CN104269462A - High-efficiency back contact solar cell back sheet without main grids, high-efficiency back contact solar cell assembly without main grids and manufacturing technology - Google Patents
High-efficiency back contact solar cell back sheet without main grids, high-efficiency back contact solar cell assembly without main grids and manufacturing technology Download PDFInfo
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- CN104269462A CN104269462A CN201410509348.3A CN201410509348A CN104269462A CN 104269462 A CN104269462 A CN 104269462A CN 201410509348 A CN201410509348 A CN 201410509348A CN 104269462 A CN104269462 A CN 104269462A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention relates to the field of solar cells, in particular to a high-efficiency back contact solar cell back sheet without main grids, a high-efficiency back contact solar cell assembly without main grids and a manufacturing technology of the high-efficiency back contact solar cell assembly. The back contact solar cell back sheet is characterized by sequentially comprising an electric connection layer and a basic layer from top to bottom, the electric connection layer and the basic layer are connected through adhesive, and the electric connection layer comprises two or more finger-shaped electrodes, all the finger-shaped electrodes are alternatively arrayed in an interdigital shape, and the electric connection layer is used for being connected with a back contact cell piece. The back contact solar cell back sheet has the advantages of being high in efficiency and resistant to subfissure, shading losses of grid line electrodes on the front face are eliminated, and therefore the cell efficiency is improved; the cell can be sheeted, and therefore the cost is lowered; practicability is higher, and the back contact solar cell back sheet is generally suitable for an MWT structure, an EWT structure, an IBC structure and other structures.
Description
Technical field
The present invention relates to area of solar cell, particularly without main grid, high efficiency back contact solar cell backboard, assembly and preparation technology thereof.
Background technology
The energy is the material base of mankind's activity, along with development and the progress of human society, grows with each passing day to the demand of the energy.Traditional fossil energy belongs to the demand that non-renewable energy resources have been difficult to continue to meet social development, and therefore world community is in recent years to the research of new forms of energy and renewable origin with utilize increasingly burning hot.Wherein solar energy generation technology has and sunlight is converted into electric power, uses the advantage such as simple, environment friendly and pollution-free, energy utilization rate is high especially to receive widespread attention.Solar power generation uses large-area P-N junction diode in sunlit situation, produce photo-generated carrier generating.
In prior art, occupy an leading position and the crystal-silicon solar cell of large-scale commercial, its emitter region and emitter region electrode are all positioned at battery front side (phototropic face), and namely main grid, auxiliary grid line are all positioned at battery front side.Because solar energy level silicon material electronics diffusion length is shorter, emitter region is positioned at the collection efficiency that battery front side is conducive to improving charge carrier.But the grid line due to battery front side blocks part sunlight (being about 8%), thus the effective area of shining light of solar cell is made to reduce and have lost one part of current therefrom.In addition when cell piece is connected, need the back side of receiving another block battery with tin-coated copper strip from the face bonding of one piece of battery, if use thicker tin-coated copper strip can be too hard and cause the cracked of cell piece, if but too much light can be covered again with carefully wide tin-coated copper strip due to it.Therefore, use which kind of zinc-plated welding all can produce energy loss that series resistance brings and optical loss, is unfavorable for the sheet of cell piece simultaneously.In order to solve the problems of the technologies described above, front electrode is transferred to cell backside by those skilled in the art, develops back contact solar cell, and back contacts solar cell refers to that the emitter region electrode of battery and base electrode are all positioned at a kind of solar cell of cell backside.Back contact battery has many good qualities: 1. efficiency is high, owing to completely eliminating the shading loss of front gate line electrode, thus improves battery efficiency.2. can realize the sheet of battery, the metal connector device that series connection uses is all at cell backside, and the connection do not existed from front to the back side can use thinner silicon chip, thus reduce costs.3. more attractive in appearance, the front color of battery is even, meets the esthetic requirement of consumer.
Back contacts solar cell comprises the various structures such as MWT, EWT and IBC.The key that back contacts solar cell large-scale commercial is produced is the series connection of back contacts solar cell being got up and be made into solar components of how high efficiency, low cost.The common preparation method of MWT assembly uses composite conducting backboard, conductive backings applies conducting resinl, position punching corresponding on top of the encapsulation material makes conducting resinl run through encapsulating material, being positioned over exactly by back contacts solar cell on encapsulating material makes the conductiving point in conductive backings be contacted by conducting resinl with the electrode on back contacts solar cell, then on cell piece, lay upper strata EVA and glass, more whole stacked good module upset is entered laminating machine carry out lamination.There is following defect in this technique: the composite conducting backboard 1, used is composite conducting metal forming in backboard, is generally Copper Foil, and need to carry out laser ablation or chemical etching to Copper Foil.Because laser ablation still can operate for simple graph, for complex pattern, then etching speed is slow, production efficiency is low, and chemical etching then exists needs previously prepared complex-shaped and corrosion resistant mask, environmental pollution and corrosive liquid to the etching problem of polymer base material.The conductivity type backplane manufacturing process manufactured in this way is complicated, and cost is high.2, need to carry out punching to make conducting resinl run through encapsulating material to the encapsulating material of layer after solar cell piece, due to encapsulating material normally viscoelastic body, it is very big to carry out accurate punching difficulty.3, need accurate spot gluing equipment by the relevant position of conductive glue at backboard, the battery less to this back contacts of MWT point can also operate, and uses spot gluing equipment cannot realize to back contact battery that back contacts point area is little, quantity is large such as IBC at all.
P-N junction is positioned over cell backside by IBC technology, and the distance simultaneously decreasing electron collection is blocked without any in front, therefore can increase substantially cell piece efficiency.IBC battery uses shallow diffusion, light dope and SiO in front
2the technology such as passivation layer reduce recombination losses, and at cell backside, diffusion region is limited in less region, these diffusion regions become lattice arrangement at cell backside, and diffusion region Metal Contact is limited in the fine contact point being rendered as One's name is legion in very little scope.IBC battery decreases the area of the heavy diffusion region of cell backside, and the saturation current of doped region can significantly reduce, and open circuit voltage and conversion efficiency are improved.By the little contact point collected current of One's name is legion, electric current is shortened in the transmission range of back surface simultaneously, significantly reduce the series resistance of assembly.
IBC back contact battery enjoys industry to pay close attention to owing to having the unapproachable high efficiency of conventional solar cell, has become the study hotspot of solar battery technology of new generation.But IBC solar module P-N junction position is adjacent comparatively near and all at the cell piece back side, be difficult to connect to IBC battery module and be prepared into assembly in prior art.For solving the problem, also there is the multiple improvement to IBC back contact solar cell in prior art, Sunpower company once invented and adjacent P or N emitter was guided to battery edge by the connected electric current the most at last of the thin grid line of silver slurry silk screen printing, re-use connecting band at the solder joint that the printing of cell piece edge is larger and carry out welding series connection, when after screen printing technique invention, and field of solar energy uses screen printing technique to form confluxing of electric current at present always, as the patent 201310260260.8 of up-to-date application, 201310606634.7, 201410038687.8, 201410115631.8, do not make any improvement.
But, thin grid line is used to carry out electric current collection, 5 cun of cell pieces still can use, but generally popular in the prior art 6 cun or larger silicon chip will run into series resistance and rise and degradation problem under fill factor, curve factor, cause manufactured component power seriously to reduce.IBC battery in the prior art also can reduce series resistance by silk screen printing is wider between adjacent P or N emitter silver slurry grid line, but the increase due to silver consuming amount can bring the sharply rising of cost, the insulation effect that wide grid line also can produce between P-N is simultaneously deteriorated, the problem of easily electric leakage.
