CN104411123B - Quick press molding process for multilayer flexible plates - Google Patents
Quick press molding process for multilayer flexible plates Download PDFInfo
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- CN104411123B CN104411123B CN201410702318.4A CN201410702318A CN104411123B CN 104411123 B CN104411123 B CN 104411123B CN 201410702318 A CN201410702318 A CN 201410702318A CN 104411123 B CN104411123 B CN 104411123B
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- China
- Prior art keywords
- plate
- glued membrane
- molded
- multilayer flexible
- flexible board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to the field of manufacturing and processing technologies for printed circuit boards, and provides a quick press molding process for multilayer flexible plates. The quick press molding process includes steps of cutting processing, drilling machining, film adhering pre-processing, single-layer flexible plate quick press molding, multilayer flexible plate quick press molding and the like. Exhaust holes are formed in non-molded regions of flexible plates to form bubble passing discharging channels, so that bubbles among layers of the multilayer flexible plates can be effectively removed by means of step-by-step exhaust pre-press molding and quick press molding. The quick press molding process for the multilayer flexible plates has the advantages of good bubble removing effects, convenience and speediness in operation, low cost and wide universality.
Description
Technical field
The present invention relates to printed circuit board (PCB) processing technique field, the fast molded technique of more particularly to a kind of Multilayer Flexible Board.
Background technology
The general Making programme of the making of Multilayer Flexible Board is：Sawing sheet → circuit making → pure glued membrane, flex plate para-position pressure
Conjunction → rear operation, wherein, bonding processes must effectively remove the bubble of flex plate interlayer, for the performance impact of Multilayer Flexible Board
Particularly critical, conventional pressing technology includes fast pressure and traditional vacuum pressure transmission at present.Traditional vacuum pressure transmission can be provided takes out true
Altitude, can be prevented effectively from the generation of bubble in bonding processes, but the High Temperature High Pressure of traditional vacuum pressure transmission is easily caused flexibility
Plate harmomegathus changes greatly, and time-consuming, cumbersome, not universal enough in printed circuit board industry application, by contrast, presses with which soon
Simple to operate, the quick and low advantage of environmental requirement has more industrial application prospect.
Fast pressure flow process is specially：Pure glued membrane sawing sheet → brill location hole → paste pure glued membrane → pure glued membrane precompressed → flex plate in advance is pre-
Para-position → Multilayer Flexible Board is pressed soon.Carry out by existing fast compression technology, be easily caused fast moulding film and flex plate para-position pressing
During, in plate, gas effectively cannot be discharged, and form bubble.The presence of bubble, not only largely effects on product appearance, follow-up easy
Forming layering plate bursting causes to scrap；If carrying out catching up with bubble to do over again to flex plate, Multilayer Flexible Board is pressed through multiple high temp, is held
It is easily caused flex plate harmomegathus and becomes big and inconsistent, cause flex plate interlayer alignment precision to decline, follow-up drilling hole partially, and is made accordingly
Into scrappage virtual height, making the risk and cost of enterprise is increased.
The content of the invention
The present invention thoroughly cannot be removed for the bubble that existing fast pressure technology is present, serious restriction Multilayer Flexible Board pressing product
The problem of matter and scrappage virtual height, forms a kind of fast molded technique of Multilayer Flexible Board, with bubble removal effect is good, operation just
The characteristics of prompt, with low cost and wide versatility.
Present disclosure is：
A kind of fast molded technique of Multilayer Flexible Board, comprises the following steps：
The first step, sawing sheet process, carry out flex plate, pure glued membrane according to process and cut；
Second step, Drilling operation, select the non-forming region in flex plate figure, are spaced in flex plate according to certain
Carrying out catching up with pore to position, and Drilling operation being carried out in the position location for catching up with pore, pore is caught up with formation；
3rd step, rubberizing film pre-treatment, the flex plate for completing second step Drilling operation enter row line make, AOI detection,
Brown makes, and completes pad pasting pre-treatment；
4th step, single layer flexible plate glued membrane are molded soon, and the 3rd step is completed to divide above the flex plate of pad pasting pre-treatment
Glued membrane is not sticked in advance, modeling is crossed by laminator, flatten rapidly the glued membrane being attached on flex plate in advance after crossing modeling and complete single layer flexible plate
Glued membrane it is molded soon, its concrete steps can three steps below atmosphere：
Step one, glued membrane are pasted in advance, are prepared fixed backing plate, first flex plate are inserted on backing plate, glued membrane release paper of tearing, protect
Outwardly, glued membrane face using non-dust cloth is tentatively caught up with gas after being inserted in glued membrane towards flex plate to film, makes glued membrane face with flexible plate face
After being fully contacted, reuse electric cautery and its technique edges is suitably fixed, complete glued membrane and paste in advance；
Step 2, modeling precompressed excessively：The flex plate of pre- rubberizing film is clamped up and down using special modeling accessory plate of crossing, opened modeling
Machine, it is 100-150 DEG C to adjust temperature, and pressure reel speed 0.5-1.0m/min, pressure are certain, will first cross after mould plate one end compresses and is put into
Machine carried out modeling, until imposite is crossed modeling and completed；
Step 3, glued membrane are pressed soon, and the single layer flexible plate to completing to mould precompressed is carried out rapidly in the state of heating pressurization
It is fast molded, obtain final fast molded single layer flexible plate.
