CN104582275B - The preparation method of the pcb board of high frequency material and the pcb board of high frequency material - Google Patents
The preparation method of the pcb board of high frequency material and the pcb board of high frequency material Download PDFInfo
- Publication number
- CN104582275B CN104582275B CN201310487644.3A CN201310487644A CN104582275B CN 104582275 B CN104582275 B CN 104582275B CN 201310487644 A CN201310487644 A CN 201310487644A CN 104582275 B CN104582275 B CN 104582275B
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- China
- Prior art keywords
- pcb board
- high frequency
- frequency material
- cover plate
- connection position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0235—Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses the pcb board of a kind of preparation method of pcb board of high frequency material and high frequency material, main contents include：By the work flow for optimizing high frequency material, after plating, due to the also non-printed wiring figure of the pcb board of high frequency material, therefore, when the upper and lower capping cover plate of the pcb board of high frequency material carries out forming processes, upper and lower cover plate and the pcb board of high frequency material are combined closely, and do not produce space, and burr or flash will not be produced in forming processes；After forming processes after post forming is carried out to the pcb board of high frequency material, the pcb board of high frequency material is prepared.It is thus possible to so that again be capped cover plate when, the connection position and line pattern can combine closely with cover plate, be not in space, it is ensured that burr or flash will not be produced during forming processes.
Description
Technical field
The present invention relates to printed circuit board manufacturing field, more particularly to a kind of preparation method of pcb board of high frequency material and
The pcb board of high frequency material.
Background technology
In current PCB industries, for the processing method and the pcb board of other conventional materials of the pcb board of high frequency material
Processing method it is basically identical, including：Blanking, inner figure, pressing, drilling, PTH/ plating, outer graphics, at anti-welding, surface
Reason, shaping, repair（Manually repair flash）, electrical measurement, visual examination, packaging shipment.Wherein, after plating is completed, lead to
Cross and pcb board is performed etching, form outer graphics（I.e. printing forms line pattern）.After subsequent passing through surface treatment,
The upper and lower capping cover plate of pcb board, and using the molding mode of mechanical milling or punching press, pcb board is cut into required size, shape
The PCB daughter boards of shape.
As shown in figure 1, to have been completed the pcb board of the high frequency material of surface treatment, wherein, the pcb board of high frequency material
On have a line pattern that etching forms, certain drop be present with pcb board plane in the line pattern.And then forming Fig. 2 institutes
When the capping shown has the pcb board of high frequency material of upper and lower cover plate, space as shown in Figure 2 can be produced, and this space is by height
The thickness of line pattern on the pcb board of frequency material（Copper is thick）Determine, the thickness of line pattern is bigger, upper cover plate and high frequency material
The space of the pcb board of material is bigger.
With polytetrafluoroethylene (PTFE)（PTFE, Poly tetra fluoro tehylene）Exemplified by the pcb board of this high frequency material,
Because the material of PTFE material is very soft, cutting ability is poor, thread or sheet waste material caused by shaping, due to cover plate with
Space be present because circuit supports mutually between pcb board, therefore, caused waste material can be bonded at the surface of pcb board, a large amount of so as to produce
Burr or flash, it is necessary to removed using external force, that is, need to repair（Manually repair flash）Technique.
As can be seen here, need to spend substantial amounts of manpower to go to repair removing, and repair procedures once burr or flash is produced
In easily cause scrapping for product, therefore, the preparation method for finding a kind of new pcb board is needed badly, to avoid being directed to high frequency material
Pcb board produce burr or flash when preparing.
The content of the invention
The embodiment of the present invention provides a kind of preparation method of pcb board of high frequency material and the pcb board of high frequency material, to solve
The problem of burr or flash being produced when forming processes in the prior art certainly be present.
The embodiment of the present invention uses following technical scheme：
A kind of preparation method of the pcb board of high frequency material, methods described include：
After plating is completed, in the upper and lower capping cover plate of pcb board, and according to line pattern to be printed and default
The size of pcb board, one-shot forming processing is carried out to the pcb board；
Upper and lower cover plate is removed to the pcb board after progress one-shot forming processing, and printing shape is carried out to the surface of the pcb board
Into line pattern.
In embodiments of the present invention, by adjusting printed wiring figure and the order of shaping, forming processes are first carried out, then print
Line pattern processed, thereby may be ensured that pcb board will not produce space when being capped cover plate, produced when avoiding one-shot forming burr or
Flash.
