CN105331109B - A kind of composite material and preparation method - Google Patents
A kind of composite material and preparation method Download PDFInfo
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- CN105331109B CN105331109B CN201510702781.3A CN201510702781A CN105331109B CN 105331109 B CN105331109 B CN 105331109B CN 201510702781 A CN201510702781 A CN 201510702781A CN 105331109 B CN105331109 B CN 105331109B
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
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- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
Abstract
The invention discloses a kind of composite material and preparation methods, can improve the heat-sinking capability of heat sink material to a certain extent, and the heat dissipation performance for solving the problems, such as heat sink material is limited.The composite material includes at least two heat conduction particles, graphene and organic matrix, at least two heat conduction particle is dispersed in the organic matrix, and the surface of the heat conduction particle is covered with the graphene, passes through graphene realization bridging between at least two heat conduction particle.
Description
Technical field
The present invention relates to Material Field, in particular to a kind of composite material and preparation method.
Background technique
As the volume of electronic device is smaller and smaller, the requirement to the heat-sinking capability of material is also higher and higher.Currently, heat dissipation
Material is mainly added heat conduction particle in organic matrix and is formed, wherein common heat conduction particle is aluminium oxide, magnesia, oxygen
Change the inorganic metal compounds such as zinc.But use inorganic metal compound as the heat dissipation of heat sink material made of heat conduction particle
Limited capacity, it is difficult to meet the higher and higher cooling requirements of current electronic device.
Summary of the invention
The embodiment of the present invention provides a kind of composite material and preparation method, can improve heat sink material to a certain extent
Heat-sinking capability, the heat dissipation performance for solving the problems, such as heat sink material is limited.
In a first aspect, the embodiment of the present invention provides a kind of composite material, including at least two heat conduction particles, graphene and
Organic matrix, at least two heat conduction particle are dispersed in the organic matrix, and the surface covering of the heat conduction particle is
Graphene is stated, and bridging is realized by the graphene between at least two heat conduction particle.So that at least two thermally conductive
Effective contact area between grain becomes larger, and the heat conduction velocity between at least two heat conduction particle is accelerated, and leads to enhance
The capacity of heat transmission of hot material.
With reference to first aspect, in the first possible implementation of the first aspect, the surface of the graphene has
Functional group, and chemical bond is formed between the functional group of the graphene surface and the surface of the heat conduction particle.The chemical bond
Chemical bond force so that graphene is firmly covered on the surface of heat conduction particle.
The possible implementation of with reference to first aspect the first, in second of possible implementation of first aspect
In, in the case where the heat conduction particle includes oxide particle, the functional group of the graphene surface is oxygen-containing functional group, institute
With the oxygen atom on the heat conduction particle surface dehydration condensation can occur for the oxygen-containing functional group for stating graphene surface, to be formed
Covalent bond.
The possible implementation of with reference to first aspect the first, in the third possible implementation of first aspect
In, in the case where the surface of the heat conduction particle has functional group, the functional group on the heat conduction particle surface can with it is described
Condensation reaction occurs for the functional group of graphene surface, to form covalent bond.
With reference to first aspect or with reference to first aspect the first to any one of the third possible implementation can
The implementation of energy, in a fourth possible implementation of the first aspect, the heat conduction particle are metal oxide, non-gold
Belong to oxide or metal nitride.
With reference to first aspect or with reference to first aspect the first to any one of the 4th kind of possible implementation can
The implementation of energy, in the fifth possible implementation of the first aspect, the heat conduction particle are spherical or spherical.
Any possible implementation of with reference to first aspect the first into the 5th kind of possible implementation,
In 6th kind of possible implementation of first aspect, the functional group of the graphene surface is carboxyl, hydroxyl, epoxy group, sulphur
Base, amino, phosphino- or sulfydryl.
With reference to first aspect or with reference to first aspect the first to any one of the 6th kind of possible implementation can
The implementation of energy, in a seventh possible implementation of the first aspect, the graphene are graphene oxide or reduction
Graphene oxide.
With reference to first aspect or with reference to first aspect the first to any one of the 7th kind of possible implementation can
The implementation of energy, in the 8th kind of possible implementation of first aspect, the graphene is single-layer graphene, the double-deck stone
Black alkene or multi-layer graphene.
