference to figure 2, the junction II to be welded of aluminium backboard 12 is the bottom of aluminium backboard 12 groove 121, is equally also the surface will welded with aluminium target 11 junction I to be welded.
Then, the junction to be welded of aluminium backboard 12 is cleaned.Concrete steps comprise:
Grinding process being carried out to the junction II to be welded of aluminium backboard 12, for removing the oxide layer of aluminium backboard 12 junction II to be welded, and making aluminium backboard 12 junction II to be welded have certain roughness.The reason making the junction II to be welded of aluminium backboard 12 have certain roughness is with to make the junction I to be welded of aluminium target 11 have the reason of certain roughness identical.Specifically can with reference to the method for the junction polishing to be welded to aluminium target 11.After polishing, then clean the junction II to be welded of aluminium backboard 12 with alcohol or isopropyl alcohol, cleaning 50min ~ 70min, the pollutant formed during for removing polishing, puts into vacuum drying chamber inner drying 15min after cleaning.
In other embodiments, solder soakage layer can be formed at the junction II to be welded of aluminium backboard 12, now, the junction I to be welded of aluminium target 11 not need form solder soakage layer.Concrete forming process is as follows:
Solder is placed on the junction II to be welded of aluminium backboard 12, then aluminium backboard 12 is heated, made by brazing filler metal melts solder form equally distributed solder soakage layer on the junction II to be welded of aluminium backboard 12.
Carry out heating to aluminium backboard 12 to carry out in ultrasonic welding machine, adopt the built-in heater of ultrasonic welding machine or external heater to heat aluminium backboard 12.Temperature is 100 DEG C ~ 300 DEG C.Heating-up temperature is higher than the fusing point of solder, and solder can melt, and the solder of fusing sucks in aluminium backboard 12 by capillarity, and the solder of fusing and aluminium backboard 12 soak mutually at junction place to be welded, forms solder soakage layer.When heating-up temperature is greater than 300 DEG C, the wetting effect of the solder of fusing is very good easily causes brazing filler metal erosion on the contrary, produces corrode phenomenon at the junction II to be welded of aluminium backboard 12.
The probe of ultrasonic welding machine scans the solder of fusing on the junction II to be welded of aluminium backboard 12, described scanning sequency can from top to bottom, left and right back and forth to cover the solder of whole fusing, thus forms uniform solder soakage layer.Scanning sequency in the present embodiment is not limited to above-mentioned scanning sequency, also can adopt from top to bottom in other embodiments, left and right order back and forth or other order, is not repeated herein, as long as it is just passable to form uniform solder soakage layer.
Ultrasonic wave produces the to be welded junction II of dither wave loops to the aluminium backboard 12 of interpolation solder, the junction acoustic resistance of solder and aluminium backboard 12 is large, localized hyperthermia can be produced, and can not distribute in time, when pressurizeing, liquid solder immerses the junction to be welded of aluminium backboard 12, after ultrasonic wave fails, pressure durations a few second, make the solder coagulation forming entering aluminium backboard 12, thus form solder soakage layer at the junction II to be welded of aluminium backboard 12.In the present embodiment, the power output of the ultrasonic oscillator of ultrasonic welding machine can be arranged on 26KHz to 34KHz, ultrasonic treatment time is 20min ~ 30min, liquid solder can be immersed in aluminium backboard 12 with more effective more fast, good in the performance of the solder soakage layer of the junction II formation to be welded of aluminium backboard 12.
In prior art, even if the surface of aluminium target, aluminium backboard is also easily oxidized at normal temperatures, therefore, when aluminium target welds with aluminium backboard by the method for direct employing soldering, cannot produce capillarity, thus make liquid solder be difficult to mutually soak with aluminium target, aluminium backboard, the weld strength of the aluminium target material assembly therefore adopting the method for prior art to be formed is low, time serious, aluminium target cannot be made to weld with aluminium backboard.And in technical scheme of the present invention, the junction I to be welded of aluminium target 11 or the junction II to be welded of aluminium backboard 12 form solder soakage layer.In follow-up welding procedure, the solder in solder soakage layer can be good at the junction to be welded of wetting aluminium target 11, aluminium backboard 12, substantially reduces the difficulty of welding procedure, shortens weld interval, thus improve welding efficiency.Solder soakage layer can be fine and close the junction to be welded of filling up aluminium target 11, aluminium backboard 12 between welding gap place, make can carry out better physics, chemical reaction between solder, aluminium target 11, aluminium backboard 12, thus realize combining closely of aluminium target 11 and aluminium backboard.Thus improve solder bond intensity.
