CN104565902A - Spiral LED (light emitting diode) lamp - Google Patents
Spiral LED (light emitting diode) lamp Download PDFInfo
- Publication number
- CN104565902A CN104565902A CN201410527429.6A CN201410527429A CN104565902A CN 104565902 A CN104565902 A CN 104565902A CN 201410527429 A CN201410527429 A CN 201410527429A CN 104565902 A CN104565902 A CN 104565902A
- Authority
- CN
- China
- Prior art keywords
- led
- substrate
- luminescence chip
- chip group
- spiral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention provides a spiral LED (light emitting diode) lamp, which at least comprises an LED bulb shell (1), a substrate (2) and an LED light emitting chip group (3), wherein the LED light emitting chip group (3) is attached to the inner side of the substrate (2); the substrate (2) is of a spiral shape; the front end and the rear end of the spiral shape are small, the middle end of the spiral shape is big, so that the spiral shape adapts to the inner shape of the LED bulb shell (1); when the substrate (2) is put in the LED bulb shell (1), the outer side of the substrate (2) is fit with the inner surface of the LED bulb shell (1). According to the spiral LED lamp, the substrate which is used for bearing a light emitting chip is designed into the spiral shape, and the spiral LED lamp has the advantages of special shape, easiness in operation and realization and good market value.
Description
Technical field
The present invention relates to field of LED illumination, especially a kind of LED, particularly, relate to spiral LED.
Background technology
Along with the widespread adoption of LED, as the advantage of emerging illumination new light sources, embodied day by day significantly, but simultaneously, the unidirection luminous property of price, LED and LED need large-area heat abstractor.
The puzzlement of following several item also becomes the part obstruction of LED illumination development day by day.
A, price: LED illumination is made up of LED light source, power drives, LED heat abstractor and bulb structure four major parts, along with constantly dropping of LED light source price, the Cost Problems of other three parts becomes severe.
B, large-scale heat abstractor
A large amount of heats can be produced due to during LED luminescence; for protection properties of product are stablized in design; must assist heat radiation with large-area metal, this part metal adds the directionality that light fixture cost limits the unidirectional bright dipping of LED, goes back the globality of the light fixture bright dipping of partial occlusion.
Such as, number of patent application is 201310242060.X, denomination of invention is " LED chip U-tube heat dissipation, energy conservation lamp ", and number of patent application is 201310190476.1, patent name is that " a kind of linear LED light source " all proposes respective technical solution.The present invention wishes to provide different technical schemes on this basis.
Summary of the invention
For the technological deficiency that LED heat radiation aspect in prior art exists, the object of this invention is to provide a kind of spiral LED, it is characterized in that, at least comprise LED cell-shell 1, substrate 2 and LED luminescence chip group 3; Wherein, described LED luminescence chip group 3 is attached at the inner side of described substrate 2, described substrate 2 in the shape of a spiral, and described spiral helicine front end and rear end is less, middle-end is larger to adapt with the interior shape of described LED cell-shell 1, when described substrate 2 is placed in described LED cell-shell 1 inside, the outside of described substrate 2 and the inner surface of described LED cell-shell 1 are fitted.
Preferably, described substrate 2 comprises multiple submounts 6, and the part in described multiple submounts 6 is independent, and the part in described submounts 6 corresponds to described helical form.
Preferably, described spiral is preferably circular.
Preferably, described circle is preferably approximate and closes, and the front end 61 of a submounts 6 is close to the tail end 62 of a described submounts 6
Preferably, described at least one, the tail end 62 of submounts 6 connects the first fixed part 63, the top 631 of described first fixed part 63 is preferably connected from level angle with described tail end 62, the bottom 632 of described fixed part 63 is connected in near-normal angles with described top 631, and described bottom 632 is stretched downwards, the afterbody of described bottom 632 is the first electrical connection section 633.
Preferably, the arrangement of the first fixed part 63 of described multiple submounts 6 is as any one under type: less parallel; Or, torch-like.
Preferably, the bottom 632 of described multiple submounts 6 is electrically connected with the first electrical connection section 633.
Preferably, described substrate 2 is an entirety, and described spiral helicine rear end connects the second fixed part 64, and described second fixed part 64 stretches downwards, and the afterbody of described second fixed part is the second electrical connection section 641.
Preferably, the upper surface of the LED luminescence chip at least described LED luminescence chip group 3 scribbles fluorescent material 23.
Preferably, described substrate 2 is provided with at least one via hole 21 as loophole for the region or peripheral region attaching described LED luminescence chip group 3.
Preferably, at least one via hole 21 described is evenly distributed.
Preferably, the surface area of described substrate 2 is greater than the surface area of described LED luminescence chip group 3.
Preferably, described substrate 2 is any one composition in following material: sheet metal; Alloying metal sheet; Or sheet glass.
Preferably, described substrate 2 is transparence or translucent.
Further, the quantity of described substrate 2 is one or more, and accordingly, the quantity of described LED luminescence chip group 3 is no less than the quantity of described substrate 2.
The present invention is by being close to LED cell-shell by LED luminescence chip, LED luminescence chip fully can be contacted in bulb housing, and then enable LED luminescence chip closer to the external world, make LED luminescence chip can more easily be dispersed into the external world to go, greatly increase radiating efficiency, improve service life and the service efficiency of LED.Meanwhile, the substrate design of carrying luminescence chip is helical form by the present invention, has special moulding and is easy to operation and realizes, having good market value.
