CN104460119B - Display panel and method for manufacturing the same - Google Patents
Display panel and method for manufacturing the same Download PDFInfo
- Publication number
- CN104460119B CN104460119B CN201410690830.1A CN201410690830A CN104460119B CN 104460119 B CN104460119 B CN 104460119B CN 201410690830 A CN201410690830 A CN 201410690830A CN 104460119 B CN104460119 B CN 104460119B
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- China
- Prior art keywords
- base plate
- filter sheet
- display panel
- sheet base
- lateral margin
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims description 24
- 239000003292 glue Substances 0.000 claims abstract description 97
- 210000000746 body region Anatomy 0.000 claims abstract description 41
- 239000010409 thin film Substances 0.000 claims abstract description 41
- 230000003287 optical effect Effects 0.000 claims abstract description 33
- 238000007789 sealing Methods 0.000 claims abstract description 12
- 230000003746 surface roughness Effects 0.000 claims description 8
- 230000001458 anti-acid effect Effects 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 32
- 230000001681 protective effect Effects 0.000 abstract description 10
- 239000002585 base Substances 0.000 description 97
- 238000010276 construction Methods 0.000 description 22
- 238000003486 chemical etching Methods 0.000 description 20
- 239000011159 matrix material Substances 0.000 description 8
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 241000278713 Theora Species 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 238000013467 fragmentation Methods 0.000 description 3
- 238000006062 fragmentation reaction Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 230000002633 protecting effect Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
A display panel and a manufacturing method thereof are provided, the manufacturing method comprises the following steps. The bonding filter substrate is arranged in the combined area of the thin film transistor substrate. And performing a first glue sealing step, namely arranging a first protective glue on the electric connection area connected with the combination area and contacting the side end of the optical filter substrate. A first thinning step is performed to thin the body region and the side edge region of the filter module, which are connected with each other. And performing a second glue sealing step, wherein a second protective glue is arranged on the side edge area, and the first protective glue is connected with the second protective glue. And performing a second thinning step to thin the filter substrate so that the thickness of the side edge region is greater than that of the main body region. And removing the first protective glue and the second protective glue. By means of the temporary sequential arrangement of the first protective glue and the second protective glue, the utilization rate of the substrate and the assembly quality can be improved.
Description
【Technical field】
The present invention is on a kind of display panel and its manufacture method, particularly a kind of slim display panel and its manufacture
Method.
【Background technology】
In general, thin-film transistor LCD device (Thin-film-transistor liquid crystal
Display it is) to include a thin film transistor base plate (Thin-film-transistor substrate) and a colorized optical filtering
Plate base (Color filter substrate), colored filter substrate is the central surface for being stacked at thin film transistor base plate
On, and liquid crystal flow between thin film transistor base plate and colored filter substrate.In addition, the surface of thin film transistor base plate
Drive circuit can be set in edge, and drive circuit is adjacent to colored filter substrate and to drive liquid crystal, to change opticpath.
, can be in setting multigroup thin film transistor (TFT) on a sheet of substrate and be stacked at film during a large amount of manufactures
Colored filter substrate on transistor.In addition, the integral thickness in order to reduce thin-film transistor LCD device, can be to coloured silk
Colo(u)r filter substrate carries out thinning program with thin film transistor base plate, then substrate is cut, to be divided into multigroup panel.
Specifically, colored filter substrate is fitted on the part surface of thin film transistor base plate, and each colorized optical filtering
Plate base can be at a distance.Protection glue is now set on thin film transistor base plate, and Protection glue is contacted with colored filter
At least one side of substrate.Next, disposable thin to the whole face of colored filter substrate progress using chemical etching mode
Change, to reduce its thickness to 0.1 millimeter (mm) below.However, in be coated with Protection glue when, easily make air penetrate into Protection glue with
And between the side of colored filter substrate, and produce minute bubbles.In this way, when carrying out chemical etching, chemical etching liquor
Bubble between Protection glue and colored filter substrate side penetrates into and then destroys internal circuit.
In order to solve the problem of above-mentioned chemical etching liquor penetrates into, Protection glue can also be arranged at colored filter substrate simultaneously
Surface upper edge and side.In this way, the surface upper edge of colored filter substrate by Protection glue because being covered without quilt
Thinning, to avoid chemical etching liquor from being penetrated into from the ora terminalis of colored filter substrate.But, this colored filter substrate it is not thin
The thickness of the ora terminalis of change is excessive, can produce excessive segment difference with the stage casing of colored filter substrate.In this way, excessive segment difference can shadow
Attaching and the successive process of follow-up polaroid are rung, or even easily causes colored filter substrate or thin film transistor base plate fragmentation
The problem of.
