CN104460095A - Display panel and manufacturing method thereof - Google Patents
Display panel and manufacturing method thereof Download PDFInfo
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- CN104460095A CN104460095A CN201510004919.2A CN201510004919A CN104460095A CN 104460095 A CN104460095 A CN 104460095A CN 201510004919 A CN201510004919 A CN 201510004919A CN 104460095 A CN104460095 A CN 104460095A
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- substrate
- display panel
- underlay substrate
- bearing substrate
- base plate
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the invention provides a display panel and a manufacturing method thereof and relates to the technical field of display. Thinning and polishing manufacture procedures in the traditional technology can be omitted, so that defects caused in the thinning or polishing process are avoided, and meanwhile the cost is reduced. The display panel comprises a display substrate. The preparation method of the display panel comprises the steps that the peripheral area of a base substrate and the peripheral area of a bearing substrate are fused and bonded so as to form a combined substrate with a bonding area. A preset component is manufactured on the side, away from the bearing substrate, of the base substrate so as to form the display substrate. The display substrate is adopted for forming the display panel. The bonding area of the combined substrate is cut away so that the bearing substrate and the display panel can be separated. The display panel and the manufacturing method of the display panel are used for display device manufacturing.
Description
Technical field
The present invention relates to display technique field, particularly relate to a kind of display panel and preparation method thereof.
Background technology
Along with the development of display technique, ultrathin display panel gained popularity in display industries.In prior art, be example with LCD (Liquid Crystal Display, liquid crystal display), the preparation process of ultrathin display panel as shown in Figure 1, specifically can comprise:
S1, on the first underlay substrate 101, make pixel key-course 102, to form array base palte 10; Second underlay substrate 201 makes colored key-course 202, to form color membrane substrates 20.
S2, by array base palte 10 and color membrane substrates 20 pairs of boxes shaping, and between two substrates, pour into liquid crystal, to form display dielectric layer 30.
S3, the back side of hydrofluorite to above-mentioned two underlay substrates is utilized to carry out reduction processing, to reach required thickness.Wherein, the thickness of the underlay substrate before thinning is usually at about 0.5mm, and the thickness of the underlay substrate after thinning is usually at about 0.2mm.
S4, carry out polishing to through thinning two substrate surfaces, to form ganoid ultrathin display panels.
Because the underlay substrate in display panel has supporting role, therefore in above-mentioned preparation process, the original depth of described underlay substrate is relatively thick; On this basis, in order to realize the preparation of ultrathin display panel, after the manufacturing process of display panel completes, also need to carry out thinning and polishing to the upper and lower surface of described display panel.
But thinning easily to form pit or scratch etc. at substrate surface bad, although polishing can improve to a certain extent thinning bring bad, also can introduce new problem simultaneously; Concrete, the pressure perpendicular to display panel is certainly existed in the process of polishing, the existence of this pressure makes PI (Polyimide, polyimide) oriented layer and PS (Photo Spacer, chock insulator matter) between can there is Relative friction, thus cause local PI to be rubbed off, and thin bright rays when causing display further.
In addition, in the preparation process of display panel, thinning also relatively high with cost that is polishing, this just causes the cost of manufacture of ultrathin display panel to remain high.
Summary of the invention
Embodiments of the invention provide a kind of display panel and preparation method thereof, can save the thinning and polishing processing procedure in traditional handicraft, thus avoid causing in thinning or polishing process bad, simultaneously can also be cost-saving.
For achieving the above object, embodiments of the invention adopt following technical scheme:
On the one hand, provide a kind of preparation method of display panel, described display panel comprises display base plate; Described method comprises: bond vitrified is carried out in the neighboring area of underlay substrate and bearing substrate, to form the assembled substrate comprising bond regions; Preset component is prepared in the side deviating from described bearing substrate at described underlay substrate, to form described display base plate; Described display base plate is adopted to form described display panel; Excise the bond regions of described assembled substrate, be separated with described display panel to make described bearing substrate.