With reference to first aspect or with reference to first aspect the first to any one of the 8th kind of possible implementation can
The implementation of energy, in the 9th kind of possible implementation of first aspect, the weight percent of the graphene is 0.1%
~20%, the weight percent of the heat conduction particle is 20%~96%, wherein the weight percent of graphene and heat conduction particle
The sum of be greater than 20% and be less than or equal to 98%.
Second aspect, the embodiment of the present invention provide a kind of preparation method of composite material, comprising:
Heat conduction particle, graphene and organic matrix are uniformly mixed, presoma is formed, wherein in the presoma,
The surface of the heat conduction particle is covered with the graphene, and real by the graphene between at least two heat conduction particles
Existing bridging；
Curing molding processing is carried out to the presoma, to obtain the composite material.
In conjunction with second aspect, in the first possible implementation of the second aspect, the surface of the graphene has
Functional group is formed with chemical bond between the functional group of the graphene surface and the surface of the heat conduction particle, passes through the chemistry
The chemical bond force of key makes graphene firmly be covered on the surface of heat conduction particle.
In conjunction with the first possible implementation of second aspect, in second of possible implementation of second aspect
In, in the case where the heat conduction particle includes oxide particle, the functional group of the graphene surface is oxygen-containing functional group, institute
With the oxygen atom of the oxide particle surface dehydration condensation can occur for the oxygen-containing functional group for stating graphene surface, with shape
At covalent bond.
In conjunction with the first possible implementation of second aspect, in the third possible implementation of second aspect
In, in the case where the surface of the heat conduction particle has functional group, the functional group on the heat conduction particle surface can with it is described
Condensation reaction occurs for the functional group of graphene surface, to form covalent bond.
It can in conjunction with any one of the first of second aspect or combination second aspect to the third possible implementation
The implementation of energy, in the fourth possible implementation of the second aspect, the heat conduction particle are metal oxide, non-gold
Belong to oxide or metal nitride.
It can in conjunction with any one of the first of second aspect or combination second aspect to the 4th kind of possible implementation
The implementation of energy, in a fifth possible implementation of the second aspect, the heat conduction particle are spherical or spherical.
In conjunction with the first any possible implementation into the 5th kind of possible implementation of second aspect,
In 6th kind of possible implementation of second aspect, the functional group of the graphene surface is carboxyl, hydroxyl, epoxy group, sulphur
Base, amino, phosphino- or sulfydryl.
It can in conjunction with any one of the first of second aspect or combination second aspect to the 6th kind of possible implementation
The implementation of energy, in the 7th kind of possible implementation of second aspect, the graphene is graphene oxide or reduction
Graphene oxide.
It can in conjunction with any one of the first of second aspect or combination second aspect to the 7th kind of possible implementation
The implementation of energy, in the 8th kind of possible implementation of second aspect, the graphene is single-layer graphene, the double-deck stone
Black alkene or multi-layer graphene.
It can in conjunction with any one of the first of second aspect or combination second aspect to the 8th kind of possible implementation
The implementation of energy, in the 9th kind of possible implementation of second aspect, the organic matrix includes silicon rubber and consolidates
Agent；
Heat conduction particle, graphene and organic matrix are uniformly mixed, comprising:
By the heat conduction particle of 1 parts by weight, the graphenes of 0.001~0.2 parts by weight, 0.1~100 parts by weight
The silicon rubber and the curing agent of 0.001~10 parts by weight uniformly mix.
The one or more technical solutions provided in the embodiment of the present invention, have at least the following technical effects or advantages:
In the embodiment of the present invention, heat conduction particle surface is covered with graphene, and passes through stone between at least two heat conduction particles
Black alkene realizes bridging.Based on the excellent heating conduction of graphene, the capacity of heat transmission for covering the heat conduction particle of graphene is mentioned
It rises；Furthermore bridging is realized by graphene between at least two heat conduction particles, due to effective between at least two heat conduction particles
Contact area becomes larger, so the heat conduction velocity between at least two heat conduction particle is accelerated, to further enhance thermally conductive
The capacity of heat transmission of material.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly introduced, it should be apparent that, drawings in the following description are only some embodiments of the invention, for this
For the those of ordinary skill in field, without any creative labor, it can also be obtained according to these attached drawings
His attached drawing.