Patent US20110041908A1 discloses back contact solar battery and the production method thereof that a kind of back side has elongated interdigital emitter region and base region, there is Semiconductor substrate, the backside surface of Semiconductor substrate is provided with elongated base region and elongated emitter region, base region is base semiconductor type, and emitter region is provided with the emitter semiconductor type contrary with described base semiconductor type; Elongated emitter region is provided with the elongated emitter electrode for electrical contact emitter region, and elongated base region is provided with the elongated base electrode for electrical contact base region; Wherein elongated emitter region has the structure width less than elongated emitter electrode, and wherein elongated base region has the structure width less than described elongated base electrode.But need and arrange the next effective collected current of a large amount of electric-conductors, therefore cause manufacturing cost to increase, processing step is complicated.
Patent EP2709162A1 discloses a kind of solar cell, applies to back contact solar cell, discloses and is separated from each other and the electrode contact unit be alternately arranged, and by the connector connecting electrode osculating element of longitudinal direction, forms " work " shape electrode structure; But this kind of structure has carried out twice connection on cell piece, that cell piece is connected with electrode contact unit for the first time, then also need by connector connecting electrode osculating element, twice connection brings technologic complexity, and cause too much electrode contact point, may cause " disconnection " or " even wrong ", be unfavorable for the overall performance of back contact solar cell.
Patent WO2011143341A2 discloses a kind of back contact solar cell, comprise substrate, multiple adjacent P doped layer and N doped layer are positioned at substrate back, P doped layer and N doped layer and metal contact layer stacked, and P doped layer and be provided with passivation layer between N doped layer and metal contact layer, described passivation layer has a large amount of nanometer connecting holes, described nanometer connecting hole connects P doped layer and N doped layer and metal contact layer; But this invention utilizes nano-pore connection metal contact layer that resistance can be made to increase, moreover manufacturing process is complicated, has higher requirement to manufacturing equipment.This invention can not be integrated into a module multi-disc solar cell and electric connection layer, and after cell piece is integrated into solar module, be not only convenient to be assembled into assembly, and the connection in series-parallel be convenient between adjusting module, thus be conducive to the series-parallel system adjusting cell piece in solar module, reduce the contact resistance of assembly.
As can be seen here, a kind of structure simple, assembled battery sheet convenience, low cost, low series resistance, resistance toly hiddenly to split, high efficiency, high stability, the back contact solar cell assembly of easily technology production and preparation technology thereof need the technical problem of solution at present badly.
Summary of the invention
The object of the invention is to for the deficiencies in the prior art, provide that a kind of structure is simple, assembled battery sheet convenience, low cost, low series resistance, resistance toly hiddenly to split, the back contact solar cell backboard of high efficiency, high stability, assembly and preparation technology thereof.
The invention provides a kind of main technical schemes without main grid, high efficiency back contact solar cell backboard is:
Described back contact solar cells backboard is followed successively by electric connection layer and basic unit from top to bottom, and described electric connection layer is connected by bonding agent with between basic unit; Described electric connection layer comprises finger electrode more than two, and the described finger electrode of each group becomes interdigitated to be alternately arranged, and described electric connection layer is for connecting back contact battery sheet.
One of the present invention can also adopt following attached technical scheme without main grid, high efficiency back contact solar cell backboard:
Described electric connection layer is three-decker, ground floor is conductive material layer, the second layer is resistance to deformation layer, and the material of third layer is the material identical or close with the coefficient of thermal expansion and contraction of ground floor material, and the finger electrode that interdigitated is alternately arranged is arranged on described conductive material layer.
Described conductive material layer is aluminium-plastic panel, copper moulds plate or silver is moulded in plate any one, described resistance to deformation layer is foaming PET material, and the material of described third layer is identical with the electric conducting material of ground floor.
Described finger electrode is coated with any one in layers of copper, silver layer or aluminium lamination; The electric connection layer of described backboard is provided with keeper.
On described electric connection layer, the shape of finger electrode finger is bending shape.
The finger of described finger electrode is provided with secondary grid or conducting particles, for collecting electronics, and described secondary grid or conducting particles and Electrode connection.
The shape of cross section of described finger electrode finger is circular, square or any one in ellipse; The circumscribed circle diameter of described finger electrode finger shape of cross section is 0.05mm ~ 1.5mm.
Surface, described finger electrode finger is coated with low melting material or is coated with conducting resinl.
The thickness of coating of the finger of described finger electrode or conductive adhesive layer thickness are 5 μm ~ 50 μm.
The quantity of described finger electrode finger is 10 ~ 500.
Bus bar electrode is arranged on the base portion of finger electrode, and the surface of bus bar electrode has concaveconvex shape.
Described conducting resinl is low resistivity conductive bonded adhesives, and its main component is conducting particles and polymeric adhesive.
Conducting particles in described conducting resinl be in gold, silver, copper, gold-plated nickel, silver-plated nickel or silver-plated copper any one or appoint several combination; The shape of described conducting particles is the combination of any one or several in spherical, sheet, olive-shaped or needle-like; The particle diameter of conducting particles is 0.01 μm ~ 5 μm.
Polymeric adhesive in described conducting resinl be in epoxy resin, polyurethane resin, acrylic resin, organic siliconresin any one or appoint several combination, described bonding agent can hot curing or photocuring.
A kind of main technical schemes without main grid, high efficiency back contact solar cell assembly provided by the invention is:
Comprise the front layer material, encapsulating material, solar cell layer, the backboard that connect from top to bottom, described solar cell layer comprises several cell pieces, the shady face of described cell piece is arranged with the P electrode be connected with P type doped layer and the N electrode be connected with N-type doped layer, described cell piece is electrically connected with the electric connection layer on backboard, the backboard that described backboard limits for technique scheme.
One provided by the invention can also comprise following technical scheme without main grid, high efficiency back contact solar cell assembly:
The electric connection layer of described backboard divides multiple module installation, forms battery module after loading onto cell piece; The bus bar electrode that described battery module is arranged by electric connection layer both sides connects; The cell piece number of described solar cell layer is 1 ~ 120, and wherein, comprise 1 ~ 120 battery module, described battery module comprises 1 ~ 120 cell piece.
Described P electrode is point-like P electrode or line style P electrode, and described N electrode is point-like N electrode or line style N electrode.
The diameter of described point-like P electrode is 0.4mm ~ 1.5mm, and the distance between two that are connected with the same finger of described finger electrode adjacent point-like P electrode is 7mm ~ 10mm; The diameter of described point-like N electrode is 0.4mm ~ 1.5mm, the distance 7mm ~ 10mm between point-like N electrode adjacent with two of the same finger of described finger electrode.
Total number of described point-like P electrode and described point-like N electrode is 1000 ~ 40000.
Described Spot electrodes or wire-type of electrode are any one in silver slurry, conducting resinl, scolding tin.
Be connected with described P electrode and be connected with described N electrode and distance between the finger of adjacent finger electrode is 0.1mm ~ 20mm.
Insulating barrier place between described P electrode and described N electrode is provided with thermoplastic resin or thermosetting resin.
Described resin is any one in ethylene-vinyl acetate copolymer, vistanex, epoxy resin, polyurethane resin, acrylic resin, organic siliconresin.
