CN104388961B - A kind of cleaning agent for copper and preparation method thereof - Google Patents
A kind of cleaning agent for copper and preparation method thereof Download PDFInfo
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- CN104388961B CN104388961B CN201410644869.XA CN201410644869A CN104388961B CN 104388961 B CN104388961 B CN 104388961B CN 201410644869 A CN201410644869 A CN 201410644869A CN 104388961 B CN104388961 B CN 104388961B
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 57
- 239000010949 copper Substances 0.000 title claims abstract description 57
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 57
- 239000012459 cleaning agent Substances 0.000 title claims abstract description 38
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 22
- 150000007522 mineralic acids Chemical class 0.000 claims abstract description 18
- 239000004094 surface-active agent Substances 0.000 claims abstract description 18
- 230000000740 bleeding effect Effects 0.000 claims abstract description 17
- 239000008139 complexing agent Substances 0.000 claims abstract description 17
- 239000013530 defoamer Substances 0.000 claims abstract description 16
- 150000007524 organic acids Chemical class 0.000 claims abstract description 16
- 239000003995 emulsifying agent Substances 0.000 claims abstract description 15
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 18
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 16
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 12
- IMQLKJBTEOYOSI-GPIVLXJGSA-N Inositol-hexakisphosphate Chemical compound OP(O)(=O)O[C@H]1[C@H](OP(O)(O)=O)[C@@H](OP(O)(O)=O)[C@H](OP(O)(O)=O)[C@H](OP(O)(O)=O)[C@@H]1OP(O)(O)=O IMQLKJBTEOYOSI-GPIVLXJGSA-N 0.000 claims description 12
- IMQLKJBTEOYOSI-UHFFFAOYSA-N Phytic acid Natural products OP(O)(=O)OC1C(OP(O)(O)=O)C(OP(O)(O)=O)C(OP(O)(O)=O)C(OP(O)(O)=O)C1OP(O)(O)=O IMQLKJBTEOYOSI-UHFFFAOYSA-N 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 12
- 239000000467 phytic acid Substances 0.000 claims description 12
- 229940068041 phytic acid Drugs 0.000 claims description 12
- 235000002949 phytic acid Nutrition 0.000 claims description 12
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical group CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 claims description 10
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 10
- QJZYHAIUNVAGQP-UHFFFAOYSA-N 3-nitrobicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1C2C=CC1C(C(=O)O)C2(C(O)=O)[N+]([O-])=O QJZYHAIUNVAGQP-UHFFFAOYSA-N 0.000 claims description 9
- 239000004021 humic acid Substances 0.000 claims description 9
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 8
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 8
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 8
- 239000001630 malic acid Substances 0.000 claims description 8
- 235000011090 malic acid Nutrition 0.000 claims description 8
- IDQBJILTOGBZCR-UHFFFAOYSA-N 1-butoxypropan-1-ol Chemical compound CCCCOC(O)CC IDQBJILTOGBZCR-UHFFFAOYSA-N 0.000 claims description 7
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 7
- 229910017604 nitric acid Inorganic materials 0.000 claims description 7
- 239000001509 sodium citrate Substances 0.000 claims description 7
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 claims description 7
- 229940038773 trisodium citrate Drugs 0.000 claims description 7
- 150000002596 lactones Chemical class 0.000 claims description 5
- YWFWDNVOPHGWMX-UHFFFAOYSA-N n,n-dimethyldodecan-1-amine Chemical compound CCCCCCCCCCCCN(C)C YWFWDNVOPHGWMX-UHFFFAOYSA-N 0.000 claims description 5
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 claims description 5
- 239000003513 alkali Substances 0.000 claims description 4
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 2
- NCBISIFFSNXYQJ-UHFFFAOYSA-N 1-dodecyl-4,5-dihydroimidazole Chemical compound CCCCCCCCCCCCN1CCN=C1 NCBISIFFSNXYQJ-UHFFFAOYSA-N 0.000 claims 1
- 241001122767 Theaceae Species 0.000 claims 1
- 239000002280 amphoteric surfactant Substances 0.000 claims 1
- 235000009508 confectionery Nutrition 0.000 claims 1
- 238000004140 cleaning Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 8
- 239000003599 detergent Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 230000003628 erosive effect Effects 0.000 abstract description 3
- 241000969106 Megalaima haemacephala Species 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 238000007654 immersion Methods 0.000 abstract description 2
- 239000012153 distilled water Substances 0.000 description 11
- 238000003756 stirring Methods 0.000 description 7
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 4