5th step, Multilayer Flexible Board are molded soon, it is the 4th step glued membrane fast it is molded after single layer flexible plate according to certain
Level carry out pre- para-position, carry out high-temperature pressurizing and cross modeling by crossing mould plate and clamping, cross the monolayer of rapid compression different levels after moulding
Flex plate, the glued membrane for completing Multilayer Flexible Board are molded soon.Its concrete steps can be divided into following three step：
The pre- para-position of step one, Multilayer Flexible Board, the protecting film of the single layer flexible plate surface for completing to mould precompressed is torn off, point
Not successively be not inserted in fixed backing plate according to level, using non-dust cloth carry out it is secondary catch up with gas, after being fully contacted glued membrane face, ironed using electricity
Ferrum is suitably fixed to its technique edges, completes pre- para-position；
Flex plate is clamped using special mould plate of crossing, opens laminator so as to temperature by step 2, Multilayer Flexible Board precompressed
100-150 DEG C is reached, modeling speed 0.5-1.0m/min is crossed, pressure is certain, and machine is put into after first compress one end carried out modeling, directly
Modeling is crossed to imposite to complete；
Step 3, Multilayer Flexible Board are molded soon, and the Multilayer Flexible Board to completing precompressed is entered in the state of heating pressurization
Row is rapid fast molded, obtains final fast molded Multilayer Flexible Board.
Preferably, the quantity for catching up with pore described in the 3rd step Drilling operation increases according in 30mm × 30mm～50mm × 50mm
Plus one hole be arranged on the non-forming region of flex plate.Setting can not be overstocked, and crossing secret meeting increases difficulty of processing, can also increase multilamellar and scratch
Property plate laminating after hidden danger of quality；Can not dredge excessively, dredge excessively the effect that can have a strong impact on removal of bubbles.
The invention has the beneficial effects as follows：
Firstth, bubble removal effect is good, catches up with stomatal limiting value bubble to arrange by increasing in the non-forming region of single layer flexible plate
Go out passage, bubble removing is gone with molded soon by substep aerofluxuss pre-molding, effectively reduction bubble is between Multilayer Flexible Board
Residual；
Secondth, easy to operate, each operation is normal process steps, and process operations are simple, is ensureing the same of bubble removal effect
The step of Shi Youxiao simplifies operation；
3rd, it is with low cost, equipment and Environmental costs, operation side are effectively reduced without the need for special operational environment and Special Equipment
Just cost of labor is effectively reduced, the use of material is the effectively save material cost of conventional material；
4th.Versatility is wide, for the number of plies of the Multilayer Flexible Board for needing processing.Size etc. is suitable for institute without limiting
The popularization for having Multilayer Flexible Board makes.
Description of the drawings
Accompanying drawing 1 is a kind of process chart of the fast molded technique of Multilayer Flexible Board of the invention.
Specific embodiment
For a further understanding of present disclosure, below the content of the invention and specific embodiment are specifically described：
As shown in figure 1, a kind of fast molded technique of Multilayer Flexible Board, comprises the following steps：
The first step, sawing sheet process, carry out flex plate, pure glued membrane according to process and cut；
Second step, Drilling operation, select the non-forming region in flex plate figure, are spaced in flex plate according to certain
Carrying out catching up with pore to position, and Drilling operation being carried out in the position location for catching up with pore, pore is caught up with formation；
3rd step, pad pasting pre-treatment, enter row line making, AOI detections, palm fibre the flex plate for completing second step Drilling operation
Change and make, complete pad pasting pre-treatment；
4th step, single layer flexible plate glued membrane are molded soon, and the 3rd step is completed to divide above the flex plate of pad pasting pre-treatment
Glued membrane is not sticked in advance, modeling is crossed by laminator, flatten rapidly the glued membrane being attached on flex plate in advance after crossing modeling and complete single layer flexible plate
Glued membrane it is molded soon, its concrete steps can three steps below atmosphere：
Step one, glued membrane are pasted in advance, are prepared fixed backing plate, first flex plate are inserted on backing plate, glued membrane release paper of tearing, protect
Outwardly, glued membrane face using non-dust cloth is tentatively caught up with gas after being inserted in glued membrane towards flex plate to film, makes glued membrane face with flexible plate face
After being fully contacted, reuse electric cautery and its technique edges is suitably fixed, complete glued membrane and paste in advance；
Step 2, modeling precompressed excessively：The flex plate of pre- rubberizing film is clamped up and down using special modeling accessory plate of crossing, opened modeling
Machine, it is 100-150 DEG C to adjust temperature, and pressure reel speed 0.5-1.0m/min, pressure are certain, will first cross after mould plate one end compresses and is put into
Machine carried out modeling, until imposite is crossed modeling and completed；
Step 3, glued membrane are pressed soon, and the single layer flexible plate to completing to mould precompressed is carried out rapidly in the state of heating pressurization
It is fast molded, obtain final fast molded single layer flexible plate.