In the present embodiment, according to aluminium target 11 and the material behavior of aluminium backboard 12 and the condition of follow-up welding procedure, through performing creative labour, selected solder can for purity be 89 ~ 91% containing tin solder.In the present embodiment, preferred Sn-Zn brazing filler metal, this solder can not only reduce the surface tension of aluminium target 11 or aluminium backboard 12 in the liquid state, and the interfacial tension of aluminium target 11 and aluminium backboard 12 can be reduced, to aluminium target, aluminium backboard, there is good wetability, what can reduce aluminium target and aluminium backboard welds difficulty, but also can accelerate the speed of welding of subsequent soldering processes.This solder has good mobility, fully can fill up the weld gap between aluminium target and the junction to be welded of aluminium backboard in the welding procedure of the present embodiment.When adopting this solder to weld, be not easy to produce pore or hole in the commissure of aluminium target material assembly, the weld seam of the aluminium target material assembly of follow-up formation has superperformance corrosion-resistant, high temperature resistant, excellent in cushion effect.Such as can not produce blackspot or stain at face of weld.Exception, the Sn-Zn brazing filler metal of the present embodiment is nontoxic, maximized reduction potential safety hazard.
In the present embodiment, in order to improve further aluminium target 11, aluminium backboard 12 speed of welding, increase the solder bond intensity of aluminium target 11, aluminium backboard 12, the to be welded junction II of the method for machining to aluminium backboard 12 can be adopted to carry out patterned process, described pattern is form the bulge-structure that can insert aluminium target 11 at the junction II to be welded of aluminium backboard 12, and the cross section of this bulge-structure can be tip-angled shape, needle-like or boss-shaped.Patterned process is carried out to the junction II to be welded of aluminium backboard 12, in subsequent technique, because the quality of aluminium target 11 is softer than aluminium backboard 12, the above-mentioned bulge-structure of aluminium backboard 12 can directly insert aluminium target 11, and the junction I to be welded of the junction II to be welded of aluminium backboard 12, aluminium target 11 fits with solder soakage layer respectively, realize aluminium backboard 12, maximized void-free contact between aluminium target 11 and solder soakage layer.Aluminium backboard 12 in the present embodiment, maximized void-free contact between aluminium target 11 and solder soakage layer, for in follow-up welding procedure, aluminium atom and solder atom, between aluminium atom and aluminium atom, gravitational force between atoms can be produced as soon as possible, thus make aluminium atom with solder atom, between aluminium atom and aluminium atom, carry out phase counterdiffusion.Therefore, the junction II to be welded of aluminium backboard 12 carries out above-mentioned patterned process, the speed of welding of aluminium target 11 and aluminium backboard 12 can not only be improved, and the high welding of bond strength can also be realized.
Again through performing creative labour, find that on the junction II to be welded of aluminium backboard 12, carry out machining forms following thread pattern, aluminium backboard 12 welds the aluminium target material assembly formed solder bond intensity with aluminium target is the highest, and welding efficiency is also the highest.
Fig. 3 is the plane enlarged diagram of the thread pattern that the junction II to be welded of aluminium backboard 12 is formed.Fig. 4 is the cross section enlarged diagram of Fig. 3 along AA direction.Incorporated by reference to reference to figure 3 and Fig. 4, the cross sectional shape of thread pattern projection is the isosceles triangle that multiple base angle is connected, each triangular form is called tooth form, the thread height H1 of thread pattern is that 0.19mm ~ 0.43mm(comprises end points), the distance W1 on tooth form base is that 0.44mm ~ 0.7mm(comprises end points).Angle between adjacent two tooth form sidewalls is that thread form angle α 1 equals 60 degree, is the groove part of thread pattern between adjacent two tooth forms, and the distance between adjacent two tooth forms is pitch L1 equals 0.44mm ~ 0.7mm(and comprise end points).
