CN106163135A - A kind of partial hybrid board structure of circuit and processing method thereof - Google Patents
A kind of partial hybrid board structure of circuit and processing method thereof Download PDFInfo
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- CN106163135A CN106163135A CN201510190551.3A CN201510190551A CN106163135A CN 106163135 A CN106163135 A CN 106163135A CN 201510190551 A CN201510190551 A CN 201510190551A CN 106163135 A CN106163135 A CN 106163135A
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- pcb
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Abstract
Embodiments provide a kind of partial hybrid board structure of circuit and processing method thereof, for solving the problems referred to above that the structure of circuit board multimode in prior art exists, to improve make efficiency and the integrated level of circuit board, reduce cost.Offer PCB motherboard is provided, there is inside PCB motherboard resistance film；Slot corresponding to the position of resistance film at PCB motherboard, and resistance film is removed, obtain step groove；Use the first prepreg that step groove carries out preset filling, form daughter board groove；Place layer reinforced structure on the surface of PCB motherboard, layer reinforced structure has, corresponding to the position of daughter board groove, the first groove mated with daughter board groove；Being positioned in daughter board groove by pre-processed PCB daughter board, carry out pressing, form partial hybrid PCB, PCB daughter board is different with the material of the insulating barrier of PCB motherboard.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to a kind of partial hybrid board structure of circuit and add
Work method.
Background technology
In current circuit board technology, circuit structure includes radio-frequency module, high-speed module, high-frequency model
With power module etc., disparate modules need to apply different printed circuit board (Printed Circuit Board,
PCB) sheet material.
Prior art is to process multiple PCB of modules, connects each by the way of socket and lead-in wire
PCB, thus realize the structure of multimode.
But, multiple PCB connect by the way of socket and lead-in wire, and the volume causing circuit structure is relatively big,
Need the step implementing to connect multiple PCB so that work efficiency is low so that the consumption of material is big.
Summary of the invention
Embodiments provide a kind of partial hybrid board structure of circuit and processing method thereof, be used for solving
The problems referred to above that in prior art, the structure of circuit board multimode exists, to improve the make efficiency of circuit board
And integrated level, reduce cost.
First aspect present invention provides the processing method of a kind of partial hybrid board structure of circuit, including following step
Rapid:
S1, offer printing board PCB motherboard, have resistance film inside described PCB motherboard；
S2, slot corresponding to the position of described resistance film at described PCB motherboard, and by described resistance glue
Sheet is removed, and obtains step groove；
S3, use the first prepreg that described step groove carries out preset filling, form daughter board groove；
S4, the surface of described PCB motherboard place layer reinforced structure, described layer reinforced structure correspond to described son
The position of board slot has the first groove mated with described daughter board groove；
S5, pre-processed PCB daughter board is positioned in described daughter board groove, carries out pressing, formation office
Portion's mixed pressure PCB, described PCB daughter board is different with the material of the insulating barrier of described PCB motherboard.
Second aspect present invention provides a kind of partial hybrid board structure of circuit, including:
Printing board PCB motherboard, layer reinforced structure and PCB daughter board；
Described PCB motherboard has daughter board groove, and described layer reinforced structure is in the surface of described PCB motherboard, institute
State layer reinforced structure and there is in the position of described daughter board groove the first groove mated with described daughter board groove, described
PCB daughter board is positioned among the described daughter board groove of described PCB motherboard, described PCB motherboard and described PCB
The material of the insulating barrier of daughter board is different.
As can be seen from the above technical solutions, the embodiment of the present invention has the advantage that
In the present invention, the PCB motherboard that inside has resistance film is slotted, after film removal will be hindered,
To step groove, according to PCB daughter board, step groove is carried out the filling of the first cured sheets, form daughter board groove,
Place layer reinforced structure on PCB motherboard, PCB daughter board is positioned in daughter board groove, carries out pressing, obtain office
Mixed pressure PCB, PCB motherboard in portion's is different with the material of the insulating barrier of PCB daughter board, therefore, it can exist respectively
Two kinds of modules of circuit board are formed on the PCB motherboard region of partial hybrid PCB and PCB sub-tile areas,
By the way of socket and lead-in wire, each PCB, PCB motherboard and PCB daughter board bag is connected relative to prior art
It is contained in partial hybrid PCB, it is not necessary to implement the step connected, eliminates socket and the space taken that goes between
And material, improve work efficiency and the integrated level of circuit board processing, save the cost of making.
