CN104465467B - A kind of LED shells golden machine slide glass dish - Google Patents
A kind of LED shells golden machine slide glass dish Download PDFInfo
- Publication number
- CN104465467B CN104465467B CN201410828370.4A CN201410828370A CN104465467B CN 104465467 B CN104465467 B CN 104465467B CN 201410828370 A CN201410828370 A CN 201410828370A CN 104465467 B CN104465467 B CN 104465467B
- Authority
- CN
- China
- Prior art keywords
- film releasing
- releasing groove
- disk body
- big
- small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a kind of LED and shells golden machine slide glass dish, including：Disk body, the disk body edge are provided with fixing screw hole, and disk body disk body one end, which is provided with, cuts blue hymenotome piece slideway, big film releasing groove is provided with disk body, two small film releasing grooves are provided with big film releasing groove, small film releasing groove side, which is provided with, takes film trap, and vacuum suction aperture is provided with small film releasing groove.2 inch wafers of the invention shell golden efficiency and improve 33.3%；4 inch wafers shell golden efficiency and improve 66.7%；Solves size incompatibility problem, equivalent to two equipment of an equipment use, and are terminated an agreement to company and save equipment purchase expense.
Description
Technical field
The present invention relates to LED manufacturing technologies field, specially a kind of LED shells golden machine slide glass dish.
Background technology
During the modern LED manufacturings, MESA photoetching, ICP are carried out after extension is cleaned from the chip of epitaxial growth
Etching, MESA are removed photoresist, ITO is deposited, is carried out ITO photoetching, ITO etchings, PN Pad photoetching, PN Pad evaporations and then enter row metal
Peel off, the golden machine of stripping is just needed to use when carrying out metal-stripping.
Existing most domestic LED industry is all the stripping gold machine using same structure, and it is to be adapted to shell golden machine and hold piece disk
The chip of specific dimensions, the chip of other specifications can not all be used, and suction piece mode is not to use vacuum suction, but use compression empty
Gas changes into vacuum suction effect.Such as the letter product of our factory buying shells golden machine, two cun of golden machines of stripping can disposably peel off 15 platelets
Piece, 4 cun of golden machines of stripping can disposably peel off 6 wafers.
The content of the invention
Technical problem solved by the invention is that providing a kind of LED shells golden machine slide glass dish, to solve above-mentioned background technology
The problem of middle.
Technical problem solved by the invention is realized using following technical scheme：A kind of LED shells golden machine slide glass dish, bag
Include：Disk body, the disk body edge are provided with fixing screw hole, and disk body disk body one end, which is provided with, cuts blue hymenotome piece slideway, on disk body
Big film releasing groove is provided with, two small film releasing grooves are provided with big film releasing groove, small film releasing groove side is provided with and takes film trap, is provided with small film releasing groove
Vacuum suction aperture.
The two small tangent settings of film releasing groove in the big film releasing groove, small film releasing groove are inscribed within big film releasing groove, big film releasing groove
Depth is more than the depth of small film releasing groove.
The big film releasing groove is distributed on disk body in matrix form.
The small film releasing groove depth is 0.3mm, and big film releasing groove depth is 0.4mm.
It is placed equidistant between the fixing screw hole.
Compared with disclosed technology, there is advantages below in the present invention：2 inch wafers of the invention are shelled golden efficiency and improved
33.3%；4 inch wafers shell golden efficiency and improve 66.7%；Solve size incompatibility problem, equivalent to two equipment of an equipment
Use, terminated an agreement to company and save equipment purchase expense.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention.
Embodiment
In order that technological means, creation characteristic, workflow, application method reached purpose and effect of the present invention are easy to bright
It is white to understand, below in conjunction with the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described,
Obviously, described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.Based in the present invention
Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all
Belong to the scope of protection of the invention.
As shown in figure 1, a kind of LED shells golden machine slide glass dish, including：Disk body 7, the edge of disk body 7 are provided with fixing screws
Hole 1, the one end of 7 disk body of disk body 7, which is provided with, cuts blue hymenotome piece slideway 2, is provided with big film releasing groove 4 on disk body 7, is set in big film releasing groove 4
There are two small film releasing grooves 5, the small side of film releasing groove 5, which is provided with, takes film trap 3, and vacuum suction aperture 6 is provided with small film releasing groove 5.
Two small 5 tangent settings of film releasing groove in the big film releasing groove 4, small film releasing groove 5 are inscribed within big film releasing groove 4, big film releasing
The depth of groove 4 is more than the depth of small film releasing groove 5.
The big film releasing groove 4 is distributed on disk body 7 in matrix form.