- 238000011010 flushing procedure Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 235000016068 Berberis vulgaris Nutrition 0.000 description 3
- 241000335053 Beta vulgaris Species 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000001384 succinic acid Substances 0.000 description 3
- LEHNQGSPRXHYRT-UHFFFAOYSA-N 2-dodecyl-1h-imidazole Chemical class CCCCCCCCCCCCC1=NC=CN1 LEHNQGSPRXHYRT-UHFFFAOYSA-N 0.000 description 2
- 239000005639 Lauric acid Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- ZZVUWRFHKOJYTH-UHFFFAOYSA-N diphenhydramine Chemical compound C=1C=CC=CC=1C(OCCN(C)C)C1=CC=CC=C1 ZZVUWRFHKOJYTH-UHFFFAOYSA-N 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 2
- 239000006210 lotion Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229960003237 betaine Drugs 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000002079 cooperative effect Effects 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 239000006184 cosolvent Substances 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 1
- 231100000206 health hazard Toxicity 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 polyoxyethylene nonylphenol Polymers 0.000 description 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical group CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Detergent Compositions (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention discloses a kind of cleaning agent for copper and preparation method thereof.Cleaning agent for copper of the present invention is made up of inorganic acid, organic acid, surfactant, bleeding agent, emulsifying agent, defoamer, complexing agent, water, compounded using inorganic acid and organic acid, avoid conventional clean agent and harm of the inorganic acid to clean manufacturing operator health is used alone, and the excessive erosion to coppersmith part, it is a kind of environmental type cleaning agent, and with certain oiliness, improve cleaning action of the cleaning agent to dirts such as the greases of copper piece surface attachment, and detergent solution can remove the oxide skin on copper piece surface well in acidity.The present invention prepares that cleaning agent application method is simple, and lower of normal temperature needs 2 ~ 5min immersions to can be achieved the cleaning to copper piece, and the copper piece after cleaning is without greasy residues, and copper piece surface color is copper-based true qualities, and cleaning performance is notable.Preparation method of the present invention is simple, and cost is low, and effect is significantly, suitable for industrialized production and application.
Description
Technical field
The present invention relates to chemical field, more particularly to a kind of cleaning agent for copper and preparation method thereof.
Background technology
Copper and its alloy have excellent electric conductivity, thermal conductivity and ductility due to it, obtain wide in terms of material engineering
General application, is used extensively especially in High-Voltage Electrical Appliances industry as conductive contact surfaces etc..During the use of copper alloy, no
Same use environment such as alkalescence, acid, neutral solution and marine environment can cause the corrosion of copper alloy, so as to influence it
Electric conductivity；In electrical apparatus industry, using copper as conductive contact surfaces, need to ensure the clear of its surface before assembling or plating
It is clean, cleaning treatment is carried out to copper piece surface, the quality of cleaning quality directly affects the performance and quality of subsequent film.
The research both at home and abroad for copper piece cleaning agent is roughly divided into alkaline cleaner and acidic cleaner two types at present,
And common for acidic cleaner is highly acid cleaning agent main with the acid of industry three especially based on nitric acid, in use
The volatilization of acid solution is produced a very large impact to the health and safety of operator, and easily causes when cleaning workpiece the mistake of workpiece
Corrosion, so that great economic loss is caused, therefore in order to overcome the defect using the acid of industry three, Chinese patent CN1482278A
Disclose a kind of phytic acid cleaning agent, the cleaning agent by phytic acid 2.5 ~ 10%, hydramine 0.8 ~ 2.0%, polyethylene oxide adducts type it is non-
Ionic surface active agent 0.6 ~ 2.0%, cosolvent 1.0 ~ 8.0%, water surplus, but the hydramine wherein used has excitant, puts
Easily it is oxidized in air, and has larger corrosivity to copper, aluminium and its alloy.
