CN104294335A - Activation process for nickel plating pretreatment of aluminum alloy used for electronic devices - Google Patents
Activation process for nickel plating pretreatment of aluminum alloy used for electronic devices Download PDFInfo
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- CN104294335A CN104294335A CN201310306014.1A CN201310306014A CN104294335A CN 104294335 A CN104294335 A CN 104294335A CN 201310306014 A CN201310306014 A CN 201310306014A CN 104294335 A CN104294335 A CN 104294335A
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- aluminum alloy
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
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- Chemical Kinetics & Catalysis (AREA)
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- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an activation process for nickel plating pretreatment of aluminum alloy used for electronic devices. The process adopts an activating solution composed of: 52-56g/L of nickel sulfate, 18-22g/L of sodium phosphate, 22-26g/L of citric acid, 15-19g/L of ammonium sulfate, 12-16g/L of zinc dihydrogen phosphate, 6-8g/L of zinc oxide, 65-75g/L of sodium hydroxide, 6-10g/L of ferrous chloride, 10-14g/L of potassium sodium tartrate, and the balance water. The activation process includes: subjecting the aluminum alloy used for electronic devices to alkali washing to remove oil, then performing cleaning by hot water, conducting flushing with cold water, then employing a 65-75g/L sodium hydroxide solution to remove an oxide film under a temperature of 55-65DEG C, and performing flushing with water, then putting the aluminum alloy used for electronic devices into the activating solution with the above components to conduct activation for 4-6min, with the pH value of the activating solution being 10-11 and the temperature being 35-45DEG C.
Description
Technical field
The present invention relates to technical field of surface, particularly relate to a kind of aluminum alloy nickel plated pre-treatment activating process used for electronic device.
Background technology
Because aluminium is a kind of active metal, Al and Alalloy surface is easy to react with the oxygen in air, steam the oxide film forming layer, and this layer of oxide film can cause metal plating and aluminum substrate sticking power not strong, does not reach processing requirement.So Al and Alalloy must carry out having good sticking power when eliminating the activation treatment of oxide film to guarantee Al and Alalloy plating before plating.
The pretreatment technology of current aluminium alloy comprises the following steps: degreasing → matting → leaching zinc → electronickelling → chemical nickel plating, wherein soak zinc step and be mainly double zincate process, because the potential difference between zinc and phosphorus nickel alloy layer is larger, affect bonding force and the protective of nickel dam, twice leaching zinc gained zinc layers can be dissolved in plating solution often at follow-up chemical nickel plating, has a strong impact on bath stability; And the nitric acid cleaning that can use prepare at 1: 1 between twice leaching zinc, easily evaporate into acid mist in process of production, environmental hazard is large.In addition the method for twice leaching zinc has many shortcomings: 1, zinc-impregnating layer has pollution to chemical nickel-plating solution.2, in the corrosive atmosphere of humidity, zinc constitutes the anode of corrosion cell relative to nickel coating, and zinc layers will be subject to lateral encroaching, finally causes nickel dam to peel off.3, between twice leaching zinc, one more nitric acid moves back zinc operation, contaminate environment.4, the commodity leaching zinc liquid of exploitation at present contains prussiate, and operational danger is large, does not more meet environmental requirement.Therefore, be in fact necessary to propose a kind of aluminum alloy activated liquid, be not only independent of each other but also less contaminate environment with follow-up chemical nickel plating operation.
Summary of the invention
The object of the invention is to propose a kind of aluminum alloy nickel plated pre-treatment activating process used for electronic device, by the adjustment to activation solution component, overcome defect of the prior art, avoid environmental pollution, and activation effect is good.
For reaching this object, the present invention by the following technical solutions:
A kind of aluminum alloy nickel plated pre-treatment activating process used for electronic device, consisting of of the activation solution that this technique adopts: single nickel salt 52-56g/L, sodium phosphate 18-22g/L, citric acid 22-26g/L, ammonium sulfate 15-19g/L, primary zinc phosphate 12-16g/L, zinc oxide 6-8g/L, sodium hydroxide 65-75g/L, iron protochloride 6-10g/L, Seignette salt 10-14g/L, surplus is water; Described activating process is: be first the hot water cleaning after oil removing at 40-60 DEG C of temperature of the sodium hydroxide of 6-8% and the sodium carbonate solution of 10-14% with mass percent concentration by aluminium alloy used for electronic device, use cold water flush again, then the sodium hydroxide solution of 65-75g/L deoxidize at 55-65 DEG C of temperature is used, and rinse with water, then the activation solution with above-mentioned composition is put into, wherein the pH value of activation solution is 10-11, and temperature is 35-45 DEG C, and soak time is 4-6 minute.
The present invention has following beneficial effect:
Activation solution of the present invention processes aluminium alloy, reduce the potential difference of active layer and coating, improve the activity of aluminum alloy surface, the meagre nickel with coated metal growth activity can be formed in aluminum alloy surface used for electronic device, there is good effect to follow-up chemical nickel plating, binding force of cladding material and solidity to corrosion can be improved, the pollution to plating solution can be decreased again simultaneously, improve bonding force and the protective of coating, extend chemical nickel-plating solution working life.
