CN104295962B - LED lamp with insulation protection - Google Patents
LED lamp with insulation protection Download PDFInfo
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- CN104295962B CN104295962B CN201410527360.7A CN201410527360A CN104295962B CN 104295962 B CN104295962 B CN 104295962B CN 201410527360 A CN201410527360 A CN 201410527360A CN 104295962 B CN104295962 B CN 104295962B
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- luminescence chip
- led
- led lamp
- substrate
- circuit board
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V25/00—Safety devices structurally associated with lighting devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention provides an LED lamp with insulation protection. The LED lamp is characterized by at least comprising an LED lampshade (1), a base plate (2) and an LED lighting chip set (3); one side of the base plate (2) is attached to the inner surface of an LED bulb housing (1); the LED lighting chip set (3) is attached to the other side of the base plate (2); an insulation protecting device (4) is arranged at the top end of the base plate (2). According to the LED lamp with the insulation protection, the insulating device is arranged on the top end of the base plate, thus the base plate does not form current interference to each other, and as a result, the stability and performance of the LED lamp can be improved; such radiating mode is simple and convenient, and easily operated and realized; the LED lamp has a high market value.
Description
Technical field
The present invention relates to led lighting field, especially a kind of LED lamp, in particular it relates to have the LED lamp of insulation protection.
Background technology
With the widespread adoption of led, as the advantage of emerging illumination new light sources, emerge from increasingly apparently, but with
When, price, the unidirection luminous property of led and led need large-area heat abstractor.
The part that the puzzlement of following several items is also increasingly becoming led illumination development hinders.
A, price: led illumination is by LED light source, power drives, led heat abstractor and the most group of bulb structure four
Become, with constantly dropping of LED light source price, the Cost Problems of other three parts become severe.
B, large-scale heat abstractor
Substantial amounts of heat can be produced due to when led lights, in design be protection properties of product stable it is necessary to large-area
Metal come to assist radiate, this part metals increased light fixture cost limit led unidirectional go out light directivity, go back partial occlusion
Light fixture goes out the globality of light.
For example, number of patent application is 201310242060.x, invention entitled " led chip u-shaped pipe heat-dissipating energy-saving lamp ", specially
Sharp Application No. 201310190476.1, patent name all propose respective technology solution party for " a kind of line style LED light source "
Case.Correspondingly, segmentation scheme is also had to propose the technical scheme with the substrate of luminescence chip for the attaching on bulb housing, and so
The problem brought of scheme be that contacting with each other of substrate may lead to the electric charge on substrate to cause to interfere with each other, the purpose of the present invention
It is to solve above-mentioned technical problem.
Content of the invention
There may be contact between substrate for LED lamp in prior art and cause the technology of the aspect presence such as electric charge interference
Defect, it is an object of the invention to provide a kind of LED lamp with insulation protection is it is characterised in that at least include LED lamp shade 1, base
Plate 2 and led luminescence chip group 3；Wherein, the side of described substrate 2 is attached at the inner surface of described LED lamp cell-shell 1, described
Led luminescence chip group 3 is attached at the opposite side of described substrate 2；Wherein, the top of described substrate 2 is provided with insulation protection device 4.
Preferably, described insulation protection device 4 is ambroin outer housing, the shape of described ambroin outer housing and described base
The shape on the top of plate 2 is adapted.
Preferably, the outside on the top of described substrate 2 scribbles insulating paint, and described protective outer insulative jacket be arranged at described
The outside of insulating paint.
Preferably, described insulation protection device 4 is insulating paint.
Preferably, described insulation protection device 4 is to put forth effort umbrella 7, and described umbrella 7 of putting forth effort is umbrella stand shape, and the end of each umbrella stand
End is equipped with plastic envelope 71, and the shape of described plastic envelope 71 is adapted with the shape on the top of described substrate 2.
Preferably, described umbrella 7 of putting forth effort includes at least six umbrella stands, and described umbrella stand from the described summit 72 putting forth effort umbrella 7 to
Dissipate outward and symmetrical.
Preferably, described led luminescence chip group 3 includes one or more led luminescence chips；And when the luminous core of described led
When piece group 3 includes multiple led luminescence chip, it is connected in series by bonding line 22 between the plurality of led luminescence chip, described many
The anode of individual led luminescence chip is electrically connected on described substrate 2, the negative electrode of the plurality of led luminescence chip and a flexible circuitry
Plate is connected such that and forms current supply circuit with power supply.
Preferably, described flexible circuit board 6 is arranged on described substrate 2.
Preferably, described flexible circuit board 6 includes l binding post, n binding post, flexible circuit board anode and flexibility
Wiring board negative electrode, described flexible circuit board negative electrode is electrically connected with the negative electrode of the plurality of led luminescence chip, described flexible circuit board
Anode is electrically connected with described substrate 2.
Preferably, described flexible circuit board 6 includes flexible circuit board anode and flexible circuit board negative electrode, described flexible wires
Road plate negative electrode is electrically connected with the negative electrode of the plurality of led luminescence chip, and described flexible circuit board anode is electrically connected with described substrate 2
Connect, when described LED lamp uses, described flexible circuit board anode and flexible circuit board negative electrode respectively with power anode and the moon
Pole connects.
Preferably, the upper surface of the led luminescence chip at least described led luminescence chip group 3 scribbles fluorescent material 23.
Preferably, described substrate 2 is used for attaching the region of described led luminescence chip group 3 or peripheral region is provided with least
One via 21 is as loophole.
Preferably, at least one via 21 described is evenly distributed.
Preferably, the surface area of described substrate 2 is more than the surface area of described led luminescence chip group 3.
