CN104582312A - Surface-treated copper foil, copper clad laminate comprising the same, printed circuit board using the same and manufacturing method thereof - Google Patents
Surface-treated copper foil, copper clad laminate comprising the same, printed circuit board using the same and manufacturing method thereof Download PDFInfo
- Publication number
- CN104582312A CN104582312A CN201410531637.3A CN201410531637A CN104582312A CN 104582312 A CN104582312 A CN 104582312A CN 201410531637 A CN201410531637 A CN 201410531637A CN 104582312 A CN104582312 A CN 104582312A
- Authority
- CN
- China
- Prior art keywords
- copper clad
- clad layers
- treated layer
- copper
- clad laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/24—Aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a surface-treated copper foil, a copper clad laminate comprising the same, a printed circuit board using the same and a manufacturing method thereof. Specifically, according to the specific embodiment of the invention, the copper clad laminate comprises a carrier, a peeling layer formed on the carrier, a copper cladding layer formed on the peeling layer, and a surface treatment layer formed on the copper cladding layer, wherein the surface treatment layer includes thiol group compounds. Therefore, the surface treatment layer is formed on the copper cladding layer, the printed circuit board capable of improving the adhesion between a substrate and the copper cladding layer can be provided without the treatment of the coarse surface.
Description
The cross reference of related application
This application claims the priority being entitled as the Korean Patent Application No. 10-2013-0120775 of " surface treated Copper Foil and comprise the copper clad laminate of described Copper Foil and use the printed circuit board (PCB) of described Copper Foil " submitted on October 10th, 2013, and the priority being entitled as the Korean Patent Application No. 10-2014-0055802 of " surface treated Copper Foil; comprise the copper clad laminate of described Copper Foil; use printed circuit board (PCB) of described Copper Foil and preparation method thereof " requiring on May 9th, 2014 to submit to, its full content is by reference to being incorporated to herein.
Technical field
The present invention relates to surface treated Copper Foil and the copper clad laminate comprising described Copper Foil, and use the printed circuit board (PCB) of described Copper Foil and the preparation method of this printed circuit board (PCB).
Background technology
Along with electronic equipment is towards miniaturized and high performance trend development, for the increase in demand of high density, multi-functional, small-sized and thin multilayer board.Therefore, the printed circuit board (PCB) of various electronic component is installed by fine patterning.
Recently developing rapidly along with IT technology, to high-performance, multi-functional and small-sized electronic equipment, the demand as portable terminal, computer and display increases sharply.Therefore, as also tended to multi-functional and high-performance development for the semiconductor device of electronic equipment and the electronic component such as circuit board that is provided with these electronic components.
Especially, in order to develop meticulous and high-density wiring, replace forming the method with the insulating barrier of the pre-preg type of impregnated glass colth, SAP or MSAP scheme is used to be increased so that the method forming circuit is existing by the dielectric film built without glass cloth, further, the structure layer multiple stratification of multilayer board.
Such as, when connecting with flexible printing wiring board (hereinafter, being called FPC), wiring pattern needs thinning, multiple stratification etc.Now, FPC is provided with the detail assembly panel FPC of element, at the two-sided two-sided FPC being formed with circuit, the multi-layer FPC etc. forming interlayer wiring by piling up multiple FPC occurs.Therefore, it is required for forming the material with the FPC of higher thinness and dimensional stability.
At present, as the Copper Foil used in electronics industry, by plating, there is the Copper Foil of 18-35 μm of thickness or aluminum foil carrier and the thin copper plating paper tinsel of the thickness of 1-5 μm that formed is used.In addition, light, thin, the little fine circuitry be required with meticulous copper plating paper tinsel in the electronic component as high-density printed circuit board, the accurate printed wiring circuit element for circuit board etc.
According to prior art, in order to increase the electroplate adhesion power between copper clad layers and insulating barrier, implement by processing with the decontamination (alligatoring plating) forming rough surface with the surface of the etching isolation layers such as potassium permanganate.In addition, by the Anchoring Effect (anchor effect) of insulating barrier shown on a rough surface, attempt increasing the adhesive strength between insulating barrier and copper clad layers.But owing to forming the formation size of rough surface on the insulating layer, there is the restriction of thinness aspect in the formation thickness of Copper Foil.
In other words, when thin copper foil is attached to rough surface, described Copper Foil is probably torn, and may have more weak mechanical strength due to its thinner thickness.
Therefore, in order to realize meticulous and high-density wiring, need a kind of adhesion for guaranteeing between insulating barrier and copper clad layers to keep the method for the thinner thickness of copper clad layers simultaneously.
Therefore, the invention provides a kind of surface treated Copper Foil, a kind of copper clad laminate comprising this surface treated Copper Foil, a kind of printed circuit board (PCB) of this surface treated Copper Foil and preparation method of this printed circuit board (PCB) of using.In the present invention, described surface treated Copper Foil comprises copper clad layers and is formed in surface-treated layer in copper clad layers, comprises the copper clad laminate of described surface treated Copper Foil, uses the described printed circuit board (PCB) of surface treated Copper Foil and the preparation method of this printed circuit board (PCB), while keeping thinner copper clad layers, show high adhesive strength.The present invention is based on above completing.
Patent documentation 1: Korean Patent Publication No. 2007-0017547
The copper clad layers used in prior art is formed by electrolytic method; instead of by deposition process as above; therefore, when implementing fine pattern and the thickness of copper clad layers needs to be set to be equal to or greater than 18 μm, controlling the thickness of copper clad layers and guaranteeing that the adhesion of substrate is difficult.Reason is the adhesion in order to ensure copper clad layers, copper clad layers or substrate forms rough surface (rough surface) to form anchor (anchor).