Without the preparation method of main grid, high efficiency back contact solar cell assembly, comprise the following steps:
Step one: prepare electric connection layer, shaping finger electrode on electric connection layer; By bonding with backboard for a group or more described finger electrode; Each group of described finger electrode becomes interdigitated to be alternately arranged, and arranges bus bar electrode at the base portion of finger electrode;
Step 2: the doped layer of back contact solar cell is electrically connected with the finger electrode on electric connection layer, the described one-tenth interdigited electrode of arranged adjacent is electrically connected with different shaped doped layer electrode; Connect the bus bar electrode on electric connection layer; Described cell piece forms solar cell layer;
Step 3: undertaken stacked by the solar cell layer prepared by front layer material, encapsulating material, step 2, backboard order successively, lamination obtains battery component.
Preparation method without main grid, high efficiency back contact solar cell assembly provided by the invention can also comprise following technical scheme:
Interdigited electrode on described electric connection layer uses conducting medium printing shaping.
Described electric connection layer is three-decker, ground floor is conductive material layer, the second layer is resistance to deformation layer, the material of third layer is identical with the coefficient of thermal expansion and contraction of ground floor material or close, ground floor electric conducting material to be scribed or punching press is finger electrode, finger electrode is gluing laminating with resistance to deformation layer, third layer material layer successively, then the P electrode of finger electrode and cell piece or N electrode are electrically connected.
The one side of electric connection layer is pasted one deck glue, then carries out scribing or punching press; And concaveconvex shape is scribed on described bus bar electrode.
P electrode on cell piece described in step one and N electrode have mirror symmetrical structure in the horizontal plane, when the quantity of cell piece is greater than 1, the mode of assembled battery sheet is, after first piece of cell piece is connected with electric connection layer, second piece of cell piece is revolved turnback at horizontal plane, two panels cell piece justified margin, make the P electrode on second piece of cell piece and the N electrode on first piece of cell piece on the finger of a finger electrode, then normally the 3rd back contact battery is placed, make the N electrode of P electrode on the 3rd piece of cell piece and second piece of cell piece on the finger of one article of finger electrode, repeat aforesaid operations and form cascaded structure, form solar cell layer.
The finger of described finger electrode adopts plating process to be coated with low melting material, described low melting material be in scolding tin, leypewter, sn-bi alloy or tin pb-ag alloy any one or appoint several, after heating, make the finger of finger electrode be welded and fixed by low melting material thawing with P electrode or N electrode, the finger of finger electrode is electrically connected with cell piece.
Described heating fixation procedure uses heating resistance pad in cell piece front; The heating-up temperature of described heating resistance pad is 40 ~ 80 degree.
Described mode of heating is any one in infrared radiation, Resistant heating or Hot-blast Heating, and heating-up temperature is 150 ~ 500 DEG C.
The parameter of described lamination sets according to the vulcanization characteristics of encapsulating material, and described encapsulating material is EVA, is 145 degree of laminated 16 minutes.
The plating process of the finger of electric connection layer finger electrode is any one in hot-dip, plating or chemical plating.
Described finger electrode is coated with any one in aluminium, copper, silver in the mode of cold plating or plating; The mode of described cold plating is that after being mixed with air by metal powder, high pressure sprays.
Electric connection layer arranges keeper; In step 2, the electric connection mode of cell piece and finger electrode is form P electrode and N electrode by silk screen printing coated with conductive glue on the P doped layer and N doped layer of cell piece, then the cell piece having applied conducting resinl is positioned on described electric connection layer by the keeper on described electric connection layer, described conducting resinl can solidify in heating process, after heating, make described finger electrode form ohmic contact with described P electrode or described N electrode by described conducting resinl, realize the electrical connection of finger electrode and cell piece.
Enforcement of the present invention comprises following technique effect:
1, the present invention proposes a kind ofly to use technology without main grid comb teeth-shaped structure electric connection layer to realize the series connection of large scale back contacts solar cell and to make the method for corresponding solar components.This technology does not need, to the thin silver slurry of silk screen printing between adjacent P or the N emitter of IBC battery grid line, significantly to reduce the consumption of silver slurry, thus reduces the manufacturing cost of IBC battery and simplified manufacturing technique flow process.
2, back contact solar cell used herein is without the need to main grid, greatly reduces the use amount of silver slurry, the manufacturing cost of back contact battery is obviously reduced; One is that transformation efficiency is high, and two is that packaging efficiency is high, eliminates the shading loss of front gate line electrode, thus improves battery efficiency;
3, in the present invention, electrode of solar battery contacts with electric connection layer multiple spot distributing, reduces electron collection distance, significantly reduces the series resistance of assembly.Also can realize the sheet of battery, the metal connector device that series connection uses is all at cell backside, and the connection do not existed from front to the back side can use thinner silicon chip, thus reduce costs;
4, practicality is stronger, and back contacts solar cell of the present invention is suitable is commonly used to the various structures such as MWT, EWT and IBC;
5, resistance toly hiddenly to split, the photovoltaic system of Components integration that the technology of the present invention is produced can thoroughly be avoided because one piece of cell piece occurs hiddenly split and lose certain electric current and cause the electric current of whole group of string that the problem significantly reduced will occur, what propose due to this invention achieves Mulit-point Connection between electric conductor and cell piece without main grid comb back of the body winding displacement technology, can improve whole system to manufacturing, transport, hiddenly splitting and the tolerance of fine fisssure of producing in installation and use procedure.
Secondary grid or conducting particles the migration distance that can reduce electronics and hole is set, strengthen the ability that cell piece collects electronics.Bus bar electrode concaveconvex shape the contact area that can increase electrode is set, reduce resistance.
This technology does not need to use conductive adhesive technique, thus saves the cost of conducting resinl and avoid conducting resinl and need the series of technical such as Accurate Points glue.This technology can realize welding between electric conductor with cell piece, can increase substantially the long-term reliability of assembly.In assembly prepared by this technology, Mulit-point Connection between IBC battery and electric conductor, tie point distribution is more intensive, several thousand even several ten thousand can be reached, more optimize with the path of fine fisssure position electric current conduction hidden the splitting of silicon chip, therefore the loss caused based on fine fisssure is greatly reduced, the Quality advance of product.Usually, in photovoltaic system, cell piece occurs hiddenly to split rear cell piece upper part region and can depart from main grid, and the electric current of this region generation cannot be collected.Photovoltaic system is all adopt the mode of series connection to form matrix, there is obvious bucket effect, when one piece of cell piece occur hidden split and lose certain electric current time whole group of string electric current will there is obvious reduction, thus cause the generating efficiency of whole group of string significantly to reduce.The photovoltaic system of the Components integration using this technology to produce can thoroughly avoid problems to occur, what propose due to this invention achieves Mulit-point Connection between electric conductor and cell piece without main grid comb back of the body winding displacement technology, make whole photovoltaic system to manufacturing, transport, hiddenly splitting and hallrcuts has high tolerance of producing in installation and use procedure.Can illustrate with a simple example, the solar components that conventional art is produced similarly is common glass, a point has been crashed monolithic glass and has just been pulverized, similarly be then doubling safety glass with the assembly produced without main grid comb back of the body winding displacement technology, point is cracked to have seemed unsightly in appearance, but the function of keeping out wind and rain of whole glass also exists.The traditional battery pack string technique of this technological break-through, makes battery arrange freer, more closely, the assembly of above-mentioned technology is adopted to be expected to less lighter, concerning the project development of downstream, this just means floor space less in installation, lower roof load-bearing requirements and lower human cost.The connectivity problem of low cost, high efficiency back contacts solar cell can be solved without main grid back of the body winding displacement technology, silver-colored main grid is replaced to reduce costs by using copper cash, realize the industrial-scale production that back contacts solar cell is real, reduce costs while raising the efficiency, for photovoltaic system provides that efficiency is higher, cost is lower, stability is higher, resistance toly hiddenly splits outstanding photovoltaic module, greatly promote the competitiveness of photovoltaic system and traditional energy.