Fig. 1 and Fig. 2 is the stereoscan photograph in composite sample cross section in the embodiment of the present invention；
Fig. 3 is graphene in the embodiment of the present invention to the schematic diagram of the bridging effect of heat conduction particle；
Fig. 4 is the flow diagram of the preparation method of composite material in the embodiment of the present invention.
Specific embodiment
In the prior art, heat sink material is formed by the way that inorganic metal compound heat conduction particle is added in organic matrix,
In, heat sink material heating conduction can be enhanced in the dosage for increasing heat conduction particle.But as heat conduction particle dosage increases, heat dissipation
The viscosity of material quicklys increase, and seriously affects the availability of heat sink material.
So being limited to viscosity control in actual conditions, the dosage of the heat conduction particle in heat sink material is controlled in centainly
In range, the heating conduction of heat sink material is limited, it is difficult to meet higher thermally conductive demand at present.
To solve the above-mentioned problems, the embodiment of the present invention provides a kind of composite material and preparation method, below by attached
Figure and specific embodiment are described in detail technical solution of the present invention, it should be understood that in the embodiment of the present invention and embodiment
Specific features be detailed description to technical solution of the present invention, rather than the restriction to technical solution of the present invention is not being rushed
In the case where prominent, the technical characteristic in the embodiment of the present invention and embodiment be can be combined with each other.
Embodiment one
Referring to FIG. 1 and FIG. 2, the embodiment of the present invention provides a kind of composite material, and composite material includes at least two thermally conductive
Grain, graphene and organic matrix, wherein at least two heat conduction particles are dispersed in organic matrix, and the surface of heat conduction particle
It is covered with graphene, and bridging is realized by graphene between at least two heat conduction particles.
Since graphene has excellent heating conduction, the capacity of heat transmission for covering the heat conduction particle of graphene is mentioned
It rises；Furthermore bridging is realized by graphene between at least two heat conduction particles, due to effective between at least two heat conduction particles
Contact area becomes larger, so the heat conduction velocity between at least two heat conduction particle is accelerated, to further enhance thermally conductive
The capacity of heat transmission of material.
It optionally, further include having the heat conduction particle for not covering graphene in composite material, 2 or 2 or more do not cover stone
The heat conduction particle of black alkene can be in contact each other, do not cover graphene heat conduction particle can also be covered with leading for graphene
Hot particle is in contact, and is dispersed in organic matrix alternatively, the heat conduction particle for not covering graphene is isolated.
It optionally, further include having free graphite alkene piece in composite material, free graphite alkene piece is to be not covered at thermally conductive
The graphene on grain surface.
2 or 2 or more free graphite alkene pieces can be in contact each other, and free graphite alkene piece can also be with heat conduction particle
(can be the heat conduction particle for being covered with graphene, or do not cover the heat conduction particle of graphene) be in contact, and two thermally conductive
Particle can realize bridging by a free graphite alkene piece or multiple free graphite alkene pieces being in contact.
In the embodiment of the present invention, 2 heat conduction particles realize bridging, including following implementations by graphene:
First, the graphene on 2 heat conduction particle surfaces for being covered with graphene is in contact, so that two heat conduction particles are realized
Bridging.
Second, 1 heat conduction particle for not covering graphene and 1 are covered with the graphene on the heat conduction particle surface of graphene
It is in contact, so that two heat conduction particles realize bridging.
Third, 2 heat conduction particles realize bridge by a free graphite alkene piece or multiple free graphite alkene pieces being in contact
Even, wherein 2 heat conduction particles can be the heat conduction particle for being covered with graphene, and 2 heat conduction particles can also be not cover
The heat conduction particle of graphene, 2 heat conduction particles can not also cover stone for 1 heat conduction particle for being covered with graphene and 1
The heat conduction particle of black alkene.
As shown in figure 3, left side is schematic diagram when graphene being not present in Heat Conduction Material, connecing between multiple heat conduction particles
It touches less, causes the heat dissipation performance of the Heat Conduction Material not high.Right side is that there are the schematic diagrames of graphene in Heat Conduction Material, due to dividing
The graphene film being dispersed in Heat Conduction Material has very big specific surface area, and adsorption capacity is very strong, very easy and heat conduction particle
It is in contact, is perhaps covered on the surface of heat conduction particle or as thermally conductive " bridge " between adjacent heat conduction particle, in composite material
The fine and close heat conduction network of middle formation, greatly improves the heat-sinking capability of composite material.