But, according to a kind of embodiment of the present invention, by forming surface-treated layer 20 in copper clad layers 10, surface-treated layer 20 can be formed with chemical anchors, and not form rough surface, thus fine circuit pattern and fine pitch can be realized.
Surface-treated layer 20 is formed by the surface of surface treatment copper clad layers 10.Described surface-treated layer 20 is by absorption thiolating compound to the surface of described copper clad layers 10 is formed.Therefore, described surface-treated layer 20 can improve copper clad layers 10 wettability of the surface exempting from coarse process.
As mentioned above, according to a kind of embodiment of the present invention, in copper clad laminate 3, surface-treated layer 20 is formed in copper clad layers 10 to form chemical adhesion power, thus improve the adhesion not carrying out forming roughened surface treatment, and copper clad layers 10 is by formation such as described sputtering sedimentation, electron beam depositions, instead of formed by electro-plating method, thus form thin copper clad layers.
Therefore, surface-treated layer 20 does not carry out coarse process, improved the adhesion of Copper Foil by chemical method to form thin copper clad layers, thus the copper clad laminate 3 be suitable for for circuit material can be formed.
Fig. 4 is the schematic diagram of the printed circuit board (PCB) illustrated according to a kind of embodiment of the present invention.At this, in order to avoid repeat specification, described printed circuit board (PCB) is described with reference to Fig. 1-3.
With reference to Fig. 4, according to a kind of embodiment of the present invention, the circuit pattern 410 that printed circuit board (PCB) 4 comprises insulating barrier 400, is formed at the surface-treated layer 420 on described insulating barrier 400 and is formed on described surface-treated layer 420, wherein, described surface-treated layer 420 can contain thiolating compound.
Insulating barrier 400 can be dielectric film, preimpregnation material (PPG) and the structure film (build-up film) for insulator chain layer, wherein, the outermost both sides of insulating barrier 400 can be formed by insulating material (as photoresist), but are not particularly limited to this.
Further, according to a kind of embodiment of the present invention, consider thermal expansion character coefficient (coefficient of thermal expansion characteristic), printed circuit board (PCB) 4 can be formed containing inorganic filler etc. in insulating barrier 400.
Insulating barrier 400 can be formed by material such as the epoxy resin of display insulation characterisitic, wherein, at least one in Naphthol-based Epoxy Resin, bisphenol A type epoxy resin, novolac epoxy resin, cresol novolac epoxy resins, rubber modified epoxy resin, phosphoric acid epoxy resin and bisphenol f type epoxy resin is selected from as the epoxy resin of insulating material.
Circuit pattern 410 can be formed on insulating barrier 400 and its thickness can be 0.1-5 μm.
Such as, press/heat on insulating barrier 400 and to it by copper clad laminate 3 is adhered to and peel off carrier 30 as one kind and the peel ply 40 of copper clad laminate 3, circuit pattern 410 can be adhered to and be incorporated on insulating barrier 400.At this, because copper clad laminate 3 comprises the peel ply 40 be formed between carrier 30 as one kind and copper clad layers 10, therefore can easily the carrier 30 as one kind in copper clad layers 10 be peeled off.
Further, circuit pattern 410 can pass through copper clad layers 10 that patterning (etching) comes out by the stripping of carrier 30 as one kind and be formed, at this, describe patterning by the mode enumerated, copper clad layers 10 is carried out the process forming photoresist oxidant layer and exposure photoresist oxidant layer; At this, in order to carry out exposure-processed, by using the mask had corresponding to circuit pattern shape, exposure area and lightproof area are split; Further, the photoresist oxidant layer being divided into exposure area or lightproof area is divided into consolidation zone and uncured region, and forms remaining area by the photoresist oxidant layer of uncured/solidification of developing and remove region.Therefore, mask pattern can be formed by using remaining area.In this case, copper clad layers 10 is removing the regional exposure of mask pattern, and when the copper clad layers 10 exposed is removed by etchant and mask pattern is removed, circuit pattern 410 can be formed with the shape of copper clad layers 10 remainder.
In addition, surface-treated layer 420 can be formed between circuit pattern 410 and insulating barrier 400.Described surface-treated layer 420 also can be formed by the engraving method of above-mentioned surface-treated layer 20 as shown in Figure 3.Described surface-treated layer 420 can improve the wettability of the surface of the circuit pattern 410 that need not suffer coarse process.Add man-hour when carrying out pressing on insulating barrier 400, described surface-treated layer 420 can as improving fusible auxiliary agent.Further, the peel strength of described surface-treated layer and described insulating barrier can be 0.6kgf/cm or larger.
Therefore, the stable adhesion that surface-treated layer 420 need not suffer coarse process can guarantee between circuit pattern 410 and insulating barrier 400, and do not form the printed circuit board (PCB) 4 that rough surface can form the circuit pattern 410 of the possible fine pattern of tool and fine pitch.
Fig. 5 A-5E illustrates the flow chart preparing the method for printed circuit board (PCB) according to a kind of embodiment of the present invention.In order to avoid repeat specification, the preparation method of described printed circuit board (PCB) is described with reference to Fig. 1-4.
With reference to Fig. 5 A, according to a kind of embodiment of the present invention, the preparation method of printed circuit board (PCB) comprises the copper clad laminate 3 being attached to by insulating barrier 400 and comprising carrier 30 as one kind, peel ply 40, copper clad layers 10 and surface-treated layer 20.
Carrier 30 as one kind can be formed by the polymer or metal forming copper clad layers 10 and interface of dissociating.When described carrier 30 as one kind is formed by polymer, the thickness of described carrier 30 as one kind can be 15-200 μm, and when stripping interface is by when such as copper, aluminium or their composition are formed, the thickness of described carrier 30 as one kind can be 10-30 μm.
Peel ply 40 can be formed on carrier 30 as one kind and also can be formed by any one technique be selected from dipping method, spraying method and injection method by the solution containing silicon base compound, pyrrolyl compound or their composition.