Accompanying drawing explanation
Fig. 1 is the flow chart of the processing method of the partial hybrid board structure of circuit of the embodiment of the present invention；
Fig. 2 provides the schematic diagram of PCB motherboard for the embodiment of the present invention；
Fig. 3 provides the schematic diagram of the first central layer for the embodiment of the present invention；
Fig. 4 is the schematic diagram that the embodiment of the present invention forms the second groove；
Fig. 5 is the schematic diagram that the embodiment of the present invention forms the PCB motherboard with step groove；
Fig. 6 is the schematic diagram that the embodiment of the present invention forms the PCB motherboard with resin hole and electrodeposited coating；
Fig. 7 is the schematic diagram that the embodiment of the present invention forms daughter board groove；
Fig. 8 is the schematic diagram that the embodiment of the present invention places layer reinforced structure on PCB motherboard；
Fig. 9 is the structural representation of the partial hybrid circuit board that the embodiment of the present invention is formed；
The structural representation of a kind of partial hybrid circuit board that Figure 10 provides for the embodiment of the present invention.
Detailed description of the invention
Embodiments provide a kind of partial hybrid board structure of circuit and processing method thereof, be used for solving
The problems referred to above that in prior art, the structure of circuit board multimode exists, to improve the make efficiency of circuit board
And integrated level, reduce cost.
In order to be illustrated more clearly that embodiment of the present invention technical scheme, below will be to embodiment and prior art
In description, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is only
It is only some embodiments of the present invention, for those of ordinary skill in the art, is not paying creativeness
On the premise of work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Referring to Fig. 1, the embodiment of the present invention provides the processing method of a kind of partial hybrid board structure of circuit, should
Method can comprise the following steps that
Step S1, offer PCB motherboard, have resistance film inside PCB motherboard；
As in figure 2 it is shown, be the schematic diagram of PCB motherboard 20 that provides of the embodiment of the present invention, PCB motherboard interior
Portion has resistance film 201.
Optionally, as shown in Figure 3, it is provided that a PCB, a PCB comprises one piece of first central layer 301,
The material of the insulating barrier 302 of the first central layer 301 is the first material, as shown in Figure 4, carries out a PCB
Fluting, forms the second groove 401, should matching with resistance film 201 of the second groove 401, will resistance film 201
It is positioned in the second groove 401, carries out a PCB increasing layer, form PCB motherboard 20 as shown in Figure 2,
Resistance film 201 is imbedded the inside of PCB motherboard 20, and resistance film 201 can be Teflon pad or other tools
There is the pad that the material of resistance glue characteristic makes.
It should be noted that a PCB comprises one or more the first central layer, particular number does not limits.
Step S2, PCB motherboard corresponding to resistance film position slot, and will resistance film remove,
Obtain step groove；
In this step, controlled depth milling groove technique is utilized to slot corresponding to the position of resistance film at PCB motherboard,
Bottom land touches resistance film, is removed by resistance film, obtains step groove 501 as shown in Figure 5.
Optionally, as shown in Figure 6, PCB motherboard 20 is holed, obtain through hole 601, to PCB
Motherboard 20 is electroplated, and the hole wall at the surface of PCB motherboard 20 and through hole 601 forms electrodeposited coating 602, right
Through hole 601 carries out filling holes with resin process, forms resin hole 603.
Step S3, use the first prepreg that step groove carries out preset filling, form daughter board groove；
As it is shown in fig. 7, use the first prepreg 701 that step groove 501 carries out preset filling, form daughter board
Groove 702, the first prepreg 701 not can exceed that the surface of PCB motherboard 20, the daughter board formed after preset filling
Groove 702 should match with PCB daughter board.
Step S4, the surface of PCB motherboard place layer reinforced structure；
As shown in Figure 8, layer reinforced structure 80, wherein PCB motherboard 20 1 are placed on the surface of PCB motherboard 20
The position that layer reinforced structure 80 on surface corresponds to daughter board groove 702 has first mated with daughter board groove 702 and leads to
Groove 801.