Optionally, in the embodiment of the present invention, the surface of graphene has a functional group, the functional group of graphene surface with it is thermally conductive
Chemical bond is formed between particle surface.
Specifically, the functional group of graphene surface can form chemical bond with the atom or ion on heat conduction particle surface, lead to
Cross the surface that the chemical bond force of the chemical bond makes graphene firmly be covered on heat conduction particle.
When it is implemented, including the following two kinds mode:
Mode 1, in the case where heat conduction particle includes oxide particle, the functional group of graphene surface is oxygen-containing function
With the oxygen atom of oxide particle surface dehydration condensation can occur for the oxygen-containing functional group of group, graphene surface, to be formed
Covalent bond.Further, the oxygen-containing functional group of graphene surface and the oxygen atom of oxide particle surface are in acid condition
Dehydration condensation occurs, to form covalent bond.It is appreciated that the various chemical bond includes covalent bond, ionic bond etc.；Covalently
Key is a kind of specific chemical bond.
Wherein, the oxygen-containing functional group of graphene surface can be for hydroxyl, carboxyl, epoxy group, sulfo group etc., and oxide thermally conductive
Grain can be the particles such as aluminium oxide, magnesia, zinc oxide.For example, the functional group of graphene surface be carboxyl or hydroxyl, thermally conductive
Grain is alumina particle, and the carboxyl or hydroxyl on graphene and the oxygen element in aluminium oxide carry out dehydrating condensation in acid condition
Reaction, the Al-O-C covalent bond of formation, Al-O-C covalent bond will be so that graphene be more securely combined with heat conduction particle.
Mode 2, in the case where the surface of heat conduction particle has functional group, the functional group on heat conduction particle surface can be with stone
Condensation reaction occurs for the functional group on black alkene surface, to form covalent bond.
Wherein, the functional group of graphene surface can for hydroxyl, carboxyl, sulfo group, epoxy group, amino, phosphino-, sulfydryl etc.,
The functional group on heat conduction particle surface be can with above-mentioned group occur condensation reaction group, the functional group on heat conduction particle surface with
Condensation reaction occurs for the functional group of graphene surface, forms covalent bond, will be so that graphene is more securely combined with heat conduction particle.
Optionally, in the embodiment of the present invention, heat conduction particle can be the particle of metal oxide, e.g., aluminium oxide, oxidation
The particles such as magnesium, zinc oxide；Heat conduction particle can also be metal nitride particles, such as aluminum nitride particle；Heat conduction particle can also be
Nonmetallic compound particle, such as boron nitride, silicon carbide particle.
Optionally, in the embodiment of the present invention, heat conduction particle is spherical or spherical (spherical-like), wherein
It is spherical to refer to almost spherical, such as elliposoidal, spherical shape of local irregularities, etc..
Optionally, in the embodiment of the present invention, the size of heat conduction particle is micron order, for example, the partial size of heat conduction particle can be with
In 0.1~200 micron range.
Optionally, in the embodiment of the present invention, the size of graphene can be nanoscale.
Optionally, in the embodiment of the present invention, graphene with a thickness of within the scope of 0.34nm to 4nm.
Optionally, in the embodiment of the present invention, the radial dimension of graphene is averagely about 60 microns.
Optionally, in the embodiment of the present invention, the functional group of graphene surface be carboxyl, hydroxyl, epoxy group, sulfo group, amino,
Phosphino- or sulfydryl.
Optionally, in the embodiment of the present invention, graphene is graphene oxide or redox graphene.Wherein, stone is aoxidized
Black alkene refers to the oxide that the graphene obtained after oxidation processes is carried out to graphene.Redox graphene is referred to oxygen
Graphite alkene carries out the compound of the graphene obtained after reduction treatment.Graphene in actual conditions, in the embodiment of the present invention
It can also be for without the graphene of oxidation processes.
In addition, composite material can only include a kind of graphene of form in above-mentioned three kinds of forms in the embodiment of the present invention,
It may also be included in which the graphene of two kinds of forms, or the graphene comprising above-mentioned three kinds of forms.