Optionally, the described neighboring area by underlay substrate and bearing substrate is carried out bond vitrified and is specifically comprised: utilize high temperature heat source that bond vitrified is carried out in the neighboring area of described underlay substrate and described bearing substrate; Wherein, the temperature of described high temperature heat source is greater than 1000 DEG C.
Optionally, the bond regions of the described assembled substrate of described excision specifically comprises: the bond regions of being excised described assembled substrate by the method for diamond cut or cut.
Preferably, the thickness of described underlay substrate is less than or equal to 0.2mm, and the thickness of described bearing substrate is greater than or equal to 0.3mm, and the thickness of described assembled substrate is greater than or equal to 0.4mm.
Optionally, described underlay substrate is glass substrate.
Optionally, preset component is prepared in the described side deviating from described bearing substrate at described underlay substrate, specifically comprise to form described display base plate: the pixel cell prepared thin film transistor (TFT) in the side that described underlay substrate deviates from described bearing substrate and controlled by described thin film transistor (TFT), to form the array base palte of described display panel.
Or it is optional, preset component is prepared in the described side deviating from described bearing substrate at described underlay substrate, specifically comprise to form described display base plate: chromatic filter layer and black matrix are prepared in the side deviating from described bearing substrate at described underlay substrate, to form the color membrane substrates of described display panel.
On the other hand, provide a kind of display panel, described display panel adopts above-mentioned method preparation and obtains.
Embodiments of the invention provide a kind of display panel and preparation method thereof.Based on this, in the preparation process of described display panel, the below due to underlay substrate is provided with passive bearing substrate, therefore can select relatively thin underlay substrate; After formation display panel, described bearing substrate and described display panel can be made to be separated from each other, thus to obtain extra-thin display panel.So, described display panel is prepared by adopting said method, not only can meet the requirement of strength of preparation technology for display base plate, thinning and the polishing processing procedure in traditional ultrathin display panel preparation technology can also be saved, thus avoid causing in thinning or polishing process bad, the cost of manufacture of display panel can also be reduced simultaneously.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the preparation process schematic diagram of ultrathin display panel in prior art;
The preparation flow figure of a kind of ultrathin display panel that Fig. 2 provides for embodiments of the invention;
The preparation process schematic diagram of a kind of ultrathin display panel that Fig. 3 (a) provides to 3 (d) for embodiments of the invention;
The structural representation of a kind of ultrathin display panel that Fig. 4 provides for embodiments of the invention;
The preparation flow figure of a kind of ultrathin LCD that Fig. 5 provides for embodiments of the invention.
Reference numeral:
10-array base palte; 101-first underlay substrate; 102-pixel key-course; 20-color membrane substrates; 201-second underlay substrate; The colored key-course of 202-; 30-display dielectric layer; 5-display panel; 50-display base plate; 500-assembled substrate; 501-underlay substrate; 502-bearing substrate; 503-bond regions; 504-preset component.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiments of the invention provide a kind of preparation method of display panel; Wherein, described display panel comprises display base plate.
On this basis, as shown in Figure 2, described method specifically can comprise:
S10, as shown in Fig. 3 (a), underlay substrate 501 and the neighboring area of bearing substrate 502 are carried out bond vitrified, to form the assembled substrate 500 comprising bond regions 503.
Wherein, described underlay substrate 501 can be glass substrate or quartz base plate etc., as long as it can be bondd mutually by the mode of high-temperature fusion and described bearing substrate 502.
Here it should be noted that, the width of described bond regions 503 should can ensure in successive process that the strong bonded between two substrates is as the criterion, and embodiments of the invention are not specifically limited for the developed width of described bond regions 503; But consider raw-material effective utilization and cost-saving problem, the width of described bond regions 503 is unsuitable wide.
On this basis, described bond regions 503 is positioned at the surrounding of described assembled substrate 500, its finally can cut fall, therefore this region belongs to dead space for described display panel.Based on this, it will be apparent to those skilled in the art that the physical size of described underlay substrate 501 should be greater than the physical size of the final display panel formed; That is, when utilizing described underlay substrate 501 to make described display panel, need to reserve certain spacing at the edge of described underlay substrate 501, so that be the formation reserved location of described bond regions 503.
