CN104427746A - Circuit board structure - Google Patents
Circuit board structure Download PDFInfo
- Publication number
- CN104427746A CN104427746A CN201310388781.1A CN201310388781A CN104427746A CN 104427746 A CN104427746 A CN 104427746A CN 201310388781 A CN201310388781 A CN 201310388781A CN 104427746 A CN104427746 A CN 104427746A
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- China
- Prior art keywords
- dielectric layer
- circuit board
- end surface
- board structure
- layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a circuit board structure which is suitably used for bearing a heating element. The circuit board structure comprises a core layer, an active type refrigeration element, a dielectric layer and a plurality of blind guide holes, wherein the core layer is provided with a through hole penetrating through the core layer; the active type refrigeration element comprises a cold end surface and a hot end surface and is arranged in the through hole; the dielectric layer covers the core layer and fills into a gap between the through hole and the active type refrigeration element; the heating element is arranged on the outer surface of the dielectric layer and the blind guide holes are formed in the dielectric layer and are connected with the cold end surface and the outer surface, so that the heating element is connected with the active type refrigeration element. The invention also provides a circuit board structure with active type refrigeration blind guide holes.
Description
Technical field
The present invention relates to a kind of circuit board structure, and particularly relate to a kind of radiating efficiency preferably circuit board structure.
Background technology
Along with the progress of science and technology, portable electronic devices is towards frivolous and multi-functional future development.Such as panel computer or Smartphone etc., its frivolous external form is quite applicable to user and carries with and operation.Base this, existing function the more or stronger intelligent electronic installation need to possess chip more at a high speed, but the heat energy that chip more at a high speed produces also the more, adds the miniaturization of portable electronic devices, make radiating subassembly become an indispensable element of portable electronic devices.
Traditional electronic product, such as desktop computer or notebook computer, mostly reach the effect of heat radiation at elements such as near heating sources provided with fan, radiating fins, this is common in the heat dissipation design of desktop computer or notebook computer.But, with panel computer or Smartphone, this type of portable electronic devices due to its inner space less, the heat-dissipating space of portable electronic devices is subject to suitable restriction and compression, and the design direction of this extreme compression stroke causes the difficulty of heat radiation.And, this type of portable electronic devices to run into the problem of heat radiation also relevant with the complexity of device, existing multi-functional, intelligent electronic installation makes internal circuit design relative complex, also the design of high efficiency heat radiation is affected, cause the centralized heat energy of portable electronic devices cannot dissipation outward in chip placement, not only cause the discomfort that user uses, even may cause the damage of chip.
Summary of the invention
The object of the present invention is to provide a kind of circuit board structure, it has active refrigerating function, can promote the radiating efficiency of circuit board structure.
For reaching above-mentioned purpose, a kind of circuit board structure of the present invention, is suitable for carrying heater element.Described circuit board structure comprises core layer, active cooling element, the first dielectric layer and multiple first guide hole.Core layer have run through core layer pass through mouth.Active cooling element comprises cold end surface and hot end surface.Active cooling element is arranged at and passes through in mouth.First dielectric layer covers the surface of core layer and cold end surface, and is filled in the space passed through between mouth and active cooling element.Wherein the first dielectric layer has the first outer surface do not contacted with core layer and active cooling element, for arranging heater element.First guide hole to be arranged in the first dielectric layer and to connect cold end surface and the first outer surface, for connection heater element and active cooling element.
Another kind of circuit board structure of the present invention is suitable for carrying heater element, and described circuit board structure comprises the first dielectric layer, multiple first guide hole and active refrigeration material.First dielectric layer comprises the second surface of first surface and relative first surface.First guide hole is arranged at the first dielectric layer and is communicated with first surface and second surface respectively.Active refrigeration material is filled in each first guide hole, to make each first guide hole have hot end surface and cold end surface, and the second surface of corresponding first dielectric layer of difference and first surface.First surface and cold end surface are respectively for arranging and connecting heater element.