Optionally, the electrodeposited coating on the surface of PCB motherboard is placed the second prepreg, the second semi-solid preparation
The thickness of sheet is less than 125um, the layers of copper on second one surface of central layer is removed, and the thickness of the second central layer is little
In 125um, the material of the insulating barrier of the second central layer is identical with the material of PCB motherboard insulating barrier, by second
Central layer does not has the one side of layers of copper to be positioned on the second prepreg, forms layer reinforced structure, at layer reinforced structure
Slotting in position corresponding to daughter board groove, forms the first groove mated with daughter board groove.
It should be noted that layer reinforced structure can one layer of second core plate structure as shown in Figure 9, or such as
Bilayer the second core plate structure shown in Figure 10, or the structure of other more layers the second central layers, do not do
Limit.
Step S5, pre-processed PCB daughter board is positioned in daughter board groove, carries out pressing, formation office
Portion's mixed pressure PCB.
As it is shown in figure 9, be positioned in daughter board groove 702 by pre-processed PCB daughter board 90, carry out pressing,
Forming partial hybrid PCB, the material of the insulating barrier of PCB daughter board is the second material, with PCB motherboard and the
The first material of the insulating barrier of two central layers differs.
Optionally, it is provided that polylith the 3rd central layer and the 3rd prepreg, the material of the insulating barrier of the 3rd central layer
Material is the second material, places one piece of the 3rd prepreg, carry out pressing between two piece of the 3rd central layer,
Forming the 2nd PCB, the 2nd PCB can be double-deck or multi-layer PCB, according in processing technique to circuit board
Requirement, the 2nd PCB is carried out preset processing, such as, holes, electroplates, milling limit etc., form PCB daughter board.
It should be noted that the material of the insulating barrier of PCB motherboard and the second central layer can be to appoint in prior art
What a kind of material being applicable to board dielectric layer, the material of the insulating barrier of PCB daughter board can be prior art
Any one of be applicable to the material of board dielectric layer, but, PCB motherboard and the insulating barrier of PCB daughter board
Material can not be identical.
Optionally, as shown in Figure 10, holing partial hybrid PCB, wherein layer reinforced structure 80 is double-deck
The structure of the second central layer, obtains double rank blind hole 1001.
It should be noted that the exponent number of blind hole can be single order or multistage, concrete exponent number with increase layer knot
Structure is correlated with, and the concrete exponent number of blind hole does not limits.
In sum, the embodiment of the present invention has the advantage that
The PCB motherboard that inside has resistance film is slotted, after film removal will be hindered, obtains step groove, root
According to PCB daughter board, step groove is carried out the filling of the first cured sheets, forms daughter board groove, PCB motherboard is placed
Layer reinforced structure, is positioned over PCB daughter board in daughter board groove, carries out pressing, obtain partial hybrid PCB, PCB
Motherboard is different with the material of the insulating barrier of PCB daughter board, therefore, it can respectively at the PCB of partial hybrid PCB
Form two kinds of modules of circuit board on motherboard region and PCB sub-tile areas, pass through socket relative to prior art
Connect each PCB, PCB motherboard and PCB daughter board with the mode of lead-in wire and be included in partial hybrid PCB, it is not necessary to
Implement the step connected, eliminate socket and the space and material taken that go between, improve circuit board processing
Work efficiency and integrated level, save the cost of making.
Embodiment two,
Referring to Figure 10, the embodiment of the present invention provides a kind of partial hybrid board structure of circuit, it may include:
PCB motherboard 20, layer reinforced structure 80 and PCB daughter board 90；
PCB motherboard 20 has daughter board groove 702, and layer reinforced structure 80 is in the surface of PCB motherboard 20, increases layer knot
Structure 20 has the first groove 801 mated with daughter board groove 702, PCB daughter board 90 in the position of daughter board groove 702
It is positioned among the daughter board groove 702 of PCB motherboard 20, the material of the insulating barrier of PCB motherboard 20 and PCB daughter board 90
Different.
Optionally, PCB motherboard 20 has resin hole 603, and layer reinforced structure 80 has blind hole 1001.