Therefore being badly in need of a kind of display panel and its manufacture method at present, chemistry erosion is produced during can solve the problem that thinning
Carve the problem of liquid penetrates into and avoids fragmentation.
【The content of the invention】
In view of the above problems, the invention discloses a kind of display panel and its manufacture method, it is by the secondary sealing of progress
And the mode of secondary thinning, and then avoid chemical etching liquor penetrate into wherein and produce fragmentation the problems such as.
One embodiment of the invention discloses a kind of manufacture method of display panel, and it is comprised the steps of.Laminating optical filter
Substrate is in the combination region of thin film transistor base plate.The first sealing step is carried out, the first Protection glue is arranged at and is connected with combination region
Electrical bonding land on and contact the side of filter sheet base plate.Carry out the first thinning step, the phase each other of thinning filter sheet base plate
The body region and lateral margin area of connection.The second sealing step is carried out, the second Protection glue is arranged in the area of lateral margin, and the first protection
The Protection glue of gemel connection second.The second thinning step, thinning filter sheet base plate are carried out, so that the thickness in lateral margin area is more than body region
Thickness.Remove the first Protection glue and the second Protection glue.
One embodiment of the invention discloses a kind of display panel, and it includes thin film transistor base plate and filter sheet base plate.
Thin film transistor base plate has the combination region and electrical bonding land being connected to each other.Filter sheet base plate is arranged on combination region,
Conjunction area is electrically connected with exposed.Filter sheet base plate has the body region and lateral margin area being connected to each other, and lateral margin area is between main body
Between area and electrical bonding land.Wherein, the thickness in lateral margin area is more than the thickness of body region.
One embodiment of the invention discloses a kind of display panel, and it includes a thin film transistor base plate, a filter sheet base plate
And one first optical element.Thin film transistor base plate has the combination region and an electrical bonding land being connected to each other.Filter
Plate base is arranged on combination region and with a raised structures, the position of raised structures is corresponding and is adjacent to electrical bonding land.The
One optical element is on filter sheet base plate, and a side contact protrusion structure of the first optical element.
According to the invention discloses display panel and its manufacture method, the first Protection glue is first set in thin film transistor base plate
Electrical bonding land on and contact the side of filter sheet base plate and then carry out first time thinning.Then, set the second Protection glue in
In the area of lateral margin, and the first protection Protection glue of gemel connection second, then carry out the second thinning step, thinning filter sheet base plate, so that filter
The thickness in the lateral margin area of mating plate substrate is more than the thickness of body region.In this way, by sequentially carrying out the step of sealing twice and thinning,
Circuit that can be between protective film transistor base and filter sheet base plate, to avoid damaging.Furthermore, due to first time thinning step
In also thinning lateral margin area, therefore the segment difference between body region and lateral margin area reduces, so that the surface of filter sheet base plate is more smooth, has
Beneficial to the assembling of following other elements, and then lift assembling quality.
More than on the explanation of present invention and the explanation of following embodiment demonstrated with explaining this hair
Bright principle, and provide the present invention patent claim further explain.
【Brief description of the drawings】
Fig. 1 is the schematic flow sheet of the manufacture method of panel construction according to an embodiment of the invention.
Fig. 2 to Fig. 6 is the manufacture schematic diagram of panel construction according to an embodiment of the invention.
Fig. 7 is the manufacture schematic diagram of panel construction according to another embodiment of the present invention.
Fig. 8 to Fig. 9 is the manufacture schematic diagram for the panel construction according to one embodiment of the invention.
Figure 10 is the cut-away illustration of the panel construction according to further embodiment of this invention.
Figure 11 is the schematic perspective view of panel construction according to an embodiment of the invention.
Figure 12 is the cut-away illustration of panel construction according to an embodiment of the invention.
Figure 13 is the schematic perspective view of panel construction according to yet another embodiment of the invention.
Figure 14 is the schematic perspective view of panel construction according to yet another embodiment of the invention.
Figure 15 is the cut-away illustration of panel construction according to yet another embodiment of the invention.