5th step, Multilayer Flexible Board are molded soon, it is the 4th step glued membrane fast it is molded after single layer flexible plate according to certain
Level carry out pre- para-position, carry out high-temperature pressurizing and cross modeling by crossing mould plate and clamping, cross the monolayer of rapid compression different levels after moulding
Flex plate, the glued membrane for completing Multilayer Flexible Board are molded soon.Its concrete steps can be divided into following three step：
The pre- para-position of step one, Multilayer Flexible Board, the protecting film of the single layer flexible plate surface for completing to mould precompressed is torn off, point
Not successively be not inserted in fixed backing plate according to level, using non-dust cloth carry out it is secondary catch up with gas, after being fully contacted glued membrane face, ironed using electricity
Ferrum is suitably fixed to its technique edges, completes pre- para-position；
Flex plate is clamped using special mould plate of crossing, opens laminator so as to temperature by step 2, Multilayer Flexible Board precompressed
100-150 DEG C is reached, modeling speed 0.5-1.0m/min is crossed, pressure is certain, and machine is put into after first compress one end carried out modeling, directly
Modeling is crossed to imposite to complete；
Step 3, Multilayer Flexible Board are molded soon, and the Multilayer Flexible Board to completing precompressed is entered in the state of heating pressurization
Row is rapid fast molded, obtains final fast molded Multilayer Flexible Board.
Preferably, the quantity for catching up with pore described in the 3rd step Drilling operation increases according in 30mm × 30mm～50mm × 50mm
Plus one hole be arranged on the non-forming region of flex plate.
The above, only presently preferred embodiments of the present invention not makees any pro forma restriction to the present invention；It is all
The those of ordinary skill of the industry can shown in by specification accompanying drawing and the above and swimmingly implement the present invention；But, it is all
Those skilled in the art in the range of without departing from technical solution of the present invention, using disclosed above technology contents
A little change, modification and the equivalent variations for developing made, are the Equivalent embodiments of the present invention；Meanwhile, it is all according to the present invention
The change of substantial technological any equivalent variations that above example is made, modification with develop etc., still fall within the present invention's
Within the protection domain of technical scheme.
Claims (4)
1. the fast molded technique of a kind of Multilayer Flexible Board, it is characterised in that comprise the following steps：
The first step, sawing sheet process, carry out flex plate, pure glued membrane according to process and cut；
Second step, Drilling operation, select the non-forming region in flex plate figure, are spaced in carrying out in flex plate according to certain
Catching up with pore to position, and Drilling operation being carried out in the position location for catching up with pore, pore is caught up with formation；
3rd step, rubberizing film pre-treatment, enter row line making, AOI detections, brown the flex plate for completing second step Drilling operation
Make, complete pad pasting pre-treatment；
4th step, single layer flexible plate glued membrane are molded soon, the 3rd step are completed pre- respectively above the flex plate of pad pasting pre-treatment
Glued membrane is sticked, modeling is crossed by laminator, to cross and the glue that the glued membrane being attached on flex plate in advance completes single layer flexible plate is pressed rapidly after moulding
Film is molded soon；
5th step, Multilayer Flexible Board are molded soon, it is the 4th step glued membrane fast it is molded after single layer flexible plate according to certain layer
It is secondary to carry out pre- para-position, carry out high-temperature pressurizing and cross modeling by crossing mould plate and clamping, cross the single layer flexible of rapid compression different levels after moulding
Plate, the glued membrane for completing Multilayer Flexible Board are molded soon.