Preferably, described substrate 2 is any one composition in following material: sheet metal；Alloying metal piece；Or glass
Piece.
Preferably, described substrate 2 is transparence or translucent.
Further, the quantity of described substrate 2 is one or more, accordingly, the quantity of described led luminescence chip group 3
Quantity no less than described substrate 2.
The present invention is by being close to LED lamp cell-shell so that led luminescence chip can fill in bulb housing by led luminescence chip
Tap is touched, and then enables led luminescence chip closer to extraneous so that led luminescence chip can be easier to be dispersed into the external world
Go, greatly increase radiating efficiency, improve service life and the service efficiency of LED lamp.Pass through in described substrate simultaneously
Top arranges seal so that described substrate will not form mutually current interference, thus improve stability and the property of LED lamp
Energy.This radiating mode easier it is easy to operation and realize, there is good market value.
Brief description
The detailed description with reference to the following drawings, non-limiting example made by reading, the further feature of the present invention,
Objects and advantages will become more apparent upon:
Fig. 1 illustrates according to a specific embodiment of the present invention, the structural representation of LED lamp；
Fig. 2 illustrates according to the first embodiment of the present invention, the structural representation of LED lamp；
Fig. 3 shows the schematic diagram of the LED lamp with insulation protection device according to the first embodiment of the present invention；
Fig. 4 shows the schematic diagram of the LED lamp with insulation protection device according to the second embodiment of the present invention；
Fig. 5 illustrates that, according to the first embodiment of the present invention, the substrate of LED lamp is connected with bulb housing, led luminescence chip group
The structural representation of relation；
Fig. 6 illustrates according to the first embodiment of the present invention, the substrate of LED lamp and led luminescence chip group, flexible circuit board
Connection diagram；
Fig. 7 illustrates according to the first embodiment of the present invention, and in LED lamp, to be incorporated into flexible circuitry hardened for power driving template
Connection diagram in structure；And
Fig. 8 illustrates according to the first embodiment of the present invention, and in LED lamp, to be placed on flexible circuitry hardened for electric power driving module
The connection diagram of structure.
Specific embodiment
It will be appreciated by those skilled in the art that invention broadly provides a kind of LED lamp with excellent heat dispersion performance, and realize
The led luminescence chip that heat sinking function is mainly dependence LED lamp presses close to LED lamp cell-shell so that led luminescence chip can be with external rings
Border more short distance is liftoff close to so that the luminescence chip of led can more directly contact external environment, more real
The radiating of existing led luminescence chip.Further, it will be appreciated by those skilled in the art that the shape of the bulb housing of described LED lamp can be
Circle, can be rectangle or other any shapes, this has no effect on the flesh and blood of the present invention, and here is no longer superfluous
State,
Specifically, Fig. 1 illustrates according to a specific embodiment of the present invention, the structural representation of LED lamp.Further
Ground, it will be appreciated by those skilled in the art that the present invention provides a kind of LED lamp, it at least includes LED lamp cell-shell 1, substrate 2 and led and sends out
Optical chip group 3.Preferably, it will be appreciated by those skilled in the art that described LED lamp shade 1 defines inner space 8, and in prior art
In scheme, described led luminescence chip is placed in described inner space 8.Preferably, it will be appreciated by those skilled in the art that described
Led luminescence chip group 3 is tightly attached at the inwall of described LED lamp cell-shell 1 by substrate 2, by leading to described luminescence chip group 3
Crossing substrate 2 and tightly attach can make heat produced by described luminescence chip group 3 pass through with the inwall of described LED lamp cell-shell 1
Short approach is dispersed in the external environment condition residing for LED lamp, and that is, preferably, the heat of described led luminescence chip group 3 passes through substrate
2 are conducted to LED lamp cell-shell 1, thus even heat ground is absorbed by described LED lamp cell-shell 1, described led luminescence chip group 3 is produced
Raw heat only needs to just to be directly emitted to the external world by one layer of very thin LED lamp cell-shell, without making described led send out
Produced by optical chip group 3, heat accumulates in described LED lamp in large quantities, the radiating causing LED lamp difficult so that described led
The heat that luminescence chip group 3 produces can Quick diffusing go out, it is ensured that the temperature of LED lamp is maintained in rational scope, to enter
And ensure normal, safety and the efficient operation of LED lamp.
Specifically, it will be appreciated by those skilled in the art that the interior table of described LED lamp cell-shell 1 is close in the side of described substrate 2
Face, the opposite side of described substrate 2 is close to described led luminescence chip group 3.Further, it will be appreciated by those skilled in the art that will be described
The inwall that led luminescence chip directly attached, was fixed on described LED lamp cell-shell 1 has great difficulty in the realization of technology, because
This needs by placing described substrate 2 in the middle of described LED lamp cell-shell 1 with described luminescence chip 3, and described substrate 2 can be very
It is fixed with described bulb housing 1 well, described substrate 2 can be fixed with described luminescence chip 3, therefore, by described
Substrate 2 can realize the inwall that described luminescence chip 3 is fixed on described LED lamp cell-shell 1 well.Further, this area skill
Art personnel understand, the fixed form between described LED lamp cell-shell 1 and described substrate 2 and described substrate 2 are lighted with described led
Fixed form between chipset 3 is not unique, is capable of being relatively fixed of three, and this has no effect on the reality of the present invention
Matter content, will not be described here.