Accompanying drawing explanation
By reading the detailed description done non-limiting example with reference to the following drawings, other features, objects and advantages of the present invention will become more obvious:
Fig. 1 illustrates according to a specific embodiment of the present invention, the structural representation of LED;
Fig. 2 illustrates according to an embodiment of the invention, spiral LED lamp structure schematic diagram;
Fig. 3 illustrates according to an embodiment of the invention, the structural representation of substrate in spiral LED, and wherein, number of substrates is multiple;
Fig. 4 illustrates according to an embodiment of the invention, the structural representation of substrate in spiral LED, and wherein, number of substrates is one;
Fig. 5 illustrates according to the first embodiment of the present invention, the connection diagram of the substrate of LED and LED luminescence chip group, FPC;
Fig. 6 illustrates according to the first embodiment of the present invention, and in LED, power drives template is incorporated into the connection diagram in flexible circuitry plate structure; And
Fig. 7 illustrates according to the first embodiment of the present invention, and in LED, electric power driving module is placed on the connection diagram of flexible circuitry plate structure.
Detailed description of the invention
Those skilled in the art understand, invention broadly provides a kind of LED with excellent heat dispersion performance, and realize heat sinking function and mainly rely on the LED luminescence chip of LED to press close to LED cell-shell, make that LED luminescence chip can short distance be liftoff close more with external environment condition, make the luminescence chip of LED more directly can contact external environment, realize the heat radiation of LED luminescence chip more simply and easily.Further, it will be appreciated by those skilled in the art that the shape of the bulb housing of described LED can be circular, can be rectangle, can be other any shapes, this affect flesh and blood of the present invention, does not repeat them here yet,
Particularly, Fig. 1 illustrates according to a specific embodiment of the present invention, the structural representation of LED.Further, it will be appreciated by those skilled in the art that and the invention provides a kind of LED, it at least comprises LED cell-shell 1, substrate 2 and LED luminescence chip group 3.Preferably, it will be appreciated by those skilled in the art that described LED lamp cover 1 defines inner space 8, and in the prior art scheme, namely described LED luminescence chip is placed in described inner space 8.Preferably, those skilled in the art understand, described LED luminescence chip group 3 is tightly attached at the inwall of described LED cell-shell 1 by substrate 2, be dispersed in the external environment condition residing for LED by described luminescence chip group 3 is tightly attached the heat that described luminescence chip group 3 can be made to produce with the inwall of described LED cell-shell 1 by substrate 2 by the shortest approach, namely preferably, the heat of described LED luminescence chip group 3 conducts to LED cell-shell 1 by substrate 2, thus even heat ground absorb by described LED cell-shell 1, the heat that described LED luminescence chip group 3 produces only needs just directly to be dispersed into the external world by very thin one deck LED cell-shell, and the heat that described LED luminescence chip group 3 can not be made to produce accumulates in described LED in large quantities, cause the heat radiation difficulty of LED, the heat that described LED luminescence chip group 3 is produced can be gone out by Quick diffusing, ensure that the temperature of LED remains in rational scope, and then ensure the normal of LED, safety and efficiently work.
Particularly, it will be appreciated by those skilled in the art that the inner surface of described LED cell-shell 1 is close in the side of described substrate 2, the opposite side of described substrate 2 is close to described LED luminescence chip group 3.Further, those skilled in the art understand, the inwall directly attaching described LED luminescence chip, be fixed on described LED cell-shell 1 has great difficulty in the realization of technology, therefore need by placing described substrate 2 in the middle of described LED cell-shell 1 with described luminescence chip 3, described substrate 2 can be fixed with described bulb housing 1 well, described substrate 2 can be fixed with described luminescence chip 3, therefore, can realize by described substrate 2 inwall that described luminescence chip 3 is fixed on described LED cell-shell 1 well.Further, those skilled in the art understand, fixed form between described LED cell-shell 1 and described substrate 2 and the fixed form between described substrate 2 and described LED luminescence chip group 3 not unique, the relatively fixing of three can be realized, this does not affect flesh and blood of the present invention, does not repeat them here.
Preferably, it will be appreciated by those skilled in the art that described substrate 2 is preferably translucent or transparence.Preferably, those skilled in the art understand, described substrate 2 is designed to translucent or transparence and can ensures that the wide part that described LED luminescence chip group 3 is launched can both exhale to greatest extent, if described substrate 2 is nontransparent shape or light transmission extreme difference, then can cause the illuminating effect extreme difference of LED, can be that the light that LED projects produces many shades and blackspot, greatly have impact on illuminating effect and the function of LED.Further, those skilled in the art understand, realize described substrate 2 transparence or translucent can by use transparent material make described substrate 2, also can by punching at described substrate 2, so also can increase the penetration capacity of light, the illuminating effect of LED can be made better.Any process that can realize transparent or translucentization of described substrate 2, all can meet the requirement of the present invention to described substrate 2, this does not affect flesh and blood of the present invention, does not repeat them here.
Preferably, it will be appreciated by those skilled in the art that in this embodiment, the surface of described substrate 2 is obviously little than described LED luminescence chip group 3.The effect that described substrate 2 plays mainly is used for connecting described LED cell-shell 1 and described LED luminescence chip group 3, so not strict restriction to the size of described substrate 2, can realize above-mentioned linkage function.But consider that if described substrate is too large, described LED luminescence chip group 3 will be affected through the illumination effect of described LED cell-shell 1, the illuminating effect of described LED is made a big impact.Therefore, described substrate 2 should realizing connecting described LED cell-shell 1 with under the prerequisite of described LED luminescence chip group 3 function, little as much as possible.Can not affect the lighting function of described LED luminescence chip group 3 so largely, ensure that the illuminating effect of described LED, its object is consistent with described substrate 2 is designed to the transparent or translucent effect that will reach, and does not repeat them here.
