CN101572194A - Profiled high conductivity copper-tungsten electrical contact material and processing technique thereof - Google Patents
Profiled high conductivity copper-tungsten electrical contact material and processing technique thereof Download PDFInfo
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- CN101572194A CN101572194A CNA2009103022942A CN200910302294A CN101572194A CN 101572194 A CN101572194 A CN 101572194A CN A2009103022942 A CNA2009103022942 A CN A2009103022942A CN 200910302294 A CN200910302294 A CN 200910302294A CN 101572194 A CN101572194 A CN 101572194A
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Abstract
The invention discloses a profiled high conductivity copper-tungsten electrical contact material and a processing technique thereof. the processing technique is characterized by firstly choosing copper powder and tungsten powder with suitable granularity and mixing the powders according to a certain proportion; carrying out to-and-fro heat treatment, press forming and smashing on the mixed raw powder, then isostatically pressing a required shape and sintering the shape with electric sparks into copper tungsten blanks; lastly, carrying out vacuum infiltration on the prepared copper and the sintered blanks to ensure that copper can be totally infiltrated into the body during material production to produce the profiled high conductivity copper-tungsten electrical contact material with the porosity of less than 0.15%. The electrical contact produced by the contact material simplifies construction of electric switches, eliminates the dispersivity of the springs in the switches and greatly improves the reliability of components. The material is widely used in high temperature materials, electrical alloys for high voltage switches, electromachining electrodes, microelectronic materials and the like.
Description
Technical field
The present invention relates to electrical contact material in a kind of vacuum circuit-breaker, relate in particular to a kind of high-power no silver-bearing copper tungsten alloy contact material and processing technology thereof.
Background technology
Copper-tungsten is to serve as a kind of two phase structure pseudo-alloy of main composition with copper, W elements, it is metal-base composites, it combines the advantage of the big and copper conduction of the fusing point height, density of tungsten, good heat conductivity, make copper-tungsten have high temperature resistant, arc ablation resistance, intensity height, than characteristics such as great, conduction and good heat conductivity, this product is widely used in exotic material, used for high-voltage switch electrical alloy, edm electrode, microelectronic material etc., and parts of doing and components and parts are widely used in industries such as space flight, aviation, electronics, electric power, metallurgy.
Because metallic copper and tungsten physical difference are bigger, can not adopt fusion casting to produce, general now employing powder metallurgy technology obtains, and the technological process of adopting this method to produce copper-tungsten is: mixing, compression moulding, sintering and infiltration and cold working.Continuous progress along with society's science and technology, it is more and more obvious that the copper-tungsten material is made unitarily formed trend, as in the high-voltage switch gear industry, because the change of breaker structure, the arcing contact structure is improved to the self-operated type integral contact by fingertip and spring mechanism, construction of switch is obviously simplified, and eliminated the dispersiveness of switch medi-spring, increase substantially the reliability of parts.In the electrode industry electrode being made single piece brings very big progress to industry equally.
Make the copper-tungsten single piece at present both at home and abroad and mainly adopt following several method: soldering, electron beam welding, high temperature insostatic pressing (HIP) diffusion connection etc., these methods respectively have pluses and minuses, evidence, tungsten electrode is easily air-breathing when welding, can cause defectives such as weld seam slag inclusion, pore, reduce the bonding strength of commissure.Because the thermal impact in the welding process makes near the copper product of weld seam be in the annealing softening state, reduced the intensity and the elasticity of copper simultaneously, in addition, interface shape must be simple when welding, and complicated interface can't realize welding.It is big that high temperature insostatic pressing (HIP) connects technology investment, and technology is very complicated, and consistency is not high.Also can adopt the global copper tungsten alloy material to be processed into special-shaped contact in addition, processing cost height, long processing time like this, and also the wasting phenomenon of material is very serious.
Summary of the invention
The object of the invention is to provide a kind of good conduction of copper, heat conduction and chemical stability of making full use of, in conjunction with tungsten material high rigidity, high-melting-point, utilize effective sintering and infiltration technique between the tungsten particle simultaneously, make copper be full of the connection hole of material internal, this technology is not limited by the shape of blank, can be designed to various difform heterotypic materials according to actual needs.
The technical scheme that realizes the object of the invention is:
Profiled high conductivity copper-tungsten electrical contact material is made up of copper and tungsten, it is characterized in that: the content of copper is 8--17% in the material.
The processing technology of profiled high conductivity copper-tungsten electrical contact material:
At first select the copper powder and the tungsten powder of suitable particles degree to mix in proportion; Mixed raw meal is carried out repeatedly reciprocal heat treatment, compression moulding and fragmentation, the needed shape of isostatic compaction again, and electric spark sintering becomes the copper-tungsten blank; At last the blank behind ready copper and the sintering is carried out the vacuum infiltration, must high-power hard copper ferrotungsten composite electric contact material.
Above-mentioned heat treated temperature is 700 ℃ of 580--, and the time is 2--4 hour.
The pressure of above-mentioned compression moulding is 4.5~8.5 tons/square centimeter pressure.
The copper powder of above-mentioned employing is crossed 400 mesh sieves, and the particle of tungsten powder is between 3--6 μ m.
The weight ratio that above-mentioned copper powder and tungsten powder mix is 0.3--0.8: 99.7--99.2.
Adopting the content of copper in the profiled high conductivity copper-tungsten electrical contact material of above-mentioned explained hereafter is 8--17%.
The utility model compared with prior art has following advantage:
1. this electrical contact material is because to adopt tungsten be skeleton, has hardness height, characteristics that mar proof is good.
2. because material adopts copper product, the combination property height such as electric current breaking capacity, conductive capability and discontinuous current characteristic of the electrical contact of making are improved; Material in the cycle in useful life, the performance uniformity height.