【Symbol description】
1st, 2,3 display panel
10 thin film transistor base plates
10a combination regions
The electrical bonding lands of 10b
11 first support plates
12 tft layers
121 thin film transistor (TFT)s
122 liquid crystal
20 filter sheet base plates
20a body regions
20b lateral margins area
20c can viewing area
21 second support plates
22 filter layers
221 black matrix"s
222 optical filters
23 sides
31 first Protection glues
311 outer surfaces
32 second Protection glues
40 first optical elements
40a sides
50 second optical elements
60 drive circuits
70 thin film transistor base plates
70a combination regions
The electrical bonding land of 70b, 70c
80 filter sheet base plates
80a body regions
80b, 80c lateral margin area
90 bubbles
A1 center of curvature axles
A2 bearing of trends
The distances of D1 first
D2 second distances
T1 first thickness
T2 second thickness
The thickness of T3 the 3rd
The thickness of T4 the 4th
The width of W1 first
The width of W2 second
【Embodiment】
The detailed features and advantage of the narration present invention in detail in embodiments below, its content is enough to make any to be familiar with
The technology contents that relevant art understands the present invention are simultaneously implemented according to this, and content according to disclosed by this specification, apply for a patent
Scope and schema, it is any to be familiar with relevant art and be readily understood upon the purpose and advantage of correlation of the invention.Following embodiment
It is the viewpoint that the present invention is further described, but it is non-anyways to limit scope of the invention.
In the present invention, described in text " on ", " under ", "left", "right", are the relative position relations in diagram, its
It is not used to limit the present invention.For example, from the point of view of a visual angle of an embodiment, A elements are arranged on B elements；Regarded in another
From the point of view of angle, A elements are disposed under B elements.
The present invention provides a kind of panel construction, is watched for display picture for user.In the present invention, this panel construction
It is for tft type liquid crystal display panel.
The manufacture of panel construction introduced below, next refer to " Fig. 1 " to " Fig. 6 " and " Fig. 8 " to " Fig. 9 ",
Wherein, " Fig. 1 " is the schematic flow sheet of the manufacture method for the panel construction according to one embodiment of the invention." Fig. 2 " to " Fig. 6 "
And " Fig. 8 " to " Fig. 9 " is respectively the manufacture schematic diagram of panel construction according to an embodiment of the invention.
" Fig. 2 " is refer to, there is provided thin film transistor base plate 10 and filter sheet base plate 20 (S100) first.Specifically,
Thin film transistor base plate 10 includes the first support plate 11 and tft layer 12, and tft layer 12 is arranged at the first support plate
On 11, the first support plate 11 is the plate of a light-permeable, and tft layer 12 includes multiple thin film transistor (TFT) (Thin-film-
Transistor, abbreviation TFT), the element (not illustrating) such as spacer (Spacer).Have in addition, defining thin film transistor base plate 10
There are the combination region 10a and electrical bonding land 10b being connected to each other, tft layer 12 is all located in the 10a of combination region.At this
In embodiment, electrical bonding land 10b is the side for being connected to combination region 10a.Furthermore, filter sheet base plate 20 includes the second support plate 21
And filter layer 22, filter layer 22 is on the second support plate 21.Specifically, when thin film transistor base plate 10 and optical filter
Substrate 20 is fitted into after panel, filter layer 22 and tft layer 12 be then located at the first support plate 11 and the second support plate 21 it
Between.Defining filter sheet base plate 20 has the body region 20a and lateral margin area 20b being connected to each other.Filter sheet base plate 20 has more
Side 23.In the present invention, side 23 refers to the ora terminalis for being connected to relative two surfaces of the second support plate 21 and filter layer 22.
In more detail, the filter layer 22 of filter sheet base plate 20 can include black matrix" (Black matrix) 221 and multiple filters
Mating plate (Color filter) 222, optical filter 222 is arranged between each black matrix" 221 respectively.Wherein, with optical filter 222
Within ring-like enclosing region can be considered can viewing area (i.e. zone of action, Active Area) 20c, make light change its show
Show colour, be able to the picture for allowing user to watch different color.
Then, it refer to " Fig. 3 ", laminating sets filter sheet base plate 20 in the combination region 10a of thin film transistor base plate 10 with folded
Upper (S200).That is, filter sheet base plate 20 covered combination region 10a, and exposed electrical bonding land 10b.Further to
Say, the filter layer 22 of filter sheet base plate 20 is faced and fitted on the tft layer 12 of thin film transistor base plate 10, and
Lateral margin area 20b is between body region 20a and the electrical bonding land 10b of thin film transistor base plate 10.In the present embodiment, separately
Liquid crystal 122 can be injected between tft layer 121 and filter layer 22.
