CN110023770A - For testing method, test platform and the test macro of chip - Google Patents

For testing method, test platform and the test macro of chip Download PDF

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Publication number
CN110023770A
CN110023770A CN201780001875.5A CN201780001875A CN110023770A CN 110023770 A CN110023770 A CN 110023770A CN 201780001875 A CN201780001875 A CN 201780001875A CN 110023770 A CN110023770 A CN 110023770A
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China
Prior art keywords
core board
version
firmware
chip
bottom plate
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CN201780001875.5A
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Chinese (zh)
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刘金涛
曹岚健
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Shenzhen Goodix Technology Co Ltd
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Shenzhen Goodix Technology Co Ltd
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Publication of CN110023770A publication Critical patent/CN110023770A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

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  • General Physics & Mathematics (AREA)
  • Test And Diagnosis Of Digital Computers (AREA)

Abstract

For testing method, test platform and the test macro of chip.The test platform (100) includes: core board (120) and a variety of bottom plates (110), wherein, the corresponding different chips of bottom plate (110) not of the same race in a variety of bottom plates (110), the first bottom plate (110) in a variety of bottom plates (110) includes the test interface for connecting chip to be measured, which is chip corresponding with the first bottom plate (110)；The core board (120) is for testing the chip to be measured by first bottom plate (110).This is used to test method, test platform and the test macro of chip, for different chips, select different bottom plates (110), and the core board (120) can partially reuse, match between the firmware and bottom plate (110) and chip to be measured of terminal device guarantee core board (120) connected by test platform (100), user is without the concern for the matching problem between driving, firmware and software etc., use process is simplified, is operated convenient for user.

Description

For testing method, test platform and the test macro of chip Technical field
This application involves electronic product testing fields, more particularly, to test method, test platform and the test macro of chip.
Background technique
Whether during chip production, chip detection is a very important job, need normal by the working condition of test platform detection chip.
Since the type or purposes of chip are different, such as various sensor chips, micro-control unit (microcontroller unit, MCU) etc., in traditional test method, a new testing tool can be researched and developed to every kind of chip under test in a variety of different chips, the exploitation including software and hardware.Therefore, traditional test platform needs manual burning firmware；It also needs to design one piece of test board comprising MCU for every kind of chip under test, causes its at high cost, heavy workload；User is needed to have the drawbacks of corresponding professional knowledge in addition, traditional test platform also has.
Summary of the invention
Method, test platform and the test macro that this application provides a kind of for testing chip, being capable of test platform used in facilitating chip test process.
First aspect, provide a kind of test platform, the test platform includes: core board and a variety of bottom plates, wherein, bottom plate not of the same race corresponds to different chips in a variety of bottom plates, the first bottom plate in a variety of bottom plates includes the test interface for connecting chip to be measured, which is chip corresponding with first bottom plate；The core board is for testing the chip to be measured by first bottom plate.
Therefore, the test platform of the embodiment of the present application, including core board and a variety of bottom plates, bottom plate not of the same race corresponds to different chips, different chips can be directed to, select different bottom plates, and the core board part can reuse, without manual burning firmware, and the terminal device connected by test platform guarantees to match between core board firmware and bottom plate and chip to be measured, i.e. user simplifies use process without the concern for the matching problem between driving, firmware and software etc., operates convenient for user.And by the expensive independent reuse in core board part, cheap supporting base plate need to only be designed for every kind of chip under test, test platform cost can be reduced.
Second aspect, provides a kind of method for testing chip, this method by test platform core Plate executes, the test platform includes the core board and a variety of bottom plates, bottom plate not of the same race corresponds to different chips in a variety of bottom plates, the first bottom plate includes the test interface for connecting chip to be measured in a variety of bottom plates, the chip to be measured is chip corresponding with first bottom plate, the core board is for testing the chip to be measured by first bottom plate, this method comprises: the firmware version that the core board receiving terminal apparatus is sent indicates information；The core board indicates information according to the firmware version, sends firmware version information to the terminal device, which is used to indicate the current version of firmware in the core board；When the current version of the firmware and chip to be measured match, which receives the test instruction information of terminal device transmission；The core board indicates information according to the test, is tested by first bottom plate the chip to be measured.
Therefore, the method for testing chip of the embodiment of the present application, use the test platform including core board and a variety of bottom plates, bottom plate not of the same race corresponds to different chips in the test platform, for different chips, select different bottom plates, and the core board part can reuse, without manual burning firmware, and the terminal device connected by test platform guarantees to match between core board firmware and bottom plate and chip to be measured, i.e. user simplifies use process without the concern for the matching problem between driving, firmware and software etc., operates convenient for user.And by the expensive independent reuse in core board part, cheap supporting base plate need to only be designed for every kind of chip under test, test platform cost can be reduced.
The third aspect, provide a kind of method for testing chip, this method comprises: determining the current version of firmware in the core board of test platform, the test platform includes the core board and a variety of bottom plates, wherein, bottom plate not of the same race corresponds to different chips in a variety of bottom plates, and the first bottom plate in a variety of bottom plates includes the test interface for connecting chip to be measured, the chip to be measured is chip corresponding with first bottom plate, and the core board is for testing the chip to be measured by first bottom plate；Determine the backplane version information for the bottom plate currently connecting with the core board；The current version and chip to be measured for determining the firmware match, and the bottom plate currently connecting with the core board is after first bottom plate, test instruction information is sent to the core board, test instruction information is used to indicate the core board and tests by first bottom plate the chip to be measured.
Optionally, this method can be executed by terminal device.
Therefore, the method for testing chip of the embodiment of the present application, terminal device connecting test platform can be used, the test platform includes core board and a variety of bottom plates, wherein, bottom plate not of the same race corresponds to different chips, for different chips, select different bottom plates, and the core board part can reuse, without manual burning firmware, and the terminal device connected by test platform guarantees to match between core board firmware and bottom plate and chip to be measured, i.e. user is without the concern for driving, matching problem between firmware and software etc., simplify use process, convenient for user's operation.And by the expensive independent reuse in core board part, cheap supporting base plate need to only be designed for every kind of chip under test, it is flat that test can be reduced Platform cost.