Further, those skilled in the art understand, in another specific embodiment, such as specific embodiment shown in Fig. 3, the surface area of described substrate 2 is preferably more than the area of described LED luminescence chip group 3, thus described LED luminescence chip group 3 is adhered on described substrate 2 by entirety, and described substrate 2 is fixedly attached at the inner surface of described LED cell-shell 1 further.Further, it will be appreciated by those skilled in the art that attaching set forth in the present invention does not represent the inner surface that described substrate 2 is attached to described LED cell-shell 1, and only represent that both are fixed relatively.
Further, it will be appreciated by those skilled in the art that the thickness of described substrate 2 should be less.When the thickness of described substrate 2 remains in a less thickness range, light transmission can be realized better, the light being unlikely to described LED luminescence chip group 3 is launched causes very large decay after described substrate 2, ensure that the illuminating effect of light transmission and described LED.Further, if it will be appreciated by those skilled in the art that, described substrate 2 is too thick, then serious mistake can stop and cause the light that described LED luminescence chip group 3 is launched the significantly decay of described light, also can affect the heat dispersion of described LED.
Preferably, it will be appreciated by those skilled in the art that the position of described substrate 2 is not fixing, its position can be determined according to the position of described LED luminescence chip group 3 is corresponding.Meanwhile, the quantity of described substrate 2 is also unique, can be one also can be multiple.Further, those skilled in the art understand the determination of quantity and the determination of position of described substrate 2, mainly in order to better described LED cell-shell 1 be fitted with described LED luminescence chip group 3, can in concrete realization, dynamically adjust quantity and the position of described substrate 2, do not repeat them here.
In sum, described LED forms primarily of described LED cell-shell 1, described substrate 2 and described LED luminescence chip group 3.The connection of described LED cell-shell 1 and described LED luminescence chip group 3 is realized by described substrate 2, described LED luminescence chip group 3 is made directly to fit in described LED cell-shell 1, substantially reduce the heat conducting distance of described LED luminescence chip group 3, the heat that described LED luminescence chip group 3 is produced directly just promptly can be passed in external environment condition by the LED cell-shell of thin layer and go, substantially increase the radiating efficiency of described LED, define the good thermal conductivity of LED, and then extend service life and the service efficiency of LED, solve the heat dissipation problem of LED simply and easily.
Further, it will be appreciated by those skilled in the art that in this embodiment, the upper surface of the LED luminescence chip in described LED luminescence chip group 3 scribbles fluorescent material.Particularly, described LED luminescence chip group 3 comprises one or more LED luminescence chip, and preferably, when it comprises multiple LED luminescence chip, then each LED luminescence chip all can obtain the electric power provided from electric power driving module, does not repeat them here.Further, preferably, the upper surface of wherein one or more LED luminescence chips scribbles fluorescent material, thus the light that the LED luminescence chip of coated fluorescent material is sent is more even, color more easily receive by consumer.
Further, it will be appreciated by those skilled in the art that Fig. 1 illustrate only the schematic diagram of LED luminescence chip group 3 described in a described substrate 2 and a group, this does not show that the present invention is only only limitted to one group of LED luminescence chip group 3, does not repeat them here.Meanwhile, for convenience, in Fig. 1, the direction of described substrate 2 has been drawn as longitudinal direction, but has not shown that the direction of described substrate 2 is in all embodiments longitudinal direction.Further, it will be appreciated by those skilled in the art that and middle set forth the preferred embodiment being driven described LED luminescence chip group 3 by circuit connecting mode at Fig. 6 to embodiment illustrated in fig. 7, specifically please refer to Fig. 6 to embodiment illustrated in fig. 7.
Fig. 2 illustrates according to an embodiment of the invention, spiral LED lamp structure schematic diagram.Those skilled in the art understand, shown Fig. 2 only shows a kind of structural representation of preferably spiral LED, not only has this kind of spiral LED lamp structure, and described Fig. 2 is not the complete structure figure of spiral LED, the Figure is intended to illustrate primary structure connection schematic diagram in spiral LED.
Particularly, described spiral LED at least comprises LED cell-shell 1, substrate 2 and LED luminescence chip group 3 (not shown), the inner side of wherein said substrate 2 is pasted with described LED luminescence chip group 3, the outside of described substrate 2 and the inner surface of described LED cell-shell 1 are fitted, by this kind of design, the heat that described LED luminescence chip group 3 is produced directly just promptly can be passed in external environment condition by the LED cell-shell 1 of thin layer and go, substantially increase the radiating efficiency of described LED, define the good thermal conductivity of LED, and then extend service life and the service efficiency of LED, solve the heat dissipation problem of LED simply and easily.
More specifically, as shown in Figure 2, described substrate 2 stretches out from the afterbody of described LED cell-shell 1, and spirals along the inner surface of described LED cell-shell 1, and the top of the described LED cell-shell 1 that finally spirals, namely presents helical form.Those skilled in the art understand, described LED cell-shell 1 is broad in the middle, small in ends, for the inner surface making described substrate 2 tightly can be attached at described LED cell-shell 1, described spiral helicine front end and rear end is less, middle-end is larger to adapt with the interior shape of described LED cell-shell 1, when described substrate 2 is placed in described LED cell-shell 1 inside, the outside of described substrate 2 and the inner surface of described LED cell-shell 1 are tightly fitted.
Further, those skilled in the art understand, the structure of the substrate 2 in described spiral LED is diversified, can only be made up of a substrate, also can be made up of multiple substrate, below in conjunction with accompanying drawing 3 and accompanying drawing 4, two of spiral LED kinds of preferred embodiments be set forth in detail.