3. adopt this contact material can be made into the special-shaped contact of different shape, simplify electrical switch structure, eliminated the dispersiveness of switch medi-spring, increase substantially the reliability of parts.
4. control the distance between the tungsten particle in the material by the granulating process of innovation and to the meticulous selection of technological parameter, solved the problem of forming materials difficulty and infiltration difficulty, in whole sintering process, need not to add sintering agent.
Technology by innovation when guaranteeing manufacture of materials copper infiltrate fully in the base substrate, produce porosity less than 0.15% electrical contact material.
Description of drawings
Fig. 1 is the process chart of profiled high conductivity copper-tungsten electrical contact material processing technology of the present invention
Embodiment
As can be seen from Figure 1, the course of processing of profiled high conductivity copper-tungsten electrical contact material is as follows:
At first copper powder is crossed 400 mesh sieves, selected the mixed of the tungsten powder of 3--6 μ m by weight 0.3--0.8: 99.7--99.2
To mixed raw meal under 580--620 ℃ temperature heat treatment 2--4 hour, with 4.5--8.5 ton/cm
2Pressure forming, fragmentation; Under 620--670 ℃ temperature heat treatment 2--4 hour again, with 6--8.5 ton/cm
2Pressure forming, fragmentation; Under 670--700 ℃ temperature, carried out heat treatment 2--4 hour for the third time, with 6--8.5 ton/cm
2Pressure forming, fragmentation; Last isostatic compaction becomes needed shape, and electric spark sintering becomes the copper-tungsten blank again.
Blank behind ready fine copper and the sintering is carried out the vacuum infiltration, make the content of copper reach 8--17%, the porosity that is made into different shape is less than 0.15% special-shaped copper tungsten electrical contact material.
Special-shaped copper tungsten electrical contact material major technique and performance index
Claims (6)
1. the processing technology of profiled high conductivity copper-tungsten electrical contact material is characterized in that: at first select the copper powder of suitable particles degree and tungsten powder to mix in proportion; Mixed raw meal is carried out repeatedly reciprocal heat treatment, compression moulding and fragmentation, the needed shape of isostatic compaction again, and electric spark sintering becomes the copper-tungsten blank; At last the blank behind ready copper and the sintering is carried out infiltration, must profiled high conductivity copper-tungsten electrical contact material.
2. processing technology according to claim 1 is characterized in that: above-mentioned heat treated temperature is 580--700 ℃, and the time is 2--4 hour.
3. processing technology according to claim 1 is characterized in that: the pressure of above-mentioned compression moulding is 4.5~8.5 tons/square centimeter pressure.
4. processing technology according to claim 1 is characterized in that: the copper powder of above-mentioned employing is crossed 400 mesh sieves, and the particle of tungsten powder is between 36--μ m.
5. processing technology according to claim 1 is characterized in that: the weight ratio that above-mentioned copper powder and tungsten powder mix is 0.3--0.8: 99.7--99.2.
6. profiled high conductivity copper-tungsten electrical contact material is made up of copper and tungsten, it is characterized in that: the content of weight of copper is 8--17%.
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CNA2009103022942A CN101572194A (en) | 2009-05-14 | 2009-05-14 | Profiled high conductivity copper-tungsten electrical contact material and processing technique thereof |
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CNA2009103022942A CN101572194A (en) | 2009-05-14 | 2009-05-14 | Profiled high conductivity copper-tungsten electrical contact material and processing technique thereof |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101807488A (en) * | 2010-04-21 | 2010-08-18 | 山东晨鸿电气有限公司 | Three-position device of vacuum interrupter |
CN102509663A (en) * | 2011-10-27 | 2012-06-20 | 福达合金材料股份有限公司 | Spark sintering process for contacts |
CN104715940A (en) * | 2013-12-16 | 2015-06-17 | 通用电气公司 | Monolithic contact system and method of forming |
WO2021047340A1 (en) * | 2019-09-12 | 2021-03-18 | 全球能源互联网研究院有限公司 | Carbon fiber composite copper-tungsten alloy material and preparation method therefor and use thereof |
CN113921310A (en) * | 2021-11-01 | 2022-01-11 | 西安西电高压开关有限责任公司 | Process manufacturing method of high-performance arc contact |
-
2009
- 2009-05-14 CN CNA2009103022942A patent/CN101572194A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101807488A (en) * | 2010-04-21 | 2010-08-18 | 山东晨鸿电气有限公司 | Three-position device of vacuum interrupter |
CN102509663A (en) * | 2011-10-27 | 2012-06-20 | 福达合金材料股份有限公司 | Spark sintering process for contacts |
CN102509663B (en) * | 2011-10-27 | 2016-01-06 | 福达合金材料股份有限公司 | A kind of technique of contact electric spark sintering |
CN104715940A (en) * | 2013-12-16 | 2015-06-17 | 通用电气公司 | Monolithic contact system and method of forming |
US10008341B2 (en) | 2013-12-16 | 2018-06-26 | General Electric Company | Monolithic contact system and method of forming |
CN104715940B (en) * | 2013-12-16 | 2019-03-15 | 通用电气公司 | Monolithic contact system and forming method |
WO2021047340A1 (en) * | 2019-09-12 | 2021-03-18 | 全球能源互联网研究院有限公司 | Carbon fiber composite copper-tungsten alloy material and preparation method therefor and use thereof |
CN113921310A (en) * | 2021-11-01 | 2022-01-11 | 西安西电高压开关有限责任公司 | Process manufacturing method of high-performance arc contact |
CN113921310B (en) * | 2021-11-01 | 2024-03-26 | 西安西电高压开关有限责任公司 | Technological manufacturing method of arc contact |
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Open date: 20091104 |