Based on above-mentioned, the present invention is by inserting being embedded in active cooling element in circuit board structure or by active refrigeration material in the guide hole of circuit board structure.So, utilize electric current by there is the effect of initiatively heat conduction during active material of cooling, its one end can form cold end surface, the other end then forms the characteristic of hot end surface, cold end surface is connected on heater element by the first guide hole, to be absorbed heat to heater element by cold end surface, then by hot end surface by thermal energy dissipation.Therefore, the heat energy produced when heater element can promptly operate by circuit board structure of the present invention is taken away, and to avoid unnecessary heat energy accumulation, and then promotes the radiating efficiency of circuit board structure.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended accompanying drawing to be described in detail below.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of a kind of circuit board structure according to one embodiment of the invention;
Fig. 2 A to Fig. 2 H is the Making programme generalized section of a kind of circuit board structure according to one embodiment of the invention;
Fig. 3 A to Fig. 3 C is the Making programme generalized section of a kind of circuit board structure according to another embodiment of the present invention;
Fig. 4 is the schematic diagram of a kind of circuit board structure according to another embodiment of the present invention;
Fig. 5 A to Fig. 5 D is the Making programme generalized section of the circuit board structure of Fig. 4.
Symbol description
100,100a, 100b, 200: circuit board structure
105: base material
110: core layer
112: pass through mouth
120: active cooling element
122,242: cold end surface
124,244: hot end surface
130,230: the first dielectric layers
132: the first outer surfaces
140,240: the first guide holes
150,250: the second dielectric layers
152,252: the second outer surfaces
154,254: line layer
160,260: via
170,270: the second guide holes
220: active refrigeration material
232: first surface
234: second surface 280: the three guide hole
300: heater element
Embodiment
Fig. 1 is the schematic diagram of a kind of circuit board structure according to one embodiment of the invention.Please refer to Fig. 1, the circuit board structure 100 of the present embodiment is suitable for carrying heater element 300.Circuit board structure 100 comprises core layer 110, active cooling element 120, first dielectric layer 130 and multiple first guide hole 140.Core layer 110 has passes through mouth 112, and it runs through core layer 110.Active cooling element 120 is arranged at and passes through in mouth 112, and comprises cold end surface 122 and hot end surface 124, to be absorbed the heat of heater element 300 by cold end surface 122, then by heat dissipation that hot end surface 124 will absorb.In the present embodiment, active cooling element 120 is thermoelectric cooling element (thermal-electric cooler, TEC), and it comprises N type semiconductor material and P type semiconductor material, and its material can comprise tellurium (Te) and bismuth (Bi).First dielectric layer 130 covers in the space that core layer 110 being filled in passes through between mouth 112 and active cooling element 120.Heater element 300 is arranged on the first outer surface 132 of the first dielectric layer 130.First guide hole 140 to be arranged in the first dielectric layer 130 and to connect cold end surface 122 and the first outer surface 132, to connect heater element 300 and active cooling element 120.
When passing into electric current in active cooling element 120, one end of active cooling element 120 forms cold end surface 122, and the other end then forms hot end surface 124.Namely the present embodiment is be connected on heater element 300 by the cold end surface 122 of active cooling element 120 by the first guide hole, to absorb the heat energy that heater element 300 produces, and by hot end surface 124 by thermal energy dissipation, wherein, the heat conduction path of circuit board structure 100 can as shown in the hollow arrow in Fig. 1.So, the heat energy produced when can promptly be operated by heater element is taken away, and to avoid unnecessary heat energy accumulation, and then promotes the radiating efficiency of circuit board structure.
Fig. 2 A to Fig. 2 H is the Making programme generalized section of a kind of circuit board structure according to one embodiment of the invention.In the present embodiment, first the manufacture method of circuit board structure 100 can comprise the following steps:, as shown in Figure 2 A, provides core layer 110, and core layer 110 has passes through mouth 112, runs through core layer 110.Then, more as shown in Figure 2 B, core layer 110 is arranged on base material 105.