Back contact solar cell overall structure used herein is basically identical with conventional back contact solar cell, but thermoplasticity or heat cured resin in the insulating barrier place silk screen printing after back contact solar cell completes silver slurry sintering and the test of power stepping between its emitter region electrode and base electrode.This resin can play the effect being separated insulating emitter region electrode and base electrode on the one hand, plays the effect of bonding back contact solar cell sheet and backboard on the one hand in lamination process.
Another of conductive backings that the present invention uses is specific is have location to indicate, and is printed with anchor point at the ad-hoc location of conductive backings.The design principle of conductive backings anchor point is that the relative position of metal wire on anchor point and backboard is accurately fixed, can be easy to identify the anchor point on backboard by CCD technology, by identifying that the back contact solar cell sheet scribbling conducting resinl can be positioned over the relevant position of conductive backings by anchor point accurately, the conductive wire that on back contact battery sheet, emitter region electrode and base electrode are corresponding in conductive backings is contacted by conducting resinl.
Accompanying drawing explanation
Fig. 1. Spot electrodes back contact solar cell schematic rear view
Fig. 2. wire-type of electrode back contact solar cell schematic rear view
Fig. 3. the finger sectional view (Fig. 3 b, has materials at two layers finger electrode finger sectional view, Fig. 3 c, has trilaminate material finger electrode finger sectional view for Fig. 3 a, finger electrode finger sectional view) of finger electrode
Fig. 4. comb structure schematic diagram
Fig. 5. back contact solar cell back board structure schematic diagram 1
Fig. 6. back contact solar cell back board structure schematic diagram 2
Fig. 7. back contact solar cell back board structure schematic diagram 3
Fig. 8. solar module connection diagram 1
Fig. 9. solar module connection diagram 2
Figure 10. back contact solar cell assembly sectional view
Figure 11. load onto the solar module schematic diagram of cell piece
1, be the metal materials such as copper, aluminium or steel; 2, be the metal material such as the aluminium different from 1 or steel; 3, be tin, tin lead, tin bismuth or the plumbous silver metal solder of tin; 4, N-type doped layer; 41, line style N electrode; 42, point-like N electrode; The finger of the finger electrode 43, be connected with N electrode; 44, conductor wire; 5, P type doped layer; 51, line style P electrode; 52, point-like P electrode; The finger of the finger electrode 53, be connected with P electrode; 6, n type single crystal silicon matrix; 7, insulating barrier; 8, backboard; 81, front layer material; 91, P electrode busbar; 92, N electrode busbar; 10, solar cell layer; 11, encapsulating material.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the present invention is described in detail, it is pointed out that described embodiment is only intended to be convenient to the understanding of the present invention, and any restriction effect is not play to it.
Embodiment 1
See Fig. 1, Fig. 3, Fig. 4, Fig. 6, the one that the present embodiment provides is without main grid, high efficiency back contact solar cell backboard, described back contact solar cells backboard is followed successively by electric connection layer and basic unit from top to bottom, and described electric connection layer is connected by bonding agent with between basic unit; Described electric connection layer can comprise finger electrode more than two, and the described finger electrode of each group becomes interdigitated to be alternately arranged, and described finger electrode is electrically connected with P electrode or N electrode, and the described one-tenth interdigited electrode of arranged adjacent is electrically connected with different shaped doped layer electrode.
See Fig. 4, described bus bar electrode is arranged on the base portion of finger electrode, and the surface of bus bar electrode has concaveconvex shape, can increase the ohmic contact area of bus bar electrode, reduces resistance; Electric connection layer described in the present embodiment is three-decker, ground floor is plastic-aluminum flaggy, and the second layer is pet layer, and third layer is plastic-aluminum flaggy, the finger electrode that interdigitated is alternately arranged is arranged on described aluminium-plastic panel, and in the present embodiment, the surface, finger electrode finger of aluminium is coated with scolding tin; The finger of described finger electrode is provided with secondary grid, for collecting electronics, described secondary grid and Electrode connection.Wherein pet layer and thick aluminum layer good rigidity, foaming PET layer can resist the distortion that following problem causes: 1, silicon plate bonds with metal level, because expanding with heat and contract with cold, the stress that the temperature difference produces; 2, punching press or the stress that produces when scribing thin aluminum sheet.Solve stress problem, make aluminium-plastic panel not easily flexural deformation.The electric connection layer of described backboard is provided with keeper, is convenient to aligning when cell piece is connected with electric connection layer;
See Fig. 3, the shape of cross section of the finger electrode finger that the described aluminium-plastic panel that the present embodiment uses is formed is any one in circular, square or ellipse, and the present embodiment is preferably square; The finger of described finger electrode can for bending shape, and such as zigzag, can increase the gross contact area between the finger of finger electrode and cell piece doped layer like this, is beneficial to the collection of electronics.Described finger electrode finger surface-coated has conducting resinl; Conducting particles in described conducting resinl is the combination of any one or several in gold, silver, copper, gold-plated nickel, silver-plated nickel or silver-plated copper, the present embodiment preferably copper; Described conducting resinl is low resistivity conductive bonded adhesives, and its main component is conducting particles and polymeric adhesive; The shape of described conducting particles is the combination of any one or several in spherical, sheet, olive-shaped, needle-like, the preferred needle-like of the present embodiment; The particle diameter of conducting particles is 0.01 μm ~ 5 μm, the present embodiment preferably 5 μm.Polymeric adhesive in described conducting resinl is any one in the epoxy resin of one-component or two component, polyurethane resin, acrylic resin, organic siliconresin, the present embodiment preferred epoxy, and can carry out hot curing or photocuring, and preparation technology is simple.
The finger of described finger electrode is provided with secondary grid or conducting particles, for collecting electronics, described secondary grid or conducting particles and Electrode connection; Described finger electrode finger is provided with conductive bumps; The height of described conductive bumps structure is 250 microns ~ 400 microns, the present embodiment preferably 250 microns; The shape of described conductive bumps is selected from any one in cylinder, cone, parallelepiped or prism, the preferred cone of the present embodiment; The setting of described conductive bumps is beneficial to the compact siro spinning technology of conductivity and cell piece electrode;
See Figure 10, the one that the present embodiment provides is without main grid, high efficiency back contact solar cell assembly, comprise the front layer material 81, encapsulating material 11, solar cell layer 10, the backboard 8 that connect from top to bottom, it is characterized in that, described solar cell layer 10 comprises several cell pieces, described backboard can be arranged by sub-module, each battery module can install polylith cell piece, each module installation electric connection layer, for installing cell piece, is electrically connected by the busbar of electric connection layer between multiple module.Also can an electric connection layer be only set on backboard.The present embodiment battery module installs one piece of cell piece, as shown in Figure 6.
Insulating barrier 7 place between described P electrode and described N electrode is provided with thermoplastic resin or thermosetting resin, described resin is any one in ethylene-vinyl acetate copolymer, vistanex, epoxy resin, polyurethane resin, acrylic resin, organic siliconresin, the present embodiment preferred polyolefm resin, can prevent the short circuit between electrode.