Fourth aspect, provide a kind of test macro, the test macro may include test platform and test module, the test platform is used to execute the method in any possible implementation of second aspect or second aspect, which can be used for executing the method in any possible implementation of the third aspect or the third aspect.
Optionally, which can be located in terminal device.
5th aspect, provide a kind of terminal device, it include: storage unit and processor, the storage unit is for storing instruction, the processor is used to execute the instruction of memory storage, and when the processor executes the instruction of memory storage, the execution is so that the processor executes the method in any possible implementation of the third aspect or the third aspect.
6th aspect, provides a kind of computer-readable medium, for storing computer program, which includes the instruction for executing the method in any possible implementation of second aspect or second aspect.
7th aspect, provides a kind of computer-readable medium, for storing computer program, which includes the instruction for executing the method in any possible implementation of the third aspect or the third aspect.
Detailed description of the invention
Fig. 1 is the schematic diagram according to the test platform of the embodiment of the present application.
Fig. 2 is the schematic flow chart according to the method for testing chip of the embodiment of the present application.
Fig. 3 is another schematic flow chart according to the method for testing chip of the embodiment of the present application.
Fig. 4 is another schematic flow chart according to the method for testing chip of the embodiment of the present application.
Fig. 5 is another schematic flow chart according to the method for testing chip of the embodiment of the present application.
Fig. 6 is the schematic block diagram according to the test macro of the embodiment of the present application.
Fig. 7 is the schematic block diagram according to the terminal device of the embodiment of the present application.
Specific embodiment
Below in conjunction with attached drawing, technical solutions in the embodiments of the present application is described.
The embodiment of the present application proposes a kind of test platform, including core board and a variety of bottom plates, wherein, bottom plate not of the same race corresponds to different chips in a variety of bottom plates, the first bottom plate in a variety of bottom plates includes the test interface for connecting chip to be measured, the chip to be measured is chip corresponding with the first bottom plate, which uses In being tested by first bottom plate the chip to be measured.
Optionally, as one embodiment, Fig. 1 shows the schematic diagram of the test platform 100 according to the embodiment of the present application.Specifically, the test platform may include a variety of bottom plates, bottom plate not of the same race corresponds to different chips, such as, for a certain chip to be measured, the chip to be measured corresponds to the first bottom plate 110 in the multiple bottom plates for including in the test platform 100, which includes communication interface corresponding with the chip to be measured, and is connected by the communication interface with chip to be measured and is tested.
In addition, first bottom plate 110 can also be connected with core board 120 by communication interface, for example, the core board 120 can access relevant information, such as the version information of first bottom plate 110 of first bottom plate 110 etc. by GPIO interface.Wherein, it can be general detachable structure between first bottom plate 110 and core board 120, core board 120 is connected with every kind of bottom plate in a variety of bottom plates.Optionally, which such as only includes the firmware for a kind of chip when testing any one chip to be measured, in core board when testing, which only connect with a bottom plate, test same class chip to be measured.
It should be understood that as shown in Figure 1, the core board 120 in the test platform 100 is connected by communication interface with terminal device, such as connected by USB interface.Specifically, which has the function of USB from equipment (Slave), connect with terminal device.The test platform 100 and terminal device test chip to be measured, such as, Fig. 2 shows the schematic flow charts according to the method 200 for testing chip of the embodiment of the present application, this method 200 is executed by the test platform 100, wherein, the test platform 100 tests chip to be measured by the test module in the terminal device, and the embodiment of the present application is not limited to this.For ease of description, it is illustrated by taking the test platform 100 and terminal device as an example here.
Specifically, as shown in Fig. 2, this method 200 includes: S210, the firmware version which sends indicates information；S220, the core board indicate information according to the firmware version, send firmware version information to the terminal device, which is used to indicate the current version of firmware in the core board；S230, when the current version of the firmware and chip to be measured match, which receives the test instruction information of terminal device transmission；S240, the core board indicate information according to the test, are tested by first bottom plate the chip to be measured.
It should be understood that, terminal device involved by the embodiment of the present application can be computer, mobile phone (mobile phone), tablet computer (Pad), the computer with radio transmission-receiving function, virtual reality (virtual reality, VR) terminal device, augmented reality (augmented reality, AR) terminal device, the wireless terminal in Industry Control (industrial control), the nothing in transportation safety (transportation safety) Line terminal etc..
In the embodiment of the present application, when needing to test chip to be measured, user or test chip personnel select a kind of bottom plate to install according to the chip to be measured in a variety of bottom plates that test platform includes, the bottom plate includes interface corresponding with the chip to be measured, which is connect with the bottom plate.Optionally, user's selection bottom plate corresponding with the chip to be measured, or, do not know which bottom plate and the chip to be measured to it is corresponding when arbitrarily select a bottom plate, or the bottom plate still used using last test, without replacement, the embodiment of the present application is not limited to this.
In the embodiment of the present application, connecting bottom board and chip to be measured, meanwhile, which connect also by interface with core board, for example, being connected by GPIO interface.In addition, core board can also be connect by communication interface with terminal device, for example, the core board can be connect by USB interface with terminal device.
In the embodiment of the present application, by after the connection of chip to be measured, test platform and terminal device, start to test.Specifically, terminal device first determines the version information of firmware in core board in the test platform, judges whether the version information matches with the chip to be measured.
Specifically, the firmware version that core board receiving terminal apparatus is sent indicates information, indicates information according to the firmware version, determines the current version of firmware in core board.For example, core board includes bootload (bootloader), the usb data of the continuous poll core board of the bootloader waits the order of terminal device.When the data that the bootloader obtains USB are that the firmware version indicates information, version number and/or model of the core board according to wherein firmware determine the current version of the firmware, for example, the current version of the firmware is first version.
Core board sends firmware version information to terminal device, the firmware version information is used to indicate the current version of firmware in the core board, such as the firmware version information may include first version, it is corresponding, terminal device according to the firmware version information, can determine that the current version of firmware in the core board is first version.