Preferably, it will be appreciated by those skilled in the art that described substrate 2 is preferably translucent or transparence.Preferably, originally
Skilled person understands, described substrate 2 is designed as translucent or transparence and can ensure that described led sends out to greatest extent
The light major part that optical chip group 3 is launched can exhale, if described substrate 2 is nontransparent shape or light transmission extreme difference,
The illuminating effect extreme difference of LED lamp then can be caused, can be that the light that LED lamp is projected produces many shades and black speck, leverage
The illuminating effect of LED lamp and function.Further, it will be appreciated by those skilled in the art that realizing the transparence or semi-transparent of described substrate 2
Bright shape can make described substrate 2 by using transparent material it is also possible to by being punched in described substrate 2, so also may be used
To increase the penetration capacity of light, enable to the illuminating effect of LED lamp more preferably.Any it is capable of the transparent of described substrate 2
Or the process of translucentization, all can meet the requirement to described substrate 2 for the present invention, this has no effect in the essence of the present invention
Hold, will not be described here.
Preferably, it will be appreciated by those skilled in the art that in this embodiment, the surface of described substrate 2 is substantially than institute
State led luminescence chip group 3 little.The effect that described substrate 2 is played is primarily used to connect described LED lamp cell-shell 1 and described led
Luminescence chip group 3, so not having strict restriction to the size of described substrate 2, is capable of above-mentioned linkage function.But
If too big in view of described substrate, it will affect the illumination effect that described led luminescence chip group 3 passes through described LED lamp cell-shell 1,
The illuminating effect of described LED lamp is made a big impact.Therefore, described substrate 2 should be capable of connecting described LED lamp bubble
On the premise of shell 1 and described led luminescence chip group 3 function, little as much as possible.Described led so will not be largely affected by
The lighting function of luminescence chip group 3 it is ensured that the illuminating effect of described LED lamp, its purpose and described substrate 2 is designed to transparent
Or translucent effect to be reached is consistent, will not be described here.
Further, it will be appreciated by those skilled in the art that in another specific embodiment, being such as embodied as shown in Fig. 5
Example, the surface area of described substrate 2 is preferably more than the area of described led luminescence chip group 3, so that described led lights
Chipset 3 is integrally adhered on described substrate 2, and further the fixation of described substrate 2 is attached at described LED lamp cell-shell 1
Inner surface.Further, it will be appreciated by those skilled in the art that set forth in the present invention attaching does not represent described substrate 2 quilt
It is attached to the inner surface of described LED lamp cell-shell 1, and be merely representative of both and be relatively fixed.
Further, it will be appreciated by those skilled in the art that the thickness of described substrate 2 should be less.When the thickness of described substrate 2 is protected
Hold in a less thickness range, light transmission can be better achieved, be unlikely to make described led luminescence chip group 3 institute
The light of transmitting causes very big decay it is ensured that the illuminating effect of light transmission and described LED lamp after described substrate 2.Enter
One step ground, if it will be appreciated by those skilled in the art that described substrate 2 is too thick, serious mistake can stop described led luminescence chip group 3 institute
The light of transmitting, causes the significantly decay of described light, also can affect the heat dispersion of described LED lamp.
Preferably, it will be appreciated by those skilled in the art that the position of described substrate 2 is not fixing, its position can basis
The position phase of described led luminescence chip group 3 should determine that.Meanwhile, the quantity of described substrate 2 is not also unique, can be one
Can be multiple.Further, skilled artisan understands that the determination of the determination of amount of described substrate 2 and position, main
If in order to preferably described LED lamp cell-shell 1 be fitted with described led luminescence chip group 3, can be in concrete implementation
In, dynamically adjust quantity and the position of described substrate 2, will not be described here.
In sum, described LED lamp is mainly by described LED lamp cell-shell 1, described substrate 2 and described led luminescence chip group
3 compositions.The connection of described LED lamp cell-shell 1 and described led luminescence chip group 3 is realized so that described led sends out by described substrate 2
Optical chip group 3 is mounted directly on described LED lamp cell-shell 1, substantially reduces the distance of the conduction of heat of described led luminescence chip group 3,
Heat produced by described led luminescence chip group 3 directly just can promptly be passed to by the LED lamp cell-shell of thin layer
In external environment condition, substantially increase the radiating efficiency of described LED lamp, define the good heat conductivity of LED lamp, and then extend
The service life of LED lamp and service efficiency, simply and easily solve the heat dissipation problem of LED lamp.
Further, it will be appreciated by those skilled in the art that in this embodiment, in described led luminescence chip group 3
The upper surface of led luminescence chip scribbles fluorescent material.Specifically, described led luminescence chip group 3 includes one or more led and sends out
Optical chip is it is preferable that when it comprises multiple led luminescence chip, then each led luminescence chip all can obtain and drive from power supply
The electric power that dynamic model block provides, will not be described here.Further it is preferable that wherein one or more led luminescence chips upper
Surface scribbles fluorescent material, so that the light that the led luminescence chip being applied fluorescent material is sent is more uniform, color
It is easier to be received by consumer.
Further, it will be appreciated by those skilled in the art that Fig. 1 illustrate only described in a described substrate 2 and one group
The schematic diagram of led luminescence chip group 3, this is not intended that the present invention is only limited to one group of led luminescence chip group 3, such as shown in Fig. 2
Implement to be illustrated the schematic diagram of multigroup described substrate 2 and led luminescence chip group 3 described in a group, will not be described here.More enter
One step ground, it will be appreciated by those skilled in the art that elaborate to drive by circuit connecting mode in Fig. 6 to embodiment illustrated in fig. 8
The preferred embodiment of described led luminescence chip group 3, specifically refer to Fig. 6 to embodiment illustrated in fig. 8.
