CN104294231B - Vacuum magnetron sputtering coating equipment with height-adjustable molecular pump gas partitioning plate - Google Patents

Vacuum magnetron sputtering coating equipment with height-adjustable molecular pump gas partitioning plate Download PDF

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Publication number
CN104294231B
CN104294231B CN201410534887.2A CN201410534887A CN104294231B CN 104294231 B CN104294231 B CN 104294231B CN 201410534887 A CN201410534887 A CN 201410534887A CN 104294231 B CN104294231 B CN 104294231B
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CN
China
Prior art keywords
magnetron sputtering
sputtering coating
vacuum magnetron
gas barrier
coating equipment
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Application number
CN201410534887.2A
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Chinese (zh)
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CN104294231A (en
Inventor
余华骏
江维
胡勇
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Xianning CSG Energy Saving Glass Co Ltd
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Xianning CSG Energy Saving Glass Co Ltd
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Priority to CN201410534887.2A priority Critical patent/CN104294231B/en
Publication of CN104294231A publication Critical patent/CN104294231A/en
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention discloses vacuum magnetron sputtering coating equipment with a height-adjustable molecular pump gas partitioning plate. The vacuum magnetron sputtering coating equipment comprises gas partitioning plates and a height adjusting structure, wherein the height adjusting structure consists of two groups of symmetrical lifting mechanisms; the lifting mechanisms comprise hanging plates, eccentric gears and ejector bars; rotating shafts of the eccentric gears are fixed on the vacuum magnetron sputtering coating equipment; the ejector bars are arranged on the upper sides of the eccentric gears; the tops of the hanging plates are connected with the ejector bars; the bottom ends of the hanging plates are arranged on the lower sides of the gas partitioning plates and are used for supporting the gas partitioning plates. The vacuum magnetron sputtering coating equipment has the advantages that firstly, the flexibility is relatively good, the gas partitioning plates can be adjusted to be in different heights so as to be applicable to demands of production when three-silver glass and single-silver glass are produced alternatively, and the production efficiency is improved; secondly, when relatively thick laminated glass is produced, in order to prevent the glass from being clamped by the gas partitioning plates, the partitioning plates can be lifted up, and when relatively thin glass is produced, the partitioning plates can be descended, so that the edge effect of a product can be eliminated, and the color uniformity of the product is improved.

Description

A kind of vacuum magnetron sputtering coating film equipment of adjustable molecular pump gas barrier height
Technical field
The present invention is applied to glass industry, is related to off-line type vacuum magnetic-control sputtering glass coating equipment technical field, specifically It is related to a kind of vacuum magnetron sputtering coating film equipment of adjustable molecular pump gas barrier height.
Background technology
With magnetron sputtering as principle, manufacture coated glass field using horizontal vacuum filming equipment, molecular pump every Gas plate plays the regulation direction of air-flow and the effect of size, and this effect is significant for industrialized production glass, but mesh The gas barrier of front all filming equipments is highly unadjustable, has the disadvantage in that
Easily clamp glass when the 1st, producing very thick laminated glass, bring very burden to production.
2nd, produce that the molecular pump gas barrier requiring when three silver medals and single silver products is highly different, molecular pump gas barrier is highly solid Fixed, cause difficulty to coating wire debugging membrane system, adjust the piece time to lengthen, inefficiency.
3rd, existing coating wire molecular pump gas barrier highly easily cause air-flow suddenly big or suddenly small so that product colour edge effect Phenomenon is serious, and product colour uniformity is had an impact, and affects product appearance.
Content of the invention
The invention aims to making up the deficiencies in the prior art, provide that a kind of production efficiency is higher, product colour more Plus the vacuum magnetron sputtering coating film equipment of uniform adjustable molecular pump gas barrier height.
In order to reach the purpose of the present invention, technical scheme is as follows:
A kind of vacuum magnetron sputtering coating film equipment of adjustable molecular pump gas barrier height it is characterised in that: there is gas barrier And height adjusting structure, described height adjusting structure is made up of two groups of symmetrical elevating mechanisms, described elevating mechanism include link plate, Eccentric and push rod,
The rotary shaft of described eccentric is fixed on vacuum magnetron sputtering coating film equipment, and described push rod is arranged on described bias The upside of wheel, the top of described link plate is connected with push rod, and gas barrier located at the downside of gas barrier and is held in the bottom of link plate, described Link plate be shaped as l shape.
As preferred technical scheme: the outside of described eccentric is provided with copper sheathing.
When rotating eccentric, push rod can be driven to move up and down, thus driving the link plate being connected with push rod to move up and down, finally The gas barrier on link plate is driven to move up and down, base plate and live-roller height due to placing glass are changeless, from And achieve height distance scalable this purpose between gas barrier and glass.And link plate be shaped as l shape, the lower end of link plate There is the protrusion side of a horizontally set, gas barrier is placed on the protrusion side of link plate lower end by the gravity of itself so that trapping Plate is big with link plate contact area, is in close contact, will not gas leakage.
The invention has the benefit that
1), motility more preferably, can be by gas barrier height adjustment to different height when exchanging and doing three silver medals and single silver glass Degree, to adapt to the needs producing, improves production efficiency.
2), produce during thicker laminated glass in order to avoid glass is clamped by gas barrier, the height of gas barrier can be raised, When producing relatively thin glass, gas barrier is highly turned down, the edge effect of product can be eliminated, be conducive to improving the color of product Uniformity.
Brief description
Fig. 1 is the structural representation of the present invention.
Specific embodiment
With reference to embodiment, the invention will be further described, but protection scope of the present invention is not limited solely to implement Example.
As shown in figure 1, a kind of vacuum magnetron sputtering coating film equipment of adjustable molecular pump gas barrier height, including placement glass Base plate 5, the live-roller 6 on base plate 5 and the height adjusting structure being located at live-roller 6 top.Height adjusting structure by Two groups of symmetrical elevating mechanism compositions, elevating mechanism includes link plate 4, eccentric 7 and push rod 3.
Push rod 3 be arranged on eccentric 7 upside and with eccentric upper contact, the rotary shaft of eccentric 7 is fixed on vacuum On magnetic-controlled sputtering coating equipment, specifically it is integrally fixed on the pump end and operating side of coating wire.The top of link plate 4 is connected with push rod 3, Gas barrier 1 located at the downside of gas barrier 1 and is held in the bottom of link plate 4, and the link plate 4 in two symmetrical elevating mechanisms is just held The both sides of gas barrier 1.
When rotating eccentric 7, push rod 3 can be driven to move up and down, thus drive moving down on the link plate 4 being connected with push rod 3 Dynamic, finally drive the gas barrier 1 being located on link plate to move up and down, base plate 5 and live-roller 6 height due to placing glass are fixing Constant, it is achieved thereby that height distance scalable this purpose between gas barrier 1 and glass.And link plate 4 be shaped as l Shape, there is the protrusion side of a horizontally set lower end of link plate 4, and gas barrier 1 is placed on the protrusion side of link plate 4 lower end by the gravity of itself Above so that gas barrier 1 is big with link plate 4 contact area, it is in close contact, will not gas leakage.
The outside of eccentric 7 is provided with copper sheathing 2, in order to protect eccentric 7, reduces friction loss.
Finally it is noted that above example only not limits technology described in the invention in order to the present invention to be described Scheme, therefore, although this specification with reference to each above-mentioned embodiment to present invention has been detailed description, this Field it is to be appreciated by one skilled in the art that still the present invention can be modified or equivalent, and all without departing from this The technical scheme of spirit and scope of invention and its improvement, it all should be covered in scope of the presently claimed invention.