Since every kind of chip to be measured has dedicated test software, so for single software, test object be it is unique, therefore, for chip to be measured, there are a kind of corresponding test softwares for testing the chip to be measured, there is also with the matched firmware of chip to be measured.Terminal device judges whether the current version (first version) of the firmware of the core board indicated in firmware version information matches with chip to be measured, if the first version matches with the chip to be measured, then the terminal device determines that current firmware matches with chip to be measured in core board, and the related procedure after continuation；If the first version and the chip to be measured mismatch, then the version of the determining firmware to match with the chip to be measured of terminal device is the second edition, and the second edition is sent to core board, so that the version of firmware is changed to the second edition by core board, so that the core board is consolidated Part matches with chip to be measured.Optionally, after the firmware of core board is changed to the second edition, terminal device determines that the firmware current version of the core board matches with chip to be measured, and the related procedure after can continuing.
It should be understood that, if the version for the second edition replacement firmware that core board is sent according to terminal device, terminal device can determine that the core board completes firmware version replacement in several ways, such as, the core board is after replacing firmware version, confirmation message is sent to terminal device, terminal device determines that the core board completes firmware version replacement according to the confirmation message；Alternatively, the terminal device, which sends firmware version to core board again, indicates information, it is used to indicate the current version that core board sends firmware, so that terminal device can determine whether the core board completes firmware version replacement, but the embodiment of the present application is not limited to this.
Optionally, as one embodiment, terminal device directly can also send the second edition to core board, that is, the terminal device is not necessarily to send firmware version instruction information to core board.Specifically, terminal device is according to chip to be measured, determine the version of the firmware of core board, such as determining that the firmware of the chip to be measured and the second edition matches, then terminal device sends the second edition to core board, in order to which the version of firmware is changed to the second edition by the core board, information is indicated by sending firmware version without terminal device, the firmware version of core board is obtained, directly by sending the version of the firmware to match, so that the firmware of core board matches with chip to be measured.
In the embodiment of the present application, terminal device also determines the version for the bottom plate being currently installed in the test platform, determines whether the bottom plate matches with the chip to be measured.Specifically, which sends backplane version to core board and indicates information, and core board obtains backplane version instruction information by the continuous poll usb data of bootloader.The core board indicates information according to the backplane version, obtains the version for the bottom plate being currently connected with the core board.Core board sends backplane version information to terminal device, which is used to indicate the version when noseplate, then terminal device can be determined according to the backplane version information when whether noseplate matches with chip to be measured.
Specifically, core board can read version number and/or the model for deserving noseplate by the GPIO interface worked as between noseplate, determine the version of the bottom plate, and send backplane version information to terminal device, which includes deserving the version of noseplate.
Optionally, if terminal device receives the backplane version information, determine that first bottom plate is the bottom plate to match with chip to be measured when noseplate is the first bottom plate, then the terminal device determines that work as noseplate matches with chip to be measured, and continues to execute related procedure；If terminal device, which according to the backplane version information, determines, works as noseplate not instead of the first bottom plate, the second bottom plate, second bottom plate be with the unmatched any bottom plate of chip to be measured, then terminal device can prompt to need replacing bottom plate.
Optionally, terminal device display backpanel replaces prompt information, for example, the terminal device is computer, the bottom board replacing prompt information is shown by computer screen, and the bottom board replacing prompt information is for prompting current bottom board replacing to be the first bottom plate to match with chip to be measured.It is corresponding, user or tester can be according to the bottom board replacing prompt informations, carry out bottom board replacing, the first bottom plate to match with chip to be measured is selected from a variety of bottom plates that test platform includes, first bottom plate is connected with core board and chip to be measured respectively, in order to test chip to be measured.
Optionally, as one embodiment, terminal device can also directly display bottom board replacing prompt information, that is, the terminal device is not necessarily to obtain the backplane version information of bottom plate by core board and judge whether corresponding with chip to be measured.Specifically, the terminal device is according to chip to be measured, determine the version of corresponding bottom plate, such as determine that the chip to be measured is corresponding with the first bottom plate, then terminal device directly shows the bottom board replacing prompt information of the backplane version information including the first bottom plate to user, in order to which user is according to the bottom board replacing prompt information, directly use first bottom plate corresponding with chip to be measured, and then the chip to be measured is tested by first bottom plate and core board.
It should be understood that, when the firmware of core board or the version information of bottom plate and chip to be measured do not match that, it can carry out version replacement, and terminal device can repeatedly determine whether the firmware of core board and the version information of bottom plate match with chip to be measured, until the firmware of core board and the version information of bottom plate match with chip to be measured.
In the embodiment of the present application, after terminal device determines that the current version of firmware matches with chip to be measured, and the bottom plate of the test platform is also matched with chip to be measured in the core board of the test platform, the test of chip to be measured is carried out.Specifically, terminal device by the core board and when noseplate treat survey chip tested.Optionally, can be consistent with the prior art to the specific performance test process of chip to be measured, different chips are carried out in different ways, but the embodiment of the present application is not limited to this.
Therefore, the method for testing chip of the embodiment of the present application, core board part in test platform can be reused, for different chips, different bottom plates is selected, so that being not necessarily to manual burning firmware, and guarantee to match between core board firmware and bottom plate and chip to be measured by terminal device, i.e. user simplifies use process without the concern for the matching problem between driving, firmware and software etc., operates convenient for user.And by the expensive independent reuse in core board part, cheap supporting base plate need to only be designed for every kind of chip under test, test platform cost can be reduced.
Fig. 3 shows the schematic flow chart of the method 300 for testing chip according to the embodiment of the present application, and this method 300 can be executed by terminal device, for example, can be executed by the test module in the terminal device.As shown in figure 3, this method 300 includes: S310, determine solid in the core board of test platform The current version of part, the test platform includes the core board and a variety of bottom plates, wherein, bottom plate not of the same race corresponds to different chips in a variety of bottom plates, the first bottom plate in a variety of bottom plates includes the test interface for connecting chip to be measured, the chip to be measured is chip corresponding with first bottom plate, and the core board is for testing the chip to be measured by first bottom plate；S320 determines the backplane version information for the bottom plate currently connecting with the core board；S330, the current version and chip to be measured for determining the firmware match, and the bottom plate currently connecting with the core board tests instruction information to be sent after first bottom plate to the core board, test instruction information is used to indicate the core board and is tested by first bottom plate the chip to be measured.
