CN104240795B - The method that application flex endurant conductive silver paste prepares flexible circuit board - Google Patents
The method that application flex endurant conductive silver paste prepares flexible circuit board Download PDFInfo
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- CN104240795B CN104240795B CN201410496461.2A CN201410496461A CN104240795B CN 104240795 B CN104240795 B CN 104240795B CN 201410496461 A CN201410496461 A CN 201410496461A CN 104240795 B CN104240795 B CN 104240795B
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- Prior art keywords
- silver paste
- circuit board
- conductive silver
- flexible circuit
- flex endurant
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Abstract
The present invention relates to flexible circuit board fabricating technology field, the method particularly relating to apply flex endurant conductive silver paste to prepare flexible circuit board, step 1 prepares ultra-fine high connductivity silver, the 2-in-1 one-tenth of step has the polyurethane PU resin of high tenacity, high adhesion force and high shrinkage, step 3 prepares high-performance flex endurant conductive silver paste, step 4 uses high-voltage corona process and surface-coated to process the mode combined, and flexible circuitry plate substrate is carried out surface process；Flexible circuit board printing can be improved so that it is the adhesive force of conductive silver paste is strong, reduce the migration of silver ion, improve the conductive stability of conducting wire, be effectively short-circuited, increase service life.
Description
Technical field
The present invention relates to flexible circuit board fabricating technology field, particularly relate to apply flex endurant conductive silver paste to prepare soft
The method of property wiring board.
Background technology
Flexible circuit board is also known as " soft board ", the printed circuit made with flexible insulating substrate.Flexible circuit provides excellent
Good electrical property, can meet the smaller and design needs of more high-density installation, it helps reduce assembling procedure and enhancing can
By property.Flexible circuit board is the only solution meeting miniaturization of electronic products and movement requirement.Can be with free bend, volume
Around, fold, millions of time dynamic bendings can be born and not damage wire, can require arbitrarily to arrange according to space layout, and
Arbitrarily move at three dimensions and stretch, thus reaching components and parts assembling and the integration of wire connection；Flexible circuit board can be big
Reduce greatly the volume and weight of electronic product, be suitable for the needs that electronic product develops to high density, miniaturization, highly reliable direction.
Existing flexible circuit board, impressionability is not high enough, and the adhesive force of its conductive silver paste is not high enough, adds silver ion
Migration, reduce the conductive stability of conducting wire, be susceptible to short circuit, reduce service life.
Summary of the invention
Present invention aims to the deficiencies in the prior art and provide a kind of application flex endurant conductive silver paste to prepare soft
Property wiring board method, flexible circuit board printing can be improved so that it is the adhesive force of conductive silver paste is strong, reduce moving of silver ion
Move, improve the conductive stability of conducting wire, be effectively short-circuited, increase service life.
For achieving the above object, the present invention adopts the following technical scheme that.
Applying the method that flex endurant conductive silver paste prepares flexible circuit board, it comprises the following steps:
Step 1, prepares ultra-fine high connductivity argentum powder: use the method that liquid phase chemical deposition and high-energy ball milling combine, with poly-
Vinylpyrrolidone is surfactant, hydrazine hydrate and ammonia compounding reduction silver nitrate, and preparation has lamellar, needle-like or petal-shaped
The ultra-fine high connductivity argentum powder of different-shape structure, and carry out surface by electron rich five yuan and hexa-member heterocycle urethane oligomer and change
Property, make ultra-fine high connductivity argentum powder have good dispersibility；
Step 2, synthesis has the polyurethane PU resin of high tenacity, high adhesion force and high shrinkage, enters by following mass parts
Row proportioning:
Polycaprolactone glycol 1800
1,6-HD 110
Trimethylolpropane 7
Dibutyl tin laurate 1.2 ‰
Butanol 5%；
Step 3, the ultra-fine high connductivity of different-shape structure prepared by polyurethane PU resin step 2 prepared and step 1
Argentum powder, and cold sealing type firming agent, curing accelerator, defoamer carry out be blended dispersion, prepare high-performance flex endurant conduction
Silver slurry；
Step 4, uses the high-performance flex endurant conductive silver paste of step 3 preparation, uses high-voltage corona process and surface-coated
Process the mode combined, flexible circuitry plate substrate is carried out surface process.
