CN104253193A - 一种高光效高性能的led - Google Patents
一种高光效高性能的led Download PDFInfo
- Publication number
- CN104253193A CN104253193A CN201410382175.3A CN201410382175A CN104253193A CN 104253193 A CN104253193 A CN 104253193A CN 201410382175 A CN201410382175 A CN 201410382175A CN 104253193 A CN104253193 A CN 104253193A
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- CN
- China
- Prior art keywords
- substrate
- led
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- light
- projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000694 effects Effects 0.000 title abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 72
- 239000002184 metal Substances 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 238000004020 luminiscence type Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 16
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000000576 coating method Methods 0.000 abstract description 8
- 239000011248 coating agent Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 239000000843 powder Substances 0.000 abstract 4
- 230000001795 light effect Effects 0.000 abstract 1
- 230000005855 radiation Effects 0.000 description 7
- 239000000047 product Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 230000008595 infiltration Effects 0.000 description 4
- 238000001764 infiltration Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000009992 mercerising Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410382175.3A CN104253193B (zh) | 2014-08-06 | 2014-08-06 | 一种高光效高性能的led |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410382175.3A CN104253193B (zh) | 2014-08-06 | 2014-08-06 | 一种高光效高性能的led |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104253193A true CN104253193A (zh) | 2014-12-31 |
CN104253193B CN104253193B (zh) | 2017-02-01 |
Family
ID=52187918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410382175.3A Active CN104253193B (zh) | 2014-08-06 | 2014-08-06 | 一种高光效高性能的led |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104253193B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110066799A (ko) * | 2009-12-11 | 2011-06-17 | 엘지디스플레이 주식회사 | 발광 다이오드 패키지 |
CN202888236U (zh) * | 2012-10-22 | 2013-04-17 | 厦门乾球光电科技有限公司 | 一种高效散热的大功率led |
CN103762293A (zh) * | 2014-01-20 | 2014-04-30 | 江苏华英光宝科技股份有限公司 | 强力结合式透明多角度发光led灯条及其制备方法 |
CN103956421A (zh) * | 2014-04-22 | 2014-07-30 | 中国科学院上海光学精密机械研究所 | 基于透明荧光陶瓷的led灯 |
-
2014
- 2014-08-06 CN CN201410382175.3A patent/CN104253193B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110066799A (ko) * | 2009-12-11 | 2011-06-17 | 엘지디스플레이 주식회사 | 발광 다이오드 패키지 |
CN202888236U (zh) * | 2012-10-22 | 2013-04-17 | 厦门乾球光电科技有限公司 | 一种高效散热的大功率led |
CN103762293A (zh) * | 2014-01-20 | 2014-04-30 | 江苏华英光宝科技股份有限公司 | 强力结合式透明多角度发光led灯条及其制备方法 |
CN103956421A (zh) * | 2014-04-22 | 2014-07-30 | 中国科学院上海光学精密机械研究所 | 基于透明荧光陶瓷的led灯 |
Also Published As
Publication number | Publication date |
---|---|
CN104253193B (zh) | 2017-02-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Led with high luminous efficiency and high performance Effective date of registration: 20220111 Granted publication date: 20170201 Pledgee: Yiwu Branch of China Construction Bank Co.,Ltd. Pledgor: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022330000050 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230720 Granted publication date: 20170201 Pledgee: Yiwu Branch of China Construction Bank Co.,Ltd. Pledgor: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022330000050 |