CN104384518B - The method of copper is covered on a kind of tungsten carbide carbon/carbon-copper composite material surface - Google Patents
The method of copper is covered on a kind of tungsten carbide carbon/carbon-copper composite material surface Download PDFInfo
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- CN104384518B CN104384518B CN201410580214.0A CN201410580214A CN104384518B CN 104384518 B CN104384518 B CN 104384518B CN 201410580214 A CN201410580214 A CN 201410580214A CN 104384518 B CN104384518 B CN 104384518B
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Abstract
The method of copper is covered on the surface that the invention discloses a kind of melting infiltration sintering tungsten carbide carbon/carbon-copper composite material, and its step is as follows: by the tungsten carbide powder of different-grain diameter, according to the spray-dried rear granulation of certain percentage by weight, die forming obtains skeleton pressed compact; The copper bar that oxygen-free copper is struck out to demand weight is as sintering and infiltration agent; Skeleton pressed compact and sintering and infiltration agent are stacked together, be placed in the graphite mo(u)ld coordinating with its cylindrical, in vacuum drying oven, be warmed up to 1250 DEG C and carry out sintering, temperature retention time is 1h, sintering obtains tungsten carbide copper alloy, and leaves the copper layer of 0.3 ~ 5mm thickness at alloy surface, sintering with cover copper and once complete, the Product jointing excellent performance obtaining, relative density reaches more than 99% after testing.
Description
Technical field
The invention belongs to metal material field, relate to the preparation technology of the immiscible alloy of two-phase, be specifically related to preparation method of tungsten carbide carbon/carbon-copper composite material and products thereof.
Background technology
Tungsten carbide copper powder metallurgy composite is by high-melting-point, the tungsten carbide of high rigidity and high conduction, the pseudo-alloy that the copper of high thermal conductivity forms, because it has good resistance to arc erosion, resistance fusion welding and high strength, the advantages such as high rigidity, be widely used as at present electrical contact material, electric resistance welding, spark machined and plasma electrode material, electrothermal alloy and heavy alloy, the military project material of specific use is (as rocket nozzle, aircraft larynx lining), and computer central processing system, the lead frame of large scale integrated circuit, the heat sink substrate of the electronic devices such as solid state microwave pipe.
Tungsten carbide, as a kind of important raw material of industry, is widely used in the industries such as surface peening, abrasive material, cutter. Because it has high hardness, density, fusing point, the difficulty in production and process is larger, conventionally adopts the method for powder metallurgy to prepare tungsten carbide parts. Therefore, the performance of tungsten-carbide powder has material impact to the performance of tungsten carbide series of products.
The tungsten carbide powder that tungsten carbide powder or interpolation is mixed with to a small amount of copper powder is made pressed compact, and infiltrated metal copper and tungsten carbide pressed compact are stacked together, then in reducing atmosphere or vacuum, and sintering at the temperature higher than copper fusing point. In sintering process, rely on capillarity, make the copper of melting infiltrate tungsten carbide skeleton. Sintering and infiltration can separately carry out, and also can be combined into an operation, but in advance sintered skeleton again the mode of infiltration can obtain the skeleton of higher-strength, make the more resistance to electrical arc erosion of this composite, infiltration density is generally 98% ~ 99% of solid density.
The present invention aims to provide a kind of new tungsten carbide carbon/carbon-copper composite material surface covers the method for copper, can obtain more than 99% relative density even complete fine and close, and hardness is high, the alloy conducting electricity very well.
Summary of the invention
The invention provides a kind of preparation method who has the tungsten carbide Cu alloy material that covers copper layer, can obtain that more than 99% relative density is even fully dense covers copper layer, and hardness is high, the alloy conducting electricity very well.