Optionally, in the embodiment of the present invention, graphene is single-layer graphene, bilayer graphene or multi-layer graphene.Wherein,
Multilayer refers to 3 layers or three layers or more.
Optionally, in the embodiment of the present invention, the weight percent of graphene is 0.1%~20%, the weight of heat conduction particle
Percentage is 20%~96%.It should be noted that the sum of weight percent of graphene and heat conduction particle is less than 1, practical feelings
In condition, the sum of weight percent of graphene and heat conduction particle can be greater than 20% and less than or equal to 98% range it
It is interior.
By adding graphene in the composite, it can guarantee the viscous of composite material in the content of control heat conduction particle
Degree in the case where over range, does not enhance the heat dissipation performance of composite material.
Optionally, in the embodiment of the present invention, organic matrix includes silicon rubber and curing agent.
Optionally, in the embodiment of the present invention, silicon rubber can be liquid silicone, methyl silicone rubber, methyl ethylene
One of silicon rubber such as silicon rubber, phenyl methyl vinylsiloxane rubber or trifluoro propyl methyl vinyl silicone rubber are a variety of.
Optionally, in the embodiment of the present invention, curing agent can be sulphur, selenium, tellurium, sulfur-containing compound, metal oxide, mistake
One of oxide, resin, quinones, amine etc. are a variety of.
Optionally, in the embodiment of the present invention, curing agent matches with silicon rubber, and specific matching way please refers to existing skill
Art.
Embodiment two
Based on identical inventive concept, a kind of preparation method of composite material of the embodiment of the present invention, Fig. 4 is the preparation method
Flow diagram, include the following steps:
Step 101: heat conduction particle, graphene and organic matrix uniformly being mixed, form presoma, wherein in forerunner
In body, the surface of heat conduction particle is covered with graphene, and realizes bridging by graphene between at least two heat conduction particles；
Step 102: curing molding processing being carried out to presoma, to obtain composite material.
Specifically, including: to the mixed uniformly mode of heat conduction particle, graphene and organic matrix progress in step 101
Heat conduction particle, graphene and organic matrix are placed in reaction vessel, ball milling is carried out using ball mill, or use twin-screw
Extruder is squeezed, and is perhaps kneaded using mixer and is perhaps kneaded or is used high-speed stirred using open mill
Machine is stirred, etc..
Cure process in step 102 includes: heat pressure forming process, melt casting technique, radiation curing technique, micro-
Wave curing process, die press technology for forming, infiltration molding process, winding shaping process, pultrusion molding process, etc..Actual conditions
In, the composite material of target shape can be obtained using one of above-mentioned solidified forming technique, can also be combined therein several
Kind technique prepares the composite material of target shape.
In above-mentioned preparation method, by the way that heat conduction particle, graphene and organic matrix to be uniformly mixed, so that before being formed
The heat conduction particle surface driven in body is covered by graphene, and realizes bridging by graphene between at least two heat conduction particles.
Since graphene has excellent heating conduction, the capacity of heat transmission for covering the heat conduction particle of graphene is promoted；Furthermore until
Bridging is realized by graphene between few two heat conduction particles, since effective contact area between at least two heat conduction particles becomes
Greatly, so the heat conduction velocity between at least two heat conduction particle is accelerated, to further enhance the thermally conductive of Heat Conduction Material
Ability.
In addition, above-mentioned preparation method also has many advantages, such as that simple process, safely controllable, cost performance is high, the composite wood of preparation
Material can be widely used for the heat dissipation to heating element.
Optionally, in the embodiment of the present invention, the surface of graphene has a functional group, the functional group of graphene surface with it is thermally conductive
Chemical bond is formed between the surface of particle.
Optionally, in the embodiment of the present invention, in the case where heat conduction particle includes oxide particle, the official of graphene surface
It can roll into a ball as oxygen-containing functional group, dehydration contracting can occur with the oxygen atom of oxide particle surface for the oxygen-containing functional group of graphene surface
Reaction is closed, to form covalent bond.Further, the oxygen-containing functional group of graphene surface and the oxygen atom of oxide particle surface are
Dehydration condensation occurs in acid condition, to form covalent bond.It is appreciated that the various chemical bond include covalent bond,
Ionic bond etc.；Covalent bond is a kind of specific chemical bond.