Fig. 3 illustrates according to an embodiment of the invention, and the structural representation of substrate in spiral LED, it will be appreciated by those skilled in the art that shown Fig. 3 only illustrates the structural representation of substrate in spiral LDE lamp, is not complete LED lamp structure figure.Particularly, as Fig. 3 illustrates, described substrate 2 is made up of multiple submounts 6, those skilled in the art understand, described submounts 6 not only has the submounts of three shown in figure, described submounts can be provided with the submounts of varying number as required, and described each submounts 6 at least includes front end 61 and tail end 62, and described tail end 62 is connected with the afterbody of described LED cell-shell 1.Further, independent of one another between each submounts 6 described, do not come in contact, described submounts 6 to stretch out and inner surface along described LED cell-shell 1 attaches from the afterbody of described LED cell-shell 1, and the figure that each submounts 6 described attaches formation on described LED cell-shell 1 inner surface is helical form.Those skilled in the art understand, each submounts 6 described all forms respective spiral, and any one submounts 6 can form multiple spiral, and such as a submounts forms multiple spirals such as 1,3 or 4, this can not affect flesh and blood of the present invention, does not repeat them here.In the preferred embodiment, as shown in Figure 3, each submounts 6 described preferably forms a spiral, and each spiral is non-intersect mutually, namely each spiral forms the plane of oneself, those skilled in the art understand, each spiral size that described each submounts 6 is formed is also inconsistent, because described LED cell-shell 1 is broad in the middle, small in ends, for making described each submounts 6 adapt with the interior shape of described LED cell-shell 1, therefore, the spiral formed in described LED cell-shell 1 middle part is comparatively large, and less at the spiral of described LED cell-shell 1 two-end part formation.
Further, those skilled in the art understand, described the spiral-shaped of each submounts 6 formation is diversified, the shape of described spiral and the shape of described LED cell-shell 1 adapt, if described LED cell-shell 1 is spherical, correspondingly, the spiral-shaped of described each submounts 6 formation is then circular; If the shape of described LED cell-shell 1 is cuboid, correspondingly, described each the spiral-shaped of submounts 6 formation is then rectangle; If the shape of described LED cell-shell 1 is irregular, correspondingly, described each the spiral-shaped of submounts 6 formation is then irregularly shaped, and described LED cell-shell 1 also has other shapes, but this does not affect flesh and blood of the present invention, therefore does not repeat them here.In this preferred embodiment, as shown in Figure 3, described spiral is circular.
Further, in the preferred embodiment, described spiral is circular, it will be appreciated by those skilled in the art that described circle can be closed, also can not close, owing to described each submounts 6 being connected with circuit (elaborating in accompanying drawing 7 below), if the spiral formed is the annulus of enclosed shape, in order to avoid short circuit, insulation sleeve should be enclosed with at the top of described each submounts 6.Preferably, in this enforcement, the spiral that described each submounts 6 is formed is approximate (conveniently the setting forth each anatomical connectivity relation, so do not embody the approximate helical structure closed in the drawings) closed, then the front end 61 of described each submounts 6 is close to its tail end 62, as shown in Figure 3.
More specifically, it will be appreciated by those skilled in the art that the afterbody of described LED cell-shell 1 is provided with the first fixed part 63, described fixed part 63 at least includes top 631 and bottom 632.The top 631 of described first fixed part 63 is connected with the tail end 62 of each submounts 6, makes its each submounts 6 be fixed on described first fixed part 63; The bottom 632 of described first fixed part 63 is stretched downwards, and the afterbody of described bottom 632 is the first electrical connection section 633, those skilled in the art understand, the bottom 632 that described first electrical connection section 633 can be installed in described first fixed part 63 is inner, also the outer surface of described bottom 632 can be installed in, this does not affect flesh and blood of the present invention, does not repeat them here.
Further, those skilled in the art understand, the shape of described first fixed part 63 is not unique, it can be cylinder, may also be torch-like, can also be other shapes, if when the first fixed part 63 is cylinder, the top 631 of described first fixed part 63 be arranged in parallel with bottom 632; If when described first fixed part 63 is torch-like, top 631 and the bottom 632 of described first fixed part 63 are not arranged in parallel, and described bottom 632 is slightly less than top 631, for other shapes, all can not affect flesh and blood of the present invention, therefore not repeat them here.
Further, those skilled in the art understand, the afterbody 62 of described each submounts 6 and the connection on the top 631 of described first fixed part 63 are only not being fixedly connected with physically, and should be electrically connected, and the bottom 632 of described first fixed part is electrically connected with the first electrical connection section 633, in addition, described first electrical connection section 633 is electrically connected with external power source again, connected by this kind, external power source is that LED luminescence chip group 3 on described each submounts 6 is powered by the first electrical connection section 633.
Fig. 4 illustrates according to an embodiment of the invention, the structural representation of substrate in spiral LED.It will be appreciated by those skilled in the art that shown Fig. 4 only illustrates the structural representation of substrate in spiral LDE lamp, is not complete LED lamp structure figure.Particularly, as Fig. 4 illustrates, described substrate 2 only only has a substrate to form, namely described substrate 2 is an entirety, described substrate 2 to stretch out and along the inner surface spiral of described LED cell-shell 1 from the afterbody of described LED cell-shell 1, top to LED cell-shell 1 stops, those skilled in the art understand, described substrate 2 can form some helical structures, the number of spiral is correspondingly determined in the aspects such as the power of its size according to described LED cell-shell 1, shape and LED, not only has the helical structure of three shown in figure.Those skilled in the art understand, described substrate 2 defines some spirals at the inner surface of described LED cell-shell 1, from the afterbody of bulb housing 1 until the top of bulb housing 1, and the size of described spiral inconsistent, spiral near described LED cell-shell 1 two ends is less, and the spiral of close described LED cell-shell 1 middle part is larger.