Step of the present invention is as follows:
(1) mix tungsten carbide powder: be 0.05 μ m by average grain diameter, 0.2 μ m, 1 μ m, 3 μ m, the ratio that the tungsten carbide powder of 8 μ m is 1:2:3:3:1 according to percentage by weight mixes, and the tungsten carbide powder mixing and copper is mixed, then add the spray-dried granulation of a certain amount of forming agent;
(2) tungsten carbide skeleton compacting: compressing in mould, pressing pressure 150 ~ 400MPa, obtains having the tungsten carbide skeleton pressed compact of various given shapes;
(3) copper bar that oxygen-free copper is struck out to demand weight is as sintering and infiltration agent;
(4) skeleton pressed compact and sintering and infiltration agent are stacked together, be placed in the graphite mo(u)ld coordinating with its cylindrical, in vacuum drying oven, be warmed up to 1250 DEG C and carry out sintering, temperature retention time is 1h, sintering obtains tungsten carbide copper alloy, and leave the copper layer of 0.3 ~ 5mm thickness at alloy surface, sintering with cover copper and once complete.
The weight ratio of the preferred tungsten carbide powder of step (1) and forming agent is 10:1;
Step (1) preferably forming agent is polyvinyl alcohol;
The preferred wherein quality percentage composition of tungsten carbide copper powder proportioning of step (4) is tungsten carbide 90 ~ 95wt%, copper 5 ~ 10wt%.
Usefulness of the present invention is:
1, on tungsten carbide copper product, once sintering completes that to cover copper be advantage of the present invention, adopts the method easy to operate, and whole preparation technology simply can control, cost;
2, adhere to certain thickness copper layer and improve the welding performance of tungsten carbide copper alloy by melting infiltration sintering tungsten carbide copper alloy surface;
3, it is full that the constraint of graphite mo(u)ld makes to cover copper layer;
4, alloy monolithic can obtain the more than 99% even fully dense effect of relative density.
Brief description of the drawings
Fig. 1 is the stacked configuration rough schematic of tungsten carbide skeleton pressed compact and copper bar.
Detailed description of the invention
Embodiment 1:
A preparation method who has the tungsten carbide Cu alloy material that covers copper layer, its step is as follows:
(1) mix tungsten carbide powder: be 0.05 μ m by average grain diameter, 0.2 μ m, 1 μ m, 3 μ m, the ratio that the tungsten carbide powder of 8 μ m is 1:2:3:3:1 according to percentage by weight mixes;
(2) tungsten carbide skeleton compacting: the tungsten carbide powder mixing and copper are mixed, wherein the percentage composition of alloy material is tungsten carbide 90wt%, copper 10wt%, add again after the spray-dried granulation of a certain amount of polyvinyl alcohol, compressing in mould, pressing pressure 150 ~ 400MPa, obtains having the tungsten carbide skeleton pressed compact of various given shapes;
(3) copper bar that oxygen-free copper is struck out to demand weight is as sintering and infiltration agent;
(4) skeleton pressed compact and sintering and infiltration agent are stacked together, be placed in the graphite mo(u)ld coordinating with its cylindrical, in vacuum drying oven, be warmed up to 1250 DEG C and carry out sintering, temperature retention time is 1h, sintering obtains tungsten carbide copper alloy, and leave the copper layer of 0.3 ~ 5mm thickness at alloy surface, sintering with cover copper and once complete.
The relative density of product reaches 100% after testing.
Embodiment 2:
A preparation method who has the tungsten carbide Cu alloy material that covers copper layer, its step is as follows:
(1) mix tungsten carbide powder: be 0.05 μ m by average grain diameter, 0.2 μ m, 1 μ m, 3 μ m, the ratio that the tungsten carbide powder of 8 μ m is 1:2:3:3:1 according to percentage by weight mixes;
(2) tungsten carbide skeleton compacting: the tungsten carbide powder mixing and copper are mixed, wherein the percentage composition of alloy material is tungsten carbide 96wt%, copper 4wt%, add again after the spray-dried granulation of a certain amount of stearic acid, compressing in mould, pressing pressure 150 ~ 400MPa, obtains having the tungsten carbide skeleton pressed compact of various given shapes;
(3) copper bar that oxygen-free copper is struck out to demand weight is as sintering and infiltration agent;
(4) skeleton pressed compact and sintering and infiltration agent are stacked together, be placed in the graphite mo(u)ld coordinating with its cylindrical, in vacuum drying oven, be warmed up to 1250 DEG C and carry out sintering, temperature retention time is 1h, sintering obtains tungsten carbide copper alloy, and leave the copper layer of 0.3 ~ 5mm thickness at alloy surface, sintering with cover copper and once complete.