S20, as shown in Fig. 3 (b), preset component 504 is prepared in the side deviating from described bearing substrate 502 at described underlay substrate 501, to form described display base plate 50.
Here, described preset component 504 refers to and needs for dissimilar display base plate the parts prepared on its underlay substrate.
Example, when described display base plate 50 is the array base palte in LCD, the pixel electrode etc. that described preset component 504 refers to the thin film transistor (TFT) be positioned on underlay substrate 501, the multiple pixel cell controlled by thin film transistor (TFT) and is connected with thin film transistor (TFT).
Or when described display base plate 50 is the color membrane substrates in LCD, described preset component 504 refers to and is positioned at chromatic filter layer on underlay substrate 501 and by the isolated black matrix etc. of adjacent color filter unit.
S30, as shown in Fig. 3 (c), described display base plate 50 is adopted to form described display panel 5.
Here it should be noted that, display panel generally includes two substrates be oppositely arranged.In an embodiment of the present invention, described display base plate 50 can be one of them substrate forming described display panel 5, as for another substrate of the described display panel 5 of composition, it also can adopt the method identical with this substrate to prepare, can certainly adopt and prepare with this substrate diverse ways, be not specifically limited here.
Example, when described display panel 5 is LCD, described display panel 5 can comprise array base palte and color membrane substrates; In the case, described array base palte and described color membrane substrates all can adopt above-mentioned method to be prepared, or also can be that a substrate in described array base palte and described color membrane substrates adopts above-mentioned method to be prepared.
S40, as shown in Fig. 3 (d), excise the bond regions 503 of described assembled substrate 500, be separated with described display panel 5 to make described bearing substrate 502.
Concrete, after the described display panel 5 of formation, owing to mutually boning between described underlay substrate 501 and described bearing substrate 502, therefore the actual (real) thickness of described display panel 5 is the thickness comprising described bearing substrate 502; On this basis, by excising described bond regions 503, to make described bearing substrate 502 be separated with described underlay substrate 501, just described bearing substrate 502 can be separated from described display panel 5, thus reducing the thickness of described display panel 5.
Based on above-mentioned steps S101-S104, the display panel 5 shown in Fig. 4 can be formed.
Wherein, described display panel 5 can be LCD, LED (Light EmittingDiode, light emitting diode) any one in panel and OLED (Organic Light Emitting Diode, Organic Light Emitting Diode) panel.
Based on this, in the preparation process of described display panel 5, the below due to underlay substrate 501 is provided with passive bearing substrate 502, therefore can select relatively thin underlay substrate 501; After formation display panel 5, described bearing substrate 502 can be made to be separated from each other with described display panel 5, thus to obtain extra-thin display panel.So, described display panel is prepared by adopting said method, not only can meet the requirement of strength of preparation technology for display base plate, thinning and the polishing processing procedure in traditional ultrathin display panel preparation technology can also be saved, thus avoid causing in thinning or polishing process bad, the cost of manufacture of display panel can also be reduced simultaneously.
Based on above-mentioned, on the one hand, describedly underlay substrate 501 is carried out bond vitrified with the neighboring area of bearing substrate 502 specifically can comprise: utilize high temperature heat source that described underlay substrate 501 is carried out bond vitrified with the neighboring area of described bearing substrate 502; Wherein, the temperature of described high temperature heat source is greater than 1000 DEG C.
Here, described bearing substrate 502 is generally glass substrate, to described underlay substrate 501 is carried out high-temperature fusion bonding with described bearing substrate 502, then need to make the temperature of high temperature heat source at least reach 1000 DEG C, so that make described underlay substrate 501 and described bearing substrate 502 all form molten state, thus the bond vitrified both realizing.
Based on above-mentioned, on the other hand, the bond regions 503 of the described assembled substrate of described excision 500 specifically can comprise: the bond regions 503 of being excised described assembled substrate 500 by the method for diamond cut or cut.
