CN104559661A - Coating used for metal film resistor encapsulating layer and preparation method thereof - Google Patents
Coating used for metal film resistor encapsulating layer and preparation method thereof Download PDFInfo
- Publication number
- CN104559661A CN104559661A CN201410831134.8A CN201410831134A CN104559661A CN 104559661 A CN104559661 A CN 104559661A CN 201410831134 A CN201410831134 A CN 201410831134A CN 104559661 A CN104559661 A CN 104559661A
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- Prior art keywords
- epoxy resin
- parts
- coating
- metalster
- encapsulated layer
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/69—Particle size larger than 1000 nm
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Nanotechnology (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Paints Or Removers (AREA)
Abstract
The invention discloses a coating used for a metal film resistor encapsulating layer. The costing consists of the following raw materials in parts by weight: 67-72 parts of epoxy resin, 23 parts of a curing agent and 5-10 parts of nanometer aluminum oxide, wherein the average grain diameter of the nanometer aluminum oxide is 1-5 microns. The existing encapsulating material epoxy resin is filled with inorganic high heat conductivity filler nanometer aluminum oxide, and the heat conductivity coefficient of aluminum oxide is as high as 28-30 W/(m*K), so that the heat dissipation capacity of the encapsulating layer is greatly improved; therefore, under the condition that the size does not change, the power of a metal film resistor can be improved by 80-100%; moreover, the nano-particles have a nanometer size effect and a huge surface area and higher interface interaction, and after the nano-particles are fused in a certain proportion with epoxy resin, the bending strength, impact resistance and heat stability of the encapsulating layer are strengthened, so that the service life of the product is prolonged.
Description
Technical field
The present invention relates to metalster field, particularly a kind of coating for metalster encapsulated layer and preparation method thereof.
Background technology
Along with microelectronics and unicircuit are to high-density and miniaturization development, the volume of electronic devices and components is constantly compressed, and the heat that electronics unit volume produces sharply increases, and thus heat conductivility affects the life and reliability of electronic devices and components.For guaranteeing the normal operation of electronic devices and components, material is needed to possess high heat-sinking capability, to ensure the quick transmission of heat.Now widely used metalster all adopts epoxy resin enclosed layer, the poor thermal conductivity of existing epoxy resin enclosed layer, epoxy resin is the poor conductor of heat, thermal conductivity only has 0.2W/ (m.K), be unfavorable for heat radiation and reduce operating temperature, when the power of conventional metals film resistor is more than 1W, surface temperature reaches about 120 DEG C usually, the power that the heat dispersion of existing encapsulated layer constrains precision metal film resistor does greatly, can not meet the service requirements of the superpower precision metal film resistor required by special user, the paint film of existing encapsulated layer is crisp simultaneously, poor impact resistance, easy to crack, work-ing life is shorter.
Summary of the invention
Epoxy resin enclosed layer thermal diffusivity and the poor shortcoming of intensity is there is for existing metalster, the invention provides a kind of coating for metalster encapsulated layer and preparation method thereof, the heat dispersion of this coating significantly improves, the precision metal film resistor power of same size is made to improve 80-100% on the original basis, to meet the service requirements of the superpower precision metal film resistor required by special user.
The object of the invention is to be achieved by the following technical programs:
For a coating for metalster encapsulated layer, it is characterized in that, be made up of following raw material: count by ratio of weight and the number of copies, epoxy resin 67-72 part, 23 parts, solidifying agent, nano aluminium oxide 5-10 part.
Preferably, a kind of coating for metalster encapsulated layer, is made up of following raw material: count by ratio of weight and the number of copies, epoxy resin 69 parts, 23 parts, solidifying agent, nano aluminium oxide 8 parts.
The composition of described epoxy resin is: by mass percentage, epoxy resin 55%, calcium carbonate 15%, titanium dioxide 19%, butyl glycol ether 10%, toner 1%.
The composition of described solidifying agent is: by mass percentage, butyl glycol ether 60%, aminated compounds 40%.
The median size of described nano aluminium oxide is 1 ~ 5 micron.
For a preparation method for the coating of metalster encapsulated layer, it is characterized in that, raw material is carried out ball milling 3 hours by joining ball mill after proportioning mixing and stirring, leave standstill and complete after 2 hours.