Copper clad layers 10 can be formed on peel ply 40 and can by be selected from sputtering, electron beam, chemical vapour deposition (CVD) (CVD), physical vapour deposition (PVD) (PVD), vacuum moulding machine, ion plating and plasma-deposited in any one technique and formed.Further, the thickness of copper clad layers 10 can be 0.1-5 μm.
Thiolating compound can be contained in the surface that surface-treated layer 20 can be formed at copper clad layers 10, and copper clad laminate 3 also can be formed by same method.
Insulating barrier 400 can for the preimpregnation material containing epoxy resin, structure film or glass fibre prepared by varnished insulation film.
With reference to Fig. 5 B, according to the preparation method of the printed circuit board (PCB) of a kind of embodiment of the present invention, copper clad laminate 3 can adhere to and be pressed on insulating barrier 400.
The printed circuit board (PCB) obtained according to a kind of embodiment of the present invention, circuit layer can be formed as film and adhesion between insulating barrier and circuit layer also can improve.
By pressing the surface of carrier 30 as one kind of copper clad laminate 3, insulating barrier 400 and surface-treated layer 20 being adhered to and being pressed into and goes up each other, by adhering to and pressing insulating barrier 400 and copper clad laminate 3, insulating barrier 400 and copper clad laminate 3 to be adhered to and integrated.
With reference to figure 5C, according to a kind of embodiment of the present invention, the preparation method of printed circuit board (PCB) can comprise, insulating barrier 400 and copper clad laminate 3 bond/integrated state under, use peel ply 40 to be peeled off by the carrier 30 as one kind of copper clad laminate 3.At this, described peel ply 40 can be formed by silicon base compound, pyrrolyl compound etc., thus peel strength can be made to be stabilized in a lower level.Therefore, form the peel ply 40 of lower peel strength, thus can easily carrier 30 as one kind be peeled off from copper clad laminate 3.
With reference to Fig. 5 D, according to a kind of embodiment of the present invention, the preparation method of printed circuit board (PCB) can comprise patterning by copper clad layers 10 and the surface-treated layer 20 of peeling off carrier 30 as one kind and peel ply 40 and surface of coming out.
The copper clad layers 10 come out by patterning and form circuit pattern, although do not illustrate in figure 5d, but the conventional photoresist that those skilled in the art know all can be coated in copper clad layers 10, can expose the part of the photoresist film of coating and development etc. processes to form opening.Next, in the region that opening is formed, the copper clad layers 10 come out and surface-treated layer 20 are etched by coating etchant, make to form circuit pattern 410 and surface-treated layer 420, thus form the circuit pattern of patterning.Further, surface-treated layer 420 can adhere on insulating barrier 400.
With reference to Fig. 5 E, according to the preparation method of the printed circuit board (PCB) of a kind of embodiment of the present invention, circuit pattern 410 can be formed by patterning copper clad layers 10.Further, in patterning, the photoresist be retained on circuit pattern 410 also can be removed.
Meanwhile, in patterning, the surface-treated layer 20 be formed under copper clad layers 10 also can be patterned to form surface-treated layer 420.Therefore, printed circuit board (PCB) 4 can use copper clad laminate 3 and be formed.Further, the peel strength between the surface-treated layer 420 of printed circuit board (PCB) and insulating barrier 400 can be 0.6kgf/cm or larger.
Hereinafter, the present invention will be described in more detail with reference to the following examples and comparative example, but scope of the present invention is not limited to embodiment.
Summary of the invention
The present invention is devoted to provide a kind of needs by surface treatment copper clad layers to process the surface treated Copper Foil that rough surface can show Anchoring Effect (anchor effect).
Further, the present invention is devoted to provide a kind of copper clad laminate by using described surface treated Copper Foil can form thin copper clad layers.
In addition, the present invention is devoted to provide one to have the printed circuit board (PCB) of fine linewidth and fine pitch (pitch), pile up copper clad laminate on the insulating layer to form thin circuit layer to improve the adhesion between insulating barrier and thin circuit layer simultaneously, and the preparation method of this printed circuit board (PCB).
According to a kind of embodiment of the present invention, provide a kind of surface treated Copper Foil, this surface treated Copper Foil comprises: copper clad layers and the surface-treated layer be formed in described copper clad layers.
The thickness of described copper clad layers can be 0.1-5 μm.
Described surface-treated layer contains thiolating compound (thiol-based compound).
According to another kind of embodiment of the present invention, provide a kind of copper clad laminate, this copper clad laminate comprises: carrier, the peel ply be formed on described carrier, the surface-treated layer being formed at the copper clad layers on described peel ply and being formed in described copper clad layers.
The carrier formed by polymer can be selected from PETG (PET), polyphenylene sulfide (PPS), polytetrafluoroethylene (Teflon) and fluoropolymer membrane (fluorine containing film).
The thickness of the carrier formed by polymer can be 15-200 μm.
The carrier formed by metal can be selected from copper, aluminium or their combination.
The thickness of the carrier formed by metal can be 10-30 μm.
Peel ply can be selected from silicon base compound, pyrrolyl compound (azole-based compound), or their mixture.
The thickness of copper clad layers can be 0.1-5 μm.
Surface-treated layer can contain thiolating compound.
According to another kind of embodiment of the present invention, additionally provide a kind of printed circuit board (PCB), this printed circuit board (PCB) comprises: insulating barrier, the circuit pattern being formed at the surface-treated layer on described insulating barrier and being formed on described surface-treated layer.
Described surface-treated layer can contain thiolating compound.
The thickness of described circuit pattern can be 0.1-5 μm.
The peel strength of described surface-treated layer and described insulating barrier can be 0.6kgf/cm or larger.