Then clean the junction II to be welded of aluminium backboard 12, adopt the sodium hydroxide solution of 0.1mol/L to clean aluminium backboard 12.Scavenging period is 10min ~ 30min, the pollutant formed during for removing machining, and the junction II to be welded of aluminium backboard 12 is cleaned, for follow-up welding procedure is prepared.Dry up after cleaning.
It should be noted that, in (1) the present embodiment, if carry out patterned process on the junction II to be welded of aluminium backboard 12, then do not need to form solder soakage layer on the junction II to be welded of aluminium backboard 12.Because pattern can make the wetting effect of liquid solder to the junction II to be welded of aluminium backboard 12 not good.
(2) why select to carry out machining on aluminium backboard 12, reason is as follows: the purity of aluminium target 11 is high, and quality is softer.Therefore, the aluminium backboard 12 be made into by specific alloy material relative to aluminium target 11 has higher hardness, and the bulge-structure that the junction to be welded of aluminium backboard 12 is formed can insert in aluminium target 11.
In other embodiments, the thread height of the thread pattern of aluminium backboard is lower than 0.19mm, and the junction to be welded of aluminium target and the first junction to be welded of titanium are directly fitted, and also belong to protection scope of the present invention.
In other embodiments, the junction to be welded of aluminium backboard is not carried out patterned process and forms bulge-structure and directly the junction to be welded of aluminium target and the junction to be welded of aluminium backboard are carried out fitting and belong to protection scope of the present invention yet.
Then, please refer to Fig. 5, perform step S13, aluminium backboard 12, the aluminium target 11 that is formed with solder soakage layer are placed in vacuum canning 14, the junction II to be welded of described aluminium backboard 12 contacts with described solder soakage layer, or be placed in vacuum canning 14 by aluminium target 11, the aluminium backboard 12 that is formed with solder soakage layer, the junction I to be welded of described aluminium target 11 contacts with described solder soakage layer.
Be specially, in the present embodiment, being inserted by bulge-structure on the junction II to be welded of aluminium backboard 12 is formed in the aluminium target 11 of solder soakage layer, and the side IV of aluminium target 11 fits, the groove side of aluminium backboard 12, the junction II to be welded of described aluminium backboard 12 contact with described solder soakage layer, form aluminium target assembly to be welded.
Screw thread in the above-mentioned thread pattern of aluminium backboard 12 inserts and is formed in the aluminium target 11 of solder soakage layer.And the junction II to be welded of aluminium backboard 12 contacts with described solder soakage layer, make aluminium backboard 12, solder and the maximized void-free contact of aluminium target 11.Like this, the junction II to be welded of aluminium backboard 12, by under the prerequisite of solder wetting, can produce gravitational force between atoms between aluminium atom and aluminium atom fast, thus enables aluminium atom and aluminium atom be very easy to and carry out phase counterdiffusion very fast.Therefore, such aluminium target assembly to be welded is welded, can maximized raising speed of welding, formation the solder bond intensity of aluminium target material assembly also the highest.
After forming aluminium target assembly to be welded, this assembly to be welded is placed in vacuum canning 14.Acting as of vacuum canning 14 prevents assembly to be welded to be oxidized in case of heating.It should be noted that, the material of vacuum canning 14 is selected to meet two conditions, and first condition is: the fusing point of vacuum canning 14 is higher than the temperature in subsequent heat process, otherwise vacuum canning 14 can melt in subsequent heat process; Second condition is: in the welding process of follow-up aluminium target and aluminium backboard, the material of vacuum canning can realize preferably pressure conduction, otherwise affect follow-up aluminium target and the welding quality of aluminium backboard, such as aluminium target 11 is good not with the solder bond power of aluminium backboard 12, and weld strength is not good.Excellent aluminium jacket in the present embodiment.Why aluminium jacket, be because, for aluminium target and aluminium backboard, the heat of aluminium jacket and the conducting effect of pressure best.The thickness of vacuum canning 14 is 1.0mm ~ 3.0mm.If vacuum canning 14 is too thin, in the welding process of follow-up aluminium target and aluminium backboard, the weld of vacuum canning 14 easily splits, and causes the phenomenon that assembly to be welded exposes and leaks gas; If vacuum canning 14 is too thick, in the welding process of follow-up aluminium target and aluminium backboard, vacuum canning 14 is not easy to realize pressure conduction.