Fig. 2 illustrates according to the first embodiment of the present invention, the layout architecture schematic diagram of LED lamp.Those skilled in the art
Understand, the layout architecture of described LED lamp is merely only not figure described in figure, described led luminescence chip group 3 and described substrate
2 compound mode can be variously-shaped.Figure shown in described Fig. 2 is petal type bulb lamp moulding, and wherein said led sends out
Optical chip group 3 is petal type structure, and shape extends from the afterbody of described LED lamp cell-shell 1, and along described LED lamp cell-shell 1
Inner surface spread out with strip, then gather again at the top of described LED lamp cell-shell 1, its shape is i.e. as petal.And it is described
Led luminescence chip group 3 is connected on the inner surface of described LED lamp cell-shell 1 by described substrate 2, is carried out using LED lamp cell-shell 1
Directly cross-ventilation radiating, LED lamp bar directly contacts with LED lamp cell-shell 1, and the heat that led produces endlessly is conducted to led
Bulb housing 1, LED lamp cell-shell 1, through horizontal and vertical conduct air, under the convection action of cool exterior air, is constantly carried out
Heat exchange, LED lamp cell-shell 1 serves good thermolysis.By this kind of design so that led luminescence chip group 3 produce heat
Amount is easier to be dispersed in the air.It will be appreciated by those skilled in the art that for the pattern diagram of other LED lamps, its general configuration is such as
Fig. 2 depicted, only the structure of led luminescence chip group 3 is different, therefore will not be described here.
With reference to embodiment illustrated in fig. 2, it will be appreciated by those skilled in the art that preferably, described luminescence chip group 3 is placed in described
The part of LED lamp shade 1 tail end is connected with electric power driving module, and described electric power driving module passes through described LED lamp cell-shell 1 afterbody
Screw socket is connected with power supply, and in the case that power supply is powered, described luminescence chip group 3 is powered, driven, thus sending out described in gained
Optical chip group 3 lights, and then LED lamp provided by the present invention is lighted.
Fig. 3 shows the schematic diagram of the LED lamp with insulation protection device according to the first embodiment of the present invention.Enter one
Step ground, it will be appreciated by those skilled in the art that in a preferred embodiment of the invention, the described LED lamp with insulation protection, extremely
Include a LED lamp shade 1, multiple substrate 2 and the led luminescence chip group 3 corresponding to the plurality of substrate 2 quantity less, wherein,
The side of one substrate 2 is attached at the inner surface of described LED lamp shade 1, and a described led luminescence chip group 3 is attached at institute
State the opposite side of a substrate 2, the top of described substrate 2 is provided with insulation protection device 4.It will be appreciated by those skilled in the art that it is described
The main usess of insulation protection device 4 are used for avoiding the generation between each chipset to disturb, especially current interference.
It will be appreciated by those skilled in the art that in related LED lamp, exist two schemes a kind of be multiple substrates 2 top
Independent mutually, maintain a certain distance each other, such as its length has done restriction so that the top of substrate 2 will not mutually connect
Touch；Another kind of scheme is then that the top of multiple substrates 2 contacts with each other, and for example preferably, mutually connects two-by-two between adjacent submounts
Touch, under this kind of situation, when energized, because substrate is all with like charges, current interference will necessarily be produced each other,
Impact terminal use use.In order to solve the above problems, in the present invention, it is preferred to provide with insulation protection device 4
LED lamp, makes described substrate 2 will not produce current interference by described insulation protection device 4.
Specifically, in a preferred embodiment, as shown in figure 3, described insulation protection device 4 is ambroin outer housing,
The shape of described ambroin outer housing is adapted with the shape on the top of described substrate 2.Further, those skilled in the art's reason
Solution, described ambroin outer housing is preferably a husk making of plastics, four sides of described ambroin outer housing and
Top closure, the bottom of described ambroin outer housing has opening to be inserted in described substrate 2 to facilitate.Further, art technology
Personnel understand, described ambroin outer housing preferably has certain thickness to reach insulation effect.Further, this area skill
Art personnel understand, in different change case, the material of described insulation cover is not limited to ambroin or insulation
Rubber, glass etc., will not be described here.More specifically, it will be appreciated by those skilled in the art that Fig. 3 illustrate only described in setting
The schematic diagram of ambroin outer housing, its transparent effect is merely to skilled artisan understands that the present embodiment is used, here is not
Give and repeating.
Further, with reference to above-mentioned embodiment illustrated in fig. 3, it will be appreciated by those skilled in the art that in a preferred variant,
Insulation effect is reached using the method being coated with insulating paint on a substrate 2, that is, insulation protection device 4 adopts insulating paint.Absolutely
Edge paint is based on high molecular polymer, can be solidified into dielectric film or the important insulation of insulation entirety under certain conditions
Material.Taking this scheme advantage to have two: one is to facilitate mass industrialized production, directly can apply while producing substrate
Cover；Two is to compare ambroin outer housing, and it is higher with the adhesion of substrate.The dry type of insulating paint in the market has
Self-drying type insullac, drying-type insullac, ultraviolet curing insullac, technique typically adopts dip-coating or spraying coating process, permissible
Final coated options are selected after considering.
Further, it will be appreciated by those skilled in the art that in such change case, can be produce described substrate 2 it
The appropriate section of the front material being first about to for producing this substrate 2 coats described insulating paint, such as after the molding of described substrate 2
The described insulation of top of supply line coating especially or be coated with institute on the top of described substrate 2 after the molding of described substrate 2
State insulating paint.This is only technologic difference, does not have an impact for technical scheme, will not be described here.