Optionally, the surface of PCB motherboard 20 and the hole wall outer layer in resin hole 603 have electrodeposited coating 602.
Optionally, the material of the insulating barrier of layer reinforced structure 80 is identical with the material of the insulating barrier of PCB motherboard 20.
It should be noted that the exponent number of blind hole 1001 can be single order or multistage, concrete exponent number and increasing
Rotating fields is correlated with, and the concrete exponent number of blind hole does not limits.
It should be noted that layer reinforced structure can a Rotating fields as shown in Figure 9, or as shown in Figure 10
Double-decker, or the structure of other multilamellars, do not limit.
It should be noted that the material of the insulating barrier of PCB motherboard and layer reinforced structure can be to appoint in prior art
What a kind of material being applicable to board dielectric layer, the material of the insulating barrier of PCB daughter board can be prior art
Any one of be applicable to the material of board dielectric layer, but, PCB motherboard and the insulating barrier of PCB daughter board
Material can not be identical.
In sum, the embodiment of the present invention has the advantage that
The PCB motherboard that inside has resistance film is slotted, after film removal will be hindered, obtains step groove, root
According to PCB daughter board, step groove is carried out the filling of the first cured sheets, forms daughter board groove, PCB motherboard is placed
Layer reinforced structure, is positioned over PCB daughter board in daughter board groove, carries out pressing, obtain partial hybrid PCB, PCB
Motherboard is different with the material of the insulating barrier of PCB daughter board, therefore, it can respectively at the PCB of partial hybrid PCB
Form two kinds of modules of circuit board on motherboard region and PCB sub-tile areas, pass through socket relative to prior art
Connect each PCB, PCB motherboard and PCB daughter board with the mode of lead-in wire and be included in partial hybrid PCB, it is not necessary to
Implement the step connected, eliminate socket and the space and material taken that go between, improve circuit board processing
Work efficiency and integrated level, save the cost of making.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and does not has in certain embodiment
The part described in detail, may refer to the associated description of other embodiments.
It should be noted that for aforesaid each method embodiment, in order to be briefly described, therefore by its all table
Stating as a series of combination of actions, but those skilled in the art should know, the present invention is by being retouched
Stating the restriction of sequence of movement, because according to the present invention, some step can use other order or simultaneously
Carry out.Secondly, those skilled in the art also should know, embodiment described in this description belongs to
Preferred embodiment, necessary to involved action and the module not necessarily present invention.
A kind of partial hybrid board structure of circuit provided the embodiment of the present invention above and processing method thereof are entered
Go and be discussed in detail, but the explanation of above example has been only intended to help to understand method and the core thereof of the present invention
Thought is thought, should not be construed as limitation of the present invention.Those skilled in the art, according to the present invention
Thought, in the technical scope that the invention discloses, the change that can readily occur in or replacement, all should contain
Within protection scope of the present invention.
Claims (10)
1. the processing method of a partial hybrid board structure of circuit, it is characterised in that comprise the following steps:
S1, offer printing board PCB motherboard, have resistance film inside described PCB motherboard；
S2, slot corresponding to the position of described resistance film at described PCB motherboard, and by described resistance glue
Sheet is removed, and obtains step groove；
S3, use the first prepreg that described step groove carries out preset filling, form daughter board groove；
S4, the surface of described PCB motherboard place layer reinforced structure, described layer reinforced structure correspond to described son
The position of board slot has the first groove mated with described daughter board groove；
S5, pre-processed PCB daughter board is positioned in described daughter board groove, carries out pressing, formation office
Portion's mixed pressure PCB, described PCB daughter board is different with the material of the insulating barrier of described PCB motherboard.
The processing method of partial hybrid board structure of circuit the most according to claim 1, it is characterised in that
Described offer PCB motherboard includes:
Thering is provided a PCB and resistance film, a described PCB comprises at least one piece of first central layer, and described the
The insulating barrier of one central layer uses the first material；
Oneth PCB is slotted, forms the second groove；
Described resistance film is positioned over described second groove；
Carrying out a described PCB increasing layer, form PCB motherboard, described PCB imbedded by described resistance film
Inside motherboard.