Described cold sealing type firming agent is aliphatic polyamine or alicyclic polyamine.
Described curing accelerator is m-diaminobenzene. and epoxy benzene alkane phenyl ether condensation substance or phenol formaldehyde (PF) hexamethylene diamine condensation substance.
Present invention have the beneficial effect that a kind of side applying flex endurant conductive silver paste to prepare flexible circuit board of the present invention
Method, can improve flexible circuit board printing so that it is the adhesive force of conductive silver paste is strong, reduces the migration of silver ion, improves conductor wire
The conductive stability on road, is effectively short-circuited, and increases service life.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is further illustrated.
The method that application flex endurant conductive silver paste of the present invention prepares flexible circuit board, applies flex endurant conductive silver paste system
For the method for flexible circuit board, it comprises the following steps:
Step 1, prepares ultra-fine high connductivity argentum powder: use the method that liquid phase chemical deposition and high-energy ball milling combine, with poly-
Vinylpyrrolidone is surfactant, hydrazine hydrate and ammonia compounding reduction silver nitrate, and preparation has lamellar, needle-like or petal-shaped
The ultra-fine high connductivity argentum powder of different-shape structure, and carry out surface by electron rich five yuan and hexa-member heterocycle urethane oligomer and change
Property, make ultra-fine high connductivity argentum powder have good dispersibility；
Step 2, synthesis has the polyurethane PU resin of high tenacity, high adhesion force and high shrinkage, enters by following mass parts
Row proportioning:
Polycaprolactone glycol 1800
1,6-HD 110
Trimethylolpropane 7
Dibutyl tin laurate 1.2 ‰
Butanol 5%；
Step 3, the ultra-fine high connductivity of different-shape structure prepared by polyurethane PU resin step 2 prepared and step 1
Argentum powder, and cold sealing type firming agent, curing accelerator, defoamer carry out be blended dispersion, prepare high-performance flex endurant conduction
Silver slurry；
Step 4, uses the high-performance flex endurant conductive silver paste of step 3 preparation, uses high-voltage corona process and surface-coated
Process the mode combined, flexible circuitry plate substrate is carried out surface process.
Preferably, described cold sealing type firming agent is aliphatic polyamine or alicyclic polyamine.Preferably, described solidification promotees
Entering agent is m-diaminobenzene. and epoxy benzene alkane phenyl ether condensation substance or phenol formaldehyde (PF) hexamethylene diamine condensation substance.
A kind of method applying flex endurant conductive silver paste to prepare flexible circuit board of the present invention, can improve flexible circuit board
Printing so that it is the adhesive force of conductive silver paste is strong, reduces the migration of silver ion, improves the conductive stability of conducting wire, effectively
It is short-circuited, increases service life.
The above is only the better embodiment of the present invention, thus all according to the structure described in present patent application scope,
The equivalence that feature and principle are done changes or modifies, in the range of being all included in present patent application.
Claims (3)
1. the method that application flex endurant conductive silver paste prepares flexible circuit board, it is characterised in that it comprises the following steps:
Step 1, prepares ultra-fine high connductivity argentum powder: use the method that liquid phase chemical deposition and high-energy ball milling combine, with polyethylene
Ketopyrrolidine is surfactant, hydrazine hydrate and ammonia compounding reduction silver nitrate, and it is different that preparation has lamellar, needle-like or petal-shaped
The ultra-fine high connductivity argentum powder of appearance structure, and carry out surface modification by electron rich five yuan and hexa-member heterocycle urethane oligomer,
Ultra-fine high connductivity argentum powder is made to have good dispersibility；
Step 2, synthesis has the polyurethane PU resin of high tenacity, high adhesion force and high shrinkage, joins by following mass parts
Ratio:
Polycaprolactone glycol 1800
1,6-HD 110
Trimethylolpropane 7
Dibutyl tin laurate 1.2 ‰
Butanol 5%；
Step 3, the ultra-fine high connductivity argentum powder of different-shape structure prepared by polyurethane PU resin step 2 prepared and step 1,
And cold sealing type firming agent, curing accelerator, defoamer carry out dispersion is blended, prepare high-performance flex endurant conductive silver paste；
Step 4, uses the high-performance flex endurant conductive silver paste of step 3 preparation, uses high-voltage corona process and surface-coated to process
The mode combined, carries out surface process to flexible circuitry plate substrate.