Further, with reference in above-mentioned embodiment illustrated in fig. 3 and above-mentioned change case, it will be appreciated by those skilled in the art that
In another preferred variant, after the top of described substrate 2 coats described insulating paint, then it is being coated with described insulating paint
The outside at position adds the described ambroin outer housing of set, thus using described insulating paint and described ambroin outer housing in the lump as this
The insulation protection device 4 that invention provides.It will be appreciated by those skilled in the art that such change case can prevent insulating paint due to outer
The problem that comes off that the effect of power produces, and may further ensure that the stability of insulation effect.
Above-mentioned Fig. 3 shows one embodiment of the present of invention and corresponding change case, and on this basis, by Fig. 4
Show the schematic diagram of the LED lamp with insulation protection device according to the second embodiment of the present invention.With reference to Fig. 4, this area
Technical staff understands, described schematic diagram illustrate only the position comprising described insulation protection device 4, and other positions may be referred to
Remaining word segment of the present invention is understood, will not be described here.
Specifically, in the present embodiment, as shown in figure 4, described insulation protection device 4 puts forth effort umbrella 7 for one, described put forth effort umbrella
7 are preferably umbrella stand shape, that is, have several umbrella stands from same fixed point along certain gradient or radian to different directions
Extend, its profile is similar to opening rear umbrella frame.
Further, with reference to Fig. 4, it will be appreciated by those skilled in the art that and the end of each umbrella stand described is equipped with plastic seal
Set 71, the shape of described plastic envelope 71 is adapted with the shape on described substrate 2 top.Not only can be ensured respectively using this scheme
Insulating properties between substrate, and facilitate substrate 2 to extend in lampshade 1.Specifically, first the plastics of each end of umbrella 7 will be puted forth effort
Big envelope is inserted into each substrate top, makes to put forth effort umbrella 7 to be relatively fixed with substrate 2, then described substrate 2 is stretched into described LED lamp bubble
In shell 1.Specifically, described umbrella of putting forth effort extend in described LED lamp cell-shell 1 in advance, subsequently promotes the top traction base putting forth effort umbrella 7
Plate 2 moves into bulb housing 1, further, it will be appreciated by those skilled in the art that the plastic envelope of umbrella 7 end ought described be puted forth effort
Conflict described LED lamp cell-shell 1 top inner surface when, by described substrate 2 afterbody apply thrust, so that described substrate 2 is pasted
It is combined in the inwall of bulb housing 1.
With reference to above-mentioned embodiment illustrated in fig. 4, it will be appreciated by those skilled in the art that in another change case, described put forth effort umbrella 7
Plastic envelope 71 be combined together (not shown) with the top of described substrate 2 by way of bonding, that is, be pasted onto institute
State the outer surface of substrate 2.The advantage of this scheme is it is ensured that putting forth effort firmly to be combined between umbrella 7 and described substrate 2, no
The situation that plastic envelope 71 departs from substrate 2 top can be produced.
Specifically, as shown in figure 4, described umbrella 7 of putting forth effort includes six umbrella stands, and described umbrella stand is from the described top putting forth effort umbrella 7
Point 72 outwards dissipates and symmetrical, and in change case, umbrella stand can also be asymmetric, and quantity can also be more than six,
Specifically to be designed according to the arrangement of the quantity of substrate 2 and substrate.
With reference to above-mentioned embodiment illustrated in fig. 4, it will be appreciated by those skilled in the art that the described summit 72 putting forth effort umbrella 7 is by described six
Individual umbrella stand separates so as to mutually be not turned on.Summit 72 can be designed to the other shapes such as circle, rectangular lamps, if guarantee every
From each umbrella stand, will not be described here.
The umbrella stand putting forth effort umbrella 7 can be designed as wire it is also possible to be designed as tubulose, and for example described umbrella stand can be hollow
Or solid, this has no effect on the particular content of the present invention.Umbrella stand can be bending, and that is, umbrella stand itself has
Certain radian, its radian matches with the radian on bulb housing 1 top it is ensured that umbrella stand closely can be pasted with the inwall of bulb housing 1
Close.Further, it will be appreciated by those skilled in the art that as a kind of change, umbrella stand can also be linear type, energy when by external force
Enough there is certain flexibility, but umbrella stand is not fitted with bulb housing 1.
The described material putting forth effort umbrella 7 umbrella stand can use metal, plastics, rubber.
Fig. 5 illustrates according to the first embodiment of the present invention, the structural representation of LED lamp substrate.Those skilled in the art
Understand, shown Fig. 5 is not unique LED lamp board structure schematic diagram, and the purpose of this figure only shows substrate described in LED lamp
2 general configuration.As shown in figure 5, described substrate 2 is attached on the inner surface of described LED lamp cell-shell 1, described led luminescence chip
Group 3 (this in figure is not shown) are then accordingly attached on described substrate 2.Wherein, in this Fig. 5, illustrate one of substrate 2
Point, not all, the only part of the LED lamp cell-shell 1 of arcuation.
Further, in the present embodiment, described substrate 2 at least includes via 21, specifically, with swashing on described substrate 2
The via 21 of photoengraving ad hoc rule distribution, via 21 diameter, between 0.1～0.5mm, allows the light of led luminescence chip group 3
Can pass through.It will be appreciated by those skilled in the art that the quantity of described via 21 and distribution are not changeless.For example preferred
Ground, described via 21 is uniformly distributed rectangular in one, and in a further advantageous embodiment, described via 21 is uniformly distributed in one
Individual round shape, and in another preferred embodiment, the part of described via 21 is uniformly distributed, another part non-uniform Distribution, this
Have no effect on the concrete technical scheme of the present invention.It will be appreciated by those skilled in the art that described via 21 is at least as loophole purposes,
Will not be described here.