Epoxy resin for insulating barrier can be selected from least one in Naphthol-based Epoxy Resin, bisphenol A type epoxy resin, novolac epoxy resin (phenol novolac epoxy resin), cresol novolac epoxy resins (cresol novolac epoxy resin), rubber modified epoxy resin, phosphoric acid epoxy resin and bisphenol f type epoxy resin.
According to another kind of embodiment of the present invention, additionally provide a kind of preparation method of printed circuit board (PCB), the method comprises: insulating barrier is attached to the copper clad laminate comprising carrier, peel ply, copper clad layers and surface-treated layer; Peel off carrier and the peel ply of copper clad laminate; And the copper clad layers of copper clad laminate described in patterning and surface-treated layer.
The copper clad layers of described copper clad laminate and the patterning of surface-treated layer can comprise: be coated in copper clad layers by photoresist (photoresist); Expose by the part of the photoresist film to coating and develop to form opening; And copper clad layers and the surface-treated layer in the region of opening is formed in etching.
Described copper clad layers can by be selected from sputtering, electron beam, chemical vapour deposition (CVD) (CVD), physical vapour deposition (PVD) (PVD), vacuum moulding machine, ion plating and plasma-deposited at least one technique and formed.
Described peel ply can be formed by any one technique be selected from dipping method, spraying method and injection method by the solution containing silicon base compound, pyrrolyl compound or their mixture.
The thickness of described copper clad layers can be 0.1-5 μm.
The peel strength of described surface-treated layer and described insulating barrier can be 0.6kgf/cm or larger.
Accompanying drawing explanation
Below in conjunction with the detailed description of accompanying drawing, above and other object of the present invention, feature and advantage more clearly can be understood, wherein:
Fig. 1 is the cross-sectional view of the surface treated Copper Foil according to a kind of embodiment of the present invention;
Fig. 2 is the schematic diagram of the surface-treated layer of the surface treated Copper Foil illustrated according to a kind of embodiment of the present invention;
Fig. 3 is the schematic diagram of the copper clad laminate illustrated according to a kind of embodiment of the present invention;
Fig. 4 is the schematic diagram of the printed circuit board (PCB) illustrated according to a kind of embodiment of the present invention;
Fig. 5 A-5E illustrates the flow chart preparing the method for printed circuit board (PCB) according to a kind of embodiment of the present invention.
Embodiment
Below in conjunction with the detailed description of the embodiment of accompanying drawing, will more clearly understand object of the present invention, feature and advantage.Run through accompanying drawing, identical label for representing same or analogous parts, and omits the description repeated.Further, in the following description, " first ", " second ", " side ", terms such as " opposite sides " is used for certain parts and miscellaneous part to distinguish, but the structure of these parts should not be interpreted as the restriction by these terms.In addition, in describing the invention, when determining that the detailed description of correlation technique may make main points of the present invention not know, description of related art will be saved.
Hereinafter, will be described in detail the specific embodiment of the present invention by reference to the accompanying drawings.
Fig. 1 is the cross-sectional view of the surface treated Copper Foil according to a kind of embodiment of the present invention, and Fig. 2 is the schematic diagram of the surface-treated layer of the surface treated Copper Foil illustrated according to a kind of embodiment of the present invention.
See figures.1.and.2, according to a kind of embodiment of the present invention, the surface-treated layer 20 that surface treated Copper Foil 1 comprises copper clad layers 10 and is formed in copper clad layers 10.In such an embodiment, surface-treated layer 20 can contain thiolating compound.
The thickness of copper clad layers 10 can be 0.1-5 μm.When the thickness of copper clad layers 10 is less than 0.1 μm, copper clad layers 10 may produce micropore, and when the thickness of copper clad layers 10 is more than 5 μm, this copper clad layers 10 may not possess required fundamental property.As mentioned above, fine circuit pattern and fine pitch realize by using the copper clad layers 10 of thinner thickness.
Surface-treated layer 20 can be formed on a surface of copper clad layers 10, and surface-treated layer 20 can improve the wetability of the substrate being attached to surface-treated layer 20, thus can improve the adhesion with substrate.
In order to improve adhesion, using thiolating compound, surface-treated layer 20 can be formed on of copper clad layers 10 surface.
In order to form surface-treated layer 20, need the adsorption time of 2-4 hour, such as, described surface-treated layer 20 can be formed as self-assembled monolayer (SAMs), and self-assembled monolayer can pass through spontaneously formation on a solid surface to be had the integrated thin-film of nano-scale and combines with the surface of solids.
Such as, with regard to resin and metal, because the polyimides of the wiring for being formed by insulating barrier and the copper clad layers of printed circuit board (PCB) is different from copper, can not mutually adhere to each other between polyimides and copper.Therefore, according to prior art, when making surface roughening (formation anchor) and coated with adhesive is with bonding surface from the teeth outwards, described binding agent infiltrates the adhesive segment solidification (cured) in this condition with meticulous roughness, thus obtains adhesion.
But when forming the wiring layer of thin copper clad layers, when copper clad layers is formed rough surface, described copper clad layers may be torn.
Therefore, according to a kind of embodiment of the present invention, can use thiolating compound in copper clad layers 10, form the surface-treated layer 20 formed by self-assembled monolayer, then by heating, surface-treated layer 20 is pressed and adheres to and with on the substrate of copper clad layers 10 phase bonding, thus can improve the adhesion between surface-treated layer 20 and described substrate.
In order to describe in more detail, with reference to figure 2, surface-treated layer 20 can have the functional group carrying out with the metallic atom on substrate surface reacting, thus forms self-assembled monolayer on the surface of copper clad layers 10.In addition, in order to form surface-treated layer 20, preferably use the surface conditioning agent that can form high-density film, this high-density film is formed by self-assembled monolayer gathering.In addition, described surface conditioning agent preferably has intermolecular interaction.
According to one embodiment of the present invention, form the thiol derivative of the thiolating compound of self-assembled monolayer using sulfydryl (-SH) and disulfide group (-S-S) as functional group, wherein, copper and sulphur (Cu-S) can form covalent bond.In addition, can pass through between alkyl chain and between aromatic rings
the Van der Waals force of superposition produces intermolecular active force.
There is chemical reaction to form surface-treated layer 20 in alkanethiol and the copper clad layers 10 that can form self-assembled monolayer, and alkanethiol as surfactant to prevent the reunion between metallic.
Therefore, by using the method for the self-assembled monolayer (SAM) forming alkanethiol, the thickness of molecular film can become very little, and the surface of copper clad layers 10 is formed by chemical reaction conjugated compound chemistry, more to contribute to improving adhesiveness.
According to the difference of alkanethiol derivant structure, as mercaptan, disulphide, long alkyl chains, functional end-group and the oligoethylene glycol (oligoethyleneglycol) that contains, alkanethiol derivative can form the SAMs with various feature.
Such as, as everyone knows, the self-assembled monolayer formed in the mercaptan in copper or disulfide derivatives has identical structure.When taking identical Cu-S structure, in mercaptan, also can produce hydrogen, and can cover if there is not the fact detecting sample.Weight due to thiol molecule is approximately the half of disulphide, and therefore, mercaptan has better dissolubility, to such an extent as to it is frequently used.But the difference between mercaptan and disulphide is, when functional end-group and mercaptan (Acibenzolar and maleimide) react, then need to use described disulphide.
Due to the impact of long alkyl chains, along with long alkyl chains is elongated, the stability of the self-assembled monolayer of formation can improve.Show, along with long alkyl chains is elongated, adsorbability material departs from metal electrode hardly and self-assembled monolayer can stably be formed.Further, show, long alkyl chains even greatly can affect the motion conditions using self-assembled monolayer to measure electronics.
Meanwhile, by means of only the performance using " the mixing self-assembled monolayer " of other derivatives multiple can control self-assembled monolayer.About the formation process of self-assembled monolayer and the orientation texture of self-assembled monolayer, by surface plasma body resonant vibration (SPR), quartz (controlled) oscillator microbalance (QCM), the methods such as cyclic voltammetry (CV) are evaluated.
As mentioned above, according to a kind of embodiment of the present invention, by forming the surface-treated layer 20 containing thiolating compound in copper clad layers 10, do not process rough surface, namely surface treated Copper Foil 1 can demonstrate Anchoring Effect (an anchor effort).
Fig. 3 is the schematic diagram of the copper clad laminate illustrated according to a kind of embodiment of the present invention.At this, in order to avoid repeat specification, quote Fig. 1 and Fig. 2 and be described.
With reference to Fig. 3, according to a kind of embodiment of the present invention, copper clad laminate 3 can comprise carrier 30 as one kind, the peel ply 40 be formed on described carrier 30 as one kind, the surface-treated layer 20 that is formed at the copper clad layers 10 on described peel ply 40 and is formed in described copper clad layers 10.
Carrier 30 as one kind can be formed by polymer, metal or analog, and carrier 30 as one kind can as reinforcing material for preventing the fold of copper clad layers 10.
When carrier 30 as one kind is formed by polymer, the thickness of carrier 30 as one kind can be formed the thickness with 15-200 μm, when the thickness of copper clad layers 30 is less than 15 μm, process may be not easy, and when the thickness of copper clad layers 10 is more than 200 μm, thickness adds, therefore, thinness can not realize.
The carrier 30 as one kind formed by polymer is selected from least one in such as PETG (PET), polyphenylene sulfide (PPS), polytetrafluoroethylene and fluoropolymer membrane (fluorine containing film).
Further, the carrier 30 as one kind formed by metal can be formed by the metal that can form interface of dissociating (release interface).Such as, can use and be selected from any one in alloy that copper (Cu), aluminium (Al) and their combination formed as described metal.In this case, the thickness of the carrier 30 as one kind formed by metal can be 10-30 μm.When the thickness of carrier 30 as one kind is less than 10 μm, the function supporting copper clad layers 10 may not be realized, and when the thickness of carrier 30 as one kind is more than 30 μm, in the lift-off processing of carrying out subsequently, copper clad layers may be not easy to be stripped.
Peel ply 40 can arrange and insert between copper clad layers 10 and carrier 30 as one kind, and described peel ply 40 can be formed by the inorganic agent being selected from silicon base compound, pyrrolyl compound or their mixture.
Such as, Si or SiO is selected from by using
2and a surface of any one surface treatment carrier 30 as one kind in composition can form the peel ply 40 formed by silicon base compound.In addition, be selected from BTA, tolyl-triazole, thyroidan, imidazoles by using, and a surface of any one surface treatment carrier 30 as one kind in their mixture can form the peel ply 40 using pyrrolyl compound.
Therefore, peel strength can be made to be stabilized in a lower level by using silicon base compound, pyrrolyl compound or their mixture to form peel ply 40.At this, peel ply 40 can be formed on carrier 30 as one kind by surface treatment, thus make peel ply 40 have the thickness of several nanometer.
Peel ply 40 can pass through the conventional method such as dipping method, spraying method, injection method and be formed, but the method forming peel ply 40 is not particularly limited to this.In order to meet technological design, can adopt arbitrarily and making the most even contact of the solution containing silicon and copper clad layers 10 and the method absorbing the solution containing silicon.
Copper clad layers 10 can be formed by copper and its thickness can be 0.1-5 μm, when the thickness of copper clad layers 10 is less than 0.1 μm, copper clad layers 10 may produce micropore, and when the thickness of copper clad layers 10 is more than 5 μm, copper clad layers 10 may not possess required fundamental property.