The relative density of product reaches more than 99% after testing.
Embodiment 3:
A preparation method who has the tungsten carbide Cu alloy material that covers copper layer, its step is as follows:
(1) mix tungsten carbide powder: be 0.05 μ m by average grain diameter, 0.2 μ m, 1 μ m, 3 μ m, the ratio that the tungsten carbide powder of 8 μ m is 1:2:3:3:1 according to percentage by weight mixes;
(2) tungsten carbide skeleton compacting: the tungsten carbide powder mixing and copper are mixed, wherein the percentage composition of alloy material is tungsten carbide 98wt%, copper 2wt%, add again after the spray-dried granulation of a certain amount of polyvinyl alcohol, compressing in mould, pressing pressure 150 ~ 400MPa, obtains having the W skeleton pressed compact of various given shapes;
(3) copper bar that oxygen-free copper is struck out to demand weight is as sintering and infiltration agent;
(4) skeleton pressed compact and sintering and infiltration agent are stacked together, be placed in the graphite mo(u)ld coordinating with its cylindrical, in vacuum drying oven, be warmed up to 1250 DEG C and carry out sintering, temperature retention time is 1h, sintering obtains tungsten carbide copper alloy, and leave the copper layer of 0.3 ~ 5mm thickness at alloy surface, sintering with cover copper and once complete.
The relative density of product reaches more than 99% after testing.
Embodiment 4:
A preparation method who has the tungsten carbide Cu alloy material that covers copper layer, its step is as follows:
(1) mix tungsten carbide powder: be 0.05 μ m by average grain diameter, 0.2 μ m, 1 μ m, 3 μ m, the ratio that the tungsten carbide powder of 8 μ m is 1:2:3:3:1 according to percentage by weight mixes;
(2) tungsten carbide skeleton compacting: the tungsten carbide powder mixing and copper are mixed, wherein the percentage composition of alloy material is tungsten carbide 92wt%, copper 8wt%, add again after the spray-dried granulation of a certain amount of polyvinyl alcohol, compressing in mould, pressing pressure 150 ~ 400MPa, obtains having the W skeleton pressed compact of various given shapes;
(3) copper bar that oxygen-free copper is struck out to demand weight is as sintering and infiltration agent;
(4) skeleton pressed compact and sintering and infiltration agent are stacked together, be placed in the graphite mo(u)ld coordinating with its cylindrical, in vacuum drying oven, be warmed up to 1250 DEG C and carry out sintering, temperature retention time is 1h, sintering obtains tungsten carbide copper alloy, and leave the copper layer of 0.3 ~ 5mm thickness at alloy surface, sintering with cover copper and once complete.
The relative density of product reaches more than 99% after testing.
On tungsten carbide copper product, once sintering completes and covers copper technique simply can be controlled, cost; It is fuller that the constraint of graphite mo(u)ld also makes to cover copper layer. Technique of the present invention is significantly better than prior art, is a kind of method that copper is covered on outstanding brand-new tungsten carbide carbon/carbon-copper composite material surface.
The above; it is only preferably detailed description of the invention of the present invention; but protection scope of the present invention is not limited to this; any be familiar with those skilled in the art the present invention disclose technical scope in; be equal to replacement or changed according to technical scheme of the present invention and inventive concept thereof, within all should being encompassed in protection scope of the present invention.