See Fig. 1, described cell piece is n type single crystal silicon matrix silicon 6, described P electrode is point-like P electrode 52, described N electrode is point-like N electrode 42, described point-like P electrode 52 and described point-like N electrode 42 are located at the back side of silicon substrate, point-like P electrode 52 and point-like N electrode 42 are arranged alternately with each other the back side at silicon substrate, point-like P electrode 52 is provided with positive electrode contact point, total number that point-like N electrode 42 is provided with point-like P electrode 52 described in negative electrode contact point and described point-like N electrode 42 is 1000 ~ 40000, the present embodiment preferably 11250; The diameter of point-like P electrode 52 is 0.8mm, and the distance between adjacent point-like P electrode 52 is 1.5mm.The diameter of point-like N electrode 42 is 0.7mm, distance between adjacent point-like N electrode 42 is 1.5mm, centre distance between point-like P electrode 52 line and point-like N electrode 42 line is 15mm, and the setting of above-mentioned Spot electrodes design parameter is convenient in the present embodiment to be connected, can good collected current.Cell conversion efficiency is 20.2%.
A kind of preparation method without main grid, high efficiency back contact solar cell assembly:
The finger electrode backboard wide cut 651mm that the present embodiment uses, length 662mm.As shown in Figure 6, in 156 × 156mm area that every sheet back contact battery sheet is corresponding, correspondence is arranged the finger of 150 finger electrodes, and 75 wherein in one group corresponding with emitter region contact point, and 75 in another group corresponding with base contact point.The finger of the finger electrode corresponding with emitter region contact point and the finger cross arrangement of the finger electrode corresponding with base contact point.The finger of finger electrode is aluminium, and cross sectional dimensions is 0.5 × 0.25mm.Adhesive for polyurethane is used the finger of finger electrode to be fixed on the relevant position of backboard.
Use silk screen printing even coated with conductive glue on all contacting points positions on cell piece, on each contact point, conductive glue amount is 0.2mg.The epoxy resin of the polymeric adhesive serviceability temperature solidification of conducting resinl, conducting particles is wherein the flake silver powder of particle diameter 0.3 μm.The back contact battery scribbling conducting resinl is positioned according to the keeper of backboard and is positioned on backboard.
The cell piece group of totally 32 back contacts as shown in Figure 9 laid is connected, connects bus bar electrode.Upper strata EVA and glass is placed successively again on cell piece.Module feeding laminating machine after stacked is carried out lamination, and laminating parameters sets according to the vulcanization characteristics of EVA, is generally 145 DEG C of laminated 16 minutes.The module finally completed by lamination carries out installation metal edge frame, installs terminal box and carry out power test and visual examination.As shown in figure 11, its sectional view as shown in Figure 10.
The power parameter of above-mentioned 32 back contacts assemblies is as follows:
Open circuit voltage Uoc (V) 22.25
Short circuit current Isc (A) 9.25
Operating voltage Ump (V) 17.27
Operating current Imp (A) 9.08
Maximum power Pmax (W) 156.78
Fill factor, curve factor 76.18%
Embodiment 2
See Fig. 2, Fig. 3, Fig. 4, Fig. 5, the one that the present embodiment provides is without main grid, high efficiency back contact solar cell backboard, described back contact solar cells backboard is followed successively by electric connection layer and basic unit from top to bottom, and described electric connection layer is connected by bonding agent with between basic unit; Described electric connection layer can comprise finger electrode more than two, and the described finger electrode of each group becomes interdigitated to be alternately arranged, and described finger electrode is electrically connected with P electrode or N electrode, and the described one-tenth interdigited electrode of arranged adjacent is electrically connected with different shaped doped layer electrode.
See Fig. 4, described bus bar electrode is arranged on the base portion of finger electrode, and the surface of bus bar electrode has concaveconvex shape, can increase the ohmic contact area of bus bar electrode, reduces resistance; Electric connection layer described in the present embodiment is three-decker, ground floor is that copper moulds flaggy, and the second layer is pet layer, and third layer is that copper moulds flaggy, the finger electrode that interdigitated is alternately arranged is arranged on described copper and moulds on plate, and in the present embodiment, the surface, finger electrode finger of copper material is coated with scolding tin; The finger of described finger electrode is provided with secondary grid, for collecting electronics, described secondary grid and Electrode connection.Wherein pet layer and third layer copper plate layer good rigidity, foaming PET layer can resist the distortion that following problem causes: 1, silicon plate bonds with metal level, because expanding with heat and contract with cold, the stress that the temperature difference produces; 2, punching press or the stress that produces when scribing sheet copper.Solve stress problem, make copper mould plate not easily flexural deformation.The electric connection layer of described backboard is provided with keeper, is convenient to aligning when cell piece is connected with electric connection layer;
See Fig. 3, the shape of cross section that the described copper that the present embodiment uses moulds the finger electrode finger that plate is formed is any one in circular, square or ellipse, and the present embodiment is excellent square; Described finger electrode finger surface-coated has conducting resinl; Conducting particles in described conducting resinl is the combination of any one or several in gold, silver, copper, gold-plated nickel, silver-plated nickel or silver-plated copper, the present embodiment preferably copper; Described conducting resinl is low resistivity conductive bonded adhesives, and its main component is conducting particles and polymeric adhesive; The shape of described conducting particles is the combination of any one or several in spherical, sheet, olive-shaped, needle-like, the preferred needle-like of the present embodiment; The particle diameter of conducting particles is 0.01 μm ~ 5 μm, the present embodiment preferably 0.01 μm.Polymeric adhesive in described conducting resinl is any one in the epoxy resin of one-component or two component, polyurethane resin, acrylic resin, organic siliconresin, the present embodiment preferred acrylic resins, and can carry out hot curing or photocuring, and preparation technology is simple.
The finger of described finger electrode is provided with secondary grid or conducting particles, for collecting electronics, described secondary grid or conducting particles and Electrode connection; Described finger electrode finger is provided with conductive bumps; The height of described conductive bumps structure is 250 microns ~ 400 microns, the present embodiment preferably 250 microns; The shape of described conductive bumps is selected from any one in cylinder, cone, parallelepiped or prism, the preferred cone of the present embodiment; The setting of described conductive bumps is beneficial to the compact siro spinning technology of conductivity and cell piece electrode;
The one that the present embodiment provides is without main grid, high efficiency back contact solar cell assembly, comprise the front layer material 81 connected from top to bottom, encapsulating material 11, solar cell layer 10, backboard 8, it is characterized in that, described solar cell layer 10 comprises several cell pieces, the shady face of described cell piece is arranged with the line style P electrode 51 be connected with P type doped layer 5 and the line style N electrode 41 be connected with N-type doped layer 4, described cell piece is electrically connected with the electric connection layer on backboard, described backboard can be arranged by sub-module, same finger electrode in battery back-sheet in the present embodiment can connect a module on polylith cell piece formation backboard, as shown in Figure 8.
Insulating barrier place between described P electrode and described N electrode is provided with thermoplastic resin or thermosetting resin, described resin is any one in ethylene-vinyl acetate copolymer, vistanex, epoxy resin, polyurethane resin, acrylic resin, organic siliconresin, the present embodiment preferred acrylic resins, can prevent the short circuit between electrode.
See Fig. 2, described cell piece is n type single crystal silicon matrix silicon 6, described P electrode is line style P electrode 41, described N electrode is line style N electrode 41, described line style P electrode 41 and described line style N electrode 41 are located at the back side of silicon substrate, line style P electrode 41 and line style N electrode 41 are arranged alternately with each other the back side at silicon substrate, and the distance between adjacent line style P electrode 41 is 1.5mm; Distance between adjacent line style N electrode 41 is the setting convenient connection in the present embodiment of the above-mentioned Spot electrodes design parameter of 1.5mm, can good collected current.Cell conversion efficiency is 20.2%.