Therefore, in order to overcome the defect of existing cleaning agent for copper, a kind of harmless, environmental protection is worked out, and to Copper base material
The application does not produce corrosiveness, the cleaning agent for copper for not causing Copper base material to lose, and is significant.
The content of the invention
First purpose of the invention be to provide a kind of cleaning agent for copper, and solving reduce the usage amount of industrial three strong acid, drops
Health hazard of the low cleaning agent to operating personnel, it is to avoid cleaning agent produces the technical problem of excessive erosion to Copper base material.
Second object of the present invention is to provide a kind of preparation method of cleaning agent for copper.
To achieve these goals, the technical solution adopted by the present invention is as follows：
A kind of cleaning agent for copper, is made up of the component of following weight percentage：Inorganic acid 15 ~ 30%, organic acid 10 ~
20%th, surfactant 10 ~ 18%, bleeding agent 5 ~ 12%, emulsifying agent 6 ~ 15%, defoamer 2 ~ 6%, complexing agent 2 ~ 8%, surplus are
Distilled water.
The inorganic acid is the mixture of one or both of hydrochloric acid, nitric acid, hydrofluoric acid with sulfuric acid；Wherein each is inorganic
Acid mass concentration be：Nitric acid >=95%, hydrochloric acid 36% ~ 38%, sulfuric acid 95% ~ 98%, hydrofluoric acid >=40%.
The organic acid is one or both of malic acid, succinic acid, phytic acid thing mixed above.
The surfactant is NPE -9, dodecyl-dimethyl amine second lactone, lauryl imidazoles
Any one in quinoline beet alkali ampholytic surface active agent or combination.
The bleeding agent is one or both of butyl glycol ether, propandiol butyl ether mixture.
The emulsifying agent is OP-10.
The defoamer is butyl ether.
The complexing agent is any one in azimidobenzene, humic acid, trisodium citrate, tetrasodium salt of EDTA
Or combination.
The concrete operation step of the preparation method of above-mentioned cleaning agent is as follows：After inorganic acid is diluted with water, addition organic acid,
After surfactant, bleeding agent, emulsifying agent and defoamer are well mixed, complexing agent is eventually adding, and adds the water of surplus, i.e.,
.
The specific method of wherein described mixing is：
1）Adopt and inorganic acid is diluted with water obtains solution a, organic acid is added in solution a, mix, obtained solution b；Surface is lived
Property agent, bleeding agent, emulsifying agent and defoamer it is well mixed, obtain solution c；
2）Solution c is added in solution b, after stirring, complexing agent is added, and adds the water of surplus, is produced.
Application of the above-mentioned cleaning agent in terms of copper is cleaned, specifically used method is：Copper piece is impregnated into detergent solution,
And 2 ~ 5min is soaked at normal temperatures.
Cleaning agent for copper of the present invention is compounded using inorganic acid and organic acid, it is to avoid conventional clean agent is used alone inorganic acid pair
The harm of clean manufacturing operator health, and the excessive erosion to coppersmith part, are a kind of environmental type cleaning agents, while this hair
Compound surfactant, bleeding agent, emulsifying agent, defoamer and complexing agent in Ming and Qing lotion, common synergy, make the clear of preparation
Lotion has certain oiliness, improves cleaning action of the cleaning agent to dirts such as the greases of copper piece surface attachment, and cleaning agent
Solution is in acidity, and PH=1.8 ~ 4.5 can remove the oxide skin on copper piece surface well.