The processing method of partial hybrid board structure of circuit the most according to claim 2, it is characterised in that
Described slot corresponding to the position of described resistance film at described PCB motherboard, and described resistance film is gone
Remove, also include before obtaining step groove:
Described PCB motherboard is holed, obtains through hole；
Described PCB motherboard is electroplated, at surface and the hole wall of described through hole of described PCB motherboard
Form electrodeposited coating；
Described through hole is carried out filling holes with resin process, forms resin hole.
The processing method of partial hybrid board structure of circuit the most according to claim 3, it is characterised in that
Described layer reinforced structure of placing on the surface of described PCB motherboard includes:
The second prepreg is placed on described electrodeposited coating surface；
The layers of copper on second one surface of central layer being removed, the material of the insulating barrier of described second central layer is with described
The material of PCB motherboard insulating barrier is identical；
Described second central layer does not has the one side of layers of copper be positioned on described second prepreg, is formed and increase
Rotating fields；
Described layer reinforced structure is slotted, forms the first groove matched with described daughter board groove.
The processing method of partial hybrid board structure of circuit the most according to claim 1, it is characterised in that
Described pre-processed PCB daughter board is positioned in described daughter board groove, carries out pressing, form local mixed
Also include before pressure PCB:
Thering is provided polylith the 3rd central layer and the 3rd prepreg, the material of the insulating barrier of described 3rd central layer is
The second material；
Between two pieces of described 3rd central layers, place one piece of described 3rd prepreg, carry out pressing, formed
2nd PCB；
Described 2nd PCB is carried out preset processing, forms PCB daughter board.
6. according to the processing method of the partial hybrid board structure of circuit described in claim 1 to 5, its feature
Being, described method also includes:
Described partial hybrid PCB is holed, forms blind hole.
7. a partial hybrid board structure of circuit, it is characterised in that including:
Printing board PCB motherboard, layer reinforced structure and PCB daughter board；
Described PCB motherboard has daughter board groove, and described layer reinforced structure is in the surface of described PCB motherboard, institute
State layer reinforced structure and there is in the position of described daughter board groove the first groove mated with described daughter board groove, described
PCB daughter board is positioned among the described daughter board groove of described PCB motherboard, described PCB motherboard and described PCB
The material of the insulating barrier of daughter board is different.
Partial hybrid board structure of circuit the most according to claim 7, it is characterised in that
Described PCB motherboard has resin hole, and described layer reinforced structure has blind hole.
Partial hybrid board structure of circuit the most according to claim 8, it is characterised in that
The surface of described PCB motherboard and the hole wall outer layer in described resin hole have electrodeposited coating.
Partial hybrid board structure of circuit the most according to any one of claim 1 to 9, its feature
It is,
The material of the insulating barrier of described layer reinforced structure is identical with the material of the insulating barrier of described PCB motherboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510190551.3A CN106163135A (en) | 2015-04-21 | 2015-04-21 | A kind of partial hybrid board structure of circuit and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510190551.3A CN106163135A (en) | 2015-04-21 | 2015-04-21 | A kind of partial hybrid board structure of circuit and processing method thereof |
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| CN106163135A true CN106163135A (en) | 2016-11-23 |
Family
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| CN201510190551.3A Pending CN106163135A (en) | 2015-04-21 | 2015-04-21 | A kind of partial hybrid board structure of circuit and processing method thereof |
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Cited By (5)
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| CN111225499A (en) * | 2018-11-27 | 2020-06-02 | 庆鼎精密电子（淮安）有限公司 | Local mixed-voltage circuit board structure and manufacturing method thereof |
| CN112208169A (en) * | 2020-09-30 | 2021-01-12 | 宁波甬强科技有限公司 | Copper-clad plate and manufacturing method thereof |
| CN112739066A (en) * | 2020-12-11 | 2021-04-30 | 锐捷网络股份有限公司 | PCB and manufacturing method thereof |
| CN113257747A (en) * | 2021-05-14 | 2021-08-13 | 广州天极电子科技股份有限公司 | Substrate with different dielectric constants for thin film circuit and manufacturing method thereof |
| CN115397110A (en) * | 2022-08-02 | 2022-11-25 | 中山芯承半导体有限公司 | Manufacturing method of substrate with step groove and embedded circuit |
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Application publication date: 20161123 |