Then, please refer to Fig. 2 C, active cooling element 120 to be arranged on base material 105 and to be positioned at and pass through mouth 112.In the present embodiment, base material 105 can such as be formed for release film or by specific sticker localised application or comprehensive coating on release film, it has the characteristic of temporary adhesion and can be stripped easily, with temporary carrying and fixing active cooling element 120, and can not injure active cooling element 120 being separated with active cooling element 120 easily afterwards.Afterwards, more as shown in Figure 2 D, the first dielectric layer 130 to be covered in core layer 110 and to be filled in the space passed through between mouth 112 and this active cooling element 120.Again as shown in Figure 2 E, remove base material 105, to expose the hot end surface 124 of active cooling element 120.Afterwards, the first guide hole 140 as shown in Figure 1 can be formed in the first dielectric layer 130, it is made to connect the first outer surface 132 of the first dielectric layer 130 and the cold end surface 122 of active cooling element 120, the first outer surface 132 again heater element 300 being arranged at the first dielectric layer 130 makes it be connected with the first guide hole 140, namely completes circuit board structure 100 as shown in Figure 1.
The circuit board structure 100 of the present embodiment can be circuit board or carrier (carrier), the cold end surface 122 of active cooling element 120 is connected on heater element 300 by the first guide hole by it, to absorb heat to heater element 300, and its hot end surface 124 is exposed to outside the first dielectric layer 130, the heat energy of hot end surface 124 can directly be arranged loose.Certainly, according to the element of circuit board structure and configuration design, the hot end surface 124 of active cooling element 120 also can not be exposed to the outside, but completely in be embedded in circuit board structure 100, and utilize alternate manner by thermal energy dissipation.The manufacture method of the circuit board structure 100a that this kind of hot end surface 124 is not exposed to the outside, then after the manufacture craft of Fig. 2 E, can proceed Fig. 2 F and manufacture craft afterwards.
Please continue with reference to Fig. 2 F and Fig. 2 G, after removing base material 105, the second dielectric layer 150 is pressed in the hot end surface 124 of core layer and exposure.The surface that second dielectric layer 150 contacts with hot end surface 124 has line layer 154.Line layer 154 is with hot end surface 124 hot link and extend to the outer rim of the second dielectric layer 150, to be fallen apart toward lateral row via line layer 154 by the heat energy of hot end surface 124.Afterwards, again as illustrated in figure 2h, form the first guide hole 140 in the first dielectric layer 130, it is made to connect cold end surface 122 and the first outer surface 132, then again heater element 300 is arranged on the first outer surface 132 of the first dielectric layer 130, to make the first guide hole 140 connect heater element 300 and active cooling element 120, so, namely tentatively complete the Making programme of circuit board structure 100a.
Afterwards, again as illustrated in figure 2h, can optionally form at least one via 160, run through this first dielectric layer 130, second dielectric layer 150 and core layer 110, and be connected with line layer 154, arrange loose with the partial heat energy that line layer 154 is conducted via via 160.In addition, also optionally form at least one second guide hole 170 in the second dielectric layer 150, make the second outer surface 152 of its connection line layer 154 and the second dielectric layer 150, arrange loose with the partial heat energy that line layer 154 is conducted via the second guide hole 170.In other embodiments of the invention, the second guide hole 170 also directly can connect the second outer surface 152 of hot end surface 124 and the second dielectric layer 150, with the direct thermal energy dissipation by hot end surface 124.The heat conduction path of circuit board structure 100a can refer to shown in the hollow arrow in Fig. 2 H.
Fig. 3 A to Fig. 3 D is the Making programme generalized section of a kind of circuit board structure according to another embodiment of the present invention.In another embodiment of the invention, other manufacture methods also can be adopted to make circuit board structure 100b.First, as shown in Figure 3A, provide core layer 110, and active cooling element 120 is arranged on the second dielectric layer 150.Core layer 110 has passes through mouth 112, runs through core layer 110.The surface that second dielectric layer 150 contacts with active cooling element 120 has line layer 154, it connects the hot end surface 124 of active cooling element 120, and extend laterally to the outer rim of the second dielectric layer 150, to be fallen apart via line layer 154 lateral row by the heat energy of hot end surface 124.In the present embodiment, the hot end surface 124 of active cooling element 120 can such as by multiple soldered ball and line layer 154 hot link.