The small depth of film releasing groove 5 is 0.3mm, and the big depth of film releasing groove 4 is 0.4mm.
It is placed equidistant between the fixing screw hole 1.
Drawn according to chip size size and shell golden machine slide glass dish processing drawing；It will process through slide glass dish after the assay was approved
It is clean with alcohol wipe, it is fixed by bolts on the golden machine base of stripping, using wand by chip according to from top to bottom from left to right
Order is sequentially placed into the groove of slide glass dish, by the surface sought side and be all placed on groove of chip, is opened suction piece vacuum and is pulled on
Blue film reuses pinch roller and carrys out back pressure indigo plant film, is then cut off blue film using the film sitting blade on pinch roller, finally by blue film according to from
The indigo plant film of pull-up successively of top to bottm, closing vacuum are fetched chip and are put into jam.
General principle, principal character and the advantages of the present invention of the present invention has been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the simply explanation described in above-described embodiment and specification is originally
The principle of invention, without departing from the spirit and scope of the present invention, various changes and modifications of the present invention are possible, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the present invention by appended claims and
Its equivalent thereof.
Claims (1)
1. a kind of LED shells golden machine slide glass dish, including disk body, it is characterised in that：The disk body edge is provided with fixing screw hole, disk
Body one end, which is provided with, cuts blue hymenotome piece slideway, and big film releasing groove is provided with disk body, two small film releasing grooves are provided with big film releasing groove, small to put
Film trap side, which is provided with, takes film trap, and vacuum suction aperture is provided with small film releasing groove；Two small film releasing grooves in the big film releasing groove are tangent
Set, small film releasing groove is inscribed within big film releasing groove, and the depth of big film releasing groove is more than the depth of small film releasing groove；The big film releasing groove is in disk
It is distributed on body in matrix form；The small film releasing groove depth is 0.3mm, and big film releasing groove depth is 0.4mm；The fixing screw hole it
Between be placed equidistant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410828370.4A CN104465467B (en) | 2014-12-26 | 2014-12-26 | A kind of LED shells golden machine slide glass dish |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410828370.4A CN104465467B (en) | 2014-12-26 | 2014-12-26 | A kind of LED shells golden machine slide glass dish |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104465467A CN104465467A (en) | 2015-03-25 |
| CN104465467B true CN104465467B (en) | 2017-12-01 |
Family
ID=52911312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410828370.4A Active CN104465467B (en) | 2014-12-26 | 2014-12-26 | A kind of LED shells golden machine slide glass dish |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104465467B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104821266B (en) * | 2015-05-07 | 2017-02-01 | 合肥彩虹蓝光科技有限公司 | Microscope stage |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05259265A (en) * | 1992-03-13 | 1993-10-08 | Nikon Corp | Sample holder |
| JPH05330584A (en) * | 1992-05-21 | 1993-12-14 | Hitachi Ltd | Semiconductor device tray |
| JPH1079419A (en) * | 1996-09-02 | 1998-03-24 | Seiko Epson Corp | Structure of chip tray |
| CN102768975A (en) * | 2011-05-05 | 2012-11-07 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Cassette positioning mechanism and chamber device with same |
| CN102983093A (en) * | 2012-12-03 | 2013-03-20 | 安徽三安光电有限公司 | Graphite wafer carrier used during manufacturing process of LED epitaxy wafers |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102154690B (en) * | 2011-05-23 | 2012-05-30 | 东莞市天域半导体科技有限公司 | Method and device for forming tray in planetary epitaxial growth equipment |
-
2014
- 2014-12-26 CN CN201410828370.4A patent/CN104465467B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05259265A (en) * | 1992-03-13 | 1993-10-08 | Nikon Corp | Sample holder |
| JPH05330584A (en) * | 1992-05-21 | 1993-12-14 | Hitachi Ltd | Semiconductor device tray |
| JPH1079419A (en) * | 1996-09-02 | 1998-03-24 | Seiko Epson Corp | Structure of chip tray |
| CN102768975A (en) * | 2011-05-05 | 2012-11-07 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Cassette positioning mechanism and chamber device with same |
| CN102983093A (en) * | 2012-12-03 | 2013-03-20 | 安徽三安光电有限公司 | Graphite wafer carrier used during manufacturing process of LED epitaxy wafers |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104465467A (en) | 2015-03-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210311 Address after: Room 110-7, building 3, 290 Xingci 1st Road, Hangzhou Bay New District, Ningbo City, Zhejiang Province, 315336 Patentee after: Ningbo anxinmei Semiconductor Co.,Ltd. Address before: 230012 Hefei City, Anhui, New Station Industrial Park Patentee before: HEFEI IRICO EPILIGHT TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |