CN104424059A - Jumper state detection device, system and method - Google Patents
Jumper state detection device, system and method Download PDFInfo
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- CN104424059A CN104424059A CN201310369705.6A CN201310369705A CN104424059A CN 104424059 A CN104424059 A CN 104424059A CN 201310369705 A CN201310369705 A CN 201310369705A CN 104424059 A CN104424059 A CN 104424059A
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- wire jumper
- motherboard
- measured
- jumper
- ultrasonic sensor
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Abstract
A jumper state detection method comprises when a bearing plate covers the upper portion of a main board to be tested to enable each jumper on the main board to be tested to right face towards one ultrasonic transducer, receiving reflection echoes of ultrasonic waves generated by ultrasonic emission of emission probes towards corresponding jumpers on the main board to be tested through receiving probes of the ultrasonic sensors; obtaining the numbers of the jumpers corresponding to the ultrasonic transducers; searching for reflection waveforms corresponding to the jumpers which are identical in number; comparing the received jumper reflection echo waveforms with the searched reflection waveforms to determine whether the positions of jumper caps of the jumpers are accurate. The invention further provides a jumper state detection system. By means of the system, whether the positions of the jumper caps of a plurality of the jumpers on the main board are accurate can be detected automatically, and manual detection is not needed, so that the work efficiency is greatly improved.
Description
Technical field
The present invention relates to a kind of wire jumper condition detecting system and method.
Background technology
Computer main frame panel can be provided with usually the wire jumper (Jumper) being available for users to set; this type of wire jumper comprises and is arranged at some stitch on motherboard and sets for user which stitch is interconnective jumping cap, reaches by setting different stitch and connecting the object making some signal draw high or drag down.For reaching this object, need jumping cap to be placed in certain specific position, such as one wire jumper comprising three stitch generally has three kinds of connected modes: stitch 1 is connected with stitch 2, and stitch 2 is connected with stitch 3 and all stitch do not connect; These three kinds of connected modes are placed in stitch 1,2 by by jumping cap respectively, jumping cap are placed in stitch 2,3 and do not use jumping cap to realize.In the process that motherboard detects, because the position of the wire jumper of often kind of motherboard is not identical with the state that arranges of jumping cap, existing testing scheme all needs tester's naked eyes to go the wire jumper state checked one by one on each motherboard, namely whether have to insert and jump cap, be inserted in stitch 1,2 or stitch 2,3 etc.This method of testing obviously also exists loaded down with trivial details and easily occurs causing the problems such as undetected due to human error, there is larger negative effect to the delivery quality of product.
Summary of the invention
In view of above content, be necessary to provide a kind of wire jumper condition detecting system and method, whether its position automatically can detecting the jumping cap of multiple wire jumper on motherboard is correct, do not need manual detection, drastically increases work efficiency.
A kind of wire jumper condition checkout gear, comprise a loading plate, described loading plate comprises the ultrasonic sensor corresponding with the quantity of wire jumper on motherboard to be measured and position, and each ultrasonic sensor comprises a transmitting probe and a receiving transducer.
A kind of wire jumper condition detecting system, this system comprises: receiver module, for being overlying on the top of motherboard to be measured when described loading plate, during one of them ultrasonic sensor that each wire jumper on motherboard to be measured is just in time faced toward on loading plate, hyperacoustic reflection echo that ultrasound wave produces launched by the wire jumper utilizing the receiving transducer of described ultrasonic sensor to receive transmitting probe correspondence on motherboard to be measured; Acquisition module, for obtaining the numbering of the wire jumper corresponding to described ultrasonic sensor; Search module, for searching the reflection configuration corresponding to the wire jumper identical with described numbering; And comparing module, with the reflection configuration found out, the waveform for the reflection echo by received wire jumper compares to judge that whether the position of the jumping cap of described wire jumper is correct.
