CN104363713A - Method for manufacturing high-heat-dissipativity LED baseplate - Google Patents
Method for manufacturing high-heat-dissipativity LED baseplate Download PDFInfo
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- CN104363713A CN104363713A CN201410613251.7A CN201410613251A CN104363713A CN 104363713 A CN104363713 A CN 104363713A CN 201410613251 A CN201410613251 A CN 201410613251A CN 104363713 A CN104363713 A CN 104363713A
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- copper foil
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Abstract
The invention discloses a method for manufacturing a high-heat-dissipativity LED baseplate. The method includes the steps of raw material selection, hole drilling, film pasting, exposing, developing, copper column electroplating, film striping, copper foil electroplating, line manufacturing, solder mask printing, surface processing, shape cutting, cleaning and packaging. The high-heat-dissipativity LED baseplate manufactured by the method is high in heat dissipation speed and good in electroconductive performance and can transmit heat generated by an electronic element to a lower-layer copper foil through an upper-layer copper foil and inner-layer copper columns, heat dissipation of the electronic element is accelerated, environmental temperature of the electronic element is maintained within a low range, and performance of the electronic element is guaranteed.
Description
Technical field
The present invention relates to a kind of manufacture method of high-heat-dispersion LED substrate, belong to LED technology field.
Background technology
LED is a kind of novel semi-conductor solid light source, have that security reliability is strong, power consumption is few, luminous efficiency is high, applicability is strong, good stability, response time are short, color changeable, be conducive to the advantages such as environmental protection, its performance is just constantly perfect, is widely used in illumination, the fields such as display.
Although LED has many merits, LED be made commercially can be widely used and still there are problems, wherein LED heat radiation is wherein one of problem.LED chip can produce a large amount of heats equally in the middle of use procedure, especially LED is point-like illuminating source, the heat produced concentrates in minimum region, if the heat produced cannot distribute timely and effectively, the junction temperature that PN can be caused to tie raises, thus speed-up chip and potting resin is aging, solder joint also may be caused to melt, make chip failure, and then directly affect useful life and the luminous efficiency of LED, particularly great power LED, in use produced heat is larger, require higher to heat dissipation technology, can say that LED heat dissipation problem is directly connected to its development prospect, therefore the heat-sinking capability of LED product will be promoted, crucial being still searches out a kind of method can accelerating LED heat radiation.
In order to solve LED heat dissipation problem, existing many technical schemes at present, but the basic difference of its general principle is little.The heat produced of LED chip, passes mainly through three kinds of paths, and these three kinds of paths comprise, upwards radiation, downwards conduction and sideways conduction.In order to ensure LED chip light extraction efficiency upwards, generally select silica gel to carry out packaged LED chip, but its thermal resistance is very large, therefore heat upwards radiation is little, so, only have the heat considering that two other path produces to conduct LED.Correlation theory and experiment show, the heat that LED chip produces mainly conducts downwards in heat-conducting substrate, and the cross conduction of heat is limited.
Summary of the invention
The object of the invention is to overcome current LED heat-radiating substrate to dispel the heat bad shortcoming, a kind of manufacture method of high-heat-dispersion LED substrate, with the LED-baseplate preparing rapid heat dissipation, conduct electricity very well, greatly improve the useful life and the properties of product that use this LED-baseplate to make the electronic component of carrier.
For achieving the above object, present invention employs following technical proposals: a kind of manufacture method of high-heat-dispersion LED substrate, comprise raw material selection, boring, pad pasting, exposure, development, electro-coppering post, move back film, electro copper foil, making circuit, the printing step such as solder resist, surface treatment, its detailed step is as follows:
Raw material: selection glass transition temperature is the organic resin substrate of 140-270 DEG C, and the upper and lower surface of described organic resin substrate is covered with copper film;
Boring: use mechanical drilling method to bore the via running through its thickness direction that multiple diameter is 0.10-4.00mm on organic resin substrate;
Pad pasting, exposure, development: dry film is pasted to organic resin substrate, then uses film aligning, exposure machine exposes, and makes dry film on organic resin substrate expose via, to meet follow-up requirements of process;
Electro-coppering post: filling perforation plating is carried out to organic resin substrate; Electroplated by filling perforation and make in time to be covered with copper in the via of organic resin substrate, the circular copper post of row;
Move back film: film process is moved back to organic resin substrate, the surperficial dry film of organic resin plate copper-clad plate is decorporated;
Electro copper foil: in upper surface and the lower surface copper facing of organic resin substrate, forming thickness is respectively upper strata Copper Foil and lower floor's Copper Foil of 12-36um, and wherein, upper strata Copper Foil is connected by copper post with lower floor Copper Foil; The thickness of electro copper foil also can regulate as required.