Therefore, the method for testing chip of the embodiment of the present application, core board part in test platform can be reused, for different chips, different bottom plates is selected, so that being not necessarily to manual burning firmware, and guarantee to match between core board firmware and bottom plate and chip to be measured by terminal device, i.e. user simplifies use process without the concern for the matching problem between driving, firmware and software etc., operates convenient for user.And by the expensive independent reuse in core board part, cheap supporting base plate need to only be designed for every kind of chip under test, test platform cost can be reduced.
Optionally, the current version of firmware in the core board of test platform is determined, comprising: send firmware version to the core board and indicate that information, firmware version instruction information are used to indicate the current version that the core board determines the firmware；The firmware version information of core board transmission is received, which is used to indicate the current version of the firmware.
Optionally, the current version which is used to indicate the firmware is first version, which matches with the chip to be measured.
Optionally, the current version that the firmware version information is used to indicate the firmware is first version, the first version and the chip to be measured mismatch, the current version and chip to be measured for determining the firmware match, it include: the determining second edition to match with the chip to be measured when the first version and the chip to be measured mismatch；The second edition is sent to the core board, so that the current version of the firmware is changed to the second edition by the core board；When the current version of the firmware is the second edition, determine that the current version of the firmware matches with chip to be measured.
Optionally, the backplane version information for the bottom plate currently connecting with the core board is determined, comprising: send backplane version to the core board and indicate that information, backplane version instruction information are used to indicate the backplane version information that the core board determines current bottom plate connected to it；Receive the backplane version information of core board transmission.
Optionally, determine that the bottom plate currently connecting with the core board is first bottom plate, comprising: according to the backplane version information, if the bottom plate currently connecting with the core board is first bottom plate, determine currently corresponding with the chip to be measured with the bottom plate of core board connection；According to the backplane version information, if currently with this The bottom plate of core board connection is the second bottom plate in a variety of bottom plates, and display backpanel replaces prompt information, the bottom plate which is used to that replacement to be prompted currently to connect with the core board, which is bottom plate not corresponding with the chip to be measured.
Optionally, this method is executed by terminal device, which is communicated by communication interface with the core board.
Optionally, which is USB interface.
It should be understood that the terminal device in this method 300 can be with the terminal device in corresponding method 200, the test platform in method 300 can be test platform 100 as shown in Figure 1 with the test platform in corresponding method 200, the test platform, and details are not described herein.
Therefore, the method for testing chip of the embodiment of the present application, core board part in test platform can be reused, for different chips, different bottom plates is selected, so that being not necessarily to manual burning firmware, and guarantee to match between core board firmware and bottom plate and chip to be measured by terminal device, i.e. user simplifies use process without the concern for the matching problem between driving, firmware and software etc., operates convenient for user.And by the expensive independent reuse in core board part, cheap supporting base plate need to only be designed for every kind of chip under test, test platform cost can be reduced.
Combined with specific embodiments below from the angle of terminal device, the method for testing chip of the embodiment of the present application is described.Specifically, Fig. 4 shows the schematic flow chart of the method 400 for testing chip according to the embodiment of the present application.
It should be understood that this method 400 can be executed by terminal device, which can be communicated by USB interface with test platform, in order to test chip to be measured.Wherein, the test platform includes core board and a variety of bottom plates, wherein, bottom plate not of the same race corresponds to different chips in a variety of bottom plates, for any one bottom plate in a variety of bottom plates, such as the first bottom plate, which includes the interface for connecting chip to be measured, the chip to be measured is chip corresponding with first bottom plate, which can be used for testing the chip to be measured.Here it is illustrated for testing chip to be measured.
S401 starts terminal device, i.e., is controlled by terminal device and start testing process.Optionally, which can also include connecting the core board of terminal device and test platform by USB interface.
It is corresponding, start test platform, the core board in test platform is connect with bottom plate, which can be any one bottom plate in test platform, for example, a kind of bottom plate can be randomly selected, or selection first bottom plate corresponding with chip to be measured；And chip to be measured is connect with the bottom plate.
S402 reads the firmware version information of core board by USB, i.e. terminal device determines the version information of firmware in core board by USB interface.
Specifically, terminal device can send firmware version to core board and indicate information, core board receives firmware version instruction information, and information is indicated according to the firmware version, determine that the current version of firmware in core board, such as the core board determine that the current version of firmware is first version, core board sends firmware version information to terminal device, the firmware version information is used to indicate the current version of the firmware of the core board, such as it is first version that the firmware version information, which may include the version of firmware,.Then terminal device can determine the current version of the firmware of the core board according to the firmware version information.
S403, determines whether firmware matches with chip to be measured, i.e. terminal device determines whether the firmware current version of the core board matches with chip to be measured.S405 is continued to execute if matching, if mismatching, continues to execute S404.
Specifically, terminal device determines that the firmware current version of the core board is first version, judges whether the first version matches with chip to be measured according to firmware version information.If the first version matches with chip to be measured, S405 is continued to execute, if mismatching, continues to execute S404.
S404 replaces firmware version, i.e. terminal device instruction core board replaces firmware version.Firmware version is changed to the version to match with chip to be measured by core board, and continues to execute S405.
Specifically, terminal device determines that the firmware current version of core board and chip to be measured mismatch, the then version of the determining firmware to match with the chip to be measured, such as terminal device can determine that the second edition matches with chip to be measured, the terminal device can send the second edition to core board, in order to which core board is according to the second edition, firmware current version is changed to the second edition.
S405 determines that the version information of bottom plate, i.e. terminal device determine the backplane version information for working as noseplate by core board.
