CN104363707A - Method for manufacturing high-heat-dissipativity LED baseplate - Google Patents
Method for manufacturing high-heat-dissipativity LED baseplate Download PDFInfo
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- CN104363707A CN104363707A CN201410613277.1A CN201410613277A CN104363707A CN 104363707 A CN104363707 A CN 104363707A CN 201410613277 A CN201410613277 A CN 201410613277A CN 104363707 A CN104363707 A CN 104363707A
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Abstract
The invention discloses a method for manufacturing a high-heat-dissipativity LED baseplate. The method includes the steps of raw material selection, windowing, laser drilling, hole-filling electroplating, whole plate electroplating, line manufacturing, solder mask printing, surface processing, shape cutting, cleaning and packaging. The high-heat-dissipativity LED baseplate manufactured by the method is high in heat dissipation speed and good in electroconductive performance and can transmit heat generated by an electronic element to a lower-layer copper foil through an upper-layer copper foil and inner-layer copper columns, heat dissipation of the electronic element is accelerated, environmental temperature of the electronic element is maintained within a low range, and performance of the electronic element is guaranteed.
Description
Technical field
The present invention relates to a kind of manufacture method of high-heat-dispersion LED substrate, belong to LED technology field.
Background technology
LED is a kind of novel semi-conductor solid light source, have that security reliability is strong, power consumption is few, luminous efficiency is high, applicability is strong, good stability, response time are short, color changeable, be conducive to the advantages such as environmental protection, its performance is just constantly perfect, is widely used in illumination, the fields such as display.
Although LED has many merits, LED be made commercially can be widely used and still there are problems, wherein LED heat radiation is wherein one of problem.LED chip can produce a large amount of heats equally in the middle of use procedure, especially LED is point-like illuminating source, the heat produced concentrates in minimum region, if the heat produced cannot distribute timely and effectively, the junction temperature that PN can be caused to tie raises, thus speed-up chip and potting resin is aging, solder joint also may be caused to melt, make chip failure, and then directly affect useful life and the luminous efficiency of LED, particularly great power LED, in use produced heat is larger, require higher to heat dissipation technology, can say that LED heat dissipation problem is directly connected to its development prospect, therefore the heat-sinking capability of LED product will be promoted, crucial being still searches out a kind of method can accelerating LED heat radiation.
In order to solve LED heat dissipation problem, existing many technical schemes at present, but the basic difference of its general principle is little.The heat produced of LED chip, passes mainly through three kinds of paths, and these three kinds of paths comprise, upwards radiation, downwards conduction and sideways conduction.In order to ensure LED chip light extraction efficiency upwards, generally select silica gel to carry out packaged LED chip, but its thermal resistance is very large, therefore heat upwards radiation is little, so, only have the heat considering that two other path produces to conduct LED.Correlation theory and experiment show, the heat that LED chip produces mainly conducts downwards in heat-conducting substrate, and the cross conduction of heat is limited.
Summary of the invention
The object of the invention is to overcome current LED heat-radiating substrate to dispel the heat bad shortcoming, a kind of manufacture method of high-heat-dispersion LED substrate, with the LED-baseplate preparing rapid heat dissipation, conduct electricity very well, greatly improve the useful life and the properties of product that use this LED-baseplate to make the electronic component of carrier.