Preferably, if the pcb board need to cut to obtain multiple PCB daughter boards, when the one-shot forming is handled, retain
It is used for the connection position that each PCB daughter boards link together in pcb board；
When carrying out printing to the pcb board and forming line pattern, retain the connection position so that the connection position of reservation
Height is equal with the line levels that printing is formed；
The surface of the pcb board is carried out after printing forms line pattern, methods described also includes：
Carrying out printing the upper and lower capping cover plate of the pcb board for forming surface lines figure, the pcb board is being carried out secondary
Forming processes, remove the connection position.
In embodiments of the present invention, connection position is remained in one-shot forming so that the printing afterwards forms line map
During shape, the printing of line pattern can be carried out to whole pcb board.
Preferably, the connection position is connected with the circuit in each PCB daughter boards being connected.
In embodiments of the present invention, by the height of connection position is equal with the line levels that printing is formed and each with being connected
Circuit in PCB daughter boards is connected, and therefore, when post forming removes connection position, will not produce burr or flash.
The pcb board for the high frequency material that a kind of preparation method of pcb board using high frequency material obtains.
In embodiments of the present invention, connection position is remained in one-shot forming so that the printing afterwards forms line map
During shape, the printing of line pattern can be carried out to whole pcb board.
Preferably, the pcb board of the high frequency material is the pcb board of PTFE material.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, make required in being described below to embodiment
Accompanying drawing is briefly introduced, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for this
For the those of ordinary skill in field, without having to pay creative labor, it can also be obtained according to these accompanying drawings
His accompanying drawing.
Fig. 1 is the schematic diagram of the pcb board for the high frequency material for having been completed surface treatment in the prior art；
Fig. 2 is the schematic diagram of the pcb board for the high frequency material that capping in the prior art has upper and lower cover plate；
Fig. 3 is a kind of preparation method flow chart of the pcb board for high frequency material that the embodiment of the present invention one provides；
Fig. 4 is the schematic diagram of the pcb board of the high frequency material after being electroplated in the embodiment of the present invention one；
Fig. 5 is the schematic diagram that plating back shroud and the pcb board of high frequency material are combined closely in the embodiment of the present invention one；
Fig. 6 is the schematic diagram of the connection position of the pcb board of the medium-high frequency material of the embodiment of the present invention one.
Embodiment
In order that the object, technical solutions and advantages of the present invention are clearer, the present invention is made below in conjunction with accompanying drawing into
One step it is described in detail, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole implementation
Example.Based on the embodiment in the present invention, what those of ordinary skill in the art were obtained under the premise of creative work is not made
All other embodiment, belongs to the scope of protection of the invention.
The problem of in order to avoid easily producing burr or flash when being prepared for the pcb board of high frequency material, can be by excellent
Change the work flow of high frequency material, after plating, due to the also non-printed wiring figure of the pcb board of high frequency material, therefore, in height
When the upper and lower capping cover plate of the pcb board of frequency material carries out forming processes, the pcb board of upper and lower cover plate and high frequency material is closely tied
Close, do not produce space, burr or flash will not be produced in forming processes；In the PCB to high frequency material after forming processes
After plate carries out post forming, the pcb board of high frequency material is prepared.
It should be noted that for convenience, the material of involved pcb board and PCB daughter boards is high frequency material below
Material.
The present invention program is described in detail with reference to specific embodiment, it is necessary to illustrate it is all not office of the invention
It is limited to following examples.
Embodiment one：
The embodiment of the present invention one provides a kind of preparation method of the pcb board of high frequency material, as shown in figure 3, mainly including
Following steps：
Step 101：After plating is completed, in the upper and lower capping cover plate of pcb board, and according to line pattern to be printed
With the size of default pcb board, one-shot forming processing is carried out to the pcb board.
As shown in figure 4, be the pcb board after plating, it is necessary to upper and lower position by described pcb board in this step 101
Cover plate is capped, because pcb board does not carry out the operation of printed wiring figure also, therefore, in the upper and lower capping cover plate of pcb board,
Upper and lower cover plate can combine closely with pcb board, not produce any space.As shown in figure 5, closely tied with pcb board for plating back shroud
The schematic diagram of conjunction.
Why such effect can be reached, be to follow traditional preparation flow because of this step 101, but
One-shot forming processing is added after plating before printed wiring figure（Mainly according to line pattern to be printed and default
The size of pcb board, pcb board is needed to the position milling sky of mill off）, avoid in traditional preparation technology, because of first printed wiring figure
Shape causes the pcb board surface drop to be present, then is capped cover plate and carries out producing space during forming processes, during caused forming processes
The problem of producing burr or flash.