A kind of preparation method without main grid, high efficiency back contact solar cell assembly:
Shaping finger electrode on electric connection layer; Described electric connection layer is three-decker, ground floor is conductive material layer, the second layer is resistance to deformation layer, the material of third layer is the material identical or close with the coefficient of thermal expansion and contraction of ground floor material, ground floor electric conducting material to be scribed or punching press is finger electrode, finger electrode is gluing laminating with resistance to deformation layer, third layer material layer successively, then the P electrode of finger electrode and cell piece or N electrode are electrically connected.The backboard wide cut 986mm that the present embodiment uses, length 1662mm.In 156 × 156mm area that every sheet back contact battery sheet is corresponding, correspondence is arranged the finger of 76 finger electrodes, and wherein 38 fingers of one group of finger electrode are corresponding with line style emitter region, and 38 fingers of the finger electrode of other a group are corresponding with line style base.The finger of the shape electrode corresponding with line style emitter region and the finger cross arrangement of the shape electrode corresponding with line style base.The finger of finger electrode is copper wire, and cross sectional dimensions is 0.7 × 0.2mm.Use polyacrylic acid adhesive conductor wire to be fixed on the relevant position of backboard, connect bus bar electrode.See Fig. 5, described one group of finger electrode connects the P electrode of battery strings, and the base portion of described finger electrode arranges P bus bar electrode 91, can use conductor wire 44 series cells in the middle of battery strings, another group finger electrode is for connecting N electrode, and the base portion of this finger electrode arranges N bus bar electrode 92.
Use silk screen printing even coated with conductive glue on position, all contact zones on cell piece, on every bar line style contact zone, conductive glue amount is 25mg.The polyurethane resin of the polymeric adhesive serviceability temperature solidification of conducting resinl, conducting particles is wherein the gold-plated nickel ball of particle diameter 0.5 μm.The first back contact battery scribbling conducting resinl is positioned according to the anchor point of backboard and is positioned on backboard.
See Fig. 8, cell piece is arranged on sun backboard by the keeper arranged, P electrode on cell piece described in the present embodiment and N electrode have mirror symmetrical structure in the horizontal plane, the mode of assembled battery sheet is, after first piece of cell piece is connected with electric connection layer, second piece of cell piece is revolved turnback at horizontal plane, two panels cell piece justified margin, make the P electrode on second piece of cell piece and the N electrode on first piece of cell piece on a conductor wire 44, then normally the 3rd back contact battery is placed, make the N electrode of P electrode on the 3rd piece of cell piece and second piece of cell piece on a conductor wire, repeat aforesaid operations and form cascaded structure, form solar cell layer.Finally produce 6 strings, often go here and there 10, the cell piece group of totally 60 back contacts.Upper strata EVA and glass is placed successively again on cell piece.Module feeding laminating machine after stacked is carried out lamination, and laminating parameters sets according to the vulcanization characteristics of EVA, is generally 145 DEG C of laminated 16 minutes.The module finally completed by lamination carries out installation metal edge frame, installs terminal box and carry out power test and visual examination.As shown in figure 11, its sectional view as shown in Figure 10.
The power parameter of above-mentioned 60 back contacts assemblies is as follows:
Open circuit voltage Uoc (V) 40.36
Short circuit current Isc (A) 9.34
Operating voltage μm p (V) 31.78
Operating current Imp (A) 9.25
Maximum power Pmax (W) 293.96
Fill factor, curve factor 77.98%
Embodiment 3
See Fig. 1, Fig. 3, Fig. 4, Fig. 7, the one that the present embodiment provides is without main grid, high efficiency back contact solar cell backboard, described back contact solar cells backboard is followed successively by electric connection layer and basic unit from top to bottom, and described electric connection layer is connected by bonding agent with between basic unit; Described electric connection layer can comprise finger electrode more than two, and the described finger electrode of each group becomes interdigitated to be alternately arranged, and described finger electrode is electrically connected with P electrode or N electrode, and the described one-tenth interdigited electrode of arranged adjacent is electrically connected with different shaped doped layer electrode.
See Fig. 4, described bus bar electrode is arranged on the base portion of finger electrode, and the surface of bus bar electrode has concaveconvex shape, can increase the ohmic contact area of bus bar electrode, reduces resistance; Interdigited electrode on electric connection layer described in the present embodiment uses conducting medium printing shaping; Described conducting medium is conducting resinl, by the technology printing just curing molding, conducting resinl printing is just solidified into interdigited electrode and is fixed on electric connection layer.Printing technique can accurately realize the shaping of a lot of interdigited electrode, conveniently can realize thinner finger electrode, organize the shaping of interdigital electrode more, simple to operate, and by the cross-linking reaction in solidification process, conducting medium and electric connection layer chemical covalent binding can be got up, realize permanent strong bond.The finger of described finger electrode is provided with secondary grid, for collecting electronics, described secondary grid and Electrode connection.The electric connection layer of described backboard is provided with keeper, is convenient to aligning when cell piece is connected with electric connection layer;
See Fig. 3, the shape of cross section of the described finger electrode finger that the present embodiment uses is any one in circular, square or ellipse, and the present embodiment is excellent square; Conducting particles in described conducting resinl is the combination of any one or several in gold, silver, copper, gold-plated nickel, silver-plated nickel or silver-plated copper, the present embodiment preferably copper; Described conducting resinl is low resistivity conductive bonded adhesives, and its main component is conducting particles and polymeric adhesive; The shape of described conducting particles is the combination of any one or several in spherical, sheet, olive-shaped, needle-like, the preferred needle-like of the present embodiment; The particle diameter of conducting particles is 0.01 μm ~ 5 μm, the present embodiment preferably 5 μm.Polymeric adhesive in described conducting resinl is any one in the epoxy resin of one-component or two component, polyurethane resin, acrylic resin, organic siliconresin, the present embodiment preferred epoxy, and can carry out hot curing or photocuring, and preparation technology is simple.
See Figure 10, the one that the present embodiment provides is without main grid, high efficiency back contact solar cell assembly, comprise the front layer material 81, encapsulating material 11, solar cell layer, the backboard 8 that connect from top to bottom, it is characterized in that, described solar cell layer comprises several cell pieces, described backboard can be arranged by sub-module, each battery module can install polylith cell piece, each module installation electric connection layer, for installing cell piece, is electrically connected by the busbar of electric connection layer between multiple module.Also can an electric connection layer be only set on backboard.In the present embodiment, a battery module installs polylith cell piece, as shown in Figure 7.
Insulating barrier 7 place between described P electrode and described N electrode is provided with thermoplastic resin or thermosetting resin, described resin is any one in ethylene-vinyl acetate copolymer, vistanex, epoxy resin, polyurethane resin, acrylic resin, organic siliconresin, the present embodiment optimization polyurethane resin, can prevent the short circuit between electrode.