Embodiment
Embodiment one
A kind of aluminum alloy nickel plated pre-treatment activating process used for electronic device, consisting of of the activation solution that this technique adopts: single nickel salt 52g/L, sodium phosphate 22g/L, citric acid 22g/L, ammonium sulfate 19g/L, primary zinc phosphate 12g/L, zinc oxide 8g/L, sodium hydroxide 65g/L, iron protochloride 10g/L, Seignette salt 10g/L, surplus is water; Described activating process is: be first the hot water cleaning after oil removing at 40 DEG C of temperature of the sodium hydroxide of 6% and the sodium carbonate solution of 14% with mass percent concentration by aluminium alloy used for electronic device, use cold water flush again, then the sodium hydroxide solution of 75g/L deoxidize at 55 DEG C of temperature is used, and rinse with water, then the activation solution with above-mentioned composition is put into, wherein the pH value of activation solution is 11, and temperature is 35 DEG C, and soak time is 6 minutes.
Embodiment two
A kind of aluminum alloy nickel plated pre-treatment activating process used for electronic device, consisting of of the activation solution that this technique adopts: single nickel salt 56g/L, sodium phosphate 18g/L, citric acid 26g/L, ammonium sulfate 15g/L, primary zinc phosphate 16g/L, zinc oxide 6g/L, sodium hydroxide 75g/L, iron protochloride 6g/L, Seignette salt 14g/L, surplus is water; Described activating process is: be first the hot water cleaning after oil removing at 60 DEG C of temperature of the sodium hydroxide of 8% and the sodium carbonate solution of 10% with mass percent concentration by aluminium alloy used for electronic device, use cold water flush again, then the sodium hydroxide solution of 65g/L deoxidize at 65 DEG C of temperature is used, and rinse with water, then the activation solution with above-mentioned composition is put into, wherein the pH value of activation solution is 10, and temperature is 45 DEG C, and soak time is 4 minutes.
Embodiment three
A kind of aluminum alloy nickel plated pre-treatment activating process used for electronic device, consisting of of the activation solution that this technique adopts: single nickel salt 54g/L, sodium phosphate 20g/L, citric acid 24g/L, ammonium sulfate 17g/L, primary zinc phosphate 14g/L, zinc oxide 7g/L, sodium hydroxide 70g/L, iron protochloride 8g/L, Seignette salt 12g/L, surplus is water; Described activating process is: be first the hot water cleaning after oil removing at 50 DEG C of temperature of the sodium hydroxide of 7% and the sodium carbonate solution of 12% with mass percent concentration by aluminium alloy used for electronic device, use cold water flush again, then the sodium hydroxide solution of 70g/L deoxidize at 60 DEG C of temperature is used, and rinse with water, then the activation solution with above-mentioned composition is put into, wherein the pH value of activation solution is 10.5, and temperature is 40 DEG C, and soak time is 5 minutes.
Claims (1)
1. an aluminum alloy nickel plated pre-treatment activating process used for electronic device, it is characterized in that, consisting of of the activation solution that this technique adopts: single nickel salt 52-56g/L, sodium phosphate 18-22g/L, citric acid 22-26g/L, ammonium sulfate 15-19g/L, primary zinc phosphate 12-16g/L, zinc oxide 6-8g/L, sodium hydroxide 65-75g/L, iron protochloride 6-10g/L, Seignette salt 10-14g/L, surplus is water; Described activating process is: be first the hot water cleaning after oil removing at 40-60 DEG C of temperature of the sodium hydroxide of 6-8% and the sodium carbonate solution of 10-14% with mass percent concentration by aluminium alloy used for electronic device, use cold water flush again, then the sodium hydroxide solution of 65-75g/L deoxidize at 55-65 DEG C of temperature is used, and rinse with water, then the activation solution with above-mentioned composition is put into, wherein the pH value of activation solution is 10-11, and temperature is 35-45 DEG C, and soak time is 4-6 minute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310306014.1A CN104294335A (en) | 2013-07-19 | 2013-07-19 | Activation process for nickel plating pretreatment of aluminum alloy used for electronic devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310306014.1A CN104294335A (en) | 2013-07-19 | 2013-07-19 | Activation process for nickel plating pretreatment of aluminum alloy used for electronic devices |
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| Publication Number | Publication Date |
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| CN104294335A true CN104294335A (en) | 2015-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310306014.1A Pending CN104294335A (en) | 2013-07-19 | 2013-07-19 | Activation process for nickel plating pretreatment of aluminum alloy used for electronic devices |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110117783A (en) * | 2019-04-19 | 2019-08-13 | 广东工业大学 | A kind of method of Electroless Nickel Plating of Aluminum Alloy mixed metal activation |
| CN113403614A (en) * | 2021-05-24 | 2021-09-17 | 中国科学院金属研究所 | Simple and easy-to-operate pretreatment process for chemical nickel plating on surface of aluminum alloy |
| CN115341202A (en) * | 2022-08-03 | 2022-11-15 | 惠州市安泰普表面处理科技有限公司 | Activating solution for aluminum alloy before chemical nickel plating and pretreatment method |
-
2013
- 2013-07-19 CN CN201310306014.1A patent/CN104294335A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110117783A (en) * | 2019-04-19 | 2019-08-13 | 广东工业大学 | A kind of method of Electroless Nickel Plating of Aluminum Alloy mixed metal activation |
| CN113403614A (en) * | 2021-05-24 | 2021-09-17 | 中国科学院金属研究所 | Simple and easy-to-operate pretreatment process for chemical nickel plating on surface of aluminum alloy |
| CN115341202A (en) * | 2022-08-03 | 2022-11-15 | 惠州市安泰普表面处理科技有限公司 | Activating solution for aluminum alloy before chemical nickel plating and pretreatment method |
| CN115341202B (en) * | 2022-08-03 | 2024-04-02 | 惠州市安泰普表面处理科技有限公司 | Activating solution for aluminum alloy before chemical nickel plating and pretreatment method |
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Application publication date: 20150121 |