More specifically, described substrate 2 adopts aluminium base to pass through punch forming, substrate 2 assumes linear type mode cabling, the party
Formula can facilitate bending, makes led luminescence chip group 3 be more prone to brake forming on a substrate 2, the width of led luminescence chip group 3
Can select between 0.5～5mm, substrate 2 thickness selects between 0.3～2.0mm, one group of led luminescence chip group 3 power is excellent
Between 1～3w, led luminescence chip group 3 combination is divided into the various combinations such as 3,4,6,8, to be combined into different capacity to selection of land
LED lamp, will not be described here.
Below in conjunction with the accompanying drawings 6, Fig. 7 and Fig. 8, elaborates on how to drive described led to send out by circuit connecting mode
The preferred embodiment that optical chip group 3 lights.
Fig. 6 illustrates according to the first embodiment of the present invention, LED lamp substrate and led luminescence chip group, flexible circuit board
Connection diagram.It will be appreciated by those skilled in the art that described Fig. 6 is not the present embodiment unique connected mode figure, the mesh of this figure
Be intended to illustrate implement preferred embodiment connection diagram.Specifically, as shown in fig. 6, described led luminescence chip group 3 connects
To the side of described substrate 2, the opposite side of described substrate 2 is connected with the inner surface of described bulb housing 1, and those skilled in the art manage
Solution, the mode that described led luminescence chip is connected with described substrate 2 is not changeless, for example, can be that direct stamp exists
The surface of described substrate 2, mode is varied, but has no effect on the flesh and blood of the present invention, therefore will not be described here.Meanwhile,
Via 21 (not showing in Fig. 6) is distributed with described substrate 2, with regard to the distribution of via 21, is already described in above-mentioned Fig. 5, therefore
Will not be described here.
More specifically, being connected in series, by this kind of connection by described bonding line 22 between each led luminescence chip described
Mode, can form a series circuit between each led luminescence chip described, simultaneously power supply and power-off simultaneously.
Further, flexible circuit board 6 described in, people in the art are installed in the one end connecting power supply in described substrate 2
Member understands it is preferable that the afterbody of described substrate 2 is provided with described flexible circuit board 6.Further, those skilled in the art's reason
Solution, the method that described flexible circuit board 6 is installed on a substrate 2 is not changeless, and it can be using the method for pressing
The method that adhesion can be used, method is multiple, but has no effect on the flesh and blood of the present invention, therefore will not be described here.
Further, in the present embodiment, as shown in FIG. it is preferable that will be last in described led luminescence chip group 3
The anode of one luminescence chip is electrically connected with described substrate 2, simultaneously by the one of flexible circuit board 6 close in led luminescence chip group 3
The negative electrode of individual luminescence chip is electrically connected with the negative electrode in flexible circuit board 6.Further, it will be appreciated by those skilled in the art that this
During the use of LED lamp that invention provides, described substrate 2 is preferably passed through afterbody and the external power source of described bulb housing 1
It is electrically connected, such external power source is electrically connected and obtains typically by the afterbody of lamp socket and described bulb housing 1, from
And allow external power source to drive described LED lamp.Further, it will be appreciated by those skilled in the art that the both positive and negative polarity of external power source
It is connected with described substrate 2, flexible circuit board 6 respectively, thus constituting complete power circuit, such as shown in Fig. 8.
Further, it will be appreciated by those skilled in the art that during the use of the LED lamp that the present invention provides, alternating current is
Directly electrically connected with described led luminescence chip group with wire by the lamp holder of described LED lamp or first by described lamp holder position
Electrically connected with described led luminescence chip group again after external driving power supply rectification, constant current, and real shown in Fig. 6 and Fig. 7
Apply in example, described flexible circuit board act as turning on the effect of circuit and led drive circuit carrier.
Under ac direct driving mode, the alternating current direct of described lamp holder joints connects and is wired to shown in Fig. 6 or Fig. 7
Flexible circuit board 6 on l binding post and n binding post, by emc filter circuit, bridge rectifier, constant-current driving
After circuit, described led luminescence chip group is powered, concrete structure is as shown in Fig. 6 and Fig. 7.Wherein, described emc filtered electrical
Road, bridge rectifier, constant-current drive circuit etc. be not shown in Fig. 6 and Fig. 7 it is preferable that it is all to bind skill by cob
Art is placed directly against the circuit formation path passing through scolding tin and flexible circuit board in flexible circuit board.
Further, it will be appreciated by those skilled in the art that by above-mentioned connected mode, the both positive and negative polarity of led luminescence chip group 3 is
Through being formed, such that it is able to a The electric loop can be formed in the case of externally fed, by the break-make of control loop, and then control
Whether the lighting of described led luminescence chip group 3.
It will be appreciated by those skilled in the art that so that LED lamp sends the white light of more preferable effect, in described led luminescence chip
The upper surface of group 3 coats fluorescent material 23, as shown in FIG..
Closer, how the The electric loop shown in Fig. 6 is connected with power drives, below in conjunction with accompanying drawing
7 and accompanying drawing 8, it is specifically described the embodiment of two kinds of connections.
