CN104582326B - 印刷电路板的制造方法 - Google Patents

印刷电路板的制造方法 Download PDF

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Publication number
CN104582326B
CN104582326B CN201410566475.7A CN201410566475A CN104582326B CN 104582326 B CN104582326 B CN 104582326B CN 201410566475 A CN201410566475 A CN 201410566475A CN 104582326 B CN104582326 B CN 104582326B
Authority
CN
China
Prior art keywords
insulating layer
circuit board
printed circuit
manufacturing
prime coat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410566475.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN104582326A (zh
Inventor
李在浚
李春根
张钟允
赵在春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN104582326A publication Critical patent/CN104582326A/zh
Application granted granted Critical
Publication of CN104582326B publication Critical patent/CN104582326B/zh
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
CN201410566475.7A 2013-10-25 2014-10-22 印刷电路板的制造方法 Active CN104582326B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020130128007A KR20150047926A (ko) 2013-10-25 2013-10-25 인쇄회로기판의 제조방법
KR10-2013-0128007 2013-10-25

Publications (2)

Publication Number Publication Date
CN104582326A CN104582326A (zh) 2015-04-29
CN104582326B true CN104582326B (zh) 2019-01-08

Family

ID=53047869

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410566475.7A Active CN104582326B (zh) 2013-10-25 2014-10-22 印刷电路板的制造方法

Country Status (3)

Country Link
JP (1) JP2015084420A (ko)
KR (1) KR20150047926A (ko)
CN (1) CN104582326B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105704915A (zh) * 2016-04-26 2016-06-22 浪潮电子信息产业股份有限公司 一种耐腐蚀的服务器pcb
US10763031B2 (en) 2016-08-30 2020-09-01 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing an inductor
DE102018102734A1 (de) * 2018-01-18 2019-07-18 Schreiner Group Gmbh & Co. Kg Flexible elektrische Schaltung mit Verbindung zwischen elektrisch leitfähigen Strukturelementen

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1155828A (zh) * 1995-10-31 1997-07-30 住友电木株式会社 多层印刷线路板及其生产和使用方法
CN1201586A (zh) * 1995-10-31 1998-12-09 住友电木株式会社 多层印刷电路板和其制备方法
CN1464837A (zh) * 2001-07-06 2003-12-31 钟渊化学工业株式会社 层压体及其制造方法
CN1791647A (zh) * 2003-05-21 2006-06-21 日立化成工业株式会社 底漆、带有树脂的导体箔、层叠板以及层叠板的制造方法
CN101781529A (zh) * 2009-01-21 2010-07-21 日东电工株式会社 柔性印刷电路板固定用双面粘合片
CN102099431A (zh) * 2008-03-31 2011-06-15 汉高有限公司 多层紫外线可固化粘合膜

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5101919B2 (ja) * 2007-04-09 2012-12-19 日東電工株式会社 配線回路基板用両面粘着テープ又はシートおよび両面粘着テープ付き配線回路基板
JP2012045887A (ja) * 2010-08-30 2012-03-08 Sumitomo Bakelite Co Ltd 金属張積層板、及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1155828A (zh) * 1995-10-31 1997-07-30 住友电木株式会社 多层印刷线路板及其生产和使用方法
CN1201586A (zh) * 1995-10-31 1998-12-09 住友电木株式会社 多层印刷电路板和其制备方法
CN1464837A (zh) * 2001-07-06 2003-12-31 钟渊化学工业株式会社 层压体及其制造方法
CN1791647A (zh) * 2003-05-21 2006-06-21 日立化成工业株式会社 底漆、带有树脂的导体箔、层叠板以及层叠板的制造方法
CN102099431A (zh) * 2008-03-31 2011-06-15 汉高有限公司 多层紫外线可固化粘合膜
CN101781529A (zh) * 2009-01-21 2010-07-21 日东电工株式会社 柔性印刷电路板固定用双面粘合片

Also Published As

Publication number Publication date
CN104582326A (zh) 2015-04-29
KR20150047926A (ko) 2015-05-06
JP2015084420A (ja) 2015-04-30

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