Claims (1)
1. a preparation method who has the tungsten carbide Cu alloy material that covers copper layer, its step is as follows:
(1) mix tungsten carbide powder: be 0.05 μ m by average grain diameter, 0.2 μ m, 1 μ m, 3 μM, the ratio that the tungsten carbide powder of 8 μ m is 1:2:3:3:1 according to percentage by weight mixes;
(2) tungsten carbide skeleton compacting: the tungsten carbide powder mixing and copper powder are mixed, whereinThe mass percent of mixing is tungsten carbide powder 90wt%, copper powder 10wt%, then add a certain amount ofThe spray-dried granulation of polyvinyl alcohol after, compressing in mould, pressing pressure150～400MPa, obtains having the tungsten carbide skeleton pressed compact of various given shapes;
(3) copper bar that oxygen-free copper is struck out to demand weight is as sintering and infiltration agent;
(4) skeleton pressed compact and sintering and infiltration agent are stacked together, are placed on its cylindrical and coordinateGraphite mo(u)ld in, in vacuum drying oven, be warmed up to 1250 DEG C and carry out sintering, temperature retention time is 1h,Sintering obtains tungsten carbide copper alloy, and leaves the copper layer of 0.3～5mm thickness at alloy surface,Sintering with cover copper and once complete;
The relative density of product reaches 100% after testing.
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| CN105568209B (en) * | 2016-03-04 | 2018-04-27 | 西安理工大学 | A kind of in-situ authigenic gradient WC strengthens the preparation method of CuW composite materials |
| CN107619981B (en) * | 2017-08-23 | 2019-06-18 | 安泰天龙（宝鸡）钨钼科技有限公司 | A kind of the carbonization tungsten-copper alloy and preparation method of boracic |
| CN108893642A (en) * | 2018-06-25 | 2018-11-27 | 浙江立泰复合材料股份有限公司 | A kind of preparation method of contact material of vacuum switch |
| CN109609792A (en) * | 2018-12-17 | 2019-04-12 | 河源市凯源硬质合金有限公司 | A method of preparing tungsten-copper alloy |
| CN110823656A (en) * | 2019-11-06 | 2020-02-21 | 株洲硬质合金集团有限公司 | Preparation method of tungsten carbide mosaic sample |
| CN111621661A (en) * | 2020-06-09 | 2020-09-04 | 山东威尔斯通钨业有限公司 | Preparation method of tungsten carbide copper |
| CN115522090B (en) * | 2021-10-29 | 2023-07-18 | 山东威尔斯通钨业有限公司 | Method and treatment equipment for coating copper on surface of tungsten carbide copper composite material |
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| JP3764315B2 (en) * | 2000-02-10 | 2006-04-05 | 株式会社アライドマテリアル | Tungsten material and manufacturing method thereof |
| CN101515512B (en) * | 2009-03-30 | 2011-07-06 | 西安理工大学 | Method for preparing CuW/Y*O* multi-phase contact material |
| CN101707147B (en) * | 2009-12-08 | 2012-08-08 | 浙江省冶金研究院有限公司 | Cu WC/Cu composite material and preparation technology |
| CN102800420B (en) * | 2011-05-25 | 2015-03-04 | 河南科丰新材料有限公司 | Method for manufacturing copper-tungsten contact |
| CN103526060B (en) * | 2013-10-09 | 2016-06-22 | 昆明理工大学 | A kind of fast preparation method of copper-tungsten |
| CN103981389B (en) * | 2014-05-15 | 2016-06-15 | 厦门理工学院 | A kind of method that low-temperature sintering W skeleton prepares tungsten-copper alloy |
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Address after: 313219 Zhejiang city of Huzhou province Deqing County leidian town revitalization Road No. 7 Patentee after: Zhejiang Li Tai composite limited company Address before: 313000 Zhejiang city of Huzhou province Deqing County LEIDIAN Town Industrial Park Patentee before: Zhejiang Light-tough Composite Materials Co., Ltd. |
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Denomination of invention: A method of copper coating on WC-Cu composite Effective date of registration: 20210531 Granted publication date: 20160504 Pledgee: Zhejiang Deqing Rural Commercial Bank Co.,Ltd. leidian sub branch Pledgor: ZHEJIANG LIGHT-TOUGH COMPOSITE MATERIALS Co.,Ltd. Registration number: Y2021330000496 |
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