Specifically, terminal device sends backplane version to core board and indicates information, and core board indicates information according to the backplane version, reads version number and/or the model of the bottom plate currently connecting with the core board, determines the backplane version information of the bottom plate.Core board sends backplane version information to terminal device, which is the backplane version information of the bottom plate.
S406, determines whether bottom plate matches with chip to be measured, i.e., terminal device is determined by core board works as whether noseplate matches with chip to be measured.S408 is continued to execute if matching, if mismatching, continues to execute S407.
Specifically, terminal device determines the backplane version information for working as noseplate according to the backplane version information.For example, if terminal device according to the backplane version information, determines that first bottom plate is the bottom plate to match with chip to be measured, then continues to execute S408 when noseplate is the first bottom plate；If it is determined that when noseplate be the second bottom plate, second bottom plate be with the unmatched bottom plate of chip to be measured, then continue to execute S407.
S407 prompts replacement bottom plate, i.e., terminal device, which prompts the user with, replaces current bottom plate.
Specifically, terminal device can replace prompt information by screen display backpanel, and prompting user to replace bottom plate is the first bottom plate to match with chip to be measured, and after user completes bottom board replacing, continue to execute S405.
S408 starts to test chip, when terminal device determines that the firmware of core board and the version information of bottom plate match with chip to be measured, can be tested by core board and bottom plate chip to be measured, test whether the chip to be measured is qualified chip.The test process can be same as the prior art, and details are not described herein.
Therefore, the method for testing chip of the embodiment of the present application, core board part in test platform can be reused, for different chips, different bottom plates is selected, so that being not necessarily to manual burning firmware, and guarantee to match between core board firmware and bottom plate and chip to be measured by terminal device, i.e. user simplifies use process without the concern for the matching problem between driving, firmware and software etc., operates convenient for user.And by the expensive independent reuse in core board part, cheap supporting base plate need to only be designed for every kind of chip under test, test platform cost can be reduced.
Combined with specific embodiments below from the angle of test platform, the method for testing chip of the embodiment of the present application is described.Specifically, Fig. 5 shows the schematic flow chart of the method 500 for testing chip according to the embodiment of the present application, this method 500 can be executed by test platform, it such as can be test platform as shown in Figure 1, the test platform includes core board and a variety of bottom plates, this method 500 can be executed by core board, wherein, bottom plate not of the same race corresponds to different chips in a variety of bottom plates, for any one bottom plate in a variety of bottom plates, such as first bottom plate, first bottom plate includes for connecting the corresponding interface of chip to be measured, the chip to be measured is chip corresponding with first bottom plate, first bottom plate can be used for testing the chip to be measured.
Specifically, it is illustrated for testing chip to be measured here.
S501, electrifying startup test platform.
Specifically, test platform electrifying startup includes connecting the core board in test platform with bottom plate, which is any one bottom plate in a variety of bottom plates that test platform includes, for example, randomly choosing a kind of bottom plate, or selection bottom plate corresponding with chip to be measured；And chip to be measured is connect with bottom plate.In addition, further including that the core board of test platform is connect by USB interface with terminal device.
S502 reads USB OUT order, i.e., the core board in test platform reads USB output (OUT) order.
For example, the core board may include bootloader, by the bootloader poll usb data, The order for waiting terminal device to send.
S503, S503 are judged as that firmware version indicates information, i.e. core board judges whether the order that terminal device is sent is firmware version instruction information.
For example, the core board receives the information of terminal device transmission, however, it is determined that the information is that firmware version indicates information, S504 is then continued to execute, if it is not, then continuing to execute S505, wherein, firmware version instruction information is used to indicate core board and provides the current version of firmware.
S504, send the firmware version information of core board, i.e. core board determines the firmware version instruction information that receiving terminal apparatus is sent, and information is indicated according to the firmware version, it determines the version information that firmware is current in the core board, and sends the information for being used to indicate the core board firmware current version to terminal device.And continue to execute S502.
Specifically, the current version of firmware is first version in core board, then core board can determine firmware version information, which includes first version, and it is first version which, which is used to indicate the version that firmware is current in the core board,.Core board sends the firmware version information to terminal device.
S505 is judged as that backplane version indicates information, i.e. core board judges whether the order that terminal device is sent is backplane version instruction information.
For example, the core board can receive the information of terminal device transmission, however, it is determined that the information is that backplane version indicates information, S506 is then continued to execute, if it is not, then continuing to execute S508, wherein, backplane version instruction information is used to indicate core board and provides the backplane version information for working as noseplate.
S506 reads the version information of bottom plate, i.e., core board determines the backplane version instruction information that receiving terminal apparatus is sent, and indicates information according to the backplane version, reads the backplane version information for the bottom plate currently connecting with core board.
Specifically, core board reads version number and/or the model of current bottom plate by GPIO interface, determines the version for working as noseplate, for example, determining that current bottom plate is the first bottom plate.
S507, sends backplane version information, and core board sends the backplane version information being used to indicate when the version of noseplate to terminal device.And continue to execute S502.
Specifically, core board can send backplane version information to terminal device, which is used to indicate the version when noseplate, for example, the backplane version information is used to indicate when noseplate is the first bottom plate.
S508 determines starting testing process, i.e. core board determines whether the order that terminal device is sent is instruction starting testing process, if so, S509 is executed, if it is not, then executing S502.
S509 starts to test, and core board passes through the bottom plate that currently connect with core board, to chip to be measured into Row test, tests whether the chip to be measured can work normally.
Optionally, different chips are tested, details are not described herein using different testing process using existing test method.
Therefore, the method for testing chip of the embodiment of the present application, core board part in test platform can be reused, for different chips, different bottom plates is selected, so that being not necessarily to manual burning firmware, and guarantee to match between core board firmware and bottom plate and chip to be measured by terminal device, i.e. user simplifies use process without the concern for the matching problem between driving, firmware and software etc., operates convenient for user.And by the expensive independent reuse in core board part, cheap supporting base plate need to only be designed for every kind of chip under test, test platform cost can be reduced.
It should be understood that, in the various embodiments of the application, magnitude of the sequence numbers of the above procedures are not meant that the order of the execution order, and the execution sequence of each process should be determined by its function and internal logic, and the implementation process without coping with the embodiment of the present application constitutes any restriction.