2. the fast molded technique of Multilayer Flexible Board according to claim 1, it is characterised in that：The single layer flexible plate is pressed soon
Molding is comprised the following steps：
Step one, glued membrane are pasted in advance, are prepared fixed backing plate, first flex plate are inserted on backing plate, glued membrane release paper of tearing, protecting film court
Outward, glued membrane face using non-dust cloth is tentatively caught up with gas after being inserted in glued membrane towards flex plate, makes glued membrane face abundant with flexible plate face
After contact, reuse electric cautery and its technique edges is suitably fixed, complete glued membrane and paste in advance；
The flex plate of pre- rubberizing film is clamped using special modeling accessory plate of crossing, opens laminator by step 2, modeling precompressed excessively up and down,
It is 100-150 DEG C to adjust temperature, and pressure reel speed 0.5-1.0m/min, pressure are certain, will first cross after mould plate one end compresses and is put into machine
Device carried out modeling, until imposite is crossed modeling and completed；
Step 3, glued membrane are pressed soon, and the single layer flexible plate to completing to mould precompressed carries out fast rapidly pressure in the state of heating pressurization
Molding, obtains final fast molded single layer flexible plate.
3. the fast molded technique of Multilayer Flexible Board according to claim 1, it is characterised in that：The Multilayer Flexible Board is pressed soon
Molding is comprised the following steps：
The pre- para-position of step one, Multilayer Flexible Board, the protecting film of the single layer flexible plate surface for completing to mould precompressed is torn off, is pressed respectively
Successively be inserted in fixed backing plate according to level, using non-dust cloth carry out it is secondary catch up with gas, after being fully contacted glued membrane face, using electric cautery pair
Its technique edges is suitably fixed, and completes pre- para-position；
Flex plate is clamped using special mould plate of crossing, opens laminator so as to which temperature reaches by step 2, Multilayer Flexible Board precompressed
100-150 DEG C, modeling speed 0.5-1.0m/min is crossed, pressure is certain, and machine is put into after first compress one end carried out modeling, until whole
Plate is crossed modeling and is completed；
Step 3, Multilayer Flexible Board are molded soon, and the Multilayer Flexible Board to completing precompressed carries out fast in the state of heating pressurization
It is fast fast molded, obtain final fast molded Multilayer Flexible Board.
4. the fast molded technique of Multilayer Flexible Board according to Claims 2 or 3, it is characterised in that：3rd step Drilling operation
The described quantity for catching up with pore is arranged on the non-forming area of flex plate according to one hole of increase in 30mm × 30mm～50mm × 50mm
Domain.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410702318.4A CN104411123B (en) | 2014-11-29 | 2014-11-29 | Quick press molding process for multilayer flexible plates |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410702318.4A CN104411123B (en) | 2014-11-29 | 2014-11-29 | Quick press molding process for multilayer flexible plates |
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| CN104411123A CN104411123A (en) | 2015-03-11 |
| CN104411123B true CN104411123B (en) | 2017-05-03 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105916314B (en) * | 2016-06-03 | 2019-01-11 | 深圳市景旺电子股份有限公司 | A kind of the multilayer manufacturing method of soft board and multilayer soft board of avoidable interlayer dislocation |
| CN106851975B (en) * | 2017-03-22 | 2019-09-17 | 深圳市景旺电子股份有限公司 | A kind of rigid-flex combined board and preparation method thereof |
| CN107567209A (en) * | 2017-09-30 | 2018-01-09 | 华宇华源电子科技（深圳）有限公司 | A kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method |
| CN110557885A (en) * | 2019-08-13 | 2019-12-10 | 胜宏科技（惠州）股份有限公司 | manufacturing process of copper substrate with double-sided sandwich thermoelectric separation structure |
| CN116782523B (en) * | 2023-08-21 | 2023-10-20 | 四川英创力电子科技股份有限公司 | Device and method for efficiently and precisely sticking adhesive tape on gold-plated layer of circuit board |
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| JPH0768654A (en) * | 1993-09-02 | 1995-03-14 | Hitachi Chem Co Ltd | Laminatedplate molding release sheet and manufacture of multilayer plate using the same |
| JP2005129739A (en) * | 2003-10-24 | 2005-05-19 | Fujikura Ltd | Rigid flexible printed board and its manufacturing method |
| KR100925155B1 (en) * | 2007-11-29 | 2009-11-05 | (주)예스텔레콤 | Flexible printed circuit board assembly and manufacturing method for the same |
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| CN101203095A (en) * | 2006-12-13 | 2008-06-18 | 富葵精密组件(深圳)有限公司 | Method for preparation of multi-layer flexible circuit board |
| CN101868119A (en) * | 2009-04-17 | 2010-10-20 | 比亚迪股份有限公司 | Flexible printed circuit board connecting structure body and manufacturing method thereof |
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| CN104411123A (en) | 2015-03-11 |
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