Fig. 7 illustrates according to the first embodiment of the present invention, and in LED lamp, to be incorporated into flexible circuitry hardened for power driving template
Connection diagram in structure.It will be appreciated by those skilled in the art that described Fig. 7 is not unique structure connection figure, the purpose meaning of this figure
Structure connection in explanation electric power driving module 5 and flexible circuit board 6.Specifically, as shown in fig. 7, described flexible circuitry
Binding post l, binding post n, flexible circuit board anode and flexible circuit board negative electrode is at least included in plate 6.Further, exist
In embodiment illustrated in fig. 7, described flexible circuit board anode and flexible circuit board negative electrode are in the way of electric power driving module 5
Existing, and preferably skilled artisan understands that described electric power driving module 5 is at least integrated with AC-DC conversion module and constant current
Drive module (not shown), so that the both positive and negative polarity of described led luminescence chip group 3 is formed.Those skilled in the art
Understand, described electric power driving module 5 is placed in the inside of flexible circuit board 6, becomes one of structure of flexible circuit board 6, ability
Field technique personnel understand, the method that described electric power driving module 5 is integrated in flexible circuit board 6 has many kinds, and here is not superfluous
State.
Further, with reference to Fig. 6, it will be appreciated by those skilled in the art that the negative electrode of described flexible circuit board 6 is sent out with described led
The negative electrode electrical connection of optical chip, the anode of described flexible circuit board 6 is electrically connected with described substrate 2.By such connected mode,
Described substrate 2 is made to carry positive charge, so that the anode of described led luminescence chip is connected with any point of described substrate 2
, without the anode being necessarily connected to described flexible circuit board 6, save the material of described flexible circuit board 6, also just
In being processed.And in preferred variant, for structure shown in Fig. 6 to Fig. 8 it is also possible to sun by described flexible circuit board 6
Pole is electrically connected with the anode of described led luminescence chip, and the negative electrode of described flexible circuit board 6 is electrically connected with described substrate 2, correspondingly
The negative electrode of described led luminescence chip is electrically connected with described substrate 2, thus the confession for described led luminescence chip can also be formed
The electric loop.
Further, it will be appreciated by those skilled in the art that being directed to a led luminescence chip group, preferably this led lights core
Each of piece group led luminescence chip is directly connected by bonding line 22, thus forming cascaded structure.In such architecture basics
On, the negative electrode of first led luminescence chip can be used as the negative electrode of described led luminescence chip group, and last led lights core
The anode of piece can be used as the anode of described led luminescence chip group.Yet further, in a change case, art technology
Personnel understand, its anode individually can also be connected to described base by each of described led luminescence chip group led luminescence chip
On plate 2, correspondingly the negative electrode of each led luminescence chip is connected on the negative electrode of described flexible circuit board 6, and this has no effect on this
The technical scheme of invention.
Further, with reference to above-mentioned Fig. 6 and Fig. 7, it will be appreciated by those skilled in the art that in above-described embodiment and change case
In, it provides the electrical interface of anode and negative electrode for described led luminescence chip, thus when the anode of power supply is connect respectively with negative electrode
During to above-mentioned anode and negative electrode, a current supply circuit to described led luminescence chip can be formed, will not be described here.
More specifically, similar with above-mentioned embodiment illustrated in fig. 6, in the LED lamp work process that the present invention provides, work as institute
State substrate 2 to electrically connect with external power source by the afterbody of bulb housing 1, described external power source passes through described electric power driving module 5 etc.
Described luminescence chip group 3 is driven, thus controlling described luminescence chip group 3 to light.By this kind of connection, described power supply drives
Dynamic model block 5, in the presence of flexible circuit board 6, forms The electric loop with described substrate 2 and described led luminescence chip group 3, reaches
Control the effect of described luminescence chip break-make.
Fig. 8 illustrates according to the first embodiment of the present invention, and in LED lamp, to be placed on flexible circuitry hardened for electric power driving module
The connection diagram of structure.In conjunction with above-mentioned embodiment illustrated in fig. 6, skilled artisan understands that described flexible circuit board 6 is at least wrapped
Include flexible circuit board anode, i.e. led+ shown in Fig. 8, and flexible circuit board negative electrode, i.e. led- shown in Fig. 8.Described flexible circuitry
Plate negative electrode is electrically connected with the negative electrode of the plurality of led luminescence chip, and described flexible circuit board anode is electrically connected with described substrate 2.
By such connected mode, when connecting external power source 7, described substrate 2 carries positive charge, constitutes positive pole, so that described
The both positive and negative polarity of luminescence chip group 3 is formed.It will be appreciated by those skilled in the art that described Fig. 8 is not unique structure connection figure, this figure
Purpose be intended to the structure connection of external power source (external drive part) 7 and flexible circuit board 6 is described.Set by this kind of
Meter, can control the circuit on-off of whole luminescence chip group 3 by described flexible circuit board 6 it is achieved that to luminescence chip group 3
The control whether lighting.
Further, with reference to shown in Fig. 8, under dc mode activated, the alternating current direct of above-mentioned lamp holder joints connected wire
Be connected in external driving power supply, power source internal carry out emc filter circuit, bridge rectifier, after constant-current drive circuit,
Again the positive and negative electrode in the flexible circuit board above lamp bar is connected by wire, ultimately form path.Those skilled in the art manage
Solution, flexible circuit board has only served the effect of communication line here, does not possess the ability of ac direct drive.
Further, with reference to above-mentioned Fig. 1 to Fig. 8, it will be appreciated by those skilled in the art that above-mentioned Fig. 1 to Fig. 8 is not the present invention
Unique structure connection figure, the purpose of above-mentioned figure is intended to the structure of LED lamp and the luminous core of wherein led that the present invention provides is described
The structure of piece group and flexible circuit board, connection.As shown in fig. 7, described substrate 2 is preferably by metallic conductor, so no
Method realizes complicated circuit and telegraph circuit, preferably region laminating great-wall shaped FPC thereunder, and according to base
The setting of plate can arrange multiple led luminescence chip groups, and preferably by parallel way between each led luminescence chip group, and
The quantity of connection is to be determined by the number of described led luminescence chip group.Preferably, the quantity of described led luminescence chip group can be
Select between 3-10 bar, different according to power, compound mode can also be different, and this has no effect on technical scheme.