More specifically, those skilled in the art understand, the afterbody of described LED cell-shell 1 is provided with the second fixed part 64, the tail end of described substrate 2 is connected on the second fixed part 64, and described second fixed part 64 stretches downwards, the afterbody of described second fixed part 64 is the second electrical connection section 641, described second electrical connection section 641 can be installed in the inside of described second fixed part 64, also the outer surface of described second fixed part 64 can be installed in, this does not affect flesh and blood of the present invention, does not repeat them here.
Further, those skilled in the art understand, the afterbody of described substrate 2 and the connection of described second fixed part 64 are only not being fixedly connected with physically, and should be electrically connected, and described second fixed part 64 is electrically connected with the second electrical connection section 641, in addition, described second electrical connection section 641 is electrically connected with external power source again, connected by this kind, external power source is that LED luminescence chip group 3 on described substrate 2 is powered by the second electrical connection section 641.
Further, in the present embodiment, described substrate 2 at least comprises via hole 21, and particularly, with the via hole 21 of laser ablation ad hoc rules distribution on described substrate 2, via hole 21 diameter, between 0.1 ~ 0.5mm, the light of LED luminescence chip group 3 can be passed through.It will be appreciated by those skilled in the art that described via hole 21 quantity and distribution be not changeless.Such as preferably, described via hole 21 is uniformly distributed in one rectangular, in a further advantageous embodiment, described via hole 21 is uniformly distributed in a round shape, and in another preferred embodiment, the part of described via hole 21 is uniformly distributed, another part non-uniform Distribution, and this does not affect concrete technical scheme of the present invention.It will be appreciated by those skilled in the art that described via hole 21 is at least as loophole purposes, does not repeat them here.
More specifically, described substrate 2 adopts aluminium base to pass through punch forming, substrate 2 presents linear pattern mode cabling, which can facilitate bending, LED luminescence chip group 3 is made to be more prone to brake forming on a substrate 2, the width of LED luminescence chip group 3 can be selected between 0.5 ~ 5mm, substrate 2 thickness is selected between 0.3 ~ 2.0mm, one group of LED luminescence chip group 3 power is preferably between 1 ~ 3W, the combination of LED luminescence chip group 3 is divided into the various combinations such as 3,4,6,8, to be combined into the LED of different capacity, do not repeat them here.
Below in conjunction with accompanying drawing 5, Fig. 6 and Fig. 7, elaborate the preferred embodiment how being driven the luminescence of described LED luminescence chip group 3 by circuit connecting mode.
Fig. 5 illustrates according to the first embodiment of the present invention, the connection diagram of LED substrate and LED luminescence chip group, FPC.It will be appreciated by those skilled in the art that described Fig. 5 is not that the object of the unique connected mode figure of the present embodiment, this figure is intended to the connection diagram implementing preferred embodiment is described.Particularly, as shown in Figure 5, described LED luminescence chip group 3 is connected to the side of described substrate 2, the opposite side of described substrate 2 is connected with the inner surface of described bulb housing 1, it will be appreciated by those skilled in the art that the mode that described LED luminescence chip is connected with described substrate 2 is not changeless, can be such as that directly stamp is on the surface of described substrate 2, mode is varied, but does not affect flesh and blood of the present invention, therefore does not repeat them here.Meanwhile, described substrate 2 is distributed with via hole 21 (not showing in Fig. 5), about the distribution of via hole 21, has in above-mentioned Fig. 3 and describe, therefore do not repeat them here.
More specifically, be connected in series by described bonding line 22 between described each LED luminescence chip, by this kind of connected mode, between described each LED luminescence chip, a series circuit can be formed, power supply simultaneously and power-off simultaneously.
Further, FPC 4 described in is installed in the one end connecting power supply at described substrate 2, and it will be appreciated by those skilled in the art that preferably, the afterbody of described substrate 2 is provided with described FPC 4.Further, it will be appreciated by those skilled in the art that described FPC 4 method of installing on a substrate 2 is not changeless, it can use the method for pressing also can use the method for adhesion, method is multiple, but does not affect flesh and blood of the present invention, therefore does not repeat them here.
Further, in the present embodiment, as shown in FIG., preferably, the anode of last luminescence chip in described LED luminescence chip group 3 is electrically connected with described substrate 2, the negative electrode of a luminescence chip near FPC 4 in LED luminescence chip group 3 is connected with the cathodic electricity in FPC 4 simultaneously.Further, those skilled in the art understand, in the use procedure of LED provided by the invention, afterbody preferably by described bulb housing 1 is electrically connected with external power source by described substrate 2, such external power source normally carries out being electrically connected with the afterbody of described bulb housing 1 by lamp socket and obtains, thus makes external power source can drive described LED.Further, it will be appreciated by those skilled in the art that the both positive and negative polarity of external power source will be connected with described substrate 2, FPC 4 respectively, thus form complete power circuit, such as, shown in Fig. 7.
Further, those skilled in the art understand, in the use procedure of LED provided by the invention, alternating current be directly to be electrically connected with described LED luminescence chip group with wire by the lamp holder of described LED or by described lamp holder position first by being electrically connected with described LED luminescence chip group again after the rectification of external driving power, constant current, and Fig. 5 and embodiment illustrated in fig. 6 in, described FPC act as the effect of conducting circuit and LED drive circuit carrier.
Under AC Direct driver pattern, the alternating current direct of described lamp holder joints connects and is wired to L binding post on the FPC 4 shown in Fig. 4 or Fig. 5 and N binding post, by powering to described LED luminescence chip group after EMC filter circuit, bridge rectifier, constant-current drive circuit, concrete structure as shown in figs.5 and 6.Wherein, described EMC filter circuit, bridge rectifier, constant-current drive circuit etc. are not shown in Fig. 5 and Fig. 6, and preferably, it is all directly be attached on FPC by COB binding technology to form path by the circuit of scolding tin and FPC.
