CN104465330A - 整流二极管、芯片及其制作方法 - Google Patents
整流二极管、芯片及其制作方法 Download PDFInfo
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- CN104465330A CN104465330A CN201410822269.8A CN201410822269A CN104465330A CN 104465330 A CN104465330 A CN 104465330A CN 201410822269 A CN201410822269 A CN 201410822269A CN 104465330 A CN104465330 A CN 104465330A
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- wafer
- glassy layer
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- temperature sintering
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 51
- 239000011521 glass Substances 0.000 claims abstract description 35
- 238000005245 sintering Methods 0.000 claims abstract description 22
- 239000011248 coating agent Substances 0.000 claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 238000009766 low-temperature sintering Methods 0.000 claims abstract description 19
- 238000002161 passivation Methods 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000013078 crystal Substances 0.000 claims description 30
- 229920002120 photoresistant polymer Polymers 0.000 claims description 15
- 239000000428 dust Substances 0.000 claims description 14
- 239000004744 fabric Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 5
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/6609—Diodes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Dicing (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410822269.8A CN104465330B (zh) | 2014-12-25 | 2014-12-25 | 整流二极管、芯片及其制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410822269.8A CN104465330B (zh) | 2014-12-25 | 2014-12-25 | 整流二极管、芯片及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104465330A true CN104465330A (zh) | 2015-03-25 |
CN104465330B CN104465330B (zh) | 2018-09-28 |
Family
ID=52911205
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410822269.8A Active CN104465330B (zh) | 2014-12-25 | 2014-12-25 | 整流二极管、芯片及其制作方法 |
Country Status (1)
Country | Link |
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CN (1) | CN104465330B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109087857A (zh) * | 2018-08-22 | 2018-12-25 | 扬州杰利半导体有限公司 | 一种gpp芯片的制作工艺 |
CN111341735A (zh) * | 2020-03-12 | 2020-06-26 | 扬州国宇电子有限公司 | 一种防止刮蹭台面的钝化结构及其制备方法和应用 |
CN114975095A (zh) * | 2022-04-29 | 2022-08-30 | 安徽芯旭半导体有限公司 | 改善二极管晶圆沟槽钝化崩边的加工方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101038892A (zh) * | 2007-04-25 | 2007-09-19 | 天津中环半导体股份有限公司 | 硅整流器件的刀刮法玻璃钝化工艺 |
CN101587895A (zh) * | 2009-04-29 | 2009-11-25 | 启东市捷捷微电子有限公司 | 门极灵敏触发单向晶闸管芯片及其制造方法 |
CN101667535A (zh) * | 2009-09-14 | 2010-03-10 | 南通明芯微电子有限公司 | 硅平面半导体器件的玻璃钝化方法 |
CN102079893A (zh) * | 2009-11-26 | 2011-06-01 | 浙江常山隆昌电子有限公司 | 玻璃钝化披覆gpp芯片电泳液 |
CN102496572A (zh) * | 2011-12-29 | 2012-06-13 | 江苏宏微科技有限公司 | 快恢复外延型二极管及其制备方法 |
-
2014
- 2014-12-25 CN CN201410822269.8A patent/CN104465330B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101038892A (zh) * | 2007-04-25 | 2007-09-19 | 天津中环半导体股份有限公司 | 硅整流器件的刀刮法玻璃钝化工艺 |
CN101587895A (zh) * | 2009-04-29 | 2009-11-25 | 启东市捷捷微电子有限公司 | 门极灵敏触发单向晶闸管芯片及其制造方法 |
CN101667535A (zh) * | 2009-09-14 | 2010-03-10 | 南通明芯微电子有限公司 | 硅平面半导体器件的玻璃钝化方法 |
CN102079893A (zh) * | 2009-11-26 | 2011-06-01 | 浙江常山隆昌电子有限公司 | 玻璃钝化披覆gpp芯片电泳液 |
CN102496572A (zh) * | 2011-12-29 | 2012-06-13 | 江苏宏微科技有限公司 | 快恢复外延型二极管及其制备方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109087857A (zh) * | 2018-08-22 | 2018-12-25 | 扬州杰利半导体有限公司 | 一种gpp芯片的制作工艺 |
CN111341735A (zh) * | 2020-03-12 | 2020-06-26 | 扬州国宇电子有限公司 | 一种防止刮蹭台面的钝化结构及其制备方法和应用 |
CN111341735B (zh) * | 2020-03-12 | 2021-03-26 | 扬州国宇电子有限公司 | 一种防止刮蹭台面的钝化结构及其制备方法和应用 |
CN114975095A (zh) * | 2022-04-29 | 2022-08-30 | 安徽芯旭半导体有限公司 | 改善二极管晶圆沟槽钝化崩边的加工方法 |
Also Published As
Publication number | Publication date |
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CN104465330B (zh) | 2018-09-28 |
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Address after: 247100 Fuan Electronic Information Industry Park 10, Chizhou economic and Technological Development Zone, Anhui Applicant after: Anhui Anxin electronic Polytron Technologies Inc Address before: 247100 Fuan Electronic Information Industrial Park No. 10, Chizhou Economic Development Zone, Anhui Applicant before: ANHUI ANXIN ELECTRONIC TECHNOLOGY CO., LTD. |
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GR01 | Patent grant | ||
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Effective date of registration: 20190326 Address after: 247 100 No. 10 Factory Building of Fuan Electronic Industrial Park, Chizhou Economic Development Zone, Anhui Province Patentee after: Anhui Xin Xu Semiconductor Co., Ltd Address before: 247100 Fuan Electronic Information Industry Park 10, Chizhou economic and Technological Development Zone, Anhui Patentee before: Anhui Anxin electronic Polytron Technologies Inc |