Copper clad layers 10 can by using sputtering, electron beam, chemical vapour deposition (CVD) (CVD), physical vapour deposition (PVD) (PVD), vacuum moulding machine, ion plating and the method such as plasma-deposited formation.
As mentioned above, copper clad layers 10 is not formed by galvanoplastic by sedimentation, so that form thin copper foil and do not need to reclaim electroplating solution.Described sedimentation be a kind ofly make deposition materials evaporate under the high temperature conditions, by a kind of materials adsorption to by the method for the surface of sorbing material also coating solid material thereon.
Be briefly described for sputtering and electron beam deposition, such as, when the raw material copper of film is for sputtering, sputtering method is as having the particle energy that increases copper and strengthening the advantage with the adhesion of sample (as the substrate in the specific embodiment of the present invention or substrate and copper clad layers 10).Further, no matter be alloy, compound etc., sputtering can form film not changing under composition ratio, even if when forming film in larger area, also can be formed uniformly the film of less distortion and deviation.
In addition, when electron beam deposition, the energy of molecule is less, and therefore adhesion is slightly weak, and when evaporating, the situation changing composition still film may occur and can be formed under a high vacuum, thus forms highly purified film.Further, described electron beam deposition has film forming speed faster.
Therefore, copper clad layers 10 can be formed by the mode of the condition meeting said method.At this, after peel ply 40 peels off copper clad layers 10, described electron beam deposition method can more easily be peeled off.
embodiment 1
Prepare thickness be the carrier (PET) of 100 μm and form peel ply on a surface of PET, Si is used to carry out surface treatment to peel ply, thus formation thickness is the peel ply of 500nm, the concentration with 5g/L is mixed as solvent with silicon by ion exchange water, to form peel ply, mixed solution is made to be adsorbed onto the surface of PET by spraying method, then, it is 150 DEG C in surface temperature, time is under the condition of 4 seconds, uses drier transpiring moisture to be prepared in sample carrier being formed with peel ply.
Then, in DC magnetic control sputtering device, prepare sample, then, prepare the copper target as target, and use DC magnetic control sputtering device to carry out RF plasma treatment to it, pressure is 50 millitorrs, and output density is 0.14W/cm
2, the time is 3 minutes, uses sputtering sedimentation to make on the copper absorption of separation to the peel ply of sample to form the copper clad layers that thickness is 1 μm.
In order to form surface-treated layer on the surface of copper clad layers, by flooding copper clad layers 30 minutes to form surface-treated layer in the phosphoric acid solution of 0.1 mole of (M) 2-aminoethyl disulfide dihydrochloride (Cystamine dihydrochloride), thus obtained copper clad laminate.
embodiment 2
Prepare copper clad laminate according to the method for embodiment 1, difference is, by flooding copper clad layers 1 hour to form surface-treated layer in the phosphoric acid solution of 0.1 mole of (M) 2-aminoethyl disulfide dihydrochloride.
embodiment 3
Prepare copper clad laminate according to the method for embodiment 1, difference is, by flooding copper clad layers 3 hours to form surface-treated layer in the phosphoric acid solution of 0.1 mole of (M) 2-aminoethyl disulfide dihydrochloride.
embodiment 4
Prepare thickness be the carrier (Copper Foil) of 18 μm and form peel ply on a surface of Copper Foil, BTA is used to carry out surface treatment to peel ply, thus formation thickness is the peel ply of 200nm, the concentration with 5g/L is mixed as solvent with BTA by ion exchange water, to form peel ply, mixed solution is made to be adsorbed onto the surface of Copper Foil by spraying method, then, it is 150 DEG C in surface temperature, time is under the condition of 4 seconds, uses drier transpiring moisture to be prepared in sample carrier being formed with peel ply.
Then, in electron beam deposition device, prepare sample, then, in electron beam deposition device, prepare the copper target as target.At this, inert gas injecting argon gas (Ar) in the chamber of electron beam deposition device, until the vacuum diagram of chamber from 5.0 × 10
-6holder is increased to 2.0 × 10
-5holder.Electron beam deposition device is used to make on the copper absorption of separation to the peel ply of sample to form the copper clad layers that thickness is 1 μm.
In order to form surface-treated layer on the surface of copper clad layers, by flooding copper clad layers in the acetone soln of 0.1 mole of (M) cystine, in acetone soln, then flood copper clad layers 2 minutes to form surface-treated layer, thus obtained copper clad laminate.
embodiment 5
Prepare copper clad laminate according to the method for embodiment 4, difference is, by flooding copper clad layers 5 minutes to form surface-treated layer in the acetone soln of the cystine of 0.1 mole (M).
embodiment 6
Prepare copper clad laminate according to the method for embodiment 4, difference is, by flooding copper clad layers 30 minutes to form surface-treated layer in the acetone soln of the cystine of 0.1 mole (M).
comparative example 1
Preparation comprises the sample being formed at the copper clad layers on carrier obtained by embodiment 1, then, the copper clad layers being prepared in sample is not formed the copper clad laminate of surface-treated layer.
comparative example 2
Preparation comprises the sample being formed at the copper clad layers on carrier obtained by embodiment 4, then, by the copper clad layers of impregnated sample in the acetone soln of the cystine of 0.1 mole (M) 2 minutes to form surface-treated layer, and by implementing decontamination (desmear) process with obtained copper clad laminate to copper clad layers and surface-treated layer.
embodiment 7
the preparation of printed circuit board (PCB)
Under temperature is 90 DEG C and pressure is the condition of 2MPa, use Morton CVA 725 vacuum laminator, copper clad laminate obtained for embodiment 3 and 6 is carried out vacuum lamination 20 seconds on the two sides of the insulated substrate (insulating barrier) containing epoxy resin, obtained printed circuit board (PCB).
detect physical property
The physical property evaluation of the copper clad laminate that embodiment 1-6 and comparative example 1 and 2 obtain is as shown in table 1 below.The copper clad layers obtained in above embodiment and comparative example and insulating barrier adhere to and cutting sample under integrated state, and based on the method that JISC6511 defines, with the working sample width of 10mm, measuring peel strength by peeling off Copper Foil from attachment/integrated copper clad layers and insulating barrier, adopting universal testing machine (UTM) to measure and evaluating the peel strength of copper clad layers and insulating barrier.