Then, as shown in Figure 3 B, core layer 110 is arranged on the second dielectric layer 150, and the first dielectric layer 130 is covered core layer 110 and is filled in the space passed through between mouth 112 and this active cooling element 120.Afterwards, more as shown in Figure 3 C, the first guide hole 140 is formed in the first dielectric layer 130, the cold end surface 122 making it connect active cooling element 120 and the first outer surface 132 of the first dielectric layer 130.Then again heater element 300 is arranged on the first outer surface 132 of the first dielectric layer 130, to make the first guide hole 140 connect heater element 300 and active cooling element 120, so, namely tentatively completes the Making programme of circuit board structure 100b.
Afterwards, again as shown in Figure 3 C, can optionally form at least one via 160, run through this first dielectric layer 130, second dielectric layer 150 and core layer 110, and be connected with line layer 154, arrange loose with the partial heat energy that line layer 154 is conducted via via 160.In addition, also at least one second guide hole 170 of alternative formation is in the second dielectric layer 150, makes the second outer surface 152 of its connection line layer 154 and the second dielectric layer 150, arranges loose with the partial heat energy conducted by line layer 154 via the second guide hole 170.Certainly, in other embodiments of the invention, the second guide hole 170 also directly can connect the second outer surface 152 of hot end surface 124 and the second dielectric layer 150, with the direct thermal energy dissipation by hot end surface 124.The heat conduction path of circuit board structure 100a can refer to shown in the hollow arrow in Fig. 3 C.
So, circuit board structure 100a, the cold end surface 122 of active cooling element 120 is connected on heater element 300 by the first guide hole 140 by 100b, and its hot end surface 124 is connected on line layer 154, and line layer 154 extends laterally to the outer rim of the second dielectric layer 150, to be absorbed heat by cold end surface 122 pairs of heater elements 300, and by hot end surface 124, heat energy is arranged loose via line layer 154, the heat energy produced when thus can promptly be operated by heater element 300 is taken away, to avoid unnecessary heat energy accumulation, and then promote circuit board structure 100a, the radiating efficiency of 100b.
Fig. 4 is the schematic diagram of a kind of circuit board structure according to another embodiment of the present invention.In the present embodiment, circuit board structure 200 comprises active refrigeration material 220, first dielectric layer 230 and multiple first guide hole 240.First dielectric layer 230 comprises the second surface 234 on first surface 232 and relative surface 232.First guide hole 240 is arranged at the first dielectric layer 230 and is communicated with first surface 232 and second surface 234 respectively.Active refrigeration material 220 is filled in each first guide hole 240, has cold end surface 242 and hot end surface 244 to make each first guide hole 240.Heater element 300 to be arranged on first surface 232 and to connect cold end surface 242, absorbs heat with the cold end surface 242 pairs of heater elements 300 by the first guide hole 240.In the present embodiment, circuit board structure 200 also can comprise the second dielectric layer 250, is arranged on second surface 234, and comprises line layer 254, is positioned at the surface that the second dielectric layer 250 contacts with second surface 234, and extends to the outer rim of the second dielectric layer 250.Line layer 254 connects hot end surface 244, is fallen apart by heat energy by hot end surface 244 toward lateral row.
Fig. 5 A to Fig. 5 D is the Making programme generalized section of the circuit board structure of Fig. 4.In the present embodiment, first the manufacture method of circuit board structure 200 can comprise the following steps:, provide the second dielectric layer 250, its surface is provided with line layer 254, and line layer 254 extends to the outer rim of the second dielectric layer 250.Then, as shown in Figure 5 B, the first dielectric layer 230 is formed on the second dielectric layer 250.First dielectric layer 230 comprises relative first surface 232 and second surface 234.Line layer 254 is namely between the first dielectric layer 230 and the second dielectric layer 250.
Afterwards, more as shown in Figure 5 C, form the first guide hole 240 and be communicated with first surface 232 and second surface 234 in the first dielectric layer 230, first guide hole 240.In this enforcement, also as shown in Figure 5 C, can optionally form at least one via 260, it runs through the first dielectric layer 230 and the second dielectric layer 250 and is connected with line layer 254.The method forming the first guide hole 240 and via 260 is such as respectively laser drill and machine drilling, and certainly, the present invention is not as limit.