It refer to " Fig. 4 ".Then, the first sealing step is carried out, the first Protection glue 31 is arranged at thin film transistor base plate
On 10 electrical bonding land 10b and contact the side 23 (S300) of filter sheet base plate 20.First Protection glue 31 is to protect optical filtering
The side 23 of plate base 20, to avoid side 23 from being directly exposed to the external world.It should be noted that the first Protection glue 31 be not provided with
On the body region 20a and lateral margin area 20b of filter sheet base plate 20.In other words, the first Protection glue 31 is covered in electrical bonding land
10b, and being in close contact with the side 23 of filter sheet base plate 20 so that circuit, metal gasket or chip on electrical bonding land 10b with
And second support plate 20 side 23 neither with contacting external air, it is to avoid sustained damage in successive process.In addition, in this implementation
In example, had between the first Protection glue 31 and side 23 because the bubble 90 produced by gluing processing procedure penetrates into wherein, but bubble 90
Volume size can have been influenceed by processing environment or operation difference, may also there is the situation of the formation of bubble-free 90.
It refer to " Fig. 5 ".Then, the first thinning step, the main body being connected to each other of thinning filter sheet base plate 20 are carried out
Area 20a and lateral margin area 20b (S400).In the present embodiment, the first thinning step is simultaneously to optical filter in chemical etching mode
The body region 20a and lateral margin area 20b of substrate 20 carry out thinning, the part etched if oblique dotted portion in " Fig. 5 " for thinning.
In the present embodiment, the first Protection glue 31 is antiacid glue or alkali resistant glue, for preventing chemical etching liquor from can destroy electrical engagement
Area 10b circuit, metal gasket or chip, while avoiding the side 23 in filter sheet base plate 20 from occurring lateral etch and injuring panel
Internal structure." Fig. 4 " and " Fig. 5 " are referred to, in first time sealing, the first Protection glue 31 and the side of filter sheet base plate 20
23 are in close contact, but are not covered on filter sheet base plate 20.In detail, the first Protection glue 31 is thrown with filter sheet base plate 20 vertical
There is not overlapping region in shadow direction (direction as shown), therefore, when carrying out the thinning process of first time, outside filter sheet base plate 20
Surface can carry out chemical etching comprehensively and reduce thickness.Furthermore, in the present embodiment and section Example, due to the first protection
Glue 31 is greater than the second thickness T2 of filter sheet base plate 20 positioned at the first thickness T1 of side 23, so also helps avoid side
23 is exposed, and then avoids sustaining damage in successive process.Specifically, first thickness T1 refers to the first Protection glue 31 in side
23 height upwardly extended from the first support plate 11, and second thickness T2 refer to filter sheet base plate 20 in after the first thinning step from
The height that one support plate 11 is upwardly extended.When first thickness T1 is more than or equal to second thickness T2, that is, represent that the first Protection glue 31 is wrapped
The side 23 of filter sheet base plate 20 is covered, to avoid side 23 exposed.When side 23 is exposed, successive process may be made, broken
Bad side 23, and bubble is entered filter sheet base plate 20.Only, above-mentioned first thinning step is not used to limit using chemical etching mode
The fixed present invention.In other embodiments, the first thinning step is the main body in physical grinding mode simultaneously to filter sheet base plate 20
Area 20a and lateral margin area 20b carries out thinning.In this embodiment, the first Protection glue 31 protects electrical bonding land 10b electricity
Road, metal gasket or chip, to avoid in physical grinding, produce dust or particle contamination and cause the phenomenons such as short circuit, and
First Protection glue 31 can be colloid or adhesive tape.In addition, in the first thinning step, except carrying out thickness to filter sheet base plate 20
Outside thinning, it is that can carry out thinning to the first support plate 11 of thin film transistor base plate 10, is thinning if oblique dotted portion in " Fig. 5 "
The part of etching, and then reduce integral thickness.When the first thinning process, filter sheet base plate 20 and not up to expected thinning thickness
Degree (is not up to final thickness), consequently, it is possible to can ensure that the bubble in the formation of gluing process will not be connected with outside air, be entered
And during thinning, it is to avoid chemical etching liquor penetrates into destroy internal circuit from substrate side through bubble.
