CN104253189B - 发光二极管的封装方法 - Google Patents
发光二极管的封装方法 Download PDFInfo
- Publication number
- CN104253189B CN104253189B CN201310262280.9A CN201310262280A CN104253189B CN 104253189 B CN104253189 B CN 104253189B CN 201310262280 A CN201310262280 A CN 201310262280A CN 104253189 B CN104253189 B CN 104253189B
- Authority
- CN
- China
- Prior art keywords
- electrode
- arc
- emitting diode
- spark stand
- reflector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000012856 packing Methods 0.000 title description 3
- 239000000463 material Substances 0.000 claims abstract description 49
- 239000007788 liquid Substances 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000005538 encapsulation Methods 0.000 claims abstract description 15
- 238000003860 storage Methods 0.000 claims abstract description 15
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 230000003287 optical effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (3)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310262280.9A CN104253189B (zh) | 2013-06-27 | 2013-06-27 | 发光二极管的封装方法 |
TW102124086A TW201511337A (zh) | 2013-06-27 | 2013-07-04 | 發光二極體的封裝方法及其結構 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310262280.9A CN104253189B (zh) | 2013-06-27 | 2013-06-27 | 发光二极管的封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104253189A CN104253189A (zh) | 2014-12-31 |
CN104253189B true CN104253189B (zh) | 2016-12-14 |
Family
ID=52187914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310262280.9A Active CN104253189B (zh) | 2013-06-27 | 2013-06-27 | 发光二极管的封装方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN104253189B (zh) |
TW (1) | TW201511337A (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102299240A (zh) * | 2010-06-28 | 2011-12-28 | 乐金显示有限公司 | 发光二极管以及包括其的背光单元和液晶显示器件 |
CN102903803A (zh) * | 2011-07-29 | 2013-01-30 | 展晶科技(深圳)有限公司 | 发光二极管封装结构的形成方法及其基座的形成方法 |
CN102922661A (zh) * | 2012-11-05 | 2013-02-13 | 苏州东山精密制造股份有限公司 | 一种led模压封装工艺及一种led组件 |
-
2013
- 2013-06-27 CN CN201310262280.9A patent/CN104253189B/zh active Active
- 2013-07-04 TW TW102124086A patent/TW201511337A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102299240A (zh) * | 2010-06-28 | 2011-12-28 | 乐金显示有限公司 | 发光二极管以及包括其的背光单元和液晶显示器件 |
CN102903803A (zh) * | 2011-07-29 | 2013-01-30 | 展晶科技(深圳)有限公司 | 发光二极管封装结构的形成方法及其基座的形成方法 |
CN102922661A (zh) * | 2012-11-05 | 2013-02-13 | 苏州东山精密制造股份有限公司 | 一种led模压封装工艺及一种led组件 |
Also Published As
Publication number | Publication date |
---|---|
CN104253189A (zh) | 2014-12-31 |
TW201511337A (zh) | 2015-03-16 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160923 Address after: 518000 Guangdong Province, Shenzhen New District of Longhua City, Dalang street, Hua Sheng Lu Yong Jingxuan commercial building 1608 Applicant after: Jinyang Shenzhen sea Network Intelligent Technology Co.,Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Street tabulaeformis Industrial Zone tenth east two Ring Road No. two Applicant before: ZHANJING Technology (Shenzhen) Co.,Ltd. Applicant before: Advanced Optoelectronic Technology Inc. |
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C41 | Transfer of patent application or patent right or utility model | ||
CB03 | Change of inventor or designer information |
Inventor after: Cai Jinlan Inventor after: Lin Jintian Inventor after: Lu Shufen Inventor after: Lin Shujiao Inventor after: Zhang Wen Inventor after: Li Chao Inventor before: Cai Mingda Inventor before: Yang Minshun Inventor before: Chen Jingzhong Inventor before: Zhang Zhongmin |
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COR | Change of bibliographic data | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20161115 Address after: 518100 A1 building, Sunshine Industrial Park, 2-3 south tower, Xixiang, Baoan District, Guangdong, Shenzhen, China Applicant after: XUYU OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Address before: 518000 Guangdong Province, Shenzhen New District of Longhua City, Dalang street, Hua Sheng Lu Yong Jingxuan commercial building 1608 Applicant before: Jinyang Shenzhen sea Network Intelligent Technology Co.,Ltd. Applicant before: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Effective date of registration: 20161115 Address after: Tianhe District Tong East Road Guangzhou city Guangdong province 510665 B-101 No. 5, room B-118 Applicant after: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Address before: 518000 Guangdong Province, Shenzhen New District of Longhua City, Dalang street, Hua Sheng Lu Yong Jingxuan commercial building 1608 Applicant before: Jinyang Shenzhen sea Network Intelligent Technology Co.,Ltd. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20141231 Assignee: Zhongshan Innocloud Intellectual Property Services Co.,Ltd. Assignor: XUYU OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Contract record no.: 2018440020037 Denomination of invention: Packaging method for organic LED Granted publication date: 20161214 License type: Common License Record date: 20180419 |
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EE01 | Entry into force of recordation of patent licensing contract |