Optionally, in the embodiment of the present invention, in the case where the surface of heat conduction particle has functional group, heat conduction particle surface
Functional group can with the functional group of graphene surface occur condensation reaction, to form covalent bond.
Optionally, in the embodiment of the present invention, heat conduction particle can be the particle of metal oxide, e.g., aluminium oxide, oxidation
The particles such as magnesium, zinc oxide；Heat conduction particle can also be metal nitride particles, such as aluminum nitride particle；Heat conduction particle can also be
Nonmetallic compound particle, such as boron nitride, silicon carbide particle.
Optionally, in the embodiment of the present invention, heat conduction particle is spherical or spherical (spherical-like), wherein
It is spherical to refer to almost spherical, such as elliposoidal, spherical shape of local irregularities, etc..
Optionally, in the embodiment of the present invention, the functional group of graphene surface be carboxyl, hydroxyl, epoxy group, sulfo group, amino,
Phosphino- or sulfydryl.
Optionally, in the embodiment of the present invention, graphene is graphene oxide or redox graphene.Wherein, stone is aoxidized
Black alkene refers to the oxide that the graphene obtained after oxidation processes is carried out to graphene.Redox graphene is referred to oxygen
Graphite alkene carries out the compound of the graphene obtained after reduction treatment.Graphene in actual conditions, in the embodiment of the present invention
It can also be for without the graphene of oxidation processes.
Optionally, in the embodiment of the present invention, graphene is single-layer graphene, bilayer graphene or multi-layer graphene.Wherein,
Multilayer refers to 3 layers or three layers or more.
Optionally, in the embodiment of the present invention, the weight percent of graphene is 0.1%~20%, the weight of heat conduction particle
Percentage is 20%~96%, by adding graphene in the composite, can be guaranteed multiple in the content of control heat conduction particle
The viscosity of condensation material in the case where over range, does not enhance the heat dissipation performance of composite material.
Optionally, in the embodiment of the present invention, organic matrix includes silicon rubber and curing agent；
In step 101, heat conduction particle, graphene and organic matrix are uniformly mixed, comprising:
By the heat conduction particle of 1 parts by weight, the graphene of 0.001~0.2 parts by weight, 0.1~100 parts by weight silicon rubber,
And 0.001~10 the curing agent of parts by weight uniformly mix.
Specifically, as shown in table 1, according to the type of each component and the difference of content, the preparation side of above-mentioned composite material
Method may include a variety of specific embodiments.Each ranks in table 1 go out specific materials and ratio respectively corresponds subsequent implementation
Mode 1 is to embodiment 5.
Table 1
Embodiment 1
In above-mentioned steps 101, the micron order boron nitride of 0.90 parts by weight, the multilayer of 0.10 parts by weight are added in the reactor
Graphene oxide, the methyl silicone rubber of 0.75 parts by weight, 0.08 parts by weight curing agent, high-speed stirred obtains composite material forerunner
Body；
In above-mentioned steps 102, presoma is placed under 100 degrees Celsius, using pouring type, obtain uniform graphene with
The multi-element composite material of micron order conventional thermal conductive particle collaboration, thermal coefficient 1.7W/mK.
Embodiment 2
In above-mentioned steps 101, the micron order magnesia of 0.97 parts by weight, the list of 0.03 parts by weight are added in the reactor
Layer graphene oxide, the methyl vinyl silicone rubber of 0.20 parts by weight, the curing agent of 0.02 parts by weight, ball milling obtain composite material
Presoma；
In above-mentioned steps 102, presoma is placed under 60 degrees Celsius, using compression molding mode, obtains uniform graphite
Alkene and the multi-element composite material of micron order conventional thermal conductive particle collaboration, thermal coefficient 8.02W/mK.
Embodiment 3
In above-mentioned steps 101, the micron order aluminium nitride of 0.97 parts by weight, the single layer of 0.03 parts by weight are added in the reactor
Redox graphene, the phenyl methyl vinylsiloxane rubber of 100 parts by weight, the curing agent of 10 parts by weight, ball milling obtains compound
Material precursor；
In above-mentioned steps 102, presoma is placed under 60 degrees Celsius, using mill mixing mode, obtains uniform stone
Black alkene and the multi-element composite material of micron order conventional thermal conductive particle collaboration, thermal coefficient 4.07W/mK.