A kind of wire jumper condition detection method, the method comprises: receiving step, when described loading plate is overlying on the top of motherboard to be measured, during one of them ultrasonic sensor that each wire jumper on motherboard to be measured is just in time faced toward on loading plate, hyperacoustic reflection echo that ultrasound wave produces launched by the wire jumper utilizing the receiving transducer of described ultrasonic sensor to receive transmitting probe correspondence on motherboard to be measured; Obtaining step, obtains the numbering of the wire jumper corresponding to described ultrasonic sensor; Finding step, searches the reflection configuration corresponding to the wire jumper identical with described numbering; And comparison step, the waveform of the reflection echo of received wire jumper and the reflection configuration found out are compared to judge that whether the position of the jumping cap of described wire jumper is correct.
Compared to prior art, described wire jumper condition detecting system and method, whether its position automatically can detecting the jumping cap of multiple wire jumper on motherboard is correct, do not need manual detection, drastically increases work efficiency.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of wire jumper condition checkout gear of the present invention.
Fig. 2 is the module map of the preferred embodiment of wire jumper condition detecting system of the present invention.
Fig. 3 is the process flow diagram of the preferred embodiment of wire jumper condition detection method of the present invention.
Fig. 4 is the position view of ultrasonic sensor and the wire jumper corresponding to it.
Main element symbol description
| Wire jumper condition checkout gear | 1 |
| Loading plate | 10 |
| Ultrasonic sensor | 11 |
| Transmitting probe | 110 |
| Receiving transducer | 111 |
| Single-chip microcomputer | 12 |
| Motherboard to be measured | 2 |
| Wire jumper | 20 |
| Jump cap | 21 |
| Stitch | 22 |
| Processor | 120 |
| Memory device | 121 |
| Display device | 122 |
| Wire jumper condition detecting system | 13 |
| Receiver module | 130 |
| Acquisition module | 131 |
| Search module | 132 |
| Comparing module | 133 |
| Display module | 134 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
As shown in Figure 1, be the schematic diagram of wire jumper condition checkout gear of the present invention.This wire jumper condition checkout gear 1 comprises loading plate 10.Described loading plate 10 identical with the specification of motherboard 2 to be measured (namely length and width size is the same).Described loading plate 10 comprises the ultrasonic sensor 11 identical and corresponding with its position with the quantity of wire jumper 20 on motherboard 2 to be measured, and each ultrasonic sensor 11 comprises two probes, i.e. transmitting probe 110 and receiving transducer 111.As shown in Figure 4, when being overlying on motherboard 2 to be measured by loading plate 10, make each wire jumper (Jumper) 20 on motherboard 2 to be measured face a ultrasonic sensor 11, and described ultrasonic sensor 11 is in the side of described wire jumper 20.The transmitting probe 110 of described ultrasonic sensor 11 launches ultrasound wave for the wire jumper 20 corresponding to it, the reflection echo that the receiving transducer 111 of described ultrasonic sensor 11 reflects at corresponding wire jumper 20 place for receiving described ultrasound wave.Described wire jumper 20 comprises jumps cap 21 and stitch 22.
Described single-chip microcomputer 12 is also positioned on described loading plate 10, be connected by communication with ultrasonic sensor 11, described single-chip microcomputer 12 is a kind of integrated circuit (IC) chip, is to adopt very large scale integration technology having the little and perfect microcomputer system of that the processor CPU120 of data-handling capacity, memory device 121 and the function i ntegration to one piece of silicon chip such as interrupt system, timer/timer are formed.Described single-chip microcomputer 12 is also connected with display device 14.
As shown in Figure 2, be the module map of wire jumper condition detecting system 13 in single-chip microcomputer 12.In the present embodiment, described wire jumper condition detecting system 13 comprise receiver module 130, acquisition module 131, search module 132, comparing module 133 and display module 134.Module alleged by the present invention refer to a kind of can be performed and the series of computation machine program segment of fixed function can be completed by the processor 120 of single-chip microcomputer 12, it is stored in the memory device 121 of single-chip microcomputer 12.In the present embodiment, the function about each module will specifically describe in the flowchart of fig. 3.
As shown in Figure 3, be the process flow diagram of preferred embodiment of wire jumper condition detection method of the present invention.According to different demands, in this process flow diagram, the order of step can change, and some step can be omitted.