Vacuum canning 14 can pass through Machine Design, such as CAD, its shape is made to meet the shape of assembly to be welded, afterwards by seamless tubular goods or sheet material through splicing formation welded together, therefore, vacuum canning 14 can fit tightly built-in target material assembly to be welded and not limit by the size of assembly to be welded, can weld the welding of large-size target.As shown in Figure 5, this vacuum canning 14 generally leaves a hole 15, may be used for drawing deaeration pipe from described vacuum canning 14, this deaeration pipe is connected with vaccum-pumping equipment.
Then, sealed vacuum jacket 14 stay deaeration pipe.The technique of sealing can be realized by argon arc welding, and vacuum step is completed by deaeration pipe.
Vacuum canning 14 is put into heating furnace and carries out preheating, temperature is 100 DEG C ~ 200 DEG C (comprising end points), then starts limit heating edge and vacuumizes, and then carries out insulation 1h ~ 3h(and comprises end points).In described heating and thermal insulation process, need to continue to vacuumize to vacuum canning 14, make the vacuum in vacuum canning 14 at least reach 10
-3pa.Inventor finds, carries out preheating, be conducive to better carrying out vacuumizing process to aluminium target target material assembly to be welded, makes aluminium target 11 and aluminium backboard 12 cannot be oxidized, thus improves the weld strength of subsequent soldering processes.If heating-up temperature is too low, component to be welded is heated and is insufficiently unfavorable for follow-up welding operation nor is beneficial to the carrying out vacuumized; Heating-up temperature is too high, and the crystal grain of aluminium target is easily grown up, crystallite dimension meeting over range, thus makes the aluminium target material assembly formed not meet the requirement of sputtering technology.The internal temperature that insulation 1h ~ 3h can realize whole aluminium target target material assembly to be welded reaches design temperature uniformly, if temperature retention time is too short, aluminium target target material assembly internal temperature to be welded can not thermally equivalent, affects follow-up formation solder bond intensity; If temperature retention time is long, the crystal grain of aluminium target is easily grown up, and crystallite dimension meeting over range, the aluminium target material assembly of formation does not meet the requirement of sputtering technology.If the vacuum in vacuum canning 14 is greater than 10
-3pa, the aluminium target target material assembly to be welded in vacuum canning is easily oxidized in follow-up welding procedure; Vacuum in vacuum canning is the smaller the better.Vacuum in the present embodiment is the absolute pressure in given space, different with the concept of the vacuum that routine is understood.
Then, continuing to hold one's breath technique to vacuum canning 14 under the state keeping vacuum canning 14 inner vacuum, closing by deaeration pipe, making vacuum canning inside form an airtight vacuum environment.Described technique of holding one's breath is realized by machining and welding, in the present embodiment, can be pounded by the afterbody of vacuum canning deaeration pipe flatly then to seal with argon arc welding with iron hammer.After technique of holding one's breath, the vacuum of described vacuum canning is at least 10
-3pa.
The object that limit heating edge continues to vacuumize is, can increase the easness continuing to vacuumize on the one hand, improves the efficiency vacuumized; On the other hand, when carrying out holding one's breath technique under the condition of heating and thermal insulation, deaeration pipe meeting deliquescing, the easier afterbody by deaeration pipe is shut.
Then vacuum canning 14 is placed in static pressure stove to carry out welding procedure.
Then, continue with reference to figure 5, perform step S14, utilize heat and other static pressuring processes aluminium target 11, solder soakage layer, aluminium backboard 12 to be welded together to form aluminium target material assembly.So-called high temperature insostatic pressing (HIP) (hotisostatic pressing, HIP) be that target material assembly to be welded for aluminium target is placed in vacuum-packed vacuum canning, then utilize highly pressurised liquid or gases at high pressure to apply each pressure to equalization to vacuum canning under the high temperature conditions, make vacuum canning in this high temperature and high pressure environment, keep a period of time to be welded together by material tight to be welded.