Further, the application selection NPE -9, dodecyl-dimethyl amine second lactone, lauryl imidazoles
Any one or combination in quinoline beet alkali ampholytic surface active agent as just face activating agent, with defoamer butyl ether, polyoxyethylene nonylphenol ether-
10 and bleeding agent butyl glycol ether and propandiol butyl ether produce cooperative effect well, the cleaning agent of preparation is effectively gone
It except copper piece surface and oil contaminant, can be dissolved each other with greasy dirt, refine greasy dirt drop, come off from copper piece matrix, it is easy to clean, and can be effective
It is complexed copper ion and alloy ion in cleaning process produced by the corrosion of matrix, it is to avoid cleaning fluid is poisoned and failed, it is ensured that
The long-term validity of cleaning fluid, realizes and the batch of copper piece is cleaned.
The present invention prepares cleaning agent application method simply, and lower of normal temperature needs 2 ~ 5min immersions to can be achieved to the clear of copper piece
Wash, and the copper piece after cleaning, after distilled water flushing, surface study of water film distribution is uniform, no greasy residues, and copper piece surface color is
Copper-based true qualities, cleaning performance is notable.
Preparation method of the present invention is simple, and cost is low, and effect is significantly, suitable for industrialized production and application.
Embodiment
The present invention is described in further detail with reference to specific embodiment, but does not constitute any limit to the present invention
System.
Embodiment 1
The weight percentage composition of cleaning agent for copper is in the present embodiment：Live on inorganic acid 20%, organic acid 10.5%, surface
Property agent 14%, bleeding agent 8%, emulsifying agent 7%, defoamer 4%, complexing agent 5%, surplus is water.
Wherein inorganic acid is the mixture of sulfuric acid and hydrofluoric acid, and the mass ratio of two of which acid is sulfuric acid：Hydrofluoric acid=9：1；
Organic acid is the mixture of malic acid, phytic acid and succinic acid, wherein three kinds of sour mass ratioes are malic acid：Phytic acid：
Succinic acid=1：1.25：3；
Surfactant is NPE -9 and dodecyl-dimethyl amine second lactone mixture, two of which
The mass ratio of surfactant is 3：2；
Bleeding agent is propandiol butyl ether；Emulsifying agent is OP-10；Defoamer is butyl ether；
Complexing agent is trisodium citrate, tetrasodium ethylenediamine tetraacetate, the mixture of humic acid, wherein the matter of three kinds of complexing agents
Amount is than being trisodium citrate：Tetrasodium ethylenediamine tetraacetate：Humic acid=1：2：2.
The preparation method of the present embodiment cleaning agent for copper is：
（1）Sulfuric acid 18g, hydrofluoric acid 2g are weighed, is diluted and is well mixed using distilled water, is subsequently placed in container A
It is stand-by；
（2）Malic acid 2g, phytic acid 2.5g, succinic acid 6g are weighed, step is slowly added into（1）Container A in, and stir
Mix uniform, obtained solution a；
（3）The 12g of NPE -9, dodecyl-dimethyl amine second lactone 2g, propandiol butyl ether 8g are weighed,
OP-10 7g, butyl ether 4g, and be mixed uniformly, it is placed in container B, obtained solution b；
（4）Solution b is added in solution a, trisodium citrate 1g, EDTA-4Na 2g, humic acid 2g is added, added remaining
The distilled water of amount is produced to 100g after stirring.
The cleaning agent of above-mentioned preparation is used to clean the specific method of copper piece：Copper piece is dipped into above-mentioned detergent solution
In, 3min is soaked at normal temperatures.
Uniform, no greasy residues through the copper piece surface study of water film distribution obtained by distilled water flushing, and copper piece surface color is
Copper-based true qualities.
Embodiment 2
The weight percentage composition of cleaning agent is in the present embodiment：Inorganic acid 15%, organic acid 20%, surfactant
18%, bleeding agent 5%, emulsifying agent 15%, defoamer 2%, complexing agent 2%, surplus is water.
