CN104497894B - Adhesive for cutting wafer - Google Patents
Adhesive for cutting wafer Download PDFInfo
- Publication number
- CN104497894B CN104497894B CN201410846845.2A CN201410846845A CN104497894B CN 104497894 B CN104497894 B CN 104497894B CN 201410846845 A CN201410846845 A CN 201410846845A CN 104497894 B CN104497894 B CN 104497894B
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- CN
- China
- Prior art keywords
- parts
- weight
- component
- adhesive
- chip cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 26
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 26
- 238000005520 cutting process Methods 0.000 title claims abstract description 25
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000004014 plasticizer Substances 0.000 claims abstract description 10
- 239000004372 Polyvinyl alcohol Substances 0.000 claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims abstract description 9
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 9
- 229920002451 polyvinyl alcohol Polymers 0.000 claims abstract description 9
- 229920000459 Nitrile rubber Polymers 0.000 claims abstract description 7
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims abstract description 7
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims abstract description 7
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 claims description 12
- 239000000470 constituent Substances 0.000 claims description 11
- 239000007822 coupling agent Substances 0.000 claims description 10
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 8
- FIBARIGPBPUBHC-UHFFFAOYSA-N octyl 8-(3-octyloxiran-2-yl)octanoate Chemical compound CCCCCCCCOC(=O)CCCCCCCC1OC1CCCCCCCC FIBARIGPBPUBHC-UHFFFAOYSA-N 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 235000010265 sodium sulphite Nutrition 0.000 claims description 6
- -1 polyethylene Polymers 0.000 claims description 5
- 239000004698 Polyethylene Substances 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- 239000000395 magnesium oxide Substances 0.000 claims description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- PPDADIYYMSXQJK-UHFFFAOYSA-N trichlorosilicon Chemical compound Cl[Si](Cl)Cl PPDADIYYMSXQJK-UHFFFAOYSA-N 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 abstract 2
- PUYRISKXBBQECH-UHFFFAOYSA-N 2-ethylhexyl 8-(3-octyloxiran-2-yl)octanoate Chemical compound CCCCCCCCC1OC1CCCCCCCC(=O)OCC(CC)CCCC PUYRISKXBBQECH-UHFFFAOYSA-N 0.000 abstract 1
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 239000003153 chemical reaction reagent Substances 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 229940079827 sodium hydrogen sulfite Drugs 0.000 abstract 1
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 abstract 1
- 235000021355 Stearic acid Nutrition 0.000 description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 3
- 239000008117 stearic acid Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Abstract
The invention relates to an adhesive for cutting wafer. The adhesive comprises a component A and a component B at a weight part ratio of (25-40) to (17-31), wherein the component A comprises the following components in parts by weight: 80-100 parts of epoxy resin, 40-50 parts of polyvinyl alcohol, 15-30 parts of sodium hydrogen sulfite, 10-25 parts of precipitated barium sulphate, 1-5 parts of crylic acid, 2-10 parts of ethanol and 1.5-7.5 parts of 2-ethylhexyl epoxystearate; and the component B comprises the following components in parts by weight: 40-50 parts of nitrile rubber, 10-12.5 parts of butyl acrylate, 1-5 parts of a plasticizer and 0.1-2 parts of a coupling reagent. The adhesive has the characteristics of being easy to degum, relatively high in hardness and good in tenacity, and is applicable to cutting thin wafers; and meanwhile, a chip shell and a bright side are reduced, so that the good-grade rate is improved.
Description
Technical field
The present invention relates to a kind of chip cutting adhesive.
Background technology
In semiconductor wafer cutting process, due to a variety of causes complete crystal bar can be led to come off or Partial wafer crush, bright border etc..But cut again by using the cladding of adhesive, then pass through again
Degumming and cleaning treatment, can obtain the more preferable chip of quality.But, existing adhesive haves such problems as that piece rate is high, bright border is many, defect rate is high.
Content of the invention
The technical problem to be solved is to provide a kind of chip cutting adhesive for above drawback, and easy degumming, hardness is higher and the features such as excellent toughness, is suitable for the cutting of more LED reverse mounting type, reduce simultaneously fall piece, bright border improves quality product rate.