Claims (2)

1. a kind of vacuum magnetron sputtering coating film equipment of adjustable molecular pump gas barrier height it is characterised in that: have gas barrier and Height adjusting structure, described height adjusting structure is made up of two groups of symmetrical elevating mechanisms, and described elevating mechanism includes link plate (4), eccentric (7) and push rod (3),
The rotary shaft of described eccentric (7) is fixed on vacuum magnetron sputtering coating film equipment, and described push rod (3) is arranged on described inclined The upside of heart wheel (7), the top of described link plate (4) is connected with push rod (3), and the bottom of link plate (4) is located at the downside of gas barrier (1) And hold gas barrier (1), described link plate (4) be shaped as l shape.
2. the vacuum magnetron sputtering coating film equipment of adjustable molecular pump gas barrier height according to claim 1, its feature exists In: the outside of described eccentric (7) is provided with copper sheathing (2).
CN201410534887.2A 2014-10-10 2014-10-10 Vacuum magnetron sputtering coating equipment with height-adjustable molecular pump gas partitioning plate Active CN104294231B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410534887.2A CN104294231B (en) 2014-10-10 2014-10-10 Vacuum magnetron sputtering coating equipment with height-adjustable molecular pump gas partitioning plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410534887.2A CN104294231B (en) 2014-10-10 2014-10-10 Vacuum magnetron sputtering coating equipment with height-adjustable molecular pump gas partitioning plate

Publications (2)

Publication Number Publication Date
CN104294231A CN104294231A (en) 2015-01-21
CN104294231B true CN104294231B (en) 2017-02-01

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CN201410534887.2A Active CN104294231B (en) 2014-10-10 2014-10-10 Vacuum magnetron sputtering coating equipment with height-adjustable molecular pump gas partitioning plate

Country Status (1)

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Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1228266C (en) * 2002-09-06 2005-11-23 鲍冠中 Magnetic control sputtering hot-bending coated glass and its production method and device
US7674360B2 (en) * 2003-12-12 2010-03-09 Applied Materials, Inc. Mechanism for varying the spacing between sputter magnetron and target
CN201817543U (en) * 2010-10-25 2011-05-04 北儒精密股份有限公司 Lifting movable magnet set
CN202090052U (en) * 2011-04-27 2011-12-28 广东中环真空设备有限公司 Magnetic-controlled sputtering coating equipment
CN202688421U (en) * 2012-06-15 2013-01-23 杨宪杰 Horizontal type coating equipment
CN204151410U (en) * 2014-10-10 2015-02-11 咸宁南玻节能玻璃有限公司 A kind of vacuum magnetron sputtering coating film equipment of adjustable molecular pump gas barrier height

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C06 Publication
PB01 Publication
C53 Correction of patent for invention or patent application
CB03 Change of inventor or designer information

Inventor after: Yu Huajun

Inventor after: Jiang Wei

Inventor after: Hu Yong

Inventor before: Yu Huajun

Inventor before: Jiang Wei

Inventor before: Xiong Jian

Inventor before: Su Changfei

Inventor before: Zhang Yaopeng

COR Change of bibliographic data

Free format text: CORRECT: INVENTOR; FROM: YU HUAJUN JIANG WEI XIONG JIAN SU CHANGFEI ZHANG YAOPENG TO: YU HUAJUN JIANG WEI HU YONG

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GR01 Patent grant