CN104270929A - Heating and cooling device - Google Patents
Heating and cooling device Download PDFInfo
- Publication number
- CN104270929A CN104270929A CN201410505970.7A CN201410505970A CN104270929A CN 104270929 A CN104270929 A CN 104270929A CN 201410505970 A CN201410505970 A CN 201410505970A CN 104270929 A CN104270929 A CN 104270929A
- Authority
- CN
- China
- Prior art keywords
- contiguous block
- fixed pedestal
- thermistor
- cavity
- heat abstractor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Thermistors And Varistors (AREA)
Abstract
The invention discloses a heating and cooling device. The heating and cooling device comprises a fixed base, a main cooling framework and a thermistor, wherein the fixed base is used for being connected with an integrated circuit or an electronic element; the main cooling framework is arranged on the fixed base and used for cooling; the thermistor is arranged between the fixed base and the main cooling framework. The heating and cooling device has the advantages of having the automatic heating and cooling functions, being good in safety, being little affected by fluctuation of power voltage, and the like, can greatly reduce the requirements for a manufacturing technology and the cost of the electronic element, expands the range of working temperature of the electronic element, improves working reliability of the electronic element, and has the advantages of being simple in design method, safe, low in cost and high in reliability.
Description
Technical field
The present invention relates to a kind of heating heat abstractor for integrated circuit or electronic devices and components.
Background technology
Along with the integrated level of integrated circuit is more and more higher, environment for use is also more and more severe, density of heat flow rate also increases considerably thereupon, integrated circuit or electronic devices and components cause hydraulic performance decline because of overheated, break down, particularly huge on the impact of military avionic equipment reliability, even can cause serious consequence.In electron trade, electronic designer can know, the tremendous influence that the increase of temperature caused the components and parts life-span.After electronic devices and components reach uniform temperature, temperature often increases by 10 degrees Celsius, and the life-span of electronic devices and components will reduce half.Show according to USAF aviation electronics holistic approach project, the main cause of electronic failure is caused by temperature.Therefore, in order to adapt to cooling and the heat radiation needs of modern integrated circuits, the thermal analyses developed rapidly and thermal design technology, be subject to extensive concern.
But under airborne circumstance, the operating temperature range of electronic equipment is very wide, and usual electronic equipment reliably must work within the scope of-55 DEG C ~+70 DEG C.At extremely low-55 DEG C of temperature, by the impact of temperature, conventional industrial components and parts can not normally work reliably.And existing heater mostly adopts the traditional devices such as electrothermal tube, heating wire to heat, the shell of electrothermal tube is the steel pipe that stainless steel is made, inside there is heater element resistance wire, outwardly conducted heat by resistance wire and steel pipe during heating, when air does not flow, the heat of electrothermal tube is just loose does not go out, and temperature can be more and more higher, electrothermal tube can be burnt, even breaking out of fire time serious.Further, electronic equipment is subject to space, volume and heavily quantitative limitation, and heater not easily adopts the heater element of heaviness greatly.And under high temperature+70 DEG C of environment, during due to integrated circuit or electronic devices and components work, amount of heat can be produced, therefore, need to dispel the heat to circuit or electronic devices and components, ensure that circuit or electronic devices and components normally work.And in thermal technology field, effective heat radiation and the positive heat insulation problem being engineers and technicians always and designing thermal technology's components and parts and must consider.When device structure or apparatus arrangement are tight, arrange thermal convection device when being subject to spatial limitation, then conduction becomes the major measure of efficiently radiates heat.
Therefore, working to effectively solve in integrated circuit or electronic devices and components wide temperature range, a kind of heat radiation, the heater with dual-use function need be developed.
Summary of the invention
In order to effectively solve reliably working in integrated circuit or electronic devices and components wide temperature range, the invention provides a kind of heating heat abstractor with dual-use function.
To achieve these goals, the technical scheme that the present invention takes is: a kind of heating heat abstractor, comprising:
Fixed pedestal, for being connected with integrated circuit or electronic devices and components;
Heat radiation main frame, is arranged on fixed pedestal, for heat radiation; And
Thermistor, is arranged between fixed pedestal and heat radiation main frame.
Described thermistor is provided with lead-in wire, and lead-in wire is used for being connected with DC power supply.
Described heat radiation main frame covers on described fixed pedestal, and heat radiation main frame is connected with fixed pedestal by screw.
Described heat radiation main frame comprises the contiguous block be connected with described fixed pedestal and the radiating fin be located on contiguous block.