It refer to " Fig. 6 ".Next, carrying out the second sealing step, the second Protection glue 32 is arranged at filter sheet base plate 20
Lateral margin area 20b on, and the first Protection glue 31 connect the second Protection glue 32 (S500).Specifically, the second Protection glue 32 and
One Protection glue 31 is in close contact, and is covered in the partial outer face of filter sheet base plate 20, that is, the second Protection glue 32 and optical filter
Substrate 20 has overlapping region in upright projection direction.First Protection glue 31 is also to protect lateral margin area 20b, to avoid lateral margin area
20b is directly exposed to the external world.In the present embodiment, the second Protection glue 32 contacts with each other with the first Protection glue 31 to be close to, but
The present invention is not limited." Fig. 7 " is refer to, it is the manufacture signal for the panel construction according to another embodiment of the present invention
Figure, in another embodiment, the second Protection glue 32 can extend from the outer surface of filter sheet base plate 20 and be covered in the first Protection glue 31
Top.For increase protecting effect, the second Protection glue 32 is also extend to the outer surface 311 of the first Protection glue 31 so that first protects
Protecting glue 31 can be by the second Protection glue 32 cladding completely.
It refer to " Fig. 8 ", carry out the second thinning step, thinning filter sheet base plate 20.Because lateral margin area 20b is by the second protection
Glue 32 is covered, therefore in the second thinning step, the lateral margin area 20b of filter sheet base plate 20 will not be thinned, and only filter chip base
The body region 20a of plate 20 is thinned.In this way, there is the 3rd thickness T3 after the body region 20a of filter sheet base plate 20 is thinned, and
The lateral margin area 20b not being thinned has the 4th thickness T4, and lateral margin area 20b the 4th thickness T4 is more than the 3rd of body region 20a
Thickness T3.In the present embodiment, the 3rd thickness T3 can be substantially below 0.1mm, and the 4th thickness T4 substantially can be 0.3mm
Below.Now, lateral margin area 20b and body region 20a segment difference (T4-T3) can be substantially smaller than or equal to 0.25mm.Due to lateral margin
Area 20b the 4th thickness T4 is just slightly larger than body region 20a the 3rd thickness T3, can lift the flatness of filter sheet base plate 20, have
Beneficial to follow-up manufacturing process.But above-mentioned thickness and segment difference is not used to limit the present invention, its thickness and segment difference can roots
It is adjusted according to actual demand.
For further, this second thinning step is that thinning is carried out to filter sheet base plate 20 in chemical etching mode, and
Second Protection glue is antiacid glue or alkali resistant glue.That is, when the first thinning step and the second thinning step are all chemical etching
During mode, then the first Protection glue 31 and the second Protection glue 32 are all antiacid glue or alkali resistant glue.It can so avoid carrying out chemical etching
When, the first Protection glue 31 is corroded with the second Protection glue 32, and chemical etching liquor is penetrated into via bubble 90 and is destroyed first
Filter sheet base plate 20 under the protection of the Protection glue 32 of Protection glue 31 and second.If in addition, lateral margin area 20b is all used with body region 20a
Same way carries out thinning processing (such as chemical etching mode), then lateral margin area 20b surface roughness is equal to body region 20a
Surface roughness.In other embodiments, if lateral margin area 20b carried out when the first thinning step in physical grinding mode it is thin
Change, and body region 20a is using chemical etching mode when the second thinning step when carrying out thinning processing, then lateral margin area 20b table
Surface roughness is the surface roughness different from body region 2, and the second Protection glue 32 may extend to the appearance of the first Protection glue 31
Face 311 so that the first Protection glue 31 can be by the second Protection glue 32 cladding completely, and to avoid when the second thinning step, first protects
Shield glue 31 is chemically etched liquid and corroded.Furthermore, in the second thinning step, being also can be to the first of thin film transistor base plate 10
Support plate 11 carries out thinning, and then reduces integral thickness, the part etched if oblique dotted portion in " Fig. 8 " for thinning.Total comes
Say, the present invention can be according to the species of the lapping mode of thinning step twice, and makes the first Protection glue 31 and the second Protection glue 32
Material can be identical or different.That is, when the lapping mode of thinning step twice is all chemical etching mode, first protects
The material of shield glue 31 can be same as the corrosion-resistant material of the second Protection glue 32；When the lapping mode difference of thinning step twice
(such as the first thinning step is physical grinding mode, and the second thinning step is chemical etching mode), the material of the first Protection glue 31
Matter can be abrasive resistant material, and the second Protection glue 32 can be corrosion-resistant material.