Beneficial effect: the present invention by filling inorganic high heat conductive filler nano aluminium oxide in existing encapsulating material epoxy resin, the thermal conductivity of aluminum oxide is up to 28 ~ 30W/ (mK), the heat-sinking capability of encapsulated layer is made to obtain huge raising, thus the power of metalster can be improved 80-100% when volume size is constant, simultaneously because nanoparticle has nanometer size effect, huge surface-area and stronger interface interaction, after merging by a certain percentage with epoxy resin, enhance the flexural strength of encapsulated layer, shock-resistance and thermostability, thus improve the work-ing life of product.
Accompanying drawing explanation
Fig. 1 is the flexural strength graphic representation of epoxy resin after filling nano aluminium oxide.
Embodiment
Embodiment one:
A kind of coating for metalster encapsulated layer provided by the present invention, be made up of following raw material: count by ratio of weight and the number of copies, epoxy resin 67 parts, the epoxy coating (Z-1126) 23 parts that Chuan Yu Industries, Inc produces, nano aluminium oxide 10 parts, the composition of described epoxy resin is: by mass percentage, bisphenol A type epoxy resin 55%, calcium carbonate 15%, titanium dioxide 19%, butyl glycol ether 10%, toner 1%; The composition of described solidifying agent is: by mass percentage, butyl glycol ether 60%, aminated compounds 40%; The median size of described nano aluminium oxide is 1 ~ 5 micron.
Embodiment two:
A kind of coating for metalster encapsulated layer, be made up of following raw material: count by ratio of weight and the number of copies, epoxy resin 72 parts, 23 parts, solidifying agent, nano aluminium oxide 5 parts, the composition of described epoxy resin is: by mass percentage, bisphenol A type epoxy resin 55%, calcium carbonate 15%, titanium dioxide 19%, butyl glycol ether 10%, toner 1%; The composition of described solidifying agent is: by mass percentage, butyl glycol ether 60%, aminated compounds 40%; The median size of described nano aluminium oxide is 1 ~ 5 micron.
Embodiment three:
A kind of coating for metalster encapsulated layer, be made up of following raw material: count by ratio of weight and the number of copies, epoxy resin 69 parts, 23 parts, solidifying agent, nano aluminium oxide 8 parts, the composition of described epoxy resin is: by mass percentage, bisphenol A type epoxy resin 55%, calcium carbonate 15%, titanium dioxide 19%, butyl glycol ether 10%, toner 1%; The composition of described solidifying agent is: by mass percentage, butyl glycol ether 60%, aminated compounds 40%; The median size of described nano aluminium oxide is 1 ~ 5 micron.
Preparation method is as follows:
Raw material is carried out ball milling 3 hours by joining ball mill after proportioning mixing and stirring, and leave standstill and complete after 2 hours, the flexural strength of gained coating as shown in Figure 1.
Use formulation for coating material of the present invention and conventional epoxies coating 1W resistance and 2W resistance as encapsulated layer respectively, perform according to GJB1929-1994 product standard, apply the precision change of rated load after 1000 hours at comparing 70 DEG C, examination power level, concrete data are as follows:
| Sequence number | Coating classification | Power | Surface temperature | Precision changes |
| 1 | Ordinary epoxy resin | 1W | 100℃ | ±0.4% |
| 2 | Ordinary epoxy resin | 2W | 150℃ | ±1% |
| 3 | Embodiment one paint formulation | 1W | 79℃ | ±0.23% |
| 4 | Embodiment one paint formulation | 2W | 98℃ | ±0.36% |
| 5 | Embodiment two paint formulation | 1W | 88℃ | ±0.3% |
| 6 | Embodiment two paint formulation | 2W | 110℃ | ±0.6% |
| 7 | Embodiment three paint formulation | 1W | 80℃ | ±0.25% |
| 8 | Embodiment three paint formulation | 2W | 100℃ | ±0.4% |
Embodiment above describes ultimate principle of the present invention, principal character and advantage, not form any pro forma restriction of the present invention; Any those of ordinary skill in the art, do not departing under technical solution of the present invention ambit, the Method and Technology content of above-mentioned announcement all can be utilized to make many possible variations and modification to technical solution of the present invention, or be revised as the Equivalent embodiments of equivalent variations.Therefore, every content not departing from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, equivalent replacement, equivalence change and modification, all still belongs in the scope of technical solution of the present invention protection.
Claims (6)
1. for a coating for metalster encapsulated layer, it is characterized in that, be made up of following raw material: count by ratio of weight and the number of copies, epoxy resin 67-72 part, 23 parts, solidifying agent, nano aluminium oxide 5-10 part.
2. a kind of coating for metalster encapsulated layer according to claim 1, is characterized in that, be made up of: count by ratio of weight and the number of copies following raw material, epoxy resin 69 parts, 23 parts, solidifying agent, nano aluminium oxide 8 parts.