Described contiguous block is provided with the first cavity holding described fixed pedestal and the second cavity holding described thermistor.
Described second cavity is formed towards described contiguous block internal recess in the bottom surface of described first cavity.
Described first cavity is formed towards the internal recess of contiguous block on the side of described contiguous block, and described radiating fin is located on the another side relative with this side on contiguous block.
Described fixed pedestal is provided with the 3rd cavity holding described thermistor.
Described contiguous block is provided with the mounting groove for arranging cover plate, and mounting groove is communicated with described second cavity, and cover plate to embed in mounting groove and is connected with contiguous block, cover plate is also provided with allow described lead-in wire through through hole.
Sealed colloid is provided with between described thermistor and described contiguous block.
Heating heat abstractor of the present invention, this device has Automatic-heating, heat sinking function, fail safe is good, by the feature such as the influence of fluctuations of supply voltage is little, can greatly reduce electronic devices and components manufacture craft and cost requirement, extend the operating temperature range of electronic devices and components, improve the reliability of electronic devices and components work, have the advantages that method for designing is simple, safety, cost are low and reliability is high.
Accompanying drawing explanation
This specification comprises the following drawings, shown content respectively:
Fig. 1 is the exploded view that the present invention heats heat abstractor;
Fig. 2 is the structural representation of heat radiation main frame;
Fig. 3 is the structural representation of fixed pedestal;
Fig. 4 is the vertical view of heat radiation main frame;
Fig. 5 is the front view of heating heat abstractor;
Fig. 6 be in Fig. 5 A to cutaway view;
Be labeled as in figure:
1, thermistor; 2, dispel the heat main frame; 21, contiguous block; 22, radiating fin; 23, the first cavity; 24, the second cavity; 25, mounting groove; 3, fixed pedestal; 31, the 3rd cavity; 4, go between; 5, cover plate; 6, screw; 7, sealed colloid.
Embodiment
Contrast accompanying drawing below, by the description to embodiment, be described in further detail the specific embodiment of the present invention, object helps those skilled in the art to have more complete, accurate and deep understanding to design of the present invention, technical scheme, and contribute to its enforcement.
As shown in Figures 1 to 6, the present invention's one heating heat abstractor, is formed primarily of fixed pedestal 3, thermistor 1, sealed colloid 7, heat radiation main frame 2, cover plate 5 and some screws 6.Fixed pedestal 3 main with heat radiation main frame 2 fixing and this device and integrated circuit or electronic devices and components or circuit board assemblies fix; Thermistor 1 is positive temperature coefficient thermistor (PTCR), and this resistor is by BaTiO
3be that ferroelectric material passes through to apply micro-modifying element and is prepared from by electronic ceramic process, belong to responsive to temperature type ceramic resistor; Article 2, lead-in wire 4 is the two ends of thermistor lead-out wire, is terminal block end; Sealed colloid 7 mainly thermistor 1 and heat radiation main frame 2 is combined closely and local cavity seal, ensures that steam can not enter in seal chamber under the environment such as damp and hot; Dispelling the heat main frame body frame will as heat radiation and conductive members, its material selection conductive coefficient is higher, specific heat capacity is higher, the material that density is less, consider the requirement of easily processing simultaneously, the aluminium alloy selecting ductility to add is as the material of heat radiation main frame 2, further, this material is being common used material on the market, and cost is lower; Cover plate 5 is axial restraint thermistor 1 and lead-in wire 4 mainly; Some screws 6 are mainly used to securing cover plate 5, heat radiation main frame 2 and fixed pedestal 3, to realize the combination of whole device.
Specifically, fixed pedestal 3 is processed by aluminum alloy materials, and has the counter sink of 5 M2 in fixed pedestal 3 bottom design.This counter sink is used for revolving M2 screw 6 and uses.In addition, as shown in Figure 2, the 3rd cavity the 31, three cavity 31 this fixed pedestal 3 being designed with collecting thermistor 1 is arranging on the side of heat radiation main frame 2 at fixed pedestal 3, shape is rectangle, and the 3rd cavity 31 forms opening in one end of fixed pedestal 3.Can fluid sealant be poured in 3rd cavity 31, make thermistor 1 closely be fixed on the 3rd cavity 31 inner.