Above in conjunction with Fig. 1 to Fig. 5, the method for testing chip according to the embodiment of the present application is described in detail, below in conjunction with Fig. 6 to Fig. 7, describes test macro and terminal device according to the embodiment of the present application.
As shown in fig. 6, including test platform 610 and test module 620 according to the test macro 600 of the embodiment of the present application, wherein test module 620 specifically includes: determination unit 621 and transmission unit 622, can also include receiving unit 623 optionally.
Specifically, the test platform 610 includes core board and multiple bottom plates, bottom plate not of the same race corresponds to different chips in a variety of bottom plates, and the first bottom plate in a variety of bottom plates includes the test interface for connecting chip to be measured, which is chip corresponding with first bottom plate；The core board is for testing the chip to be measured by first bottom plate.
Optionally, which can be test platform 100 as shown in Figure 1, which can execute the corresponding process of test platform of the Fig. 1 in each method into Fig. 5, for sake of simplicity, details are not described herein.
In addition, the test module 620 is located in terminal device or the test module is terminal device, the terminal device can be terminal device as shown in Figure 1, the corresponding process for executing terminal device of the Fig. 1 in each method into Fig. 5, for sake of simplicity, details are not described herein.
Specifically, the determination unit 620 in the test module 620 is used for: determining the current version of firmware in the core board of the test platform；The determination unit 621 is also used to: determining the backplane version information for the bottom plate currently connecting with the core board in the test platform；The transmission unit 622 is used for: in the determination list Member 621 determines that the current version of the firmware matches with chip to be measured, and the bottom plate currently connecting with the core board is after first bottom plate, test instruction information is sent to the core board, test instruction information is used to indicate the core board and tests by first bottom plate the chip to be measured.
Optionally, which is also used to: sending firmware version to the core board and indicates that information, firmware version instruction information are used to indicate the current version that the core board determines the firmware；Receiving unit 623 is used for: receiving the firmware version information of core board transmission, which is used to indicate the current version of the firmware.
Optionally, the current version that the firmware version information is used to indicate the firmware is first version, the first version and the chip to be measured mismatch, which is specifically used for: when the first version and the chip to be measured mismatch, the determining second edition to match with the chip to be measured；The transmission unit 622 is also used to: the second edition is sent to the core board, so that the current version of the firmware is changed to the second edition by the core board；When the determination unit 621 determines that the current version of the firmware is the second edition, test instruction information is sent to the core board.
Optionally, which is also used to: sending backplane version to the core board and indicates that information, backplane version instruction information are used to indicate the backplane version information that the core board determines current bottom plate connected to it；Receiving unit 623 is used for: receiving the backplane version information of core board transmission.
Optionally, which is specifically used for: according to the backplane version information, if the bottom plate currently connecting with the core board is first bottom plate, determining currently corresponding with the chip to be measured with the bottom plate of core board connection；According to the backplane version information, if the bottom plate currently connecting with the core board is the second bottom plate in a variety of bottom plates, display backpanel replaces prompt information, the bottom plate that the bottom board replacing prompt information is used to that replacement to be prompted currently to connect with the core board, second bottom plate are bottom plate not corresponding with the chip to be measured.
Optionally, the test module 620 in the test macro is terminal device, alternatively, the test module 620 is located in terminal device.
Optionally, which is located in terminal device, which can be communicated by communication interface with the core board.
Optionally, which is USB interface.
It should be understood that, it can correspond to execute the method 200 and method 400 in the embodiment of the present application according to the test macro 600 of the embodiment of the present application, wherein, test module 620 can correspond to execute the method 300 and 400 in the embodiment of the present application, and above and other operation and/or function of each unit in test module 620 is respectively in order to realize terminal device or test module of the Fig. 1 in each method into Fig. 5 Corresponding process, for sake of simplicity, details are not described herein.
Therefore, the terminal device of the embodiment of the present application, chip to be measured can be detected with test platform, the test platform may include core board and a variety of bottom plates, bottom plate not of the same race corresponds to different chips, for different chips, select different bottom plates, and the core board part can reuse, it without manual burning firmware, and is determined by the terminal device and is matched between core board firmware and bottom plate and chip to be measured, i.e., user is without the concern for the matching problem between driving, firmware and software etc., use process is simplified, is operated convenient for user.And by the expensive independent reuse in core board part, cheap supporting base plate need to only be designed for every kind of chip under test, test platform cost can be reduced.
Fig. 7 shows the schematic block diagram of the terminal device 700 according to the embodiment of the present application, as shown in Figure 7, the terminal device 700 includes: processor 710 and transceiver 720, processor 710 is connected with transceiver 720, optionally, the terminal device 700 further includes memory 730, and memory 730 is connected with processor 710.Wherein, processor 710, it is communicated with each other between memory 730 and transceiver 720 by internal connecting path, transmitting control and/or data-signal, the memory 730 can be used for store instruction, the processor 710 is used to execute the instruction of the memory 730 storage, information or signal are sent to control transceiver 720, the processor 710 is used for: determining the current version of firmware in the core board of test platform, the test platform includes the core board and a variety of bottom plates, wherein, bottom plate not of the same race corresponds to different chips in a variety of bottom plates, the first bottom plate in a variety of bottom plates includes the test interface for connecting chip to be measured, the chip to be measured is chip corresponding with first bottom plate core board for being tested by first bottom plate the chip to be measured；Determine the backplane version information for the bottom plate currently connecting with the core board；The current version and chip to be measured for determining the firmware match, and the bottom plate currently connecting with the core board is after first bottom plate, test instruction information is sent to the core board, test instruction information is used to indicate the core board and tests by first bottom plate the chip to be measured.