Make circuit: on upper strata Copper Foil and lower floor's Copper Foil, make circuit according to different demand;
Welding resistance and indicate process: printing-ink on lower floor's copper foil surface, then carries out exposing, develop, solidifies, formation solder mask;
Surface treatment: form nickel dam at the plating nickel on surface of upper strata Copper Foil and lower floor's Copper Foil, nickel dam is outer silver-plated or golden;
Cutting: semi-finished product are cut into the size needed for client;
Cleaning: carry out clean at the semi-finished product of well cutting, does blasting treatment or washing process according to different customer requirement, makes its surface clean, light;
Eventually inspection: by the LED-baseplate of having cleaned according to the inspection specification inspection of enterprise, then LED-baseplate classified according to different-thickness, the finished product after this technique completes is high-heat-dispersion LED substrate;
Packaging: finished product high-heat-dispersion LED substrate is done vacuum packaging, hands over finished bin keeping.
Technique effect of the present invention: by arranging the copper post running through its thickness direction on organic resin substrate, improve the heat dispersion of organic resin substrate itself, copper post connects upper strata Copper Foil and lower floor's Copper Foil and improves heat dispersion between upper strata Copper Foil and lower floor's Copper Foil, thus ensures that LED-baseplate can meet the instructions for use of high heat dissipation technology as the support plate of electronic component in the application of reality.In actual application, because upper strata Copper Foil is connected with electronic component, electronic component generates heat, by the copper post of upper strata Copper Foil and internal layer, heat is passed to lower floor's Copper Foil, accelerate the heat radiation of electronic component, under making the ambient temperature of electronic component maintain a lower environment, ensure that the performance of electronic component.
Accompanying drawing explanation
Fig. 1 is process chart of the present invention;
Fig. 2 is the structural representation of LED-baseplate of the present invention.
1. organic resin substrates in figure; 2. upper strata Copper Foil; 3. lower floor's Copper Foil; 4. copper post; 5. solder mask; 6. nickel dam; 7. layer of precious metal.
Embodiment
For the ease of understanding, illustrate the present invention further below in conjunction with preferred embodiment.
embodiment 1
As shown in Figure 1, a kind of manufacture method of high-heat-dispersion LED substrate, its step is as follows:
S1 raw material: selection glass transition temperature is the organic resin substrate (1) of 200 DEG C, and the upper and lower surface of described organic resin substrate (1) is covered with copper film;
S2 holes: use mechanical drilling method to be the via running through its thickness direction of 0.20mm at upper brill 4 diameters of every square millimeter of organic resin substrate (1);
S3 pad pasting, exposure, development: dry film is pasted to organic resin substrate (1), then uses film aligning, exposure machine exposes, and makes the upper dry film of organic resin substrate (1) expose via, to meet follow-up requirements of process;
S4 electro-coppering post: filling perforation plating is carried out to organic resin substrate (1); Electroplated by filling perforation and make in time to be covered with copper in the via of organic resin substrate (1), the circular copper post (4) of row;
S5 moves back film: move back film process to organic resin substrate (1), and the surperficial dry film of organic resin plate copper-clad plate is decorporated;
S6 electro copper foil: in upper surface and the lower surface copper facing of organic resin substrate (1), forming thickness is respectively upper strata Copper Foil (2) and lower floor's Copper Foil (3) of 24um, and wherein, upper strata Copper Foil is connected by copper post (4) with lower floor Copper Foil;
S7 makes circuit: on upper strata Copper Foil (2) and lower floor's Copper Foil (3), make circuit according to different demand;
S8 welding resistance and indicate process: at lower floor's Copper Foil (3) printing-ink on the surface, then carry out exposing, develop, solidify, formation solder mask (5), Main Function is welding resistance and MARK sign;
S9 surface treatment: form nickel dam (6) at the plating nickel on surface of upper strata Copper Foil (2) and lower floor's Copper Foil (3), and gold-plated formation layer of precious metal (7), ensure that the good nation in crystal bonding area and routing district is qualitative;
S10: cutting: semi-finished product are cut into the size needed for client;
S11 cleans: carry out clean at the semi-finished product of well cutting, blasting treatment makes its surface clean, light;
S12 is inspection eventually: by the LED-baseplate of having cleaned according to the inspection specification inspection of enterprise, then LED-baseplate classified according to different-thickness, the finished product after this technique completes is high-heat-dispersion LED substrate;
S13 packs: finished product high-heat-dispersion LED substrate is done vacuum packaging, hands over finished bin keeping.