And in this step 101, after cover plate is capped to the pcb board, due to closely being tied between cover plate and the pcb board
It is combined, any space will not be produced, therefore, after carrying out one-shot forming processing to the pcb board, default chi can be obtained
Very little, shape pcb board, and will not produce burr or flash during one-shot forming processing.
The one-shot forming can include but is not limited to the modes such as mechanical milling or punching press, and the embodiment of the present invention is not done herein
It is specific to limit.
It should be noted that the processing technology before step 101 includes：The techniques such as blanking, inner figure, pressing and drilling
Flow, this several technique belongs to prior art, therefore repeats no more.
Step 102：Upper and lower cover plate is removed to the pcb board after progress one-shot forming processing, and the surface of the pcb board is entered
Row printing forms line pattern.
After one-shot forming processing is completed to the pcb board, upper and lower cover plate is removed, and the pcb board is printed
Form line pattern.
Afterwards, it is possible to carry out the streams such as outer graphics processing, anti-welding, surface treatment, electrical measurement, visual examination, packaging shipment
Journey.
Due to having carried out one-shot forming processing to pcb board in a step 101, therefore, it is prepared into after performing this step 102
Into the technique of pcb board, molding process will not produce burr or flash, so as to reduce the cost of manual repair, carry
Production efficiency is risen, while ensure that the quality and qualification rate of product.
Preferably, if pcb board need to cut to obtain multiple PCB daughter boards, in the one-shot forming processing of step 101, it is impossible to
Directly pcb board is cut, because, in a step 102, also need to carry out pcb board the operation of printed wiring figure.
In this case, when can carry out one-shot forming in a step 101, retain the company for being used to link together each PCB daughter boards in pcb board
Connect position.
As shown in fig. 6, the schematic diagram of the connection position for the pcb board of high frequency material, it is assumed that have determined that treat before step 101
The line pattern of printing is as shown in dash area in Fig. 6, and pcb board need to cut to obtain 4 identical PCB daughter boards, then can be by institute
State connection position and be designed to the form connected with the circuit in each PCB daughter boards being connected, handled in the one-shot forming of step 101
Afterwards, connection position as shown in Figure 6 is retained.Printing is carried out in a step 102 when forming the processing of line pattern, still retains connection
Position so that after printing forms circuit, the height of connection position is equal with the line levels that printing is formed, advantage of this is that,
Step 102 and then after anti-welding, process of surface treatment, also need to carry out post forming processing, remove the connection position,
When removing the connection position, it is necessary in the upper and lower capping cover plate of pcb board, be connected with the circuit in each PCB daughter boards due to connection position and
Height is equal with line levels, and therefore, the circuit that cover plate is connected with connection position, the connection position is combined closely, without space,
When carrying out post forming processing, flash or burr will not be also produced.
Still by taking Fig. 6 as an example, cover plate and A points in Fig. 6（Circuit in PCB daughter boards 1）, C points（Circuit in PCB daughter boards 3）And B
Point（Connect the connection position of A points and C points）Combine closely, when the connection position of B points is removed in post forming, flash or hair will not be produced
Thorn.
Fig. 6 is a kind of feasible connection position design method, but the embodiment of the present invention is not done to the design structure of connection position
Limit, for example, the structure of connection position in Fig. 6 can be deformed, retain wherein three connection positions, can still realize implementation of the present invention
The scheme of example.
In embodiments of the present invention, by retaining connection position on the pcb board of high frequency material, and the height of the connection position is made
It is equal with the height of pre-printed line pattern, so as in post forming, ensure the connection position and line pattern
To be combined closely with cover plate, space is avoided the occurrence of, and then ensures that during post forming processing burr or flash will not be produced.
The preparation method of the pcb board of the high frequency material provided corresponding to the embodiment of the present invention one, present invention also offers one
The pcb board for the high frequency material that kind is prepared using the method described in embodiment one, the pcb board of the high frequency material is PTFE material
Pcb board.
Although preferred embodiments of the present invention have been described, but those skilled in the art once know basic creation
Property concept, then can make other change and modification to these embodiments.So appended claims be intended to be construed to include it is excellent
Select embodiment and fall into having altered and changing for the scope of the invention.
Obviously, those skilled in the art can carry out the essence of various changes and modification without departing from the present invention to the present invention
God and scope.So, if these modifications and variations of the present invention belong to the scope of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprising including these changes and modification.