See Fig. 1, described cell piece is n type single crystal silicon matrix silicon 6, described P electrode is point-like P electrode 52, described N electrode is point-like N electrode 42, described point-like P electrode 52 and described point-like N electrode 42 are located at the back side of silicon substrate, point-like P electrode 52 and point-like N electrode 42 are arranged alternately with each other the back side at silicon substrate, point-like P electrode 52 is provided with positive electrode contact point, total number that point-like N electrode 42 is provided with point-like P electrode 52 described in negative electrode contact point and described point-like N electrode 42 is 1000 ~ 40000, the present embodiment preferably 2420; The diameter of point-like P electrode 52 is 0.8mm, and the distance between adjacent point-like P electrode 52 is 1.5mm.The diameter of point-like N electrode 42 is 0.7mm, distance between adjacent point-like N electrode 42 is 1.5mm, centre distance between point-like P electrode 52 line and point-like N electrode 42 line is 15mm, and the setting of above-mentioned Spot electrodes design parameter is convenient in the present embodiment to be connected, can good collected current.Cell conversion efficiency is 20.2%.
A kind of preparation method without main grid, high efficiency back contact solar cell assembly:
The finger electrode backboard wide cut 651mm that the present embodiment uses, length 662mm.In 156 × 156mm area that every sheet back contact battery sheet is corresponding, correspondence is arranged the finger of 160 finger electrodes, and 80 wherein in one group corresponding with emitter region contact point, and 80 in another group corresponding with base contact point.The finger of the finger electrode corresponding with emitter region contact point and the finger cross arrangement of the finger electrode corresponding with base contact point.The finger of finger electrode is conducting resinl, by the technology printing just curing molding, conducting resinl is printed as interdigited electrode and is fixed on electric connection layer, and the finger cross sectional dimensions of finger electrode is 0.5 × 0.25mm.Adhesive for polyurethane is used the finger of finger electrode to be printed the relevant position being just fixed on backboard.See Fig. 7, one group of finger electrode can connect polylith cell piece.
Use silk screen printing even coated with conductive glue on all contacting points positions on cell piece, on each contact point, conductive glue amount is 0.2mg.The epoxy resin of the polymeric adhesive serviceability temperature solidification of conducting resinl, conducting particles is wherein the flake silver powder of particle diameter 0.3 μm.The back contact battery scribbling conducting resinl is positioned according to the keeper of backboard and is positioned on backboard.
The cell piece group of totally 36 back contacts as shown in Figure 7 laid is connected.Upper strata EVA and glass is placed successively again on cell piece.Module feeding laminating machine after stacked is carried out lamination, and laminating parameters sets according to the vulcanization characteristics of EVA, is generally 145 DEG C of laminated 16 minutes.The module finally completed by lamination carries out installation metal edge frame, installs terminal box and carry out power test and visual examination.The sensitive surface of described solar module is provided with the good fluoropolymer membrane material of weather resisteant.As shown in Figure 10, its sectional view as shown in figure 11.
The power parameter of above-mentioned 36 back contacts assemblies is as follows:
Open circuit voltage Uoc (V) 24.84
Short circuit current Isc (A) 9.31
Operating voltage Ump (V) 19.73
Operating current Imp (A) 9.05
Maximum power Pmax (W) 178.59
Fill factor, curve factor 77.22%
From the experiment parameter of embodiment 1-3, the solar module packaged by back contacts solar cell backboard prepared by the present invention can obtain very high fill factor, curve factor, thus improves the generating efficiency of assembly.Effectively can prevent the short circuit between P electrode and N electrode, resistance toly hiddenly to split, high efficiency, high stability, there is preparation technology simultaneously simple, the advantage that cost reduces greatly.
Finally should be noted that; above embodiment is only in order to illustrate technical scheme of the present invention; but not limiting the scope of the invention; although done to explain to the present invention with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify to technical scheme of the present invention or equivalent replacement, and not depart from essence and the scope of technical solution of the present invention.
Claims (35)
1. without main grid, high efficiency back contact solar cell backboard, it is characterized in that: described back contact solar cells backboard is followed successively by electric connection layer and basic unit from top to bottom, and described electric connection layer is connected by bonding agent with between basic unit; Described electric connection layer comprises finger electrode more than two, and the described finger electrode of each group becomes interdigitated to be alternately arranged, and described electric connection layer is for connecting back contact battery sheet.
2. according to claim 1 without main grid, high efficiency back contact solar cell backboard, it is characterized in that: described electric connection layer is three-decker, ground floor is conductive material layer, the second layer is resistance to deformation layer, the material of third layer is the material identical or close with the coefficient of thermal expansion and contraction of ground floor material, and the finger electrode that interdigitated is alternately arranged is arranged on described conductive material layer.
3. according to claim 2 without main grid, high efficiency back contact solar cell backboard, it is characterized in that: described conductive material layer is aluminium-plastic panel, copper moulds plate or silver is moulded in plate any one, described resistance to deformation layer is foaming PET material, and the material of described third layer is identical with the electric conducting material of ground floor.
4. according to claim 1 without main grid, high efficiency back contact solar cell backboard, it is characterized in that: described finger electrode is coated with any one in layers of copper, silver layer or aluminium lamination; The electric connection layer of described backboard is provided with keeper.
5. according to claim 1 without main grid, high efficiency back contact solar cell backboard, it is characterized in that: on described electric connection layer, the shape of finger electrode finger is bending shape.
6. according to claim 1 without main grid, high efficiency back contact solar cell backboard, it is characterized in that: the finger of described finger electrode is provided with secondary grid or conducting particles, for collecting electronics, described secondary grid or conducting particles and Electrode connection.
7. according to claim 1 without main grid, high efficiency back contact solar cell backboard, it is characterized in that: the shape of cross section of described finger electrode finger is circular, square or any one in ellipse; The circumscribed circle diameter of described finger electrode finger shape of cross section is 0.05mm ~ 1.5mm.
8. according to claim 1 without main grid, high efficiency back contact solar cell backboard, it is characterized in that: the quantity of described finger electrode finger is 10 ~ 500.
9. according to claim 1 without main grid, high efficiency back contact solar cell backboard, it is characterized in that: bus bar electrode is arranged on the base portion of finger electrode, the surface of bus bar electrode has concaveconvex shape.
10. according to claim 1 without main grid, high efficiency back contact solar cell backboard, it is characterized in that: surface, described finger electrode finger is coated with low melting material or is coated with conducting resinl.
11. is according to claim 10 without main grid, high efficiency back contact solar cell backboard, it is characterized in that: described low melting material is any one in tin, leypewter, sn-bi alloy or tin pb-ag alloy; The thickness of coating of the finger of described finger electrode or conductive adhesive layer thickness are 5 μm ~ 50 μm.
12. is according to claim 10 without main grid, high efficiency back contact solar cell backboard, and it is characterized in that: described conducting resinl is low resistivity conductive bonded adhesives, its main component is conducting particles and polymeric adhesive.
13. is according to claim 12 without main grid, high efficiency back contact solar cell backboard, it is characterized in that: the conducting particles in described conducting resinl be in gold, silver, copper, gold-plated nickel, silver-plated nickel or silver-plated copper any one or appoint several combination; The shape of described conducting particles is the combination of any one or several in spherical, sheet, olive-shaped or needle-like; The particle diameter of conducting particles is 0.01 μm ~ 5 μm.
14. is according to claim 12 without main grid, high efficiency back contact solar cell backboard, it is characterized in that: the polymeric adhesive in described conducting resinl be in epoxy resin, polyurethane resin, acrylic resin, organic siliconresin any one or appoint several combination, described bonding agent can hot curing or photocuring.
15. without main grid, high efficiency back contact solar cell assembly, it is characterized in that: comprise the front layer material, encapsulating material, solar cell layer, the backboard that connect from top to bottom, described solar cell layer comprises several cell pieces, the shady face of described cell piece is arranged with the P electrode be connected with P type doped layer and the N electrode be connected with N-type doped layer, described cell piece is electrically connected with the electric connection layer on backboard, and described backboard is the arbitrary described backboard of claim 1-14.