Then, again as shown in Figure 5 D, fill active refrigeration material 220 in the first guide hole 240, make the first guide hole 240 that the effect of initiatively heat conduction can occur after passing into electric current, produce cold end surface 242 and hot end surface 244, its hot end surface 244 connection line layer 254, with by the heat energy sideways conduction of hot end surface to the outer rim of dielectric layer.In the present embodiment, active refrigeration material 220 is thermoelectric cooling element (thermal-electric cooler, TEC), and it comprises N type semiconductor material and P type semiconductor material, and its material can comprise tellurium (Te) and bismuth (Bi).In addition, via 260 also can contact line layer 254, the partial heat energy of line layer 254 is arranged loose by via 260.Afterwards, then heater element 300 is as shown in Figure 4 arranged on the first outer surface 232 of the first dielectric layer 230, and makes heater element 300 connect cold end surface 242, tentatively can complete the Making programme of circuit board structure 200.
Afterwards, can more as shown in Figure 4, optionally form at least one second guide hole 270 in the second dielectric layer 250, make the second outer surface 252 of its connection line layer 254 and the second dielectric layer 250, outer field dielectric layer is conducted to via the second guide hole 270 with the partial heat energy conducted by line layer 254, again in a similar fashion, by the guide hole of each layer dielectric layer by thermal energy dissipation.Certainly, in other embodiments of the invention, second guide hole 270 also directly can connect the second outer surface 252 of hot end surface 244 and the second dielectric layer 250, with direct by the thermal energy conduction of hot end surface 244 to outer field dielectric layer, then by the guide hole of each layer dielectric layer by thermal energy dissipation.The heat conduction path of circuit board structure 200 can as shown in the hollow arrow in Fig. 4.
In addition, circuit board structure 200 also can comprise multiple 3rd guide hole 280, is arranged at the first dielectric layer 230.Can insert general conduction material in 3rd guide hole 280, such as, be copper, in order to auxiliary first guide hole 240 as the use electrically conducted between heater element 300 and circuit board structure 200.
In sum, the present invention is by inserting being embedded in active cooling element in circuit board structure or by active refrigeration material in the guide hole of circuit board structure.So, utilize electric current can form cold end surface by its one end during active material of cooling, the other end then forms the characteristic of hot end surface, cold end surface is connected on heater element by the first guide hole, to be absorbed heat to heater element by cold end surface, then by hot end surface by thermal energy dissipation.Therefore, the heat energy produced when heater element can promptly operate by circuit board structure of the present invention is taken away, and to avoid unnecessary heat energy accumulation, and then promotes the radiating efficiency of circuit board structure.
Although disclose the present invention in conjunction with above embodiment; but itself and be not used to limit the present invention; this operator is familiar with in any art; without departing from the spirit and scope of the present invention; a little change and retouching can be done, therefore being as the criterion of should defining with the claim of enclosing of protection scope of the present invention.
Claims (10)
1. a circuit board structure, be suitable for carrying heater element, this circuit board structure is characterized in that comprising:
Core layer, has and passes through mouth, and this passes through mouth and runs through this core layer;
Active cooling element, comprises cold end surface and hot end surface, and this active cooling element is arranged at this and passes through in mouth;
First dielectric layer, cover surface and this cold end surface of this core layer, and be filled in this space passed through between mouth and this active cooling element, wherein the first dielectric layer has the first outer surface do not contacted with this core layer and this active cooling element, for arranging this heater element; And
Multiple first guide hole, to be arranged in this first dielectric layer and to connect this cold end surface and this first outer surface, for this heater element of connection and this active cooling element.
2. circuit board structure as claimed in claim 1, wherein this first dielectric layer exposes this hot end surface.
3. circuit board structure as claimed in claim 1, also comprises the second dielectric layer, and this active cooling element to be arranged on this second dielectric layer with this hot end surface and to be positioned at this and passes through mouth.