Described thermistor 1 is positive temperature coefficient thermistor, and its temperature characterisitic is step change type, has temperature self-balanced function; This resistor is by BaTiO
3be that ferroelectric material passes through to apply micro-modifying element and is prepared from by electronic ceramic process, at low ambient temperatures, apply 2 lead ends of voltage at thermistor 1, thermistor 1 generates heat, and can improve heated object working temperature; This thermistor 1 scope of application is wide, can reach-55 DEG C ~+125 DEG C; This thermistor 1 heating power can flexible design as requested.In addition, the thermistor 1 designed is drawn by 2 lead-in wires 4, connects DC power supply for user.
Described heat radiation main frame 2 is integrated, and heat radiation main frame 2 comprises the contiguous block 21 be connected with fixed pedestal 3 and the radiating fin 22 be located on contiguous block 21.Contiguous block 21 is provided with the first cavity 23 holding fixed pedestal 3 and the second cavity 24 holding thermistor 1, first cavity 23 is formed towards the internal recess of contiguous block 21 on the side of contiguous block 21, and radiating fin 22 is located on the another side relative with this side on contiguous block 21.The shape of the first cavity 23 is identical with the shape of fixed pedestal 3, and the second cavity 24 is towards the rectangular channel that contiguous block 21 internal recess is formed in the bottom surface of the first cavity 23.Radiating fin 22 in high temperature environments, for the heat radiation of electronic circuit components and parts or integrated circuit.The shape of contiguous block 21 is rectangle, and the surrounding of contiguous block 21 is distributed with 4 fixing holes, for this device being fixed on upper end or the pcb board of electronic circuit components and parts or integrated circuit.Be designed with the mounting groove 25 of rectangle at the side of contiguous block 21, mounting groove 25 is communicated with the second cavity 24, mounting groove 25 is designed with 2 M2 screwed holes, for installing M2 screw 6.As shown in Figure 3.
Described cover plate 5 is arranged on the mounting groove 25 li on contiguous block 21, not only can stationary heat sensitive resistor 1 and embedding sealed colloid 7, and can prevent sealed colloid 7 from flowing out from sidewall.Cover plate 5 to embed in mounting groove 25 and is fixedly connected with contiguous block 21, cover plate 5 is also provided with the through hole allowing the lead-in wire 4 of thermistor 1 pass.
Described screw 6 includes the screw of 7 M2 × 6, for securing cover plate 5 and fixed pedestal 3.
Sealed colloid 7 is filled between thermistor 1 and contiguous block 21, and sealed colloid 7 can the adverse circumstances such as heat resistance, prevent the moistures such as steam from entering in cavity.
Below by reference to the accompanying drawings to invention has been exemplary description.Obviously, specific implementation of the present invention is not subject to the restrictions described above.As long as have employed the improvement of the various unsubstantialities that method of the present invention is conceived and technical scheme is carried out; Or without improvement, above-mentioned design of the present invention and technical scheme directly applied to other occasion, all within protection scope of the present invention.
Claims (10)
1. heat a heat abstractor, it is characterized in that, comprising:
Fixed pedestal, for being connected with integrated circuit or electronic devices and components;
Heat radiation main frame, is arranged on fixed pedestal, for heat radiation; And
Thermistor, is arranged between fixed pedestal and heat radiation main frame.
2. heating heat abstractor according to claim 1, is characterized in that, described thermistor is provided with lead-in wire, and lead-in wire is used for being connected with DC power supply.
3. heating heat abstractor according to claim 1 and 2, is characterized in that, described heat radiation main frame covers on described fixed pedestal, and heat radiation main frame is connected with fixed pedestal by screw.
4. heating heat abstractor according to claim 3, is characterized in that, described heat radiation main frame comprises the contiguous block be connected with described fixed pedestal and the radiating fin be located on contiguous block.
5. heating heat abstractor according to claim 4, is characterized in that, described contiguous block is provided with the first cavity holding described fixed pedestal and the second cavity holding described thermistor.
6. heating heat abstractor according to claim 5, is characterized in that, described second cavity is formed towards described contiguous block internal recess in the bottom surface of described first cavity.
7. heating heat abstractor according to claim 6, is characterized in that, described first cavity is formed towards the internal recess of contiguous block on the side of described contiguous block, and described radiating fin is located on the another side relative with this side on contiguous block.
8. heating heat abstractor according to claim 7, is characterized in that, described fixed pedestal is provided with the 3rd cavity holding described thermistor.