For achieving the above object, present invention employs following technical proposals: a kind of manufacture method of high-heat-dispersion LED substrate, its step is as follows:
A. raw material: select the organic resin copper-clad plate that heat resistance is higher, the thickness that organic resin copper-clad plate comprises middle resin bed and upper and lower surface is the Copper Foil of 12-36um, prioritizing selection glass transition temperature is as Selection parameter, and resin bed glass transition temperature is 140-270 DEG C;
B. window: dry film is pasted to organic resin copper-clad plate, then film aligning is used, exposure machine exposes, make copper face organic resin copper-clad plate being exposed bore position, then cross etching line surface copper facet etch is fallen, then carry out moving back film process, the surperficial dry film of organic resin plate copper-clad plate is decorporated;
C. laser drill: use method for drilling holes drilling blind hole in organic resin copper-clad plate, blind hole runs through the resin bed of organic resin copper-clad plate along the thickness direction of organic resin copper-clad plate, and hole inner bottom surface is the copper-clad surface of organic resin copper-clad plate;
D. filling perforation plating: filling perforation plating is carried out to organic resin copper-clad plate; Electroplated by filling perforation and make in time to be covered with copper in the blind hole of organic resin copper-clad plate, the circular copper post of row;
E. whole plate plating: whole plate plating is carried out to organic resin copper-clad plate, make upper surface and the lower surface copper facing of organic resin copper-clad plate, copper plate and original Copper Foil form upper strata Copper Foil, lower floor's Copper Foil respectively, and wherein, upper strata Copper Foil is connected by copper post with lower floor Copper Foil;
F. circuit is made: on upper strata Copper Foil and lower floor's Copper Foil, make circuit according to different demand;
G. welding resistance and indicate process: printing-ink on lower floor's copper foil surface, then carry out exposing, develop, solidify, formation solder mask, Main Function is welding resistance and MARK sign;
H. surface treatment: form nickel dam at the plating nickel on surface of upper strata Copper Foil and lower floor's Copper Foil, and gold-plated or silver-colored formation layer of precious metal, ensure that the good nation in crystal bonding area and routing district is qualitative;
I. cut: semi-finished product are cut into the size needed for client;
J. clean: carry out clean at the semi-finished product of well cutting, blasting treatment makes its surface clean, light;
K. eventually inspection: by the LED-baseplate of having cleaned according to the inspection specification inspection of enterprise, then LED-baseplate classified according to different-thickness, the finished product after this technique completes is high-heat-dispersion LED substrate;
L. pack: finished product high-heat-dispersion LED substrate is done vacuum packaging, hand over finished bin keeping.
As preferably, in described step c, according to application requirement, the diameter of blind hole is 0.10-4.0mm.
Technique effect of the present invention: by arranging the copper post running through its thickness direction in organic resin copper-clad plate, improve the heat dispersion of organic resin copper-clad plate itself, copper post connects upper strata Copper Foil and lower floor's Copper Foil and improves heat dispersion between upper strata Copper Foil and lower floor's Copper Foil, thus ensures that LED-baseplate can meet the instructions for use of high heat dissipation technology as the support plate of electronic component in the application of reality.In actual application, because upper strata Copper Foil is connected with electronic component, electronic component generates heat, by the copper post of upper strata Copper Foil and internal layer, heat is passed to lower floor's Copper Foil, accelerate the heat radiation of electronic component, under making the ambient temperature of electronic component maintain a lower environment, ensure that the performance of electronic component.
Accompanying drawing explanation
Fig. 1 is process chart of the present invention;
Fig. 2 is the structural representation of LED-baseplate of the present invention.
1. organic resin copper-clad plates in figure; 2. upper strata Copper Foil; 3. lower floor's Copper Foil; 4. copper post; 5. solder mask; 6. nickel dam; 7. layer of precious metal.
Embodiment
For the ease of understanding, illustrate the present invention further below in conjunction with preferred embodiment.