Table 1
| Classification (Division) | Peel strength (kgf/ ㎝) | Presence or absence circuit layer |
| Embodiment 1 | 0.36 | Exist |
| Embodiment 2 | 0.51 | Exist |
| Embodiment 3 | 0.68 | Exist |
| Embodiment 4 | 0.43 | Exist |
| Embodiment 5 | 0.60 | Exist |
| Embodiment 6 | 0.69 | Exist |
| Comparative example 1 | Do not detect | Do not exist |
| Comparative example 2 | Do not detect | Do not exist |
As can be drawn from Table 1, embodiment 3 comparatively embodiment 1 and 2 has better adhesion, also can draw, embodiment 6 has better adhesion compared with the embodiment 3 and 4 formed by metal.Meanwhile, comparative example 1 and 2 almost can't detect adhesion.In embodiment 3 and 6, can draw, chemical anchors (the chemical anchor) can be formed by sufficient adsorption time, and the measured value recorded is 0.6kgf/cm or larger, and it is applicable to adhesion layer.
According to a kind of embodiment of the present invention by surface treated Copper Foil, comprise the copper clad laminate of this surface treated Copper Foil and use the printed circuit board (PCB) of this surface treated Copper Foil, and the preparation method of this printed circuit board (PCB), when not processing rough surface, by forming surface-treated layer in copper clad layers, improve the adhesion of substrate and copper clad layers, thus improve the reliability with the printed circuit board (PCB) of circuit pattern.
More clearly the features and advantages of the present invention will be understood by reference to the accompanying drawings from following detailed description.
Although embodiments of the invention have been disclosed for illustration of object of the present invention, but it should be understood that the present invention is not limited to this, and those skilled in the art should understand that be, do not deviating under scope and spirit of the present invention, various change, increase and replacement are all possible.
Therefore, any and all changes, modification or equivalent arrangement all should be considered within the scope of the invention, and detailed scope of the present invention is by open by appended claim.
Claims (23)
1. a surface treated Copper Foil, this Copper Foil comprises:
Copper clad layers; With
Be formed at the surface-treated layer in described copper clad layers.
2. surface treated Copper Foil according to claim 1, wherein, the thickness of described copper clad layers is 0.1-5 μm.
3. surface treated Copper Foil according to claim 1, wherein, described surface-treated layer contains thiolating compound.
4. a copper clad laminate, this copper clad laminate comprises:
Carrier;
Be formed at the peel ply on described carrier;
Be formed at the copper clad layers on described peel ply; With
Be formed at the surface-treated layer in described copper clad layers.
5. copper clad laminate according to claim 4, wherein, described carrier is by forming described copper clad layers and the dissociate polymer at interface or metal are formed.
6. copper clad laminate according to claim 5, wherein, the carrier formed by polymer is selected from PETG (PET), polyphenylene sulfide (PPS), polytetrafluoroethylene and fluoropolymer membrane.
7. copper clad laminate according to claim 5, wherein, the thickness of the carrier formed by polymer is 15-200 μm.
8. copper clad laminate according to claim 5, wherein, the carrier formed by metal is selected from copper, aluminium or their combination.
9. copper clad laminate according to claim 5, wherein, the thickness of the carrier formed by metal is 10-30 μm.
10. copper clad laminate according to claim 4, wherein, described peel ply is selected from silicon base compound, pyrrolyl compound or their mixture.
11. copper clad laminates according to claim 4, wherein, the thickness of described copper clad layers is 0.1-5 μm.
12. copper clad laminates according to claim 4, wherein, described surface-treated layer contains thiolating compound.
13. 1 kinds of printed circuit board (PCB)s, this printed circuit board (PCB) comprises:
Insulating barrier;
Be formed at the surface-treated layer on described insulating barrier; With
Be formed at the circuit pattern on described surface-treated layer.
14. printed circuit board (PCB)s according to claim 13, wherein, described surface-treated layer contains thiolating compound.
15. printed circuit board (PCB)s according to claim 13, wherein, the thickness of described circuit pattern is 0.1-5 μm.
16. printed circuit board (PCB)s according to claim 13, wherein, the peel strength of described surface-treated layer and described insulating barrier is 0.6kgf/cm or larger.
17. printed circuit board (PCB)s according to claim 13, wherein, at least one in Naphthol-based Epoxy Resin, bisphenol A type epoxy resin, novolac epoxy resin, cresol novolac epoxy resins, rubber modified epoxy resin, phosphoric acid epoxy resin and bisphenol f type epoxy resin is selected from for the epoxy resin of described insulating barrier.
The preparation method of 18. 1 kinds of printed circuit board (PCB)s, the method comprises:
Insulating barrier is attached to the copper clad laminate comprising carrier, peel ply, copper clad layers and surface-treated layer;
Peel off the described carrier of described copper clad laminate and described peel ply; With
The copper clad layers of copper clad laminate described in patterning and surface-treated layer.
19. methods according to claim 18, wherein, the copper clad layers of described copper clad laminate and the patterning of surface-treated layer comprise:
Resist is coated in described copper clad layers;
Expose by the part of the resist film to coating and develop to form opening; And
Etching forms copper clad layers and the surface-treated layer in the region of opening.