Further, it will be appreciated by those skilled in the art that by above-mentioned connected mode, the both positive and negative polarity of LED luminescence chip group 3 is formed, thus can form an electric loop when externally fed, by the break-make of control loop, and then the luminescence controlling described LED luminescence chip group 3 is whether.
It will be appreciated by those skilled in the art that the white light in order to make LED send better effect, coating fluorescent material 23 at the upper surface of described LED luminescence chip group 3, as shown in FIG..
Closer, how the electric loop shown in Fig. 5 is connected with power drives, below in conjunction with accompanying drawing 6 and accompanying drawing 7, and the concrete embodiment setting forth two kinds of connections.
Fig. 6 illustrates according to the first embodiment of the present invention, and in LED, power drives template is incorporated into the connection diagram in flexible circuitry plate structure.It will be appreciated by those skilled in the art that described Fig. 6 is not the anatomical connectivity situation that the object of unique anatomical connectivity figure, this figure is intended to illustrate electric power driving module 5 and FPC 4.Particularly, as shown in Figure 6, binding post L, binding post N, FPC anode and FPC negative electrode is at least comprised in described FPC 4.Further, in the embodiment shown in fig. 6, described FPC anode and FPC negative electrode present in the mode of electric power driving module 5, and preferably those skilled in the art understand described electric power driving module 5 and are at least integrated with AC-DC conversion module and constant-current driven module (not shown), thus the both positive and negative polarity of described LED luminescence chip group 3 is formed.Those skilled in the art understand, described electric power driving module 5 is placed in the inside of FPC 4, becomes one of structure of FPC 4, and those skilled in the art understand, described electric power driving module 5 method be integrated in FPC 4 has a variety of, does not repeat them here.
Further, with reference to figure 5, it will be appreciated by those skilled in the art that the negative electrode of described FPC 4 is connected with the cathodic electricity of described LED luminescence chip, the anode of described FPC 4 is electrically connected with described substrate 2.By such connected mode, make described substrate 2 with positive charge, thus the anode of described LED luminescence chip is connected with any point of described substrate 2, and do not need the anode that must be connected to described FPC 4, save the material of described FPC 4, be also convenient to process.And in preferred variant, for structure shown in Fig. 5 to Fig. 7, also the anode of the anode of described FPC 4 with described LED luminescence chip can be electrically connected, the negative electrode of described FPC 4 is electrically connected with described substrate 2, correspondingly the negative electrode of described LED luminescence chip is electrically connected with described substrate 2, thus also can form the current supply circuit for described LED luminescence chip.
Further, it will be appreciated by those skilled in the art that for a LED luminescence chip group, each the LED luminescence chip preferably in this LED luminescence chip group is directly connected by bonding line 22, thus forms cascaded structure.On such architecture basics, the negative electrode of first LED luminescence chip can as the negative electrode of described LED luminescence chip group, and the anode of last LED luminescence chip can as the anode of described LED luminescence chip group.Again further, in a change case, those skilled in the art understand, its anode also can be connected to separately on described substrate 2 by each the LED luminescence chip in described LED luminescence chip group, correspondingly the negative electrode of each LED luminescence chip is connected on the negative electrode of described FPC 4, and this does not affect technical scheme of the present invention.
Further, with reference to above-mentioned Fig. 5 and Fig. 6, those skilled in the art understand, in above-described embodiment and change case, it is the electrical interface that described LED luminescence chip provides anode and negative electrode, thus when the anode of power supply and negative electrode are connected to above-mentioned anode and negative electrode respectively, one can be formed to the current supply circuit of described LED luminescence chip, not repeat them here.
More specifically, with above-mentioned embodiment illustrated in fig. 5 similar, in the LED course of work provided by the invention, when described substrate 2 is electrically connected with external power source by the afterbody of bulb housing 1, described external power source is driven described luminescence chip group 3 by described electric power driving module 5 grade, thus it is luminous to control described luminescence chip group 3.Connected by this kind, described electric power driving module 5, under the effect of FPC 4, forms electric loop with described substrate 2 and described LED luminescence chip group 3, reaches the effect controlling described luminescence chip break-make.
Fig. 7 illustrates according to the first embodiment of the present invention, and in LED, electric power driving module is placed on the connection diagram of flexible circuitry plate structure.In conjunction with above-mentioned embodiment illustrated in fig. 4, those skilled in the art understand described FPC 4 and at least comprise FPC anode, i.e. LED+ shown in Fig. 7, and FPC negative electrode, i.e. LED-shown in Fig. 7.Described FPC negative electrode is connected with the cathodic electricity of described multiple LED luminescence chip, and described FPC anode is electrically connected with described substrate 2.By such connected mode, when connecting external power source 7, described substrate 2 is with positive charge, forms positive pole, thus the both positive and negative polarity of described luminescence chip group 3 is formed.It will be appreciated by those skilled in the art that described Fig. 7 is not the anatomical connectivity situation that the object of unique anatomical connectivity figure, this figure is intended to illustrate external power source (external drive part) 7 and FPC 4.By this kind of design, the circuit on-off of whole luminescence chip group 3 can be controlled by described FPC 4, achieve the luminescence of luminescence chip group 3 whether control.
Further, shown in figure 7, under DC mode activated, the alternating current direct of above-mentioned lamp holder joints connects and is wired on external driving power, after power source internal carries out EMC filter circuit, bridge rectifier, constant-current drive circuit, again by the positive and negative electrode on the FPC above wire connecting lamp bar, finally form path.It will be appreciated by those skilled in the art that FPC only serves the effect of communication line here, do not possess the ability of AC Direct driver.