Step S10, is overlying on the top of motherboard 2 to be measured by loading plate 10, make each wire jumper 20 on motherboard 2 to be measured just in time facing to one of them ultrasonic sensor 11 on loading plate 10.
In the present embodiment, described motherboard 2 to be measured has multiple wire jumper 20, and the position of each wire jumper 20 on motherboard 2 to be measured is not identical, and the corresponding numbering of each wire jumper 20, this numbering is for identifying described wire jumper 20.
In the present embodiment, described loading plate 10 comprises and the corresponding consistent ultrasonic sensor 11 of the quantity of the wire jumper 20 on motherboard 2 to be measured and position.
Step S11, when the transmitting probe 110 of certain ultrasonic sensor 11 launches ultrasound wave to described wire jumper, the reflection echo that receiver module 130 utilizes the receiving transducer 111 of described ultrasonic sensor 11 to receive described ultrasound wave to reflect at corresponding wire jumper 20 place.
In the present embodiment, when the transmitting probe 110 of described ultrasonic sensor 11 launches ultrasound wave to described wire jumper 20, described ultrasound wave is propagated in atmosphere, and can produce hyperacoustic reflection echo when encountering point interface of air and wire jumper 20, receiving transducer 111 can receive described reflection echo.
When the jumping cap of wire jumper is positioned at different positions, point interface of air and wire jumper is just different, will produce different reflection echos, and be three stitch for wire jumper, three stitch are respectively stitch one, stitch two and stitch three.Jump cap and can be placed in stitch one with on stitch two, on stitch two and stitch three or three stitch are inserted jump cap.Like this concerning the wire jumper of three stitch, will corresponding three kinds of different reflection echos.
Step S12, acquisition module 131 obtains the numbering of the wire jumper 20 corresponding to described ultrasonic sensor 11.
In this example, described acquisition module 131 utilizes the position of described wire jumper 20 on motherboard 2 to be measured to obtain the numbering of described wire jumper 20.
Step S13, searches module 132 in the memory device 121 of single-chip microcomputer 12, searches reflection configuration corresponding to the wire jumper identical with described numbering.
In the present embodiment, the correct reflection configuration on described motherboard to be measured 2 corresponding to each wire jumper 20 is stored in memory device 121.
Step S14, whether the position that waveform and the reflection configuration found out of the reflection echo that received wire jumper 20 reflects by comparing module 133 compare the jumping cap judging described wire jumper 20 is correct.
When the waveform of the reflection echo that received wire jumper 20 reflects is consistent with found out reflection configuration, the position of the jumping cap of described wire jumper 20 is correct, and this flow process terminates; When the waveform of the reflection echo that received wire jumper 20 reflects is inconsistent with the reflection configuration found out, the malposition of the jumping cap of described wire jumper 20, performs step S15.
Step S15, the malposition that display module 134 shows the jumping cap of described wire jumper 20 on described display device 122 checks to point out tester.
Finally it should be noted that, above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted, although with reference to preferred embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that, can modify to technical scheme of the present invention or equivalent replacement, and not depart from the spirit and scope of technical solution of the present invention.
Claims (5)
1. a wire jumper condition checkout gear, comprise a loading plate, it is characterized in that, described loading plate comprises the ultrasonic sensor corresponding with the quantity of wire jumper on motherboard to be measured and position, and each ultrasonic sensor comprises a transmitting probe and a receiving transducer.
2. utilize wire jumper condition checkout gear described in claim 1 motherboard to be measured to be carried out to a system for wire jumper state-detection, it is characterized in that, this system comprises:
Receiver module, for being overlying on the top of motherboard to be measured when described loading plate, during one of them ultrasonic sensor that each wire jumper on motherboard to be measured is just in time faced toward on loading plate, hyperacoustic reflection echo that ultrasound wave produces launched by the wire jumper utilizing the receiving transducer of described ultrasonic sensor to receive transmitting probe correspondence on motherboard to be measured;
Acquisition module, for obtaining the numbering of the wire jumper corresponding to described ultrasonic sensor;
Search module, for searching the reflection configuration corresponding to the wire jumper identical with described numbering; And
Comparing module, with the reflection configuration found out, the waveform for the reflection echo by received wire jumper compares to judge that whether the position of the jumping cap of described wire jumper is correct.