Further, the bottom of described substrate 2 is anode, and the negative electrode of described substrate 2 is connected to flexible wires by bonding line
Road plate, as shown in Figure 6.And Fig. 6 is construed as one of Fig. 7, Fig. 8 detail section, electric power driving module 5 and wire connecting portion
Divide and be made up of lower section rectangular region in Fig. 7.Electric power driving module 5 shown in Fig. 7 mainly comprises following part, for example
Emc filter circuit, bridge rectifier, constant-current drive circuit and other protection circuits composition.By above-mentioned technical scheme,
The LED lamp that the present invention provides is allow to pass through DC powered it is also possible to pass through to exchange electric drive so that installation and debugging are safeguarded
All become very simple.Further, the alternating current direct of above-mentioned lamp holder joints connects the flexibility being wired to above lamp bar
L ac terminal on wiring board 6, n ac terminal, after emc filter circuit, bridge rectifier, constant-current drive circuit, its
Middle emc filter circuit, bridge rectifier, constant-current drive circuit are all direct by cob (chip on board) binding technology
It is attached to the circuit formation path that scolding tin and flexible circuit board are passed through on flexible circuit board.
Further, it will be appreciated by those skilled in the art that because described substrate 2 is preferably by metal, therefore described substrate 2
An electrode can only be served as, led is a LED device, wanting to light to have 2 electrodes, one plus positive voltage,
One plus negative voltage, circuit part relies on flexible circuit board to complete, as shown in Figure 6.Flexible circuit board need not deliver to end line
At road, so can greatly save the cost of wiring board, flexible circuit board only needs to connect with the electrode cathode of first chip and is
Can, after certain led quantity of connecting, anode is turned on by substrate true qualities conduction, and the anode in flexible circuit board leads to
Via or welding directly fit together, and realize the conducting of circuit.
Above the specific embodiment of the present invention is described.It is to be appreciated that the invention is not limited in above-mentioned
Particular implementation, those skilled in the art can make various modifications or modification within the scope of the claims, this not shadow
Ring the flesh and blood of the present invention.
Claims (7)
1. a kind of LED lamp with insulation protection is it is characterised in that at least include LED lamp shade (1), multiple substrate (2) and right
Should be in the led luminescence chip group (3) of the plurality of substrate (2) quantity；
Wherein, the side of described substrate (2) is attached at the inner surface of described LED lamp shade (1), a described led luminescence chip group
(3) be attached at the opposite side of described substrate (2), described substrate (2) be used for attaching the region of described led luminescence chip group (3) or
Person peripheral region is provided with least one via (21),
Wherein, the top of described substrate (2) is provided with insulation protection device (4), and described insulation protection device (4) is to put forth effort umbrella (7),
Described umbrella (7) of putting forth effort is umbrella stand shape, and the end of each umbrella stand is equipped with plastic envelope (71), the shape of described plastic envelope (71)
Shape is adapted with the shape on the top of described substrate (2).
2. LED lamp according to claim 1 is it is characterised in that described umbrella (7) of putting forth effort includes at least six umbrella stands, and institute
State umbrella stand outwards to dissipate and symmetrical from the described summit (72) putting forth effort umbrella (7).
3. LED lamp according to claim 1 and 2 is it is characterised in that described led luminescence chip group (3) includes one or many
Individual led luminescence chip；And when described led luminescence chip group (3) includes multiple led luminescence chip, the plurality of led lights core
It is connected in series by bonding line (22) between piece, the anode of the plurality of led luminescence chip is electrically connected on described substrate (2),
The negative electrode of the plurality of led luminescence chip and a flexible circuit board (6) are connected such that and form current supply circuit with power supply.
4. LED lamp according to claim 3 is it is characterised in that described flexible circuit board (6) includes l binding post, n connects
Line terminals, flexible circuit board anode and flexible circuit board negative electrode, described flexible circuit board negative electrode luminous core with the plurality of led
The negative electrode electrical connection of piece, described flexible circuit board anode is electrically connected with described substrate (2).
5. LED lamp according to claim 3 is it is characterised in that described flexible circuit board (6) includes flexible circuit board anode
And flexible circuit board negative electrode, described flexible circuit board negative electrode is electrically connected with the negative electrode of the plurality of led luminescence chip, described soft
Property wiring board anode is electrically connected with described substrate (2), when described LED lamp uses, described flexible circuit board anode and flexibility
Wiring board negative electrode is connected with power anode and negative electrode respectively.
6. the LED lamp according to any one of claim 1 or 2 or 4 or 5 is it is characterised in that described led luminescence chip group
(3) upper surface of the led luminescence chip in scribbles fluorescent material.
7. LED lamp according to claim 6 is it is characterised in that described substrate (2) is transparence or translucent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410527360.7A CN104295962B (en) | 2014-10-09 | 2014-10-09 | LED lamp with insulation protection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410527360.7A CN104295962B (en) | 2014-10-09 | 2014-10-09 | LED lamp with insulation protection |
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| CN104295962A CN104295962A (en) | 2015-01-21 |
| CN104295962B true CN104295962B (en) | 2017-01-18 |
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| JP2013258082A (en) * | 2012-06-13 | 2013-12-26 | Panasonic Corp | Led lighting fixture |
| US8998459B2 (en) * | 2013-01-23 | 2015-04-07 | Yu-Chen CHIEN | Illuminating apparatus |
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| CN104295962A (en) | 2015-01-21 |
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