Wherein inorganic acid is the mixture of sulfuric acid and hydrochloric acid, and the mass ratio of two of which acid is sulfuric acid：Hydrochloric acid=2：1；
Organic acid is the mixture of phytic acid and succinic acid, and the mass ratio of two of which acid is 3：2；
Surfactant is that NPE -9 is mixed with lauric acid imidazoline beet alkali ampholytic surface active agent
Thing, the mass ratio of two of which surface-active is 5：1；
Bleeding agent is butyl glycol ether；Emulsifying agent is OP-10；Defoamer is butyl ether；
Complexing agent is the mixture of trisodium citrate and humic acid, and the mass ratio of two of which complexing agent is 1：1.
The preparation method of the present embodiment cleaning agent for copper is：
（1）Sulfuric acid 10g, hydrochloric acid 5g are weighed, is diluted and is well mixed using distilled water, be subsequently placed in container A and treat
With；
（2）Phytic acid 12g, succinic acid 8g are weighed, step is slowly added into（1）In container A, and stir, be made
Solution a；
（3）Weigh the 15g of NPE -9, lauric acid imidazoline glycine betaine 3g, butyl glycol ether 5g, OP-
10 15g, butyl ether 2g, and be mixed uniformly, it is placed in container B, obtained solution b；
（4）Solution b is added in solution a, trisodium citrate 1g, humic acid 1g is added, the distilled water of surplus is added extremely
100g, is produced after stirring.
The cleaning agent of above-mentioned preparation is used to clean the specific method of copper piece：Copper piece is dipped into above-mentioned detergent solution
In, 5min is soaked at normal temperatures.
Uniform, no greasy residues through the copper piece surface study of water film distribution obtained by distilled water flushing, and copper piece surface color is
Copper-based true qualities.
Embodiment 3
The weight percentage composition of cleaning agent is in the present embodiment：Inorganic acid 30%, organic acid 10%, surfactant
10%, bleeding agent 12%, emulsifying agent 6%, defoamer 6%, complexing agent 8%, surplus is water.
Wherein inorganic acid is the mixture of sulfuric acid, hydrofluoric acid and nitric acid, wherein three kinds of sour mass ratioes are sulfuric acid：Hydrogen fluorine
Acid：Nitric acid=6：5：4；
Organic acid is the mixture of malic acid and phytic acid, and the mass ratio of two of which acid is malic acid：Phytic acid=1：3；
Surfactant is NPE -9；
Bleeding agent is the mixture of propandiol butyl ether and butyl glycol ether, and the mass ratio of two of which bleeding agent is propane diols
Butyl ether：Butyl glycol ether=2：1；
Emulsifying agent is OP-10；Defoamer is butyl ether；Complexing agent is humic acid.
The preparation method of the present embodiment cleaning agent for copper is：
（1）Sulfuric acid 12g, hydrofluoric acid 10g, nitric acid 8g are weighed, is diluted and is well mixed using distilled water, is subsequently placed in
It is stand-by in container A；
（2）Malic acid 5g, phytic acid 15g are weighed, step is slowly added into（1）In container A, and stir, be made
Solution a；
（3）Weigh the 10g of NPE -9, propandiol butyl ether 8g, butyl glycol ether 4g, OP-10 6g, butyl ether
6g, and be mixed uniformly, it is placed in container B, obtained solution b；
（4）Solution b is added in solution a, add humic acid 8g, plus surplus distilled water to 100g, after stirring
Produce.
The cleaning agent of above-mentioned preparation is used to clean the specific method of copper piece：Copper piece is dipped into above-mentioned detergent solution
In, 4min is soaked at normal temperatures.
Uniform, no greasy residues through the copper piece surface study of water film distribution obtained by distilled water flushing, and copper piece surface color is
Copper-based true qualities.