3. a kind of coating for metalster encapsulated layer according to claim 1 and 2, is characterized in that, the composition of described epoxy resin is: by mass percentage, epoxy resin 55%, calcium carbonate 15%, titanium dioxide 19%, butyl glycol ether 10%, toner 1%.
4. a kind of coating for metalster encapsulated layer according to claim 1 and 2, is characterized in that, the composition of described solidifying agent is: by mass percentage, butyl glycol ether 60%, aminated compounds 40%.
5. a kind of coating for metalster encapsulated layer according to claim 1, is characterized in that, the median size of described nano aluminium oxide is 1 ~ 5 micron.
6. the preparation method of a kind of coating for metalster encapsulated layer described in claim 1, is characterized in that, raw material is carried out ball milling 3 hours by joining ball mill after proportioning mixing and stirring, leaves standstill and completes after 2 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410831134.8A CN104559661A (en) | 2014-12-29 | 2014-12-29 | Coating used for metal film resistor encapsulating layer and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410831134.8A CN104559661A (en) | 2014-12-29 | 2014-12-29 | Coating used for metal film resistor encapsulating layer and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104559661A true CN104559661A (en) | 2015-04-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410831134.8A Pending CN104559661A (en) | 2014-12-29 | 2014-12-29 | Coating used for metal film resistor encapsulating layer and preparation method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105255318A (en) * | 2015-11-10 | 2016-01-20 | 西南石油大学 | Preparation method of wear-resistant nano Al2O3-CaCO3-epoxy composite coating |
| CN106356171A (en) * | 2016-08-31 | 2017-01-25 | 安徽斯迈尔电子科技有限公司 | Method for preparing metal membrane resistor packaging material |
| CN106916509A (en) * | 2017-03-24 | 2017-07-04 | 合肥羿振电力设备有限公司 | A kind of metal film resistor coating and preparation method thereof |
| CN107118637A (en) * | 2017-06-05 | 2017-09-01 | 合肥嘉仕诚能源科技有限公司 | A kind of outdoor machine of air-conditioner heat emission fan high heat conduction anti-static coatings and preparation method thereof |
| CN107383786A (en) * | 2017-08-26 | 2017-11-24 | 莱州市顺利达电子材料有限公司 | The resistor high temperature of resistance to subzero temperature encapsulating material and application thereof |
| CN112500766A (en) * | 2020-10-16 | 2021-03-16 | 中国电力科学研究院有限公司 | High-performance coating for metal film resistor and preparation method thereof |
| CN113025250A (en) * | 2021-04-22 | 2021-06-25 | 中国南方电网有限责任公司超高压输电公司检修试验中心 | Special adhesive for hollow composite insulator and preparation method thereof |
-
2014
- 2014-12-29 CN CN201410831134.8A patent/CN104559661A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105255318A (en) * | 2015-11-10 | 2016-01-20 | 西南石油大学 | Preparation method of wear-resistant nano Al2O3-CaCO3-epoxy composite coating |
| CN105255318B (en) * | 2015-11-10 | 2018-12-14 | 西南石油大学 | A kind of wear-resisting nanometer Al2O3-CaCO3The preparation method of epoxy composite coating |
| CN106356171A (en) * | 2016-08-31 | 2017-01-25 | 安徽斯迈尔电子科技有限公司 | Method for preparing metal membrane resistor packaging material |
| CN106916509A (en) * | 2017-03-24 | 2017-07-04 | 合肥羿振电力设备有限公司 | A kind of metal film resistor coating and preparation method thereof |
| CN107118637A (en) * | 2017-06-05 | 2017-09-01 | 合肥嘉仕诚能源科技有限公司 | A kind of outdoor machine of air-conditioner heat emission fan high heat conduction anti-static coatings and preparation method thereof |
| CN107383786A (en) * | 2017-08-26 | 2017-11-24 | 莱州市顺利达电子材料有限公司 | The resistor high temperature of resistance to subzero temperature encapsulating material and application thereof |
| CN112500766A (en) * | 2020-10-16 | 2021-03-16 | 中国电力科学研究院有限公司 | High-performance coating for metal film resistor and preparation method thereof |
| CN113025250A (en) * | 2021-04-22 | 2021-06-25 | 中国南方电网有限责任公司超高压输电公司检修试验中心 | Special adhesive for hollow composite insulator and preparation method thereof |
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Application publication date: 20150429 |
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