Embodiment 1
As shown in Figure 1, the manufacture method of a kind of high heat radiation organic resin copper-clad plate, its step is as follows:
S1 raw material: select the organic resin copper-clad plate (1) that heat resistance is higher, the thickness that organic resin copper-clad plate (1) comprises middle resin bed and upper and lower surface is the Copper Foil of 24um, and glass transition temperature is 220 DEG C;
S2 windows: paste dry film to organic resin copper-clad plate (1), then film aligning is used, exposure machine exposes, make copper face organic resin copper-clad plate (1) being exposed bore position, then cross etching line surface copper facet etch is fallen, then carry out moving back film process, the surperficial dry film of organic resin plate copper-clad plate (1) is decorporated;
S3 laser drill: at organic resin copper-clad plate (1) upper use method for drilling holes drilling blind hole, blind hole runs through the resin bed of organic resin copper-clad plate (1) along the thickness direction of organic resin copper-clad plate (1), hole inner bottom surface is the copper-clad surface of organic resin copper-clad plate (1), the quantity of described blind hole is 4 every square millimeter, and diameter is 0.2mm;
S4 filling perforation is electroplated: carry out filling perforation plating to organic resin copper-clad plate (1); Electroplated by filling perforation and make in time to be covered with copper in the blind hole of organic resin copper-clad plate (1), the circular copper post (4) of row;
The whole plate of S5 is electroplated: carry out whole plate plating to organic resin copper-clad plate (1), make upper surface and the lower surface copper facing of organic resin copper-clad plate (1), thickness of coated copper layer is 36um, copper plate and original Copper Foil form upper strata Copper Foil (2), lower floor's Copper Foil (3) respectively, wherein, upper strata Copper Foil (2) is connected by copper post with lower floor's Copper Foil (3);
S6 makes circuit: on upper strata Copper Foil (2) and lower floor's Copper Foil (3), make circuit according to different demand;
S7 welding resistance and indicate process: at lower floor's Copper Foil (3) printing-ink on the surface, then carry out exposing, develop, solidify, formation solder mask (5), Main Function is welding resistance and MARK sign;
S8 surface treatment: form nickel dam (6) at the plating nickel on surface of upper strata Copper Foil (2) and lower floor's Copper Foil (3), and gold-plated formation layer of precious metal (7), ensure that the good nation in crystal bonding area and routing district is qualitative;
S9 cuts: semi-finished product are cut into the size needed for client;
S10 cleans: carry out clean at the semi-finished product of well cutting, blasting treatment makes its surface clean, light;
S11 is inspection eventually: by the LED-baseplate of having cleaned according to the inspection specification inspection of enterprise, then LED-baseplate classified according to different-thickness, the finished product after this technique completes is high-heat-dispersion LED substrate;
S12 packs: finished product high-heat-dispersion LED substrate is done vacuum packaging, hands over finished bin keeping.
Manufacture the structure of gained high-heat-dispersion LED substrate as shown in Figure 2, it comprises the resin bed of organic resin coating copper coin (1), described resin bed is provided with the copper post (4) running through its thickness direction, the upper surface of described resin bed is covered with upper strata Copper Foil (2), the lower surface of described resin bed is covered with lower floor's Copper Foil (3), and described copper post (4) connects upper strata Copper Foil (2) and lower floor's Copper Foil (3).There is solder mask (5) on described lower floor Copper Foil (3) surface, and there is nickel dam (6) on described upper strata Copper Foil (2) and lower floor's Copper Foil (3) surface, and nickel dam has layer gold outside (6).
Embodiment 2
Be with the difference of embodiment 1, in step S1, organic resin copper-clad plate (1) comprises the thickness of middle resin bed and upper and lower surface is the Copper Foil of 12um, and glass transition temperature is 140 DEG C; In step S5, thickness of coated copper layer is 18um.
Embodiment 3
Be with the difference of embodiment 1, in step S1, organic resin copper-clad plate (1) comprises the thickness of middle resin bed and upper and lower surface is the Copper Foil of 36um, and glass transition temperature is 270 DEG C; In step S3, the quantity of described blind hole is 9 every square millimeter, and diameter is 0.1mm; In step S5, thickness of coated copper layer is 64um.
Embodiment 4
Being with the difference of embodiment 1, in step S3, according to client's needs, is the blind hole of 4.00mm at the some diameters of the upper brill of organic resin copper-clad plate (1).
Embodiment 5
Being with the difference of embodiment 1, in step S3, according to client's needs, is the blind hole of 0.15mm at the some diameters of the upper brill of organic resin copper-clad plate (1).
Embodiment 6
In step S3, according to client's needs, be the blind hole of 1.50mm at the some diameters of the upper brill of organic resin copper-clad plate (1).
Embodiment 7
Be with the difference of embodiment 1, in step S8, by gold-plated make into silver-plated.
Embodiment 8
Be with the difference of embodiment 1, in step S8, made into first plate one deck silver plated one deck gold again by gold-plated.