It refer to " Fig. 9 " and " Figure 11 ", " Figure 11 " is shown for the solid of the panel construction according to one embodiment of the invention
It is intended to.Then, the first Protection glue and the second Protection glue are removed.In this way, completing the thinning step of display panel 1.In this reality
Apply in example, first that lateral margin area 20b extremely can be between the 20c of viewing area is more than or equal to lateral margin area 20b the first width apart from D1
W1, in this way, the lateral margin area 20b of the present embodiment do not influence can viewing area 20c transmittancy, can be applied to the aobvious of narrow frame
Showing device machine.Specifically, first is from the side ora terminalis of display panel 1 to can viewing area 20c outer rim (labels apart from D1
The dotted line at place signified 20c) distance, also as display panel 1 is arranged at width or the display of the black matrix" 221 of outermost
The width of the non-display area on the periphery of panel 1.First width W1 is then the width of the lateral margin area 20b raised structures 24 of the second support plate 21
Degree.In the present invention, raised structures 24 refer to the projection for being higher than body region 20a on lateral margin area 20b, and the position of raised structures 24
Put neighbouring and correspond to electrical bonding land 10b.
" Figure 10 " is referred to, it is the cut-away illustration of the panel construction according to further embodiment of this invention.In other realities
Apply in example, the second distance D2 that lateral margin area 20b extremely can be between the 20c of viewing area can also be more than lateral margin area 20b the second width W2.
Specifically, second distance D2 be from the side ora terminalis of display panel 1 to can viewing area 20c outer rims distance, be also aobvious
Show that panel 1 is arranged at the width of the width of the black matrix" 221 of outermost or the non-display area on the periphery of display panel 1.Second
Width W2 is then the width of the lateral margin area 20b raised structures 24 of the second support plate 21.In the present embodiment, the lateral margin of the second support plate 21
Area 20b raised structures 24 in vertical direction can have overlapping region with colored filter 222, and this structure can avoid display surface
Plate 1 needs wider neighboring area, and better than the display device machine applied in Wide frame.Although lateral margin area 20b width increases
Plus, but lateral margin area 20b thickness is also identical with " Fig. 9 " (being less than or equal to 0.25mm).In this way, also can reach this case avoids side
Effect of 23 damages.
" Figure 12 " is refer to, it is for the cut-away illustration of the panel construction according to one embodiment of the invention.In this implementation
In example and partial other embodiment, complete after above-mentioned steps, the first optical element 40 can be separately set in filter sheet base plate 20
On the 20a of body region, the second optical element 50 is set under the first support plate 11 of thin film transistor base plate 10, and drive circuit 60 is set
In on electrical bonding land 10b.In the present embodiment, a side 40a of the first optical element 40 can contact in the second support plate 21 in side
Edge area 20b raised structures 24, but the present invention is not limited, in other embodiments, the first optical element 40 and the second support plate
21 in lateral margin area 20b raised structures 24 it is spaced a distance.Because lateral margin area 20b is also thinned in the second thinning step, therefore
And body region 20a and lateral margin area 20b segment difference are reduced, and then be conducive to the first optical element 40 to be assembled in filter sheet base plate 20
On the 20a of body region, it is to avoid crooked to attach.In the present embodiment, the first optical element 40 and the second optical element 50 are all Polarizer
, but the first optical element 40 and the second optical element 50 are not used to limit the present invention for the setting of Polarizer (Polarizer).Furthermore,
Drive circuit 60 be may be disposed on electrical bonding land 10b, to drive thin film transistor base plate 10 and filter sheet base plate 20
Electronic component.
In addition, such as " Fig. 9 " and " Figure 10 ", the width of raised structures 24 can be adjusted according to practical situation.Citing comes
Say, the width of raised structures 24 can reduce, with the width of the black matrix" 221 less than outermost, that is to say, that can viewing area
The vertical direction that domain 20c corresponds to the first optical element 40 is, or optical filter 222 showing of being formed overlapping with raised structures 24
Show that region 20c outer rim (signified dotted line on label 20c) coincides with raised structures 24.It so may correspond to the machine of narrow frame
Kind.
In other embodiments, the width of raised structures 24 can increase, more than the width of the black matrix" 221 of outermost
Degree, so as to (not illustrated) in the vertical direction of the optical filter 222 of a part of outermost of raised structures 24, i.e. the institute of optical filter 222
Formed can viewing area 20c correspond to the first optical element 40 vertical direction be not overlapping with raised structures 24.So can be right
Should be in the machine of Wide frame.