For solving above-mentioned technical problem, the technical scheme is that：
A kind of chip cutting adhesive, including component A and component B, described component A is 25-40 with the ratio of weight and number of component B:17-31, the constituent of described component A is calculated by weight as：
Epoxy resin 80-100 part,
Polyvinyl alcohol resin 40-50 part,
Sodium sulfite 15-30 part,
Blanc fixe 10-25 part,
Acrylic acid 1-5 part,
Ethanol 2-10 part,
Octyl epoxy stearate 1.5-7.5 part；
The constituent of described component B is calculated by weight as：
Nitrile rubber 40-50 part,
Butyl acrylate 10-12.5 part,
Plasticizer 1-5 part,
Coupling agent 0.1-2 part.
A kind of above-mentioned chip cutting adhesive, wherein it is preferred that the constituent of described component A is calculated by weight as：90 parts of epoxy resin, 45 parts of polyvinyl alcohol resin, 16 parts of sodium sulfite, 12 parts of blanc fixe, 2 parts of acrylic acid, 4 parts of ethanol, 3 parts of octyl epoxy stearate.
A kind of above-mentioned chip cutting adhesive, wherein it is preferred that the constituent of described component B is calculated by weight as：45 parts of nitrile rubber, 11.25 parts of butyl acrylate, 2 parts of plasticizer, 0.5 part of coupling agent.
A kind of above-mentioned chip cutting adhesive, wherein, described epoxy resin is 2 with the ratio of weight and number of polyvinyl alcohol resin:1.
A kind of above-mentioned chip cutting adhesive, wherein, described acrylic acid, octyl epoxy stearate, the ratio of weight and number of ethanol are 1:1.5:2.
A kind of above-mentioned chip cutting adhesive, wherein, plasticizer is TP7595 and stearic acid with 1.5:4 ratio of weight and number mixes.
A kind of above-mentioned chip cutting adhesive, wherein, described coupling agent is polyethylene, magnesium oxide and silicochloroform are with 1:2:1 ratio of weight and number mixes.
Beneficial effects of the present invention are：The present invention suitably enhances adhesive hardness, with guarantee semiconductor wafer cutting when adhesive will not make wafer damaging repercussions because of embrittlement, by adjusting the weight between each component, the product of the present invention is made to have the characteristics that rational hardness, excellent toughness, easy degumming, it is suitable for the cutting of more LED reverse mounting type, reduce simultaneously and fall piece and bright border, improve quality product rate.
Specific embodiment
Example one
A kind of chip cutting adhesive, including component A and component B, described component A is 25 with the ratio of weight and number of component B:17, the constituent of described component A is calculated by weight as：90 parts of epoxy resin, 45 parts of polyvinyl alcohol resin, 16 parts of sodium sulfite, 12 parts of blanc fixe, 2 parts of acrylic acid, 4 parts of ethanol, 3 parts of octyl epoxy stearate；The constituent of described component B is calculated by weight as：45 parts of nitrile rubber, 11.25 parts of butyl acrylate, 2 parts of plasticizer, 0.5 part of coupling agent.
Wherein, plasticizer is TP7595 and stearic acid with 1.5:4 ratio of weight and number mixes, and coupling agent is polyethylene, magnesium oxide and silicochloroform are with 1:2:1 ratio of weight and number mixes.
Example two
A kind of chip cutting adhesive, including component A and component B, described component A is 31 with the ratio of weight and number of component B:22, the constituent of described component A is calculated by weight as：100 parts of epoxy resin, 50 parts of polyvinyl alcohol resin, 19 parts of sodium sulfite, 20 parts of blanc fixe, 4 parts of acrylic acid, 8 parts of ethanol, 6 parts of octyl epoxy stearate；The constituent of described component B is calculated by weight as：50 parts of nitrile rubber, 12.5 parts of butyl acrylate, 3 parts of plasticizer, 1 part of coupling agent.
Wherein, plasticizer is TP7595 and stearic acid with 1.5:4 ratio of weight and number mixes, and coupling agent is polyethylene, magnesium oxide and silicochloroform are with 1:2:1 ratio of weight and number mixes.
Here description of the invention and application are illustrative, are not wishing to limit the scope of the invention in above-described embodiment, therefore, the present invention is not limited by the present embodiment, and the technical scheme that any employing equivalence replacement obtains is all in the scope of protection of the invention.