Further, with reference to above-mentioned Fig. 1 to Fig. 7, those skilled in the art understand, above-mentioned Fig. 1 to Fig. 7 is not the unique anatomical connectivity figure of the present invention, and the object of above-mentioned figure is intended to illustrate the structure of LED provided by the invention and structure, the connection of wherein LED luminescence chip group and FPC.As shown in Figure 6, described substrate 2 preferably adopts metallic conductor, so complicated circuit and telegraph circuit cannot be realized, so preferably thereunder region conforms great-wall shaped FPC, and multiple LED luminescence chip group can be set according to arranging of substrate, and between each LED luminescence chip group, preferably adopting parallel way, quantity in parallel is determined by the number of described LED luminescence chip group.Preferably, the quantity of described LED luminescence chip group can be selected between 3-10 bar, different according to power, and combination also can be different, and this does not affect technical scheme of the present invention.
Further, the bottom of described substrate 2 is anodes, and the negative electrode of described substrate 2 is connected to FPC by bonding line, as shown in Figure 5.And Fig. 5 can be understood to a detail section in Fig. 6, Fig. 7, electric power driving module 5 and wiring part are made up of below rectangular region in Fig. 6.Electric power driving module 5 shown in Fig. 6 mainly comprises following parts, such as EMC filter circuit, bridge rectifier, constant-current drive circuit and other protection circuits composition.By above-mentioned technical scheme, LED provided by the invention by DC powered, also can be driven by alternating current, installation and debugging are safeguarded and all becomes very simple.Further, the alternating current direct of above-mentioned lamp holder joints connects L ac terminal, N ac terminal on the FPC 4 that is wired to above lamp bar, after EMC filter circuit, bridge rectifier, constant-current drive circuit, wherein EMC filter circuit, bridge rectifier, constant-current drive circuit are all directly be attached on FPC by COB (chip On board) binding technology to form path by the circuit of scolding tin and FPC.
Further, those skilled in the art understand, because described substrate 2 preferably adopts metal, therefore described substrate 2 can only serve as an electrode, and LED is a LED device, and wanting luminescence must have 2 electrodes, one adds positive voltage, one adds negative voltage, and circuit part relies on FPC, as shown in Figure 4.FPC is without the need to delivering to tail end line place, greatly can save the cost of wiring board like this, FPC only needs to be connected with the electrode cathode of first chip, after connecting LED quantity certain, anode carrys out conducting by substrate true qualities conduction, directly fit together by via hole or welding with the anode on FPC, the conducting of realizing circuit.
Above specific embodiments of the invention are described.It is to be appreciated that the present invention is not limited to above-mentioned particular implementation, those skilled in the art can make various distortion or amendment within the scope of the claims, and this does not affect flesh and blood of the present invention.
Claims (15)
1. a spiral LED, is characterized in that, at least comprises LED cell-shell (1), substrate (2) and LED luminescence chip group (3);
Wherein, described LED luminescence chip group (3) is attached at the inner side of described substrate (2), described substrate (2) in the shape of a spiral, and described spiral helicine front end and rear end is less, middle-end is larger to adapt with the interior shape of described LED cell-shell (1), when described substrate (2) is placed in described LED cell-shell (1) inside, the outside of described substrate (2) and the inner surface of described LED cell-shell (1) are fitted.
2. LED according to claim 1, it is characterized in that, described substrate (2) comprises multiple submounts (6), and the part in described multiple submounts (6) is independent, and the part in described submounts (6) corresponds to described helical form.
3. LED according to claim 2, is characterized in that, described in, described spiral is preferably circular.
4. LED according to claim 3, it is characterized in that, described circle is preferably approximate and closes, and the front end (61) of a submounts (6) is close to the tail end (62) of a described submounts (6).
5. the LED according to any one of claim 2 to 4, it is characterized in that, the tail end (62) of submounts described at least one (6) connects the first fixed part (63), the top (631) of described first fixed part (63) is preferably connected from level angle with described tail end (62), the bottom (632) of described fixed part (63) is connected in near-normal angles with described top (631), and described bottom (632) stretch downwards, the afterbody of described bottom (632) is the first electrical connection section (633).
6. LED according to claim 5, is characterized in that, the arrangement of first fixed part (63) of described multiple submounts (6) is as any one under type:
-less parallel; Or
-torch-like.
7. the LED according to claim 5 or 6, is characterized in that, the bottom (632) of described multiple submounts (6) is electrically connected with the first electrical connection section (633).
8. LED according to claim 1, it is characterized in that, described substrate (2) is an entirety, and described spiral helicine rear end connects the second fixed part (64), described second fixed part (64) is stretched downwards, and the afterbody of described second fixed part is the second electrical connection section (641).
9. LED according to any one of claim 1 to 8, is characterized in that, the upper surface of the LED luminescence chip at least described LED luminescence chip group (3) scribbles fluorescent material (23).
10. LED according to any one of claim 1 to 9, it is characterized in that, described substrate (2) is provided with at least one via hole (21) as loophole for the region or peripheral region attaching described LED luminescence chip group (3).
11. LED according to claim 10, is characterized in that, described at least one via hole (21) is evenly distributed.
12. LED according to any one of claim 1 to 11, it is characterized in that, the surface area of described substrate (2) is greater than the surface area of described LED luminescence chip group (3).
13. LED according to any one of claim 1 to 12, is characterized in that, described substrate (2) is any one composition in following material:
-sheet metal;
-alloying metal sheet; Or
-sheet glass.
14. LED according to any one of claim 1 to 13, it is characterized in that, preferably, described substrate (2) is transparence or translucent.