Claims (3)
1. a manufacture method for high-heat-dispersion LED substrate, is characterized in that step is as follows:
Raw material: select the organic resin copper-clad plate that heat resistance is higher, the thickness that organic resin copper-clad plate comprises middle resin bed and upper and lower surface is the Copper Foil of 12-36um, and resin bed glass transition temperature is 140 ° of C-270 ° of C;
Window: paste dry film to organic resin copper-clad plate, then use film aligning, exposure machine exposes, make copper face organic resin copper-clad plate being exposed bore position, then cross etching line surface copper facet etch is fallen, then carry out moving back film process, the surperficial dry film of organic resin plate copper-clad plate is decorporated;
Laser drill: use method for drilling holes drilling blind hole in organic resin copper-clad plate, blind hole runs through the resin bed of organic resin copper-clad plate along the thickness direction of organic resin copper-clad plate, and hole inner bottom surface is the copper-clad surface of organic resin copper-clad plate;
Filling perforation is electroplated: carry out filling perforation plating to organic resin copper-clad plate; Electroplated by filling perforation and make in time to be covered with copper in the blind hole of organic resin copper-clad plate, the circular copper post of row;
Whole plate plating: carry out whole plate plating to organic resin copper-clad plate, make upper surface and the lower surface copper facing of organic resin copper-clad plate, copper plate and original Copper Foil form upper strata Copper Foil, lower floor's Copper Foil respectively, wherein, upper strata Copper Foil is connected by copper post with lower floor Copper Foil;
Make circuit: on upper strata Copper Foil and lower floor's Copper Foil, make circuit according to different demand;
Welding resistance and indicate process: printing-ink on lower floor's copper foil surface, then carry out exposing, develop, solidify, formation solder mask, Main Function is welding resistance and MARK sign;
Surface treatment: form nickel dam at the plating nickel on surface of upper strata Copper Foil and lower floor's Copper Foil, and gold-plated or silver-colored formation layer of precious metal, ensure that the good nation in crystal bonding area and routing district is qualitative;
Cutting: semi-finished product are cut into the size needed for client;
Cleaning: carry out clean at the semi-finished product of well cutting, blasting treatment makes its surface clean, light;
Eventually inspection: by the LED-baseplate of having cleaned according to the inspection specification inspection of enterprise, then LED-baseplate classified according to different-thickness, the finished product after this technique completes is high-heat-dispersion LED substrate;
Packaging: finished product high-heat-dispersion LED substrate is done vacuum packaging, hands over finished bin keeping.
2. the manufacture method of high-heat-dispersion LED substrate according to claim 1, is characterized in that in described step c, and the diameter of blind hole is 0.10-4.00mm.
3. the manufacture method of high-heat-dispersion LED substrate according to claim 1, is characterized in that in described step c, and the diameter of blind hole is 0.20mm, and every square millimeter is bored 4 blind holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410613277.1A CN104363707A (en) | 2014-11-05 | 2014-11-05 | Method for manufacturing high-heat-dissipativity LED baseplate |
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| CN201410613277.1A CN104363707A (en) | 2014-11-05 | 2014-11-05 | Method for manufacturing high-heat-dissipativity LED baseplate |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106271564A (en) * | 2015-06-24 | 2017-01-04 | 威光自动化科技股份有限公司 | Automatic assembling method of LED lamp box |
| CN106658960A (en) * | 2015-10-29 | 2017-05-10 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN106961806A (en) * | 2017-04-21 | 2017-07-18 | 深圳崇达多层线路板有限公司 | The preparation method for burying copper billet is substituted in a kind of wiring board |
| CN109327957A (en) * | 2018-12-05 | 2019-02-12 | 景旺电子科技(龙川)有限公司 | A kind of conduction copper substrate and preparation method thereof |
| CN110446356A (en) * | 2019-08-23 | 2019-11-12 | 惠州中京电子科技有限公司 | A kind of production method of high power density LED support plate |
| CN111278237A (en) * | 2020-02-16 | 2020-06-12 | 苏州浪潮智能科技有限公司 | Through hole filling and HDI fusion processing technology |
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| Publication number | Priority date | Publication date | Assignee | Title |
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Application publication date: 20150218 |