Embodiment 4
In above-mentioned steps 101, it is added the micron order silicon carbide of 0.17 parts by weight in the reactor, three layers of 0.83 parts by weight
Redox graphene, the trifluoro propyl methyl vinyl silicone rubber of 0.6 parts by weight, the curing agent of 0.06 parts by weight, ball milling obtain
To composite material precursor；
In above-mentioned steps 102, presoma is placed under 200 degrees Celsius, using compression molding mode, obtains uniform graphite
Alkene and the multi-element composite material of micron order conventional thermal conductive particle collaboration, thermal coefficient 20W/mK.
Embodiment 5
In above-mentioned steps 101, the micron order boron nitride of 0.92 parts by weight, the bilayer of 0.04 parts by weight are added in the reactor
The multilayer graphene oxide of redox graphene and 0.04 parts by weight, the trifluoro propyl methyl ethylene silicon rubber of 0.36 parts by weight
The curing agent of glue, 0.03 parts by weight, ball milling obtain composite material precursor；
In above-mentioned steps 102, presoma is placed under 200 degrees Celsius, using compression molding mode, obtains uniform graphite
Alkene and the multi-element composite material of micron order conventional thermal conductive particle collaboration, thermal coefficient 6.7W/mK.
Above-mentioned 5 embodiments are merely to illustrate, the protection scope for embodiment that the present invention cannot be limited in this way.
The preparation method of composite material in embodiment two is used to prepare the composite material in embodiment one, so, implement
The technical characteristic of example one and embodiment two can be combined with each other and due in example 1 to the spy of composite material
Sign is described in detail, so the composite wood in embodiment two can be well understood in those skilled in the art according to foregoing description
The implementation process of the preparation method of material, in order to illustrate the succinct of book, details are not described herein again.
The one or more technical solutions provided in the embodiment of the present invention, have at least the following technical effects or advantages:
In the embodiment of the present invention, heat conduction particle surface is covered with graphene, and passes through stone between at least two heat conduction particles
Black alkene realizes bridging.Based on the excellent heating conduction of graphene, the capacity of heat transmission for covering the heat conduction particle of graphene is mentioned
It rises；Furthermore bridging is realized by graphene between at least two heat conduction particles, due to effective between at least two heat conduction particles
Contact area becomes larger, so the heat conduction velocity between at least two heat conduction particle is accelerated, to further enhance thermally conductive
The capacity of heat transmission of material.
Although preferred embodiments of the present invention have been described, it is created once a person skilled in the art knows basic
Property concept, then additional changes and modifications may be made to these embodiments.So it includes excellent that the following claims are intended to be interpreted as
It selects embodiment and falls into all change and modification of the scope of the invention.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (14)
1. a kind of composite material, which is characterized in that including at least two heat conduction particles, graphene and organic matrix, it is described extremely
Few two heat conduction particles are dispersed in the organic matrix, and the surface of the heat conduction particle is covered with the graphene, and described
Bridging is realized by the graphene between at least two heat conduction particles；Wherein, the surface of the graphene has functional group, and
Chemical bond is formed between the functional group of the graphene surface and the surface of the heat conduction particle.
2. composite material according to claim 1, which is characterized in that include the feelings of oxide particle in the heat conduction particle
Under condition, the functional group of the graphene surface is oxygen-containing functional group, the oxygen-containing functional group of the graphene surface can with it is described
Dehydration condensation occurs in acid condition for the oxygen atom on heat conduction particle surface, to form covalent bond.
3. composite material according to claim 1, which is characterized in that there is functional group on the surface of the heat conduction particle
In the case of, with the functional group of the graphene surface condensation reaction can occur for the functional group on the heat conduction particle surface, with shape
At covalent bond.
4. composite material according to any one of claims 1 to 3, which is characterized in that the heat conduction particle is metal oxidation
Object or nonmetal oxide.
5. composite material according to claim 1 or 3, which is characterized in that the heat conduction particle is metal nitride.
6. composite material according to any one of claims 1 to 3, which is characterized in that the heat conduction particle be it is spherical or
It is spherical.
7. composite material according to any one of claims 1 to 3, which is characterized in that the functional group of the graphene surface
For carboxyl, hydroxyl, epoxy group or sulfo group.