Claims (6)
1. a kind of chip cutting adhesive, it is characterized by, including component A and component B,
Described component A is 25-40 with the ratio of weight and number of component B:17-31, the group of described component A
Composition is become to be calculated by weight as：
Epoxy resin 80-100 part,
Polyvinyl alcohol resin 40-50 part,
Sodium sulfite 15-30 part,
Blanc fixe 10-25 part,
Acrylic acid 1-5 part,
Ethanol 2-10 part,
Octyl epoxy stearate 1.5-7.5 part；
The constituent of described component B is calculated by weight as：
Nitrile rubber 40-50 part,
Butyl acrylate 10-12.5 part,
Plasticizer 1-5 part,
Coupling agent 0.1-2 part.
2. a kind of chip cutting adhesive as claimed in claim 1, it is characterized by, institute
The constituent stating component A is calculated by weight as：90 parts of epoxy resin, polyvinyl alcohol tree
45 parts of fat, 16 parts of sodium sulfite, 12 parts of blanc fixe, 2 parts of acrylic acid, ethanol
4 parts, 3 parts of octyl epoxy stearate.
3. a kind of chip cutting adhesive as claimed in claim 1, it is characterized by described
The constituent of component B is calculated by weight as：45 parts of nitrile rubber, butyl acrylate 11.25
Part, 2 parts of plasticizer, 0.5 part of coupling agent.
4. a kind of chip cutting adhesive as claimed in claim 1, it is characterized by, institute
The ratio of weight and number stating epoxy resin with polyvinyl alcohol resin is 2:1.
5. a kind of chip cutting adhesive as claimed in claim 1, it is characterized by, institute
State acrylic acid, octyl epoxy stearate, ethanol ratio of weight and number be 1:1.5:2.
6. a kind of chip cutting adhesive as claimed in claim 1, it is characterized by, institute
State that coupling agent is polyethylene, magnesium oxide and silicochloroform be with 1:2:1 ratio of weight and number mixing and
Become.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410846845.2A CN104497894B (en) | 2014-12-31 | 2014-12-31 | Adhesive for cutting wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410846845.2A CN104497894B (en) | 2014-12-31 | 2014-12-31 | Adhesive for cutting wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104497894A CN104497894A (en) | 2015-04-08 |
| CN104497894B true CN104497894B (en) | 2017-02-08 |
Family
ID=52939354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410846845.2A Expired - Fee Related CN104497894B (en) | 2014-12-31 | 2014-12-31 | Adhesive for cutting wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104497894B (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY138566A (en) * | 2004-03-15 | 2009-06-30 | Hitachi Chemical Co Ltd | Dicing/die bonding sheet |
| CN1293161C (en) * | 2005-01-27 | 2007-01-03 | 柯奇君 | Adhesive for textile industry and method for preparing same |
| JP2007073647A (en) * | 2005-09-06 | 2007-03-22 | Sumitomo Bakelite Co Ltd | Die attaching film with dicing sheet function, manufacturing method of semiconductor device using the same, and semiconductor device |
| KR100907982B1 (en) * | 2006-12-27 | 2009-07-16 | 제일모직주식회사 | Dicing Die Bonding Film comprising the Adhesive Film for Semi-Conductor Packaging formed composition for Preparing Adhesive Film |
| JP2008247936A (en) * | 2007-03-29 | 2008-10-16 | Lintec Corp | Sticky adhesive composition, sticky adhesive sheet and method for producing semiconductor device |
| JP2011187571A (en) * | 2010-03-05 | 2011-09-22 | Nitto Denko Corp | Dicing die-bonding film |
-
2014
- 2014-12-31 CN CN201410846845.2A patent/CN104497894B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN104497894A (en) | 2015-04-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| CB03 | Change of inventor or designer information |
Inventor after: Xu Dan Inventor before: Nie Jingen |
|
| COR | Change of bibliographic data | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20160918 Address after: 225300, 3 floor, building 1, drug city road, Chinese medicine city, Jiangsu, Taizhou Province Applicant after: Xu Dan Address before: 212132 Dongfang Road, Dagang mechanical and Electrical Industrial Park, Dagang District, Zhenjiang, Jiangsu Applicant before: Zhenjiang Gangnan Electric Co., Ltd. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180116 Address after: Fishing town Xinghua city Jiangsu province 225761 Yang Taizhou city village land three Group No. 12 Patentee after: Lu Feng Address before: 225300, 3 floor, building 1, drug city road, Chinese medicine city, Jiangsu, Taizhou Province Patentee before: Xu Dan |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170208 Termination date: 20171231 |