20. methods according to claim 18, wherein, described copper clad layers by be selected from sputtering, electron beam, chemical vapour deposition (CVD) (CVD), physical vapour deposition (PVD) (PVD), vacuum moulding machine, ion plating and plasma-deposited at least one technique and formed.
21. methods according to claim 18, wherein, described peel ply is formed by any one technique be selected from dipping method, spraying method and injection method by the solution containing silicon base compound, pyrrolyl compound or their mixture.
22. methods according to claim 18, wherein, the thickness of described copper clad layers is 0.1-5 μm.
23. methods according to claim 18, wherein, the peel strength of described surface-treated layer and described insulating barrier is 0.6kgf/cm or larger.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20130120775 | 2013-10-10 | ||
| KR10-2013-0120775 | 2013-10-10 | ||
| KR10-2014-0055802 | 2014-05-09 | ||
| KR20140055802A KR20150042124A (en) | 2013-10-10 | 2014-05-09 | Surface-treated copper foil, copper clad laminate comprising the same, printed curcuit board using the same and manufactured method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104582312A true CN104582312A (en) | 2015-04-29 |
Family
ID=53035357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410531637.3A Pending CN104582312A (en) | 2013-10-10 | 2014-10-10 | Surface-treated copper foil, copper clad laminate comprising the same, printed circuit board using the same and manufacturing method thereof |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20150042124A (en) |
| CN (1) | CN104582312A (en) |
| TW (1) | TW201519711A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110571159A (en) * | 2019-08-01 | 2019-12-13 | 广东芯华微电子技术有限公司 | instant self-compensation method for improving large-scale chipset positioning accuracy |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107532281B (en) * | 2015-04-28 | 2020-01-24 | 三井金属矿业株式会社 | Surface-treated copper foil, method for producing same, copper-clad laminate for printed wiring board, and printed wiring board |
| JP6204430B2 (en) * | 2015-09-24 | 2017-09-27 | Ｊｘ金属株式会社 | Metal foil, metal foil with release layer, laminate, printed wiring board, semiconductor package, electronic device and method for manufacturing printed wiring board |
| KR20200142137A (en) * | 2019-06-11 | 2020-12-22 | 주식회사 포엠비 | Fluorine-based substrate with a low dielectric constant and manufacturing method thereof |
| KR102323921B1 (en) * | 2021-06-09 | 2021-11-08 | 에스케이넥실리스 주식회사 | Apparatus for Manufacturing Copper Foil |
-
2014
- 2014-05-09 KR KR20140055802A patent/KR20150042124A/en not_active Application Discontinuation
- 2014-09-25 TW TW103133121A patent/TW201519711A/en unknown
- 2014-10-10 CN CN201410531637.3A patent/CN104582312A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110571159A (en) * | 2019-08-01 | 2019-12-13 | 广东芯华微电子技术有限公司 | instant self-compensation method for improving large-scale chipset positioning accuracy |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201519711A (en) | 2015-05-16 |
| KR20150042124A (en) | 2015-04-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104582312A (en) | Surface-treated copper foil, copper clad laminate comprising the same, printed circuit board using the same and manufacturing method thereof | |
| KR100655557B1 (en) | Copper foil with extremely thin adhesive layer and method for producing the copper foil with extremely thin adhesive layer | |
| KR102472271B1 (en) | Circuit board and method for manufacturing the same | |
| TWI504323B (en) | Adhesiveless copper clad laminates and printed circuit board having adhesiveless copper clad laminates as base material | |
| JP3570802B2 (en) | Copper thin film substrate and printed wiring board | |
| CA2147334A1 (en) | Metallic body with vapor-deposited treatment layer(s) and adhesion-promoting layer | |
| JP4895611B2 (en) | Multilayer printed wiring board and method for producing multilayer printed wiring board | |
| US20060000637A1 (en) | Printed circuit board and method for manufacturing printed circuit board | |
| WO2008004399A1 (en) | Bonding resin composition for fluororesin substrates and metal-clad laminates made by using the composition | |
| JPH04304696A (en) | Formation of circuit for polymer circuit board by removal of chrome bonded layer with dc electricity | |
| US9758889B2 (en) | Method for producing substrate formed with copper thin layer, method for manufacturing printed circuit board and printed circuit board manufactured thereby | |
| CN100482034C (en) | Method for forming metal layer | |
| US20130033671A1 (en) | Liquid crystal polymer (lcp) surface layer adhesion enhancement | |
| Cho et al. | Micro-scale metallization of high aspect-ratio Cu and Au lines on flexible polyimide substrate by electroplating using SU-8 photoresist mask | |
| KR101203308B1 (en) | A two layer film, a method of manufacturing a two layer film, and a method of manufacturing a printed circuit board | |
| JP2007049116A (en) | Multilayer wiring board and manufacturing method thereof | |
| CN110634792B (en) | Manufacturing method of electrical interconnection substrate | |
| US20150101848A1 (en) | Surface-treated copper foil and copper-clad laminate plate including the same, printed curcuit board using the same, and method for manufacturing the same | |
| JP2006080473A (en) | Circuit board and process liquid for closely adhered layer | |
| JP2008277384A (en) | Adhesive sheet for build-up type multilayer board, and manufacturing method for circuit board using the same | |
| TW202220513A (en) | Method for producing printed circuit boards | |
| JP2007245646A (en) | Two-layered film, its manufacturing method and manufacturing method of printed circuit board | |
| CN108124392B (en) | Multilayer carrier foil | |
| JP6816566B2 (en) | Resin compositions, adhesive films, prepregs, multilayer printed wiring boards and semiconductor devices | |
| US7955485B2 (en) | Planar laminate substrate and method for fabricating organic laminate substrate PCBS, semiconductors, semiconductor wafers and semiconductor devices having miniaturized electrical pathways |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150429 |