8. composite material according to any one of claims 1 to 3, which is characterized in that the graphene is graphene oxide
Or redox graphene.
9. composite material according to any one of claims 1 to 3, which is characterized in that the graphene be single-layer graphene,
Bilayer graphene or multi-layer graphene.
10. composite material according to any one of claims 1 to 3, which is characterized in that the weight percent of the graphene
It is 0.1%~20%, the weight percent of the heat conduction particle is 20%~96%, wherein the weight of graphene and heat conduction particle
The sum of percentage is measured to be greater than 20% and be less than or equal to 98%.
11. a kind of preparation method of composite material characterized by comprising
Heat conduction particle, graphene and organic matrix are uniformly mixed, form presoma, wherein described in the presoma
The surface of heat conduction particle is covered with the graphene, and realizes bridge by the graphene between at least two heat conduction particles
Even；
Curing molding processing is carried out to the presoma, to obtain the composite material；
Wherein, the surface of the graphene has functional group, the table of the functional group of the graphene surface and the heat conduction particle
Chemical bond is formed between face.
12. preparation method according to claim 11, which is characterized in that in the heat conduction particle include oxide particle
In the case of, the functional group of the graphene surface is oxygen-containing functional group, and the oxygen-containing functional group of the graphene surface can be with institute
Dehydration condensation occurs in acid condition for the oxygen atom for stating oxide particle surface, to form covalent bond.
13. preparation method according to claim 11, which is characterized in that there is functional group on the surface of the heat conduction particle
In the case where, with the functional group of the graphene surface condensation reaction can occur for the functional group on the heat conduction particle surface, with
Form covalent bond.
14. 1 to 13 described in any item preparation methods according to claim 1, which is characterized in that the organic matrix includes silicon rubber
Glue and curing agent；
Heat conduction particle, graphene and organic matrix are uniformly mixed, comprising:
It will be described in the heat conduction particle of 1 parts by weight, the graphene of 0.001~0.2 parts by weight, 0.1~100 parts by weight
Silicon rubber and the curing agent of 0.001~10 parts by weight uniformly mix.
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| CN106045794B (en) * | 2016-05-31 | 2018-08-31 | 湖北航天化学技术研究所 | A kind of graphene/metal or semimetallic shell-core structure composite material and preparation method |
| CN106550585A (en) * | 2016-09-13 | 2017-03-29 | 华为机器有限公司 | A kind of fin and preparation method thereof and communication equipment |
| CN116669863A (en) * | 2020-12-30 | 2023-08-29 | 米其林集团总公司 | Rubber composition with graphene and liquid rubber |
| CN115725273A (en) * | 2021-08-26 | 2023-03-03 | 华为技术有限公司 | Diamond-based heat-conducting filler, preparation method thereof, composite heat-conducting material and electronic equipment |
| CN115594977A (en) * | 2022-10-24 | 2023-01-13 | 青岛德通纳米技术有限公司（Cn） | Graphene heat-conducting silicone grease for high-power LED and preparation method thereof |
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| CN103122075A (en) * | 2013-03-19 | 2013-05-29 | 苏州格瑞丰纳米科技有限公司 | High heat-conducting thin graphene-based composite material, as well as preparation method and application thereof |
| CN103772992A (en) * | 2014-01-22 | 2014-05-07 | 华为技术有限公司 | Thermal conductive composite material and preparation method thereof |
| CN104327515A (en) * | 2014-10-20 | 2015-02-04 | 中国科学院金属研究所 | Graphene-containing silicon rubber heat-conducting composite material and preparation method thereof |
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| CN104910625A (en) * | 2014-03-12 | 2015-09-16 | 江苏麒祥高新材料有限公司 | Preparation method of heat conduction silicone rubber interface material containing graphene |
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| CN103122075A (en) * | 2013-03-19 | 2013-05-29 | 苏州格瑞丰纳米科技有限公司 | High heat-conducting thin graphene-based composite material, as well as preparation method and application thereof |
| CN103772992A (en) * | 2014-01-22 | 2014-05-07 | 华为技术有限公司 | Thermal conductive composite material and preparation method thereof |
| CN104327515A (en) * | 2014-10-20 | 2015-02-04 | 中国科学院金属研究所 | Graphene-containing silicon rubber heat-conducting composite material and preparation method thereof |
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