16. is according to claim 15 without main grid, high efficiency back contact solar cell assembly, it is characterized in that: the electric connection layer of described backboard divides multiple module installation, forms battery module after loading onto cell piece; The bus bar electrode that described battery module is arranged by electric connection layer both sides connects; The cell piece number of described solar cell layer is 1 ~ 120, and wherein, comprise 1 ~ 120 battery module, described battery module comprises 1 ~ 120 cell piece.
17. is according to claim 15 without main grid, high efficiency back contact solar cell assembly, and it is characterized in that: described P electrode is point-like P electrode or line style P electrode, described N electrode is point-like N electrode or line style N electrode.
18. is according to claim 17 without main grid, high efficiency back contact solar cell assembly, it is characterized in that: the diameter of described point-like P electrode is 0.4mm ~ 1.5mm, the distance between two that are connected with the same finger of described finger electrode adjacent point-like P electrode is 7mm ~ 10mm; The diameter of described point-like N electrode is 0.4mm ~ 1.5mm, the distance 7mm ~ 10mm between point-like N electrode adjacent with two of the same finger of described finger electrode.
19. is according to claim 17 without main grid, high efficiency back contact solar cell assembly, it is characterized in that: total number of described point-like P electrode and described point-like N electrode is 1000 ~ 40000.
20. is according to claim 17 without main grid, high efficiency back contact solar cell assembly, it is characterized in that: described Spot electrodes or wire-type of electrode are any one in silver slurry, conducting resinl, scolding tin.
21. is according to claim 15 without main grid, high efficiency back contact solar cell assembly, it is characterized in that: be connected with described P electrode and be connected with described N electrode and distance between the finger of adjacent finger electrode is 0.1mm ~ 20mm.
22. is according to claim 15 without main grid, high efficiency back contact solar cell assembly, it is characterized in that: the insulating barrier place between described P electrode and described N electrode is provided with thermoplastic resin or thermosetting resin.
23. is according to claim 22 without main grid, high efficiency back contact solar cell assembly, it is characterized in that: described resin is any one in ethylene-vinyl acetate copolymer, vistanex, epoxy resin, polyurethane resin, acrylic resin, organic siliconresin.
24., without the preparation method of main grid, high efficiency back contact solar cell assembly, comprise the following steps:
Step one: prepare electric connection layer, shaping finger electrode on electric connection layer; By bonding with backboard for a group or more described finger electrode; Each group of described finger electrode becomes interdigitated to be alternately arranged, and arranges bus bar electrode at the base portion of finger electrode;
Step 2: the doped layer of back contact solar cell is electrically connected with the finger electrode on electric connection layer, the described one-tenth interdigited electrode of arranged adjacent is electrically connected with different shaped doped layer electrode; Connect the bus bar electrode on electric connection layer; Described cell piece forms solar cell layer;
Step 3: undertaken stacked by the solar cell layer prepared by front layer material, encapsulating material, step 2, backboard order successively, lamination obtains battery component.
25. 1 kinds, as claimed in claim 24 without the preparation method of main grid, high efficiency back contact solar cell assembly, is characterized in that: the interdigited electrode on described electric connection layer uses conducting medium to print just curing molding.
26. 1 kinds as claimed in claim 24 without the preparation method of main grid, high efficiency back contact solar cell assembly, it is characterized in that: described electric connection layer is three-decker, ground floor is conductive material layer, the second layer is resistance to deformation layer, the material of third layer is the material identical or close with the coefficient of thermal expansion and contraction of ground floor material, ground floor electric conducting material to be scribed or punching press is finger electrode, finger electrode is gluing laminating with resistance to deformation layer, third layer material layer successively, then the P electrode of finger electrode and cell piece or N electrode are electrically connected.
The preparation method of 27. 1 kinds of back contact solar cells unit as claimed in claim 24, is characterized in that: the one side of electric connection layer is pasted one deck glue, then carries out scribing or punching press; And concaveconvex shape is scribed on described bus bar electrode.
28. is according to claim 24 without main grid, the preparation method of high efficiency back contact solar cell assembly, it is characterized in that: the P electrode on cell piece described in step one and N electrode have mirror symmetrical structure in the horizontal plane, when the quantity of cell piece is greater than 1, the mode of assembled battery sheet is, after first piece of cell piece is connected with electric connection layer, second piece of cell piece is revolved turnback at horizontal plane, two panels cell piece justified margin, make the P electrode on second piece of cell piece and the N electrode on first piece of cell piece on the finger of a finger electrode, then normally the 3rd back contact battery is placed, make the N electrode of P electrode on the 3rd piece of cell piece and second piece of cell piece on the finger of one article of finger electrode, repeat aforesaid operations and form cascaded structure, form solar cell layer.
29. preparation methods without main grid, high efficiency back contact solar cell assembly according to claim 24, it is characterized in that: the finger of described finger electrode adopts plating process to be coated with low melting material, described low melting material be in scolding tin, leypewter, sn-bi alloy or tin pb-ag alloy any one or appoint several, after heating, make the finger of finger electrode be welded and fixed by low melting material thawing with P electrode or N electrode, the finger of finger electrode is electrically connected with cell piece.
30. preparation methods without main grid, high efficiency back contact solar cell assembly according to claim 29, is characterized in that: described heating fixation procedure uses heating resistance pad in cell piece front; The heating-up temperature of described heating resistance pad is 40 ~ 80 degree.
31. preparation methods without main grid, high efficiency back contact solar cell assembly according to claim 29, is characterized in that: the mode of described heating is any one in infrared radiation, Resistant heating or Hot-blast Heating, and heating-up temperature is 150 ~ 500 DEG C.
32. according to described in claim 24 without the preparation method of main grid, high efficiency back contact solar cell assembly, it is characterized in that: the parameter of described lamination sets according to the vulcanization characteristics of encapsulating material, described encapsulating material is EVA, is 145 degree of laminated 16 minutes.
33. according to described in claim 29 without the preparation method of main grid, high efficiency back contact solar cell assembly, it is characterized in that: the plating process of electric connection layer finger electrode finger is any one in hot-dip, plating or chemical plating.
34. according to described in claim 24 without the preparation method of main grid, high efficiency back contact solar cell assembly, it is characterized in that: described finger electrode is coated with any one in aluminium, copper, silver in the mode of cold plating or plating; The mode of described cold plating is that after being mixed with air by metal powder, high pressure sprays.
35. preparation methods without main grid, high efficiency back contact solar cell assembly according to claim 24, is characterized in that: on electric connection layer, arrange keeper; In step 2, the electric connection mode of cell piece and finger electrode is form P electrode and N electrode by silk screen printing coated with conductive glue on the P doped layer and N doped layer of cell piece, then the cell piece having applied conducting resinl is positioned on described electric connection layer by the keeper on described electric connection layer, described conducting resinl can solidify in heating process, after heating, make described finger electrode form ohmic contact with described P electrode or described N electrode by described conducting resinl, realize the electrical connection of finger electrode and cell piece.
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| CN110153276A (en) * | 2019-05-17 | 2019-08-23 | 浙江普兴电子科技有限公司 | A kind of solar battery sheet welding processing technology |
| CN110383500A (en) * | 2017-02-28 | 2019-10-25 | 亚特比目有限会社 | The manufacturing method of solar battery and solar battery |
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