Manufacture the structure of gained high-heat-dispersion LED substrate as shown in Figure 2, it comprises organic resin substrate (1), described organic resin substrate (1) is provided with the copper post (4) running through its thickness direction, the upper surface of described organic resin substrate (1) is covered with upper strata Copper Foil (2), the lower surface of described organic resin substrate is covered with lower floor's Copper Foil (3), and described copper post (4) connects upper strata Copper Foil (2) and lower floor's Copper Foil (3).There is solder mask (5) on described lower floor Copper Foil (3) surface, and there is nickel dam (6) on described upper strata Copper Foil (2) and lower floor's Copper Foil (3) surface, and nickel dam has layer gold outside (6).
embodiment 2
As shown in Figure 1, a kind of manufacture method of high-heat-dispersion LED substrate, its step is as follows:
S1 raw material: selection glass transition temperature is the organic resin substrate (1) of 140 DEG C, and the upper and lower surface of described organic resin substrate (1) is covered with copper film;
S2 holes: as required, uses mechanical drilling method at the upper via running through its thickness direction boring some diameter 4.00mm of organic resin substrate (1);
S3 pad pasting, exposure, development: dry film is pasted to organic resin substrate (1), then uses film aligning, exposure machine exposes, and makes the upper dry film of organic resin substrate (1) expose via, to meet follow-up requirements of process;
S4 electro-coppering post: filling perforation plating is carried out to organic resin substrate (1); Electroplated by filling perforation and make in time to be covered with copper in the via of organic resin substrate (1), the circular copper post (4) of row;
S5 moves back film: move back film process to organic resin substrate (1), and the surperficial dry film of organic resin plate copper-clad plate is decorporated;
S6 electro copper foil: in upper surface and the lower surface copper facing of organic resin substrate (1), forming thickness is respectively upper strata Copper Foil (2) and lower floor's Copper Foil (3) of 12um, and wherein, upper strata Copper Foil is connected by copper post (4) with lower floor Copper Foil;
S7 makes circuit: on upper strata Copper Foil (2) and lower floor's Copper Foil (3), make circuit according to different demand;
S8 welding resistance and indicate process: at lower floor's Copper Foil (3) printing-ink on the surface, then carry out exposing, develop, solidify, formation solder mask (5), Main Function is welding resistance and MARK sign;
S9 surface treatment: form nickel dam (6) at the plating nickel on surface of upper strata Copper Foil (2) and lower floor's Copper Foil (3), and silver-plated formation layer of precious metal (7), ensure that the good nation in crystal bonding area and routing district is qualitative;
S10: cutting: semi-finished product are cut into the size needed for client;
S11 cleans: carry out clean at the semi-finished product of well cutting, and washing makes its surface clean, light;
S12 is inspection eventually: by the LED-baseplate of having cleaned according to the inspection specification inspection of enterprise, then LED-baseplate classified according to different-thickness, the finished product after this technique completes is high-heat-dispersion LED substrate;
S13 packs: finished product high-heat-dispersion LED substrate is done vacuum packaging, hands over finished bin keeping.
embodiment 3
As shown in Figure 1, a kind of manufacture method of high-heat-dispersion LED substrate, its step is as follows:
S1 raw material: selection glass transition temperature is the organic resin substrate (1) of 270 DEG C, and the upper and lower surface of described organic resin substrate (1) is covered with copper film;
S2 holes: as required, uses mechanical drilling method to be the via running through its thickness direction of 0.10mm at the some diameters of the upper brill of organic resin substrate (1);
S3 pad pasting, exposure, development: dry film is pasted to organic resin substrate (1), then uses film aligning, exposure machine exposes, and makes the upper dry film of organic resin substrate (1) expose via, to meet follow-up requirements of process;
S4 electro-coppering post: filling perforation plating is carried out to organic resin substrate (1); Electroplated by filling perforation and make in time to be covered with copper in the via of organic resin substrate (1), the circular copper post (4) of row;
S5 moves back film: move back film process to organic resin substrate (1), and the surperficial dry film of organic resin plate copper-clad plate is decorporated;
S6 electro copper foil: in upper surface and the lower surface copper facing of organic resin substrate (1), forming thickness is respectively upper strata Copper Foil (2) and lower floor's Copper Foil (3) of 36um, and wherein, upper strata Copper Foil is connected by copper post (4) with lower floor Copper Foil;
S7 makes circuit: on upper strata Copper Foil (2) and lower floor's Copper Foil (3), make circuit according to different demand;
S8 welding resistance and indicate process: at lower floor's Copper Foil (3) printing-ink on the surface, then carry out exposing, develop, solidify, formation solder mask (5), Main Function is welding resistance and MARK sign;
S9 surface treatment: form nickel dam (6) at the plating nickel on surface of upper strata Copper Foil (2) and lower floor's Copper Foil (3), and first silver-plated gold-plated formation layer of precious metal (7) again, ensure that the good nation in crystal bonding area and routing district is qualitative;
S10: cutting: semi-finished product are cut into the size needed for client;
S11 cleans: carry out clean at the semi-finished product of well cutting, blasting treatment makes its surface clean, light;
S12 is inspection eventually: by the LED-baseplate of having cleaned according to the inspection specification inspection of enterprise, then LED-baseplate classified according to different-thickness, the finished product after this technique completes is high-heat-dispersion LED substrate;
S13 packs: finished product high-heat-dispersion LED substrate is done vacuum packaging, hands over finished bin keeping.