Concrete, when described display panel 5 is LCD, the cutting method of described bond regions 503 can adopt diamond cut; Or when described display panel 5 is LED/OLED display panel, the cutting method of described bond regions 503 can adopt cut.
Here, the bond regions 503 of described excision assembled substrate 500 specifically refers to: cut away the bond regions 503 of described assembled substrate 500, leaves the part except described bond regions 503.So, due to for the join domain of bond described underlay substrate 501 and described bearing substrate 502 cut fall, therefore just can be separated from each other between described bearing substrate 502 and described underlay substrate 501, thus do not comprised the display panel 5 of described bearing substrate 502, the thickness of described display panel 5 is significantly reduced.
Based on foregoing description, preferably, the thickness of described underlay substrate 501 is less than or equal to 0.2mm, and the thickness of described bearing substrate 502 is greater than or equal to 0.3mm, and the thickness of described assembled substrate 500 is greater than or equal to 0.4mm.
Here, in order to realize the ultrathin of display panel, the thickness of described underlay substrate 501 can be made relatively thin; But in the actual fabrication process of display panel, preparation technology has certain requirement for the thickness of display base plate 50 and intensity, cross thin (being less than 0.4mm) underlay substrate 501 and cannot meet above-mentioned requirements, therefore need to arrange bearing substrate 502 at the back side of underlay substrate 501, to form relatively thick assembled substrate 500 as the substrate in reality preparation; After prepared by display panel, bearing substrate 502 and display panel can be separated from each other, so both can meet above-mentioned process requirements, and also can realize the ultrathin of display panel simultaneously.
Optionally, described underlay substrate 501 can be glass substrate.
Here, when described underlay substrate 501 is glass substrate with described bearing substrate 502, the softening temperature of two substrates is comparatively close, when utilizing high temperature heat source to be bondd by two substrates, two substrates can be made to soften, so that carry out bond vitrified simultaneously.
Known based on foregoing description, described display panel 5 can be LCD.
In the case, preset component 504 is prepared in the described side deviating from bearing substrate 502 at underlay substrate 501, specifically can comprise to form display base plate 50: the pixel cell prepared thin film transistor (TFT) in the side that described underlay substrate 501 deviates from described bearing substrate 502 and controlled by described thin film transistor (TFT), to form the array base palte of described display panel.
Or, preset component 504 is prepared in the described side deviating from bearing substrate 502 at underlay substrate 501, specifically can comprise to form display base plate 50: chromatic filter layer and black matrix are prepared in the side deviating from described bearing substrate 502 at described underlay substrate 501, to form the color membrane substrates of described display panel.
Certainly, preset component 504 is prepared in the described side deviating from bearing substrate 502 at underlay substrate 501, can also comprise to form display base plate 50: the side deviating from described bearing substrate 502 at described underlay substrate 501 prepares thin film transistor (TFT), be positioned at negative electrode above thin film transistor (TFT) and anode, and the organic material functional layer between two electrodes, to form the array base palte of described display panel.
Below the preparation method providing a specific embodiment for described display panel is described in detail.Wherein, shown in figure 4, described display panel is LCD, and the array base palte in described LCD and color membrane substrates all adopt underlay substrate to be prepared in conjunction with the mode of bearing substrate.
Based on this, as shown in Figure 5, the concrete preparation process of described LCD is as follows:
S100, with reference to shown in figure 3 (a), underlay substrate 501 and the neighboring area of bearing substrate 502 are carried out bond vitrified, to form the first assembled substrate comprising bond regions 503.
Wherein, the physical size of described underlay substrate 501 and described bearing substrate 502 should be greater than the physical size of the display panel that will be formed, thus is the formation reserved location of described bond regions 503.
S200, with reference to shown in figure 3 (b), pixel key-course is prepared in the side deviating from described bearing substrate 502 at described underlay substrate 501, to form array base palte.
Here, the pixel cell that described pixel key-course specifically can comprise thin film transistor (TFT), be controlled by thin film transistor (TFT), and the pixel electrode be connected with thin film transistor (TFT).