Claims (5)
1. a kind of preparation method of the pcb board of high frequency material, it is characterised in that methods described includes：
After plating is completed, in the upper and lower capping cover plate of pcb board, and according to line pattern to be printed and default pcb board
Size, to the pcb board carry out one-shot forming processing；
Remove upper and lower cover plate to carrying out the pcb board after one-shot forming processing, and printing is carried out to the surface of the pcb board and forms line
Road figure；
If the pcb board need to cut to obtain multiple PCB daughter boards, when the one-shot forming is handled, being used in reservation pcb board will
The connection position that each PCB daughter boards link together；
When carrying out printing to the pcb board and forming line pattern, retain the connection position so that the height of the connection position of reservation
It is equal with the line levels that printing is formed.
2. the method as described in claim 1, it is characterised in that the surface of the pcb board is carried out printing formed line pattern it
Afterwards, methods described also includes：
Carrying out printing the upper and lower capping cover plate of the pcb board for forming surface lines figure, post forming is carried out to the pcb board
Processing, removes the connection position.
3. method as claimed in claim 2, it is characterised in that the connection position and the circuit in each PCB daughter boards being connected
It is connected.
A kind of 4. pcb board for the high frequency material being prepared using any described methods of claim 1-3.
5. pcb board as claimed in claim 4, it is characterised in that the pcb board of the high frequency material is the pcb board of PTFE material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310487644.3A CN104582275B (en) | 2013-10-17 | 2013-10-17 | The preparation method of the pcb board of high frequency material and the pcb board of high frequency material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310487644.3A CN104582275B (en) | 2013-10-17 | 2013-10-17 | The preparation method of the pcb board of high frequency material and the pcb board of high frequency material |
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| Publication Number | Publication Date |
|---|---|
| CN104582275A CN104582275A (en) | 2015-04-29 |
| CN104582275B true CN104582275B (en) | 2017-12-05 |
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| CN201310487644.3A Active CN104582275B (en) | 2013-10-17 | 2013-10-17 | The preparation method of the pcb board of high frequency material and the pcb board of high frequency material |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104869761B (en) * | 2015-05-08 | 2018-03-02 | 深圳崇达多层线路板有限公司 | A kind of preparation method of flex plate in the rigid-flexible combined circuit board of outer layer |
| CN107529277B (en) * | 2016-06-21 | 2020-03-06 | 北大方正集团有限公司 | Circuit board forming method |
| CN111954380A (en) * | 2020-08-27 | 2020-11-17 | 丰顺科威达电子有限公司 | High-frequency plate burr-free processing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1805659A (en) * | 2005-12-30 | 2006-07-19 | 深圳市深南电路有限公司 | Milling and deburring method for PCB board |
| CN101820728A (en) * | 2010-04-08 | 2010-09-01 | 深南电路有限公司 | Technological method for processing printed circuit board (PCB) with stepped groove |
| CN102065644A (en) * | 2010-12-14 | 2011-05-18 | 广东大普通信技术有限公司 | Method for making and packaging printed circuit board (PCB) and crystal oscillator |
| CN102647857A (en) * | 2012-04-27 | 2012-08-22 | 惠州中京电子科技股份有限公司 | Manufacture process of printed circuit board |
| CN103298245A (en) * | 2013-06-14 | 2013-09-11 | 东莞生益电子有限公司 | Manufacture method for high-frequency circuit board and circuit board manufactured through method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11126965A (en) * | 1997-10-24 | 1999-05-11 | Victor Co Of Japan Ltd | Manufacture of printed board |
-
2013
- 2013-10-17 CN CN201310487644.3A patent/CN104582275B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1805659A (en) * | 2005-12-30 | 2006-07-19 | 深圳市深南电路有限公司 | Milling and deburring method for PCB board |
| CN101820728A (en) * | 2010-04-08 | 2010-09-01 | 深南电路有限公司 | Technological method for processing printed circuit board (PCB) with stepped groove |
| CN102065644A (en) * | 2010-12-14 | 2011-05-18 | 广东大普通信技术有限公司 | Method for making and packaging printed circuit board (PCB) and crystal oscillator |
| CN102647857A (en) * | 2012-04-27 | 2012-08-22 | 惠州中京电子科技股份有限公司 | Manufacture process of printed circuit board |
| CN103298245A (en) * | 2013-06-14 | 2013-09-11 | 东莞生益电子有限公司 | Manufacture method for high-frequency circuit board and circuit board manufactured through method |
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| CN104582275A (en) | 2015-04-29 |
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Address after: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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Effective date of registration: 20220919 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |
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