In the above embodiments, thin film transistor base plate 10 only includes an electrical bonding land 10b, and filter sheet base plate 20 is only
Include a lateral margin area 20b.But electrical bonding land 10b and lateral margin area 20b number is not used to limit the present invention.It refer to " figure
13 ", it is for the schematic perspective view of the panel construction according to yet another embodiment of the invention.In other embodiments, display panel 2
Thin film transistor base plate 70 includes combination region 70a and two electrical bonding land 70b, 70c, and the filter sheet base plate of display panel 2
20 include body region 80a and two lateral margin area 80b, 80c.Electrical bonding land 70b, 70c are connected to the two of combination region 70a
End, and lateral margin area 80b, 80c are also connected to body region 80a two ends.Lateral margin area 80b be located at electrical bonding land 70b and
Between the 80a of body region, and lateral margin area 80c is also located between electrical bonding land 70c and body region 80a.It should be noted that side
Edge area 80b, 80c thickness are all more than body region 80a thickness.Structure so, can also achieve this case and avoids chemical etching liquor
The gap penetrated between thin film transistor base plate 10 and filter sheet base plate 20 and the effect for reaching planarizing.At " Figure 13 "
In embodiment, two electrical bonding land 70b, 70c are that in another embodiment, two is electrical positioned at the opposite sides side of display panel 2
Bonding land may also be at the two adjacent and connected sides of display panel.
In some embodiments, display panel is to can be applied to flexible displays, referring to " Figure 14 " and " figure
15 ", " Figure 14 " is for the schematic perspective view of the panel construction according to yet another embodiment of the invention." Figure 15 " is for according to the present invention
The cut-away illustration of the panel construction of another embodiment.Display panel 3 is that for a curved surface panel, it is curved along center of curvature axle A1
It is bent.Lateral margin area 20b can be considered elongated fin, be arranged on thin film transistor base plate 10 and with a bearing of trend A2.Wherein, show
Show that the center of curvature axle A1 of panel 3 is parallel to fin (i.e. lateral margin area 20b) bearing of trend A2.For further, display
Panel 3 can be considered a curved surface, and lateral margin area 20b is the end points positioned at this curved surface, such as shown in " Figure 15 ".In this way, being avoided side
The problem of edge area 20b distorts and causes brokenly plate.
Summary, according to the invention discloses display panel and its manufacture method, the first Protection glue is first set in film
On the electrical bonding land of transistor base and contact the side of filter sheet base plate and then carry out first time thinning.Then, the is set
Two Protection glues are in the area of lateral margin, and the first protection Protection glue of gemel connection second, then carry out the second thinning step, thinning optical filter
Substrate, so that the thickness in the lateral margin area of filter sheet base plate is more than the thickness of body region.In this way, by the sealing sequentially carried out twice
The step of thinning, circuit that can be between protective film transistor base and filter sheet base plate to avoid damaging, and also can reach thin
Change effect.Furthermore, due to also thinning lateral margin area in first time thinning step, the segment difference between body region and lateral margin area is smaller, with
Make the surface of filter sheet base plate more smooth, be conducive to the assembling of following other elements, and then lift assembling quality.
Although the present invention is disclosed above with foregoing preferred embodiment, so it is not limited to the present invention, any to be familiar with
Alike those skilled in the art, without departing from the spirit and scope of the present invention, when can make a little change and retouching, therefore the present invention's is special
Sharp protection domain must be defined depending on the claim person of defining appended by this specification.
Claims (10)
1. a kind of manufacture method of display panel, it is included：
A filter sheet base plate fit in a combination region of a thin film transistor base plate；
One first sealing step is carried out, one first Protection glue is arranged on the electrical bonding land being connected with the combination region and connect
Touch the side of the filter sheet base plate；
One first thinning step is carried out, a body region and a lateral margin area that the thinning filter sheet base plate is connected to each other；
Carry out one second sealing step, one second Protection glue be arranged in the lateral margin area, and the first protection gemel connection this
Two Protection glues；
One second thinning step, the thinning filter sheet base plate are carried out, so that the thickness in the lateral margin area is more than the thickness of the body region；
And
Remove first Protection glue and second Protection glue.