The method that application flex endurant conductive silver paste the most according to claim 1 prepares flexible circuit board, it is characterised in that: institute
Stating cold sealing type firming agent is aliphatic polyamine or alicyclic polyamine.
The method that application flex endurant conductive silver paste the most according to claim 1 prepares flexible circuit board, it is characterised in that: institute
Stating curing accelerator is m-diaminobenzene. and epoxy benzene alkane phenyl ether condensation substance or phenol formaldehyde (PF) hexamethylene diamine condensation substance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410496461.2A CN104240795B (en) | 2014-09-25 | 2014-09-25 | The method that application flex endurant conductive silver paste prepares flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410496461.2A CN104240795B (en) | 2014-09-25 | 2014-09-25 | The method that application flex endurant conductive silver paste prepares flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104240795A CN104240795A (en) | 2014-12-24 |
| CN104240795B true CN104240795B (en) | 2016-11-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410496461.2A Expired - Fee Related CN104240795B (en) | 2014-09-25 | 2014-09-25 | The method that application flex endurant conductive silver paste prepares flexible circuit board |
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| CN (1) | CN104240795B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105992452A (en) * | 2015-02-06 | 2016-10-05 | 常熟精元电脑有限公司 | Circuit board and manufacturing method thereof |
| CN106504815A (en) * | 2016-10-21 | 2017-03-15 | 常州亚环环保科技有限公司 | A kind of preparation method of low temperature polyurethane-base conductive silver paste |
| CN108598190A (en) * | 2018-05-31 | 2018-09-28 | 苏州瑞力博新材科技有限公司 | A kind of low-density HIT low temperature silver paste used for solar batteries and preparation method |
| CN110993148B (en) * | 2019-12-10 | 2021-07-20 | 北京中科纳通电子技术有限公司 | Flexible slurry applied to 5G mobile terminal and preparation method thereof |
| CN114141404A (en) * | 2021-11-22 | 2022-03-04 | 苏州市贝特利高分子材料股份有限公司 | High-conductivity high-flexibility low-temperature silver paste |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101245227A (en) * | 2007-02-13 | 2008-08-20 | 核工业第八研究所 | Epoxy conductive silver glue for LED and method for manufacturing same |
| CN101824132A (en) * | 2010-04-21 | 2010-09-08 | 浙江深蓝轻纺科技有限公司 | Weak solvent aliphatic polyurethane resin for synthetic leather and preparation method thereof |
| CN102361900A (en) * | 2009-03-24 | 2012-02-22 | Ppg工业俄亥俄公司 | Polyurethanes, articles and coatings prepared therefrom and methods of making the same |
| CN102470436A (en) * | 2009-10-02 | 2012-05-23 | 户田工业株式会社 | Fine silver particles, method for producing same, conductive paste containing the fine silver particles, conductive film, and electronic device |
-
2014
- 2014-09-25 CN CN201410496461.2A patent/CN104240795B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101245227A (en) * | 2007-02-13 | 2008-08-20 | 核工业第八研究所 | Epoxy conductive silver glue for LED and method for manufacturing same |
| CN102361900A (en) * | 2009-03-24 | 2012-02-22 | Ppg工业俄亥俄公司 | Polyurethanes, articles and coatings prepared therefrom and methods of making the same |
| CN102470436A (en) * | 2009-10-02 | 2012-05-23 | 户田工业株式会社 | Fine silver particles, method for producing same, conductive paste containing the fine silver particles, conductive film, and electronic device |
| CN101824132A (en) * | 2010-04-21 | 2010-09-08 | 浙江深蓝轻纺科技有限公司 | Weak solvent aliphatic polyurethane resin for synthetic leather and preparation method thereof |
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| CN104240795A (en) | 2014-12-24 |
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161130 Termination date: 20180925 |