Therefore, the terminal device of the embodiment of the present application, chip to be measured can be detected with test platform, the test platform may include core board and a variety of bottom plates, bottom plate not of the same race corresponds to different chips, for different chips, select different bottom plates, and the core board part can reuse, it without manual burning firmware, and is determined by the terminal device and is matched between core board firmware and bottom plate and chip to be measured, i.e., user is without the concern for the matching problem between driving, firmware and software etc., use process is simplified, is operated convenient for user.And by the expensive independent reuse in core board part, cheap supporting base plate need to only be designed for every kind of chip under test, test platform cost can be reduced.
Optionally, as one embodiment, which is used for: being sent firmware version to the core board and is indicated that information, firmware version instruction information are used to indicate the current version that the core board determines the firmware This；The firmware version information of core board transmission is received, which is used to indicate the current version of the firmware.
Optionally, as one embodiment, which is used for: the current version that the firmware version information is used to indicate the firmware is first version, and the first version and the chip to be measured mismatch.
Optionally, as one embodiment, the current version that the firmware version information is used to indicate the firmware is first version, the first version and the chip to be measured mismatch, the processor 710 is used for: when the first version and the chip to be measured mismatch, the determining second edition to match with the chip to be measured；The transceiver 720 is used for: the second edition is sent to the core board, so that the current version of the firmware is changed to the second edition by the core board；When the processor 710 determines that the current version of the firmware is the second edition, test instruction information is sent to the core board.
Optionally, as one embodiment, which is used for: being sent backplane version to the core board and is indicated that information, backplane version instruction information are used to indicate the backplane version information that the core board determines current bottom plate connected to it；Receive the backplane version information of core board transmission.
Optionally, as one embodiment, which is used for: according to the backplane version information, if the bottom plate currently connecting with the core board is first bottom plate, being determined currently corresponding with the chip to be measured with the bottom plate of core board connection；According to the backplane version information, if the bottom plate currently connecting with the core board is the second bottom plate in a variety of bottom plates, display backpanel replaces prompt information, the bottom plate that the bottom board replacing prompt information is used to that replacement to be prompted currently to connect with the core board, second bottom plate are bottom plate not corresponding with the chip to be measured.
Optionally, as one embodiment, which is communicated by communication interface with the core board.
Optionally, as one embodiment, which is USB interface.
It should be understood that, it can correspond to the test module 620 in the test macro 600 in the embodiment of the present application according to the terminal device 700 of the embodiment of the present application, and it can correspond to execute the corresponding main body in the method 300 and 400 according to the embodiment of the present application, and above and other operation and/or function of each unit in terminal device 700 is respectively in order to realize the corresponding process of Fig. 1 terminal device in each method into Fig. 5, for sake of simplicity, details are not described herein.
Therefore, the terminal device of the embodiment of the present application, chip to be measured can be detected with test platform, the test platform may include core board and a variety of bottom plates, the corresponding chip not of the same race of bottom plate not of the same race, for different chips, select different bottom plates, and the core board part can reuse, and determine phase between core board firmware and bottom plate and chip to be measured without manual burning firmware, and by the terminal device Match, i.e., user simplifies use process without the concern for the matching problem between driving, firmware and software etc., operates convenient for user.And by the expensive independent reuse in core board part, cheap supporting base plate need to only be designed for every kind of chip under test, test platform cost can be reduced.
It is described above; the only specific embodiment of the application, but the protection scope of the application is not limited thereto, and anyone skilled in the art is within the technical scope of the present application; it can easily think of the change or the replacement, should all cover within the scope of protection of this application.Therefore, the protection scope of the application should be based on the protection scope of the described claims.

Claims (19)

  1. A kind of test platform characterized by comprising core board and a variety of bottom plates,
    Wherein, bottom plate not of the same race corresponds to different chips in a variety of bottom plates, and the first bottom plate in a variety of bottom plates includes the test interface for connecting chip to be measured, and the chip to be measured is chip corresponding with first bottom plate；
    The core board is for testing the chip to be measured by first bottom plate.
  2. Test platform according to claim 1, which is characterized in that the core board is used for:
    The firmware version that receiving terminal apparatus is sent indicates information；
    Information is indicated according to the firmware version, and Xiang Suoshu terminal device sends firmware version information, and the firmware version information is used to indicate the current version of firmware in the core board；
    When the current version of the firmware and chip to be measured match, the test instruction information that the terminal device is sent is received；
    Information is indicated according to the test, and the chip to be measured is tested by first bottom plate.
  3. Test platform according to claim 2, which is characterized in that the current version that the firmware version information is used to indicate the firmware is first version, and the first version and the chip to be measured mismatch,
    The core board is used to receive the test instruction information that the terminal device is sent when the current version of the firmware and chip to be measured match, and specifically includes:
    Receive the second edition for the firmware to match with the chip to be measured that the terminal device is sent；
    The current version of the firmware is changed to the second edition；
    It receives the terminal device and determines that the test sent when the current version of the firmware is the second edition indicates information.
  4. Test platform according to claim 2 or 3, which is characterized in that the core board is specifically used for:
    Before receiving the test instruction information that the terminal device is sent, the backplane version instruction information that the terminal device is sent is received；
    Information is indicated according to the backplane version, determines that backplane version information, the backplane version information are the backplane version information of current bottom plate connected with the core board；
    The backplane version information is sent to the terminal device.
  5. Test platform according to claim 4, which is characterized in that currently with the core board The bottom plate of connection is first bottom plate.
  6. A kind of test macro, which is characterized in that the test macro includes test platform according to any one of claims 1 to 5 and test module, wherein the test module includes:
    Determination unit, the current version of firmware in the core board for determining the test platform；
    The determination unit is also used to: determining the backplane version information of current bottom plate connected with the core board in the test platform；
    Transmission unit, for determining that the current version of the firmware matches with chip to be measured in the determination unit, and current bottom plate connected with the core board is after first bottom plate, test instruction information is sent to the core board, the test instruction information is used to indicate the core board and tests by first bottom plate the chip to be measured.
  7. Test macro according to claim 6, which is characterized in that the transmission unit is also used to:
    Firmware version, which is sent, to the core board indicates that information, the firmware version instruction information are used to indicate the current version that the core board determines the firmware；
    The test module further include:
    Receiving unit, the firmware version information sent for receiving the core board, the firmware version information are used to indicate the current version of the firmware.