Now, inside be provided with aluminium target 11, solder soakage layer, aluminium backboard 12 vacuum canning 14 be in high temperature and high pressure environment.Aluminium target 11 and aluminium backboard 12 in the target material assembly after welding can be made to have higher weld strength by selecting suitable technological parameter, concrete, inventor finds to adopt following technological parameter to realize: the ambient temperature residing for vacuum canning 14 is 200 DEG C ~ 300 DEG C, highly pressurised liquid or gases at high pressure are utilized to make external environment condition pressure residing for vacuum canning 14 for being more than or equal to 100Mpa, further, vacuum canning 14 keeps 2 ~ 5 hours in this high temperature and high pressure environment.
The very thin thickness of vacuum canning 14, under the effect of outside environmental stress, vacuum canning 14 can realize good pressure conduction to make aluminium target 11, the junction mineralization pressure each to be welded of aluminium backboard 12, simultaneously because vacuum canning 14 is arranged in hot environment for a long time, aluminium target 11, plastic deformation and high-temerature creep can be there is and realize the aluminium target 11 of small size with the crystal grain between aluminium backboard 12 to contact in the junction each to be welded of aluminium backboard 12, under continuous effect, crystal grain contact area expands gradually, finally reach place to be welded and can realize crystal grain contact, thus make to form gravitational force between atoms between aluminium atom and aluminium atom.
Then there is the phase counterdiffusion between aluminium atom with aluminium atom at place to be welded, make many spaces at place to be welded disappear due to the lasting diffusion of the aluminium atom at place to be welded, simultaneously, the crystal boundary migration at place to be welded have left home position, even if reach poised state, many little spaces are still had to be retained in place to be welded, cause distortion of lattice, dislocation, the various crystal defect bulk deposition such as room, the junction energy each to be welded at place to be welded enlarges markedly, aluminium atom is in high level activation state, then, the diffusive migration of aluminium atom and aluminium atom is very rapid, the very fast formation of the tiny area at place to be welded take aluminium-aluminum metal key as the joint of main type of attachment, but the metallic bond at place to be welded reaches far away homogenising degree, weld strength is not high.
So needing target material assembly to be welded for aluminium target in ambient temperature is 200 DEG C ~ 300 DEG C, external environment condition pressure be carry out under the condition being more than or equal to 100Mpa being incubated, pressurize 2 ~ 5 hours, to make to treat that the left space of connected components disappears completely, place to be welded is made all to form metallic bond, namely realize the homogenising of metallic bond, increase the weld strength treating aluminium weld assembly.If insulation, dwell time are less than 2 hours, the diffusion of the metallic bond of aluminium target target material assembly to be welded can not be made more even, if temperature retention time is greater than 5 hours, aluminium target crystalline grains can be caused to grow up, the weld strength of metallic bond can be reduced on the contrary.
If ambient temperature is lower than 200 DEG C, aluminium atoms permeating can not be activated; If ambient temperature is higher than 300 DEG C, cause the waste of cost, in addition, the grain growth of aluminium target 11 can be made, not meet the requirement of sputtering technology.If temperature continues to raise, aluminium target 11 and aluminium backboard 12 can be made to melt.If external environment condition pressure is lower than 100Mpa, aluminium atoms permeating can not be activated equally; In the scope that welding equipment fortune allows, pressure is more conducive to more greatly aluminium atom and titanium atom, phase counterdiffusion between aluminium atom and aluminium atom, and then is more conducive to the carrying out of welding procedure.
In addition, because vacuum canning 14 is not by the restriction such as target size and backboard size, the vacuum canning 14 that large scale assembly to be welded is housed can be put into high temperature insostatic pressing (HIP) stove, adopt the welding procedure of high temperature insostatic pressing (HIP) namely to apply vacuum canning 14 each to equalization pressure to realize uniform large-area welding under high temperature, condition of high voltage, form large-sized target material assembly.The weld welding rate of described large-sized target material assembly is not high, weld strength is comparatively large and yielding etc.
