CN104582326B - 印刷电路板的制造方法 - Google Patents
印刷电路板的制造方法 Download PDFInfo
- Publication number
- CN104582326B CN104582326B CN201410566475.7A CN201410566475A CN104582326B CN 104582326 B CN104582326 B CN 104582326B CN 201410566475 A CN201410566475 A CN 201410566475A CN 104582326 B CN104582326 B CN 104582326B
- Authority
- CN
- China
- Prior art keywords
- insulating layer
- circuit board
- printed circuit
- manufacturing
- prime coat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130128007A KR20150047926A (ko) | 2013-10-25 | 2013-10-25 | 인쇄회로기판의 제조방법 |
KR10-2013-0128007 | 2013-10-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104582326A CN104582326A (zh) | 2015-04-29 |
CN104582326B true CN104582326B (zh) | 2019-01-08 |
Family
ID=53047869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410566475.7A Active CN104582326B (zh) | 2013-10-25 | 2014-10-22 | 印刷电路板的制造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2015084420A (ko) |
KR (1) | KR20150047926A (ko) |
CN (1) | CN104582326B (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105704915A (zh) * | 2016-04-26 | 2016-06-22 | 浪潮电子信息产业股份有限公司 | 一种耐腐蚀的服务器pcb |
US10763031B2 (en) | 2016-08-30 | 2020-09-01 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing an inductor |
DE102018102734A1 (de) * | 2018-01-18 | 2019-07-18 | Schreiner Group Gmbh & Co. Kg | Flexible elektrische Schaltung mit Verbindung zwischen elektrisch leitfähigen Strukturelementen |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1155828A (zh) * | 1995-10-31 | 1997-07-30 | 住友电木株式会社 | 多层印刷线路板及其生产和使用方法 |
CN1201586A (zh) * | 1995-10-31 | 1998-12-09 | 住友电木株式会社 | 多层印刷电路板和其制备方法 |
CN1464837A (zh) * | 2001-07-06 | 2003-12-31 | 钟渊化学工业株式会社 | 层压体及其制造方法 |
CN1791647A (zh) * | 2003-05-21 | 2006-06-21 | 日立化成工业株式会社 | 底漆、带有树脂的导体箔、层叠板以及层叠板的制造方法 |
CN101781529A (zh) * | 2009-01-21 | 2010-07-21 | 日东电工株式会社 | 柔性印刷电路板固定用双面粘合片 |
CN102099431A (zh) * | 2008-03-31 | 2011-06-15 | 汉高有限公司 | 多层紫外线可固化粘合膜 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5101919B2 (ja) * | 2007-04-09 | 2012-12-19 | 日東電工株式会社 | 配線回路基板用両面粘着テープ又はシートおよび両面粘着テープ付き配線回路基板 |
JP2012045887A (ja) * | 2010-08-30 | 2012-03-08 | Sumitomo Bakelite Co Ltd | 金属張積層板、及びその製造方法 |
-
2013
- 2013-10-25 KR KR1020130128007A patent/KR20150047926A/ko not_active Application Discontinuation
-
2014
- 2014-10-16 JP JP2014211589A patent/JP2015084420A/ja not_active Withdrawn
- 2014-10-22 CN CN201410566475.7A patent/CN104582326B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1155828A (zh) * | 1995-10-31 | 1997-07-30 | 住友电木株式会社 | 多层印刷线路板及其生产和使用方法 |
CN1201586A (zh) * | 1995-10-31 | 1998-12-09 | 住友电木株式会社 | 多层印刷电路板和其制备方法 |
CN1464837A (zh) * | 2001-07-06 | 2003-12-31 | 钟渊化学工业株式会社 | 层压体及其制造方法 |
CN1791647A (zh) * | 2003-05-21 | 2006-06-21 | 日立化成工业株式会社 | 底漆、带有树脂的导体箔、层叠板以及层叠板的制造方法 |
CN102099431A (zh) * | 2008-03-31 | 2011-06-15 | 汉高有限公司 | 多层紫外线可固化粘合膜 |
CN101781529A (zh) * | 2009-01-21 | 2010-07-21 | 日东电工株式会社 | 柔性印刷电路板固定用双面粘合片 |
Also Published As
Publication number | Publication date |
---|---|
CN104582326A (zh) | 2015-04-29 |
KR20150047926A (ko) | 2015-05-06 |
JP2015084420A (ja) | 2015-04-30 |
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GR01 | Patent grant |