embodiment 4
Be with the difference of embodiment 1: organic resin substrate (1) is upper bores the via running through its thickness direction that some diameters are 0.15mm.
embodiment 5
Be with the difference of embodiment 1: organic resin substrate (1) is upper bores the via running through its thickness direction that some diameters are 0.30mm, and the thickness of the upper and lower layer Copper Foil of plating is 18um.
Embodiment 6
Be with the difference of embodiment 2: adopt machine drilling method at the upper via boring some diameter 2.00mm of organic resin substrate (1).
In practical application; quantity, the diameter and distribution of via all can regulate as required; the surface of the organic resin substrate (1) described in the present invention is covered with copper film; those skilled in the art also can select the resin substrate without copper film; or the substrate of other types, all should think the protection range belonging to present inventive concept.
Claims (2)
1. a manufacture method for high-heat-dispersion LED substrate, it is characterized in that comprising raw material selection, boring, pad pasting, exposure, development, electro-coppering post, move back film, electro copper foil, making circuit, printing solder resist, surface treatment step; Described drill process is: use the via running through its thickness direction that mechanical drilling method drill diameter on organic resin substrate is 0.10-4.00mm; Described electro-coppering post step is: carry out filling perforation plating to organic resin substrate; Electroplated by filling perforation and make in time to be covered with copper in the via of organic resin substrate, the circular copper post of row.
2. the manufacture method of high-heat-dispersion LED substrate according to claim 1, is characterized in that step is as follows:
Raw material: selection glass transition temperature is the organic resin substrate of 140-270 DEG C, and the upper and lower surface of described organic resin substrate is covered with copper film;
Boring: use mechanical drilling method to bore the via running through its thickness direction that some diameters are 0.10-4.00mm on organic resin substrate;
Pad pasting, exposure, development: dry film is pasted to organic resin substrate, then uses film aligning, exposure machine exposes, and makes dry film on organic resin substrate expose via, to meet follow-up requirements of process;
Electro-coppering post: filling perforation plating is carried out to organic resin substrate; Electroplated by filling perforation and make in time to be covered with copper in the via of organic resin substrate, the circular copper post of row;
Move back film: film process is moved back to organic resin substrate, the surperficial dry film of organic resin plate copper-clad plate is decorporated;
Electro copper foil: in upper surface and the lower surface copper facing of organic resin substrate, respectively upper strata Copper Foil and lower floor's Copper Foil, wherein, upper strata Copper Foil is connected by copper post with lower floor Copper Foil;
Make circuit: on upper strata Copper Foil and lower floor's Copper Foil, make circuit according to different demand;
Welding resistance and indicate process: printing-ink on lower floor's copper foil surface, then carries out exposing, develop, solidifies, formation solder mask;
Surface treatment: form nickel dam at the plating nickel on surface of upper strata Copper Foil and lower floor's Copper Foil, nickel dam is outer silver-plated or golden;
Cutting: semi-finished product are cut into the size needed for client;
Cleaning: carry out clean at the semi-finished product of well cutting, does blasting treatment or washing process according to different customer requirement, makes its surface clean, light;
Finally check, pack.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410613251.7A CN104363713A (en) | 2014-11-05 | 2014-11-05 | Method for manufacturing high-heat-dissipativity LED baseplate |
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| CN201410613251.7A CN104363713A (en) | 2014-11-05 | 2014-11-05 | Method for manufacturing high-heat-dissipativity LED baseplate |
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Cited By (4)
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| CN107994106A (en) * | 2017-08-02 | 2018-05-04 | 宏齐光电子(深圳)有限公司 | A kind of LED encapsulation PCB substrate for spraying tin and its spray tin surfaces processing method |
| CN108200715A (en) * | 2018-01-16 | 2018-06-22 | 上海三菱电机·上菱空调机电器有限公司 | A kind of printed wiring board and its manufacturing method |
| CN114361314A (en) * | 2022-01-10 | 2022-04-15 | 东莞市友辉光电科技有限公司 | Manufacturing method of glass-based MINI LED backlight substrate |
| CN114434894A (en) * | 2022-02-21 | 2022-05-06 | 江西柔顺科技有限公司 | Copper foil graphite film and preparation method thereof |
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