2. the manufacture method of display panel as claimed in claim 1, it is characterised in that the second thinning step is with a chemistry
Etching mode carries out thinning to the filter sheet base plate, and second Protection glue is antiacid glue.
3. the manufacture method of display panel as claimed in claim 1, it is characterised in that the first thinning step is with a chemistry
Etching mode carries out thinning to the filter sheet base plate, and first Protection glue is antiacid glue.
4. the manufacture method of display panel as claimed in claim 1, it is characterised in that in the first thinning step, this
The thickness of one Protection glue is more than the thickness of the filter sheet base plate.
5. the manufacture method of display panel as claimed in claim 1, it is characterised in that second Protection glue coats first guarantor
Protect glue.
6. a kind of display panel, it is included：
One thin film transistor base plate, with the combination region being connected to each other and an electrical bonding land；And
One filter sheet base plate, is arranged on the combination region, with the exposed electrical bonding land, and the filter sheet base plate, which has, to be connected with each other
The body region and a lateral margin area connect, and the lateral margin area wherein lateral margin between the body region and the electrical bonding land
The thickness in area is more than the thickness of the body region.
7. display panel as claimed in claim 6, it is characterised in that the surface roughness in the lateral margin area is equal to the body region
Surface roughness.
8. display panel as claimed in claim 6, it is characterised in that the surface roughness in the lateral margin area is less than the body region
Surface roughness.
9. display panel as claimed in claim 6, it is characterised in that the display panel is for a curved surface panel, in its curvature
Heart axle is parallel to the bearing of trend in the lateral margin area.
10. a kind of display panel, it is included:
One thin film transistor base plate, with the combination region being connected to each other and an electrical bonding land；
One filter sheet base plate, is arranged on the combination region and with a raised structures, the position of the raised structures is corresponding and neighbouring
In the electrical bonding land；And
One first optical element, on the filter sheet base plate, and a contact aside of first optical element raised structures.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103129943 | 2014-08-29 | ||
| TW103129943A TWI544252B (en) | 2014-08-29 | 2014-08-29 | Display panel and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104460119A CN104460119A (en) | 2015-03-25 |
| CN104460119B true CN104460119B (en) | 2017-08-15 |
Family
ID=52906415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410690830.1A Expired - Fee Related CN104460119B (en) | 2014-08-29 | 2014-11-26 | Display panel and method for manufacturing the same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104460119B (en) |
| TW (1) | TWI544252B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101796707B1 (en) * | 2016-04-01 | 2017-12-01 | 주식회사 토비스 | a manufacturing method of curved display panel, and a curved display panel mnufactured the same method |
| CN106816096B (en) * | 2017-04-14 | 2019-07-30 | 京东方科技集团股份有限公司 | The thining method of substrate and the thining method of display panel |
| US10649267B2 (en) * | 2017-07-19 | 2020-05-12 | Innolux Corporation | Display device and manufacturing method thereof |
| CN107731102A (en) * | 2017-10-31 | 2018-02-23 | 云谷（固安）科技有限公司 | The method for assembling and camber display screen of a kind of camber display screen |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6197209B1 (en) * | 1995-10-27 | 2001-03-06 | Lg. Philips Lcd Co., Ltd. | Method of fabricating a substrate |
| TWI304502B (en) * | 2003-02-20 | 2008-12-21 | Toppoly Optoelectronics Corp | Method of forming a liquid crystal panel |
| JP2006243658A (en) * | 2005-03-07 | 2006-09-14 | Sharp Corp | Panel substrate, manufacturing method for panel substrate, and manufacturing method for liquid crystal display panel |
| CN100592170C (en) * | 2007-05-25 | 2010-02-24 | 群康科技(深圳)有限公司 | LCD and making method thereof |
| CN102224447B (en) * | 2008-12-26 | 2013-10-16 | 夏普株式会社 | Liquid crystal display device |
| CN102305974B (en) * | 2011-08-26 | 2013-11-06 | 友达光电(厦门)有限公司 | Display device and manufacturing method thereof |
| TWI521286B (en) * | 2013-12-20 | 2016-02-11 | 友達光電股份有限公司 | Thin display panel and manufacturing method thereof |
-
2014
- 2014-08-29 TW TW103129943A patent/TWI544252B/en not_active IP Right Cessation
- 2014-11-26 CN CN201410690830.1A patent/CN104460119B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW201608304A (en) | 2016-03-01 |
| TWI544252B (en) | 2016-08-01 |
| CN104460119A (en) | 2015-03-25 |
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