4. circuit board structure as claimed in claim 3, also comprises line layer, to be arranged on this second dielectric layer and to extend to the outer rim of this second dielectric layer, this this hot end surface of line layer hot link.
5. circuit board structure as claimed in claim 3, also comprise line layer and at least one via, this line layer to be arranged on this second dielectric layer and to connect this hot end surface, and this via runs through this first dielectric layer, this second dielectric layer and this core layer, and is connected with this line layer.
6. a circuit board structure, be suitable for carrying heater element, this circuit board structure is characterized in that comprising:
First dielectric layer, comprises the second surface of first surface and this first surface relatively;
Multiple first guide hole, is arranged at this first dielectric layer and is communicated with this first surface and this second surface respectively; And
Active refrigeration material, be filled in respectively in this first guide hole, to make respectively this first guide hole have hot end surface and cold end surface, respectively to should this second surface of the first dielectric layer and this first surface, this first surface and this cold end surface be respectively for arranging and connecting this heater element.
7. circuit board structure as claimed in claim 6, also comprises the second dielectric layer, is arranged on this second surface, line layer, be positioned at the surface that this second dielectric layer contacts with this second surface, and extend to the outer rim of this second dielectric layer, this line layer connects those hot end surface.
8. circuit board structure as claimed in claim 6, also comprise the second dielectric layer and multiple second guide hole, this second dielectric stack is located on this second surface, and those the second guide holes are arranged at this second dielectric layer and connect the second outer surface of those hot end surface and this second dielectric layer respectively.
9. circuit board structure as claimed in claim 7, also comprises multiple second guide hole, is arranged at the second outer surface that this second dielectric layer also connects this line layer and this second dielectric layer respectively.
10. circuit board structure as claimed in claim 7, also comprises at least one via, runs through this first dielectric layer and this second dielectric layer and is connected with this line layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310388781.1A CN104427746A (en) | 2013-08-30 | 2013-08-30 | Circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310388781.1A CN104427746A (en) | 2013-08-30 | 2013-08-30 | Circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104427746A true CN104427746A (en) | 2015-03-18 |
Family
ID=52975361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310388781.1A Pending CN104427746A (en) | 2013-08-30 | 2013-08-30 | Circuit board structure |
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| Country | Link |
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| CN (1) | CN104427746A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304634A (en) * | 2015-05-20 | 2017-01-04 | 欣兴电子股份有限公司 | Board structure of circuit and manufacture method thereof |
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| US20060145328A1 (en) * | 2005-01-06 | 2006-07-06 | Shih-Ping Hsu | Three dimensional package structure with semiconductor chip embedded in substrate and method for fabricating the same |
| US7154189B2 (en) * | 2000-12-14 | 2006-12-26 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and method for fabricating the same |
| US20070284711A1 (en) * | 2006-06-09 | 2007-12-13 | Lee Tien Yu T | Methods and apparatus for thermal management in a multi-layer embedded chip structure |
| CN101686611A (en) * | 2008-09-28 | 2010-03-31 | 华为技术有限公司 | Multilayer circuit board, manufacture method thereof and communication equipment |
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2013
- 2013-08-30 CN CN201310388781.1A patent/CN104427746A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7154189B2 (en) * | 2000-12-14 | 2006-12-26 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and method for fabricating the same |
| US20060145328A1 (en) * | 2005-01-06 | 2006-07-06 | Shih-Ping Hsu | Three dimensional package structure with semiconductor chip embedded in substrate and method for fabricating the same |
| US20070284711A1 (en) * | 2006-06-09 | 2007-12-13 | Lee Tien Yu T | Methods and apparatus for thermal management in a multi-layer embedded chip structure |
| CN101686611A (en) * | 2008-09-28 | 2010-03-31 | 华为技术有限公司 | Multilayer circuit board, manufacture method thereof and communication equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304634A (en) * | 2015-05-20 | 2017-01-04 | 欣兴电子股份有限公司 | Board structure of circuit and manufacture method thereof |
| CN106304634B (en) * | 2015-05-20 | 2019-03-19 | 欣兴电子股份有限公司 | Board structure of circuit and its manufacturing method |
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Application publication date: 20150318 |
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