Then, perform step S15, after having welded, vacuum canning is cooled, remove vacuum canning to obtain aluminium target material assembly.After having welded, vacuum canning 14 can be made to cool in atmosphere, be cooled to less than 200 DEG C, then vacuum canning 14 is removed to obtain target material assembly by chemical method or mechanical means, such as, turning process can be utilized to be removed by vacuum canning 14, and then through the method such as turning or Linear cut, thus the target material assembly of obtained final size.
Finally, the welding situation of the present embodiment aluminium target material assembly is detected:
Utilize C-SCAN(Water Immersion Ultrasonic C-scan system) detect solder bond rate, its solder bond rate scope more than 95% of target material assembly that should be made up of aluminium target and aluminium backboard.Adopt tensile testing machine to test its hot strength, the fracture strength (being greater than 100MPa) of aluminium can be reached, namely in tension test, only have the fracture of aluminum that the weld of aluminium target material assembly just can be made to rupture.Result shows, adopts the welding performance of the target material assembly that welding method obtains in the present invention very reliable.
Although the present invention with preferred embodiment openly as above; but it is not for limiting the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; the Method and Technology content of above-mentioned announcement can be utilized to make possible variation and amendment to technical solution of the present invention; therefore; every content not departing from technical solution of the present invention; the any simple modification done above embodiment according to technical spirit of the present invention, equivalent variations and modification, all belong to the protection domain of technical solution of the present invention.
Claims (8)
1. a welding method for aluminium target material assembly, is characterized in that, comprises the following steps:
Aluminium target, aluminium backboard are provided;
The junction to be welded of described aluminium target is formed solder soakage layer or form solder soakage layer in the junction to be welded of described aluminium backboard;
Be placed in vacuum canning by aluminium backboard, the aluminium target that is formed with solder soakage layer, the junction to be welded of described aluminium backboard contacts with described solder soakage layer, or,
Be placed in vacuum canning by aluminium target, the aluminium backboard that is formed with solder soakage layer, the junction to be welded of described aluminium target contacts with described solder soakage layer;
Heat and other static pressuring processes is utilized described aluminium target, solder soakage layer, aluminium backboard to be welded together to form aluminium target material assembly;
After having welded, described vacuum canning is cooled, remove described vacuum canning to obtain described aluminium target material assembly.
2. method according to claim 1, is characterized in that, described solder is for containing tin solder.
3. method according to claim 1, is characterized in that, further comprising the steps of before described aluminium backboard, the aluminium target that is formed with solder soakage layer are placed in vacuum canning:
Adopt the to be welded junction of method to described aluminium backboard of machining to carry out patterned process and form bulge-structure.
4. method according to claim 3, is characterized in that, is formed in the aluminium target of solder soakage layer described in described bulge-structure inserts.
5. the method according to claim 3 or 4, is characterized in that, the thickness of described solder soakage layer is for being greater than 0 micron and being less than or equal to 10 microns.
6. method according to claim 1, is characterized in that, the step that aluminium target, solder soakage layer, aluminium backboard weld together comprises by the described heat and other static pressuring processes that utilizes:
Make inside be provided with described aluminium target, solder soakage layer, aluminium backboard the ambient temperature of vacuum canning be 200 DEG C ~ 300 DEG C, external environment condition pressure is for being more than or equal to 100Mpa;
The described vacuum canning be positioned under described environment temperature, environmental stress is incubated, pressurize 2 ~ 5 hours, so that described aluminium target, solder soakage layer, aluminium backboard are welded together.
7. method according to claim 1, is characterized in that, described vacuum canning is that the aluminum welding being 1.0mm ~ 3.0mm by thickness is formed;
After described aluminium target, solder soakage layer, aluminium backboard are placed in vacuum canning, described vacuum canning are evacuated to vacuum and are at least 10
-3pa, more described vacuum canning is sealed.
8. method according to claim 3, is characterized in that, before being placed in vacuum canning, carries out cleaning treatment to the junction to be welded of described aluminium backboard after forming described bulge-structure, by described aluminium backboard, the aluminium target that is formed with solder soakage layer.
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