Claims (2)
1. a kind of cleaning agent for copper, it is characterised in that be made up of the component of following weight percentage：It is inorganic acid 15 ~ 30%, organic
Acid 10 ~ 20%, surfactant 10 ~ 18%, bleeding agent 5 ~ 12%, emulsifying agent 6 ~ 15%, defoamer 2 ~ 6%, complexing agent 2 ~ 8%,
Surplus is water；
The inorganic acid is the mixture of one or both of hydrochloric acid, nitric acid, hydrofluoric acid with sulfuric acid；
The organic acid is any one in malic acid, succinic acid, phytic acid or combination；
The surfactant is NPE -9, dodecyl-dimethyl amine second lactone, lauryl imidazoline sweet tea
Any one in dish alkali amphoteric surfactant or combination；
The bleeding agent is any one in butyl glycol ether, propandiol butyl ether or combination；
The emulsifying agent is OP-10；
The defoamer is butyl ether；
The complexing agent is any one in azimidobenzene, humic acid, trisodium citrate, tetrasodium ethylenediamine tetraacetate or group
Close.
2. a kind of preparation method of cleaning agent for copper as claimed in claim 1, it is characterised in that concrete operation step is：By nothing
After machine acid is diluted with water, add organic acid, surfactant, bleeding agent, emulsifying agent and defoamer it is well mixed after, finally plus
Enter complexing agent, and add the water of surplus, produce.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410644869.XA CN104388961B (en) | 2014-11-14 | 2014-11-14 | A kind of cleaning agent for copper and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410644869.XA CN104388961B (en) | 2014-11-14 | 2014-11-14 | A kind of cleaning agent for copper and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107740121A (en) * | 2017-09-13 | 2018-02-27 | 广州安赛化工有限公司 | A kind of preparation method of high-efficiency environment friendly multifunctional safety cleaning agent |
| CN107716486B (en) * | 2017-09-30 | 2023-06-23 | 河南省农业科学院农业质量标准与检测技术研究所 | Acid and alkali resistant stewing and ultra-clean cleaning device and cleaning fluid thereof |
| CN110184595A (en) * | 2019-06-28 | 2019-08-30 | 金川集团股份有限公司 | A kind of phosphor-copper bar brightening liquid |
| CN110777386B (en) * | 2019-11-25 | 2020-09-04 | 江南大学 | Multifunctional copper cleaning agent and preparation method thereof |
| CN111117793B (en) * | 2019-12-23 | 2021-09-17 | 昆山市板明电子科技有限公司 | Copper surface cleaning agent and preparation method thereof |
| CN111593386A (en) * | 2020-07-09 | 2020-08-28 | 惠州市腾达宇科技有限公司 | Electroplating activator and preparation method thereof |
| CN113249731B (en) * | 2021-05-28 | 2022-09-09 | 西安热工研究院有限公司 | Chemical cleaning agent for copper scale in generator inner cooling water system |
| CN114107995B (en) * | 2021-11-09 | 2024-04-09 | 亚太森博(广东)纸业有限公司 | Cleaning agent and application thereof |
| CN116770320A (en) * | 2023-06-21 | 2023-09-19 | 宁波江丰电子材料股份有限公司 | Surface cleaning liquid for copper material and preparation method and application thereof |
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| CN100383284C (en) * | 2006-06-14 | 2008-04-23 | 内蒙古第一机械制造（集团）有限公司 | Acidwash solution for copper and copper alloy |
| CN102392263A (en) * | 2011-11-18 | 2012-03-28 | 东莞市东辉贸易有限公司 | Metal cleaning agent |
| CN102747378B (en) * | 2012-07-24 | 2016-01-20 | 中国第一汽车股份有限公司 | Environmentally-friendly water-based metal cleaner |
| CN103215611B (en) * | 2013-03-27 | 2016-06-22 | 沈阳帕卡濑精有限总公司 | A kind of Phosphorus-Free Water-Based Cleaning Agent for Metals |
| CN103469236A (en) * | 2013-09-22 | 2013-12-25 | 西北机器有限公司 | Copper base material cleaning agent and preparation method thereof |
| CN103741156A (en) * | 2013-12-23 | 2014-04-23 | 天津市澳路浦润滑油有限公司 | Water base reaction type multifunctional metal cleaning agent and preparation method thereof |
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