15. LED according to any one of claim 1 to 14, it is characterized in that, the quantity of described substrate (2) is one or more, and accordingly, the quantity of described LED luminescence chip group (3) is no less than the quantity of described substrate (2).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410527429.6A CN104565902A (en) | 2014-10-09 | 2014-10-09 | Spiral LED (light emitting diode) lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410527429.6A CN104565902A (en) | 2014-10-09 | 2014-10-09 | Spiral LED (light emitting diode) lamp |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104565902A true CN104565902A (en) | 2015-04-29 |
Family
ID=53082623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410527429.6A Pending CN104565902A (en) | 2014-10-09 | 2014-10-09 | Spiral LED (light emitting diode) lamp |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104565902A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017070818A1 (en) * | 2015-10-26 | 2017-05-04 | 苏州汉克山姆照明科技有限公司 | Bulb with display function |
CN107701936A (en) * | 2017-10-24 | 2018-02-16 | 厦门利德宝电子科技股份有限公司 | The integrated aluminium base of integrated multiple functions |
EP4180709A1 (en) * | 2021-11-11 | 2023-05-17 | Liquidleds Lighting Corp. | Led bulb |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102281701A (en) * | 2011-08-16 | 2011-12-14 | 吴广毅 | Three-dimensional extension helical circuit board on light emitting diode (LED) lamp and manufacturing method for three-dimensional extension helical circuit board |
CN202791511U (en) * | 2012-09-13 | 2013-03-13 | 常州阿拉丁照明电器有限公司 | LED (Light Emitting Diode) crystal lamp |
CN202834942U (en) * | 2012-10-24 | 2013-03-27 | 盱眙凯亿电子材料有限公司 | Light-emitting diode (LED) lamp |
CN103883910A (en) * | 2014-04-09 | 2014-06-25 | 上海鼎晖科技股份有限公司 | LED lamp |
CN103883989A (en) * | 2014-04-09 | 2014-06-25 | 上海鼎晖科技股份有限公司 | LED lamp with heat dissipation device |
CN203771079U (en) * | 2013-10-07 | 2014-08-13 | 欧普照明股份有限公司 | Bulb lamp |
CN204254306U (en) * | 2014-10-09 | 2015-04-08 | 上海鼎晖科技股份有限公司 | A kind of spiral LED |
-
2014
- 2014-10-09 CN CN201410527429.6A patent/CN104565902A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102281701A (en) * | 2011-08-16 | 2011-12-14 | 吴广毅 | Three-dimensional extension helical circuit board on light emitting diode (LED) lamp and manufacturing method for three-dimensional extension helical circuit board |
CN202791511U (en) * | 2012-09-13 | 2013-03-13 | 常州阿拉丁照明电器有限公司 | LED (Light Emitting Diode) crystal lamp |
CN202834942U (en) * | 2012-10-24 | 2013-03-27 | 盱眙凯亿电子材料有限公司 | Light-emitting diode (LED) lamp |
CN203771079U (en) * | 2013-10-07 | 2014-08-13 | 欧普照明股份有限公司 | Bulb lamp |
CN103883910A (en) * | 2014-04-09 | 2014-06-25 | 上海鼎晖科技股份有限公司 | LED lamp |
CN103883989A (en) * | 2014-04-09 | 2014-06-25 | 上海鼎晖科技股份有限公司 | LED lamp with heat dissipation device |
CN204254306U (en) * | 2014-10-09 | 2015-04-08 | 上海鼎晖科技股份有限公司 | A kind of spiral LED |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017070818A1 (en) * | 2015-10-26 | 2017-05-04 | 苏州汉克山姆照明科技有限公司 | Bulb with display function |
CN107701936A (en) * | 2017-10-24 | 2018-02-16 | 厦门利德宝电子科技股份有限公司 | The integrated aluminium base of integrated multiple functions |
CN107701936B (en) * | 2017-10-24 | 2019-09-20 | 厦门利德宝电子科技股份有限公司 | The integrated aluminum substrate of integrated multiple functions |
EP4180709A1 (en) * | 2021-11-11 | 2023-05-17 | Liquidleds Lighting Corp. | Led bulb |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103883989B (en) | A kind of LED with heat abstractor | |
CN203880468U (en) | 3D COB LED lamp light-emitting assembly and LED lamp | |
CN104006321A (en) | 3D (Three Dimensional) COB (Chip On Board) LED (Light Emitting Diode) lamp light-emitting assembly and LED lamp | |
CN202884588U (en) | Light-emitting diode (LED) bulb | |
CN208154172U (en) | A kind of S-shaped LED lens light bar of any bending of energy | |
CN104565902A (en) | Spiral LED (light emitting diode) lamp | |
CN201416791Y (en) | Light-emitting diode lamp bulb | |
CN204227116U (en) | A kind of LED of luminescence chip particular arrangement | |
CN204254306U (en) | A kind of spiral LED | |
CN104373847B (en) | LED lamp with specifically-arranged light-emitting chips | |
CN204114642U (en) | A kind of 360 degree of light emitting LED lamp | |
CN203176870U (en) | LED light source module | |
CN203836873U (en) | LED lamp with radiating device | |
CN204704622U (en) | A kind of LED with inner bag | |
CN201892074U (en) | LED (light-emitting diode) down lamp with integrated light source and combination of reflector and radiator | |
CN205806969U (en) | A kind of LED filament | |
CN201934981U (en) | Alternating current led candle bulb | |
CN204114663U (en) | A kind of LED with insulation protection | |
CN204403815U (en) | A kind of LED with heat abstractor | |
CN104197223B (en) | Multiple-point-distribution LED lamp | |
CN201708153U (en) | Laminated encapsulation structure of LED module | |
CN204114644U (en) | A kind of LED with luring rail | |
CN201973495U (en) | LED (Light Emitting Diode) light source structure | |
CN204805986U (en) | Multipoint mode distribution LED lamp | |
CN104295962B (en) | LED lamp with insulation protection |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150429 |
|
RJ01 | Rejection of invention patent application after publication |