  8. Test macro according to claim 7, which is characterized in that the current version that the firmware version information is used to indicate the firmware is first version, and the first version and the chip to be measured mismatch,
    The determination unit is specifically used for:
    When the first version and the chip to be measured mismatch, the determining second edition to match with the chip to be measured；
    The transmission unit is also used to:
    The second edition is sent to the core board, so that the current version of the firmware is changed to the second edition by the core board；
    When the determination unit determines that the current version of the firmware is the second edition, Xiang Suoshu core board sends the test and indicates information.
  9. The test macro according to any one of claim 6 to 8, which is characterized in that the transmission unit is also used to:
    Backplane version, which is sent, to the core board indicates that information, the backplane version instruction information are used to indicate The core board determines the backplane version information of current bottom plate connected to it；
    The test module further include:
    Receiving unit, the backplane version information sent for receiving the core board.
  10. Test macro according to claim 9, which is characterized in that the determination unit is specifically used for:
    According to the backplane version information, if current bottom plate connected with the core board is first bottom plate, determine that current bottom plate connected with the core board is corresponding with the chip to be measured；
    According to the backplane version information, if current bottom plate connected with the core board is the second bottom plate in a variety of bottom plates, display backpanel replaces prompt information, the bottom board replacing prompt information replaces current bottom plate connected with the core board for prompting, and second bottom plate is bottom plate not corresponding with the chip to be measured.
  11. A method of for testing chip, it is characterized in that, the method is executed by the core board of test platform, the test platform includes the core board and a variety of bottom plates, bottom plate not of the same race corresponds to different chips in a variety of bottom plates, and the first bottom plate includes the test interface for connecting chip to be measured in a variety of bottom plates, and the chip to be measured is chip corresponding with first bottom plate, the core board is for testing the chip to be measured by first bottom plate, which comprises
    The firmware version that the core board receiving terminal apparatus is sent indicates information；
    The core board indicates information according to the firmware version, and Xiang Suoshu terminal device sends firmware version information, and the firmware version information is used to indicate the current version of firmware in the core board；
    When the current version of the firmware and chip to be measured match, the core board receives the test instruction information that the terminal device is sent；
    The core board indicates information according to the test, is tested by first bottom plate the chip to be measured.
  12. According to the method for claim 11, which is characterized in that the current version that the firmware version information is used to indicate the firmware is first version, and the first version and the chip to be measured mismatch,
    When the current version of the firmware and chip to be measured match, the core board receives the test instruction information that the terminal device is sent, comprising:
    The core board receives the second edition for the firmware to match with the chip to be measured that the terminal device is sent；
    The current version of the firmware is changed to the second edition by the core board；
    The core board receives the terminal device and determines that the test sent when the current version of the firmware is the second edition indicates information.
  13. Method according to claim 11 or 12, which is characterized in that before the test instruction information that the core board receives that the terminal device is sent, the method also includes:
    The core board receives the backplane version instruction information that the terminal device is sent；
    The core board indicates information according to the backplane version, determines that backplane version information, the backplane version information are the backplane version information of current bottom plate connected with the core board；
    The core board sends the backplane version information to the terminal device.
  14. According to the method for claim 13, which is characterized in that
    When the current version of the firmware and chip to be measured match, the core board receives the test instruction information that the terminal device is sent, comprising:
    When the current version of the firmware and the chip to be measured match and current bottom plate connected with the core board is first bottom plate, the core board receives the test instruction information that the terminal device is sent.
  15. A method of for testing chip characterized by comprising
    Determine the current version of firmware in the core board of test platform, the test platform includes the core board and a variety of bottom plates, wherein, bottom plate not of the same race corresponds to different chips in a variety of bottom plates, the first bottom plate in a variety of bottom plates includes the test interface for connecting chip to be measured, the chip to be measured is chip corresponding with first bottom plate, and the core board is for testing the chip to be measured by first bottom plate；
    Determine the backplane version information of current bottom plate connected with the core board；
    The current version and chip to be measured for determining the firmware match, and current bottom plate connected with the core board is after first bottom plate, test instruction information is sent to the core board, the test instruction information is used to indicate the core board and tests by first bottom plate the chip to be measured.
  16. According to the method for claim 15, which is characterized in that determine the current version of firmware in the core board of test platform, comprising:
    Firmware version, which is sent, to the core board indicates that information, the firmware version instruction information are used to indicate the current version that the core board determines the firmware；
    The firmware version information that the core board is sent is received, the firmware version information is used to indicate the current version of the firmware.
  17. According to the method for claim 16, which is characterized in that the firmware version information is used In indicating that the current version of the firmware is first version, the first version and the chip to be measured are mismatched,
    The current version and chip to be measured for determining the firmware match, comprising:
    When the first version and the chip to be measured mismatch, the determining second edition to match with the chip to be measured；
    The second edition is sent to the core board, so that the current version of the firmware is changed to the second edition by the core board；
    When the current version of the firmware is the second edition, determine that the current version of the firmware matches with chip to be measured.
  18. Method described in any one of 5 to 17 according to claim 1, which is characterized in that determine the backplane version information of current bottom plate connected with the core board, comprising:
    Backplane version, which is sent, to the core board indicates that information, the backplane version instruction information are used to indicate the backplane version information that the core board determines current bottom plate connected to it；
    Receive the backplane version information that the core board is sent.
  19. According to the method for claim 18, which is characterized in that determine that current bottom plate connected with the core board is first bottom plate, comprising:
    According to the backplane version information, if current bottom plate connected with the core board is first bottom plate, determine that current bottom plate connected with the core board is corresponding with the chip to be measured；
    According to the backplane version information, if current bottom plate connected with the core board is the second bottom plate in a variety of bottom plates, display backpanel replaces prompt information, the bottom board replacing prompt information replaces current bottom plate connected with the core board for prompting, and second bottom plate is bottom plate not corresponding with the chip to be measured.
CN201780001875.5A 2017-10-25 2017-10-25 For testing method, test platform and the test macro of chip Pending CN110023770A (en)

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