S300, with reference to shown in figure 3 (a), underlay substrate 501 and the neighboring area of bearing substrate 502 are carried out bond vitrified, to form the second assembled substrate comprising bond regions 503.
Wherein, the physical size of described underlay substrate 501 and described bearing substrate 502 should be greater than the physical size of the display panel that will be formed, thus is the formation reserved location of described bond regions 503.
S400, with reference to shown in figure 3 (b), colored key-course is prepared in the side deviating from described bearing substrate 502 at described underlay substrate 501, to form color membrane substrates.
Here, the described colored key-course black matrix that specifically can comprise chromatic filter layer and adjacent color filter unit is separated.
S500, with reference to shown in figure 3 (c), by described array base palte and described color membrane substrates shaping to box, and between two substrates, pour into liquid crystal, to form described display panel 5.
S600, with reference to shown in figure 3 (d), excise the bond regions 503 of described array base palte and described color membrane substrates, to make the bearing substrate 502 being positioned at described display panel both sides be separated with described display panel, thus form extra-thin display panel 5.
Wherein, the cutting method of described bond regions 503 can adopt diamond cut to realize.
Based on above-mentioned steps S100-S600, the LCD shown in Fig. 4 can be formed.In an embodiment of the present invention, the preparation of described LCD is without the need to through thinning and polishing, and that thinning or polishing can be avoided to cause is bad, again can be cost-saving.
Embodiments of the invention also provide a kind of display panel adopting said method to prepare.
Wherein, described display panel can be any one in LCD, LED panel and oled panel.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; change can be expected easily or replace, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain of described claim.
Claims (8)
1. a preparation method for display panel, described display panel comprises display base plate; It is characterized in that, described method comprises:
Bond vitrified is carried out in the neighboring area of underlay substrate and bearing substrate, to form the assembled substrate comprising bond regions;
Preset component is prepared in the side deviating from described bearing substrate at described underlay substrate, to form described display base plate;
Described display base plate is adopted to form described display panel;
Excise the bond regions of described assembled substrate, be separated with described display panel to make described bearing substrate.
2. method according to claim 1, is characterized in that, the described neighboring area by underlay substrate and bearing substrate is carried out bond vitrified and specifically comprised:
Utilize high temperature heat source that bond vitrified is carried out in the neighboring area of described underlay substrate and described bearing substrate;
Wherein, the temperature of described high temperature heat source is greater than 1000 DEG C.
3. method according to claim 1, is characterized in that, the bond regions of the described assembled substrate of described excision specifically comprises:
The bond regions of described assembled substrate is excised by the method for diamond cut or cut.
4. the method according to any one of claims 1 to 3, is characterized in that, the thickness of described underlay substrate is less than or equal to 0.2mm, and the thickness of described bearing substrate is greater than or equal to 0.3mm, and the thickness of described assembled substrate is greater than or equal to 0.4mm.
5. the method according to any one of claims 1 to 3, is characterized in that, described underlay substrate is glass substrate.
6. method according to claim 1, is characterized in that, preset component is prepared in the described side deviating from described bearing substrate at described underlay substrate, specifically comprises to form described display base plate:
At the pixel cell that the side that described underlay substrate deviates from described bearing substrate is prepared thin film transistor (TFT) and controlled by described thin film transistor (TFT), to form the array base palte of described display panel.
7. method according to claim 1, is characterized in that, preset component is prepared in the described side deviating from described bearing substrate at described underlay substrate, specifically comprises to form described display base plate:
Chromatic filter layer and black matrix are prepared in the side deviating from described bearing substrate at described underlay substrate, to form the color membrane substrates of described display panel.
8. a display panel, is characterized in that, described display panel adopts the preparation of the method described in any one of claim 1-7 and obtains.
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| CN201510004919.2A CN104460095B (en) | 2015-01-05 | 2015-01-05 | A kind of display panel and preparation method thereof |
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| WO2021121351A1 (en) * | 2019-12-20 | 2021-06-24 | 维沃移动通信有限公司 | Display module preparation method, display module and electronic device |
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| CN104460095B (en) | 2018-05-08 |
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