9. to remove the heating heat abstractor described in 8 according to right, it is characterized in that, described contiguous block is provided with the mounting groove for arranging cover plate, and mounting groove is communicated with described second cavity, cover plate to embed in mounting groove and is connected with contiguous block, cover plate is also provided with allow described lead-in wire through through hole.
10. heating heat abstractor according to claim 9, is characterized in that, is provided with sealed colloid between described thermistor and described contiguous block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410505970.7A CN104270929A (en) | 2014-09-27 | 2014-09-27 | Heating and cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410505970.7A CN104270929A (en) | 2014-09-27 | 2014-09-27 | Heating and cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104270929A true CN104270929A (en) | 2015-01-07 |
Family
ID=52162390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410505970.7A Pending CN104270929A (en) | 2014-09-27 | 2014-09-27 | Heating and cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104270929A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225982A (en) * | 2021-04-06 | 2021-08-06 | 中国科学院国家空间科学中心 | Satellite-borne high-performance processing circuit reinforcing and heat radiating device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202695679U (en) * | 2012-08-06 | 2013-01-23 | 捷星新能源科技（苏州）有限公司 | Heating and radiating device for battery pack |
| CN103943770A (en) * | 2013-01-17 | 2014-07-23 | 雅马哈株式会社 | Thermoelectric power generation unit |
| CN203824157U (en) * | 2014-04-17 | 2014-09-10 | 浙江喜尔登床垫有限公司 | Double temperature area cold-hot pad and double temperature cooling-heating device thereof |
-
2014
- 2014-09-27 CN CN201410505970.7A patent/CN104270929A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202695679U (en) * | 2012-08-06 | 2013-01-23 | 捷星新能源科技（苏州）有限公司 | Heating and radiating device for battery pack |
| CN103943770A (en) * | 2013-01-17 | 2014-07-23 | 雅马哈株式会社 | Thermoelectric power generation unit |
| CN203824157U (en) * | 2014-04-17 | 2014-09-10 | 浙江喜尔登床垫有限公司 | Double temperature area cold-hot pad and double temperature cooling-heating device thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225982A (en) * | 2021-04-06 | 2021-08-06 | 中国科学院国家空间科学中心 | Satellite-borne high-performance processing circuit reinforcing and heat radiating device |
| CN113225982B (en) * | 2021-04-06 | 2023-03-21 | 中国科学院国家空间科学中心 | Satellite-borne high-performance processing circuit reinforcing and heat radiating device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9451728B2 (en) | Explosion protection housing having an expanded ambient temperature range | |
| CN105188329A (en) | Electromagnetic shielding cover and electronic device | |
| CN204831321U (en) | Be used to lead semiconductor water circulative cooling subassembly for equipment | |
| EP3101997A1 (en) | Heater | |
| CN202632919U (en) | Thermistor element and circuit board | |
| CN104270929A (en) | Heating and cooling device | |
| KR20220050888A (en) | current feedthrough | |
| CN208285207U (en) | A kind of shell for Switching Power Supply | |
| JP6328044B2 (en) | Electronic unit | |
| CN107579625A (en) | Motor temperature regulating device for infrared band test system | |
| CN211783947U (en) | Temperature sensor and have its electromagnetism stove | |
| CN108024481B (en) | A kind of radiator structure for solving the problems, such as heater element thermal conduction path and blocking | |
| CN204616259U (en) | A kind of bus surge protector heat dissipating housing | |
| US10088369B2 (en) | Arrangement of a temperature sensor with an electrically insulating covering | |
| CN209122161U (en) | It is a kind of to have the fujinon electronic video endoscope being well heat-treated | |
| CN112284560A (en) | Method for rapidly detecting temperature of power device | |
| CN207976232U (en) | Power tube temperature-detecting device and electromagnetic oven | |
| CN201083555Y (en) | Electric heating thermos bottle temperature sensor | |
| CN202057635U (en) | Gas chromatography heating attemperator for on-line analysis on dissolved gas in insulating oil | |
| CN203708747U (en) | Heat dissipation structure of vehicle-mounted navigation system | |
| CN203690280U (en) | High-thermal-conductivity cermet composite layer-shaped heat radiation module for chip packaging | |
| CN108181018A (en) | Power tube temperature-detecting device and electromagnetic oven | |
| CN211019841U (en) | Heat dissipation assembly and accurate guidance assembly | |
| CN109114971A (en) | Muffle furnace Elema shield and Muffle furnace | |
| CN208508808U (en) | A kind of Switching Power Supply |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150107 |