3. wire jumper condition detecting system as claimed in claim 2, it is characterized in that, this system also comprises:
Display module, time inconsistent for the waveform of working as the reflection echo of received wire jumper and the reflection configuration found out, the malposition showing the jumping cap of described wire jumper on the display device carries out checking described wire jumper to point out tester.
4. utilize wire jumper condition checkout gear described in claim 1 motherboard to be measured to be carried out to a method for wire jumper state-detection, it is characterized in that, the method comprises:
Receiving step, when described loading plate is overlying on the top of motherboard to be measured, during one of them ultrasonic sensor that each wire jumper on motherboard to be measured is just in time faced toward on loading plate, hyperacoustic reflection echo that ultrasound wave produces launched by the wire jumper utilizing the receiving transducer of described ultrasonic sensor to receive transmitting probe correspondence on motherboard to be measured;
Obtaining step, obtains the numbering of the wire jumper corresponding to described ultrasonic sensor;
Finding step, searches the reflection configuration corresponding to the wire jumper identical with described numbering; And
By the waveform of the reflection echo of received wire jumper and the reflection configuration found out, comparison step, compares to judge that whether the position of the jumping cap of described wire jumper is correct.
5. wire jumper condition detection method as claimed in claim 4, it is characterized in that, the method also comprises:
Step display, when waveform and the reflection configuration found out of the reflection echo of received wire jumper are inconsistent, the malposition showing the jumping cap of described wire jumper on the display device carries out checking described wire jumper to point out tester.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310369705.6A CN104424059A (en) | 2013-08-22 | 2013-08-22 | Jumper state detection device, system and method |
| TW102131207A TW201508295A (en) | 2013-08-22 | 2013-08-30 | System and method of detecting jump state |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310369705.6A CN104424059A (en) | 2013-08-22 | 2013-08-22 | Jumper state detection device, system and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104424059A true CN104424059A (en) | 2015-03-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310369705.6A Pending CN104424059A (en) | 2013-08-22 | 2013-08-22 | Jumper state detection device, system and method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104424059A (en) |
| TW (1) | TW201508295A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110543391A (en) * | 2018-05-28 | 2019-12-06 | 佛山市顺德区顺达电脑厂有限公司 | method for detecting connection state of main board element |
| CN111025125A (en) * | 2019-11-26 | 2020-04-17 | 湖州佳格电子科技股份有限公司 | Infrared assembly circuit board detection device and detection method |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI559013B (en) * | 2015-12-18 | 2016-11-21 | 技嘉科技股份有限公司 | Measurement fixture |
| CN106896280B (en) * | 2015-12-18 | 2019-08-06 | 技嘉科技股份有限公司 | Measure jig |
| TWI559015B (en) * | 2015-12-18 | 2016-11-21 | 技嘉科技股份有限公司 | Measurement fixture |
| TWI559017B (en) * | 2015-12-18 | 2016-11-21 | 技嘉科技股份有限公司 | Measurement system |
| TWI559014B (en) * | 2015-12-18 | 2016-11-21 | 技嘉科技股份有限公司 | Measurement fixture |
-
2013
- 2013-08-22 CN CN201310369705.6A patent/CN104424059A/en active Pending
- 2013-08-30 TW TW102131207A patent/TW201508295A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110543391A (en) * | 2018-05-28 | 2019-12-06 | 佛山市顺德区顺达电脑厂有限公司 | method for detecting connection state of main board element |
| CN111025125A (en) * | 2019-11-26 | 2020-04-17 | 湖州佳格电子科技股份有限公司 | Infrared assembly circuit board detection device and detection method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201508295A (en) | 2015-03-01 |
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Application publication date: 20150318 |
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| WD01 | Invention patent application deemed withdrawn after publication |