TW201828307A - Resistance material - Google Patents

Resistance material Download PDF

Info

Publication number
TW201828307A
TW201828307A TW106116323A TW106116323A TW201828307A TW 201828307 A TW201828307 A TW 201828307A TW 106116323 A TW106116323 A TW 106116323A TW 106116323 A TW106116323 A TW 106116323A TW 201828307 A TW201828307 A TW 201828307A
Authority
TW
Taiwan
Prior art keywords
resistance material
weight percentage
material according
resin
catalyst
Prior art date
Application number
TW106116323A
Other languages
Chinese (zh)
Inventor
胡先欽
沈芾雲
何明展
莊毅強
Original Assignee
大陸商鵬鼎控股（深圳）股份有限公司
大陸商宏啟勝精密電子（秦皇島）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商鵬鼎控股（深圳）股份有限公司, 大陸商宏啟勝精密電子（秦皇島）有限公司 filed Critical 大陸商鵬鼎控股（深圳）股份有限公司
Publication of TW201828307A publication Critical patent/TW201828307A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Abstract

A resistance material, the resistance material is used to make a resistance element. The resistance material is a heat-curable colloid. The resistance material consists of a resin, a sclerosing agent, an accelerant, and a conductive filler. In the resistance material, the resin has a weight percentage of about 19.5%~35%, the sclerosing agent has a weight percentage of about 10%~17%, the accelerant has a weight percentage of about 0~1%, and the conductive filler has a weight percentage of about 0~1%.

Description

電阻材料Resistive material

本發明涉及電路板製作領域，尤其涉及一種用於製作電阻元件的電阻材料。The invention relates to the field of circuit board manufacturing, and in particular, to a resistive material for manufacturing a resistive element.

隨著電阻元件向微型化發展，內埋技術應運而生。其具有如下優勢：封裝面積消減與低耗電化、提升信號品質及降低電磁幹擾雜訊與高頻電源安定化。With the development of miniaturization of resistance elements, embedded technology has emerged. It has the following advantages: reduced packaging area and lower power consumption, improved signal quality, reduced electromagnetic interference noise and high-frequency power stabilization.

內埋技術中常用的內埋被動元件主要有：電感元件、電容元件及電阻元件。The embedded passive components commonly used in the embedded technology mainly include: inductive components, capacitive components and resistive components.

例如，內埋電阻元件的通常做法是：先將電阻元件內埋在同一導電線路層內，再增層，制程複雜；且電阻元件的材料多使用NiCr，NiP等合金層，但是這些材料通常被材料商控制，導致內埋有電阻元件的電路板的製作成本較高。For example, the common practice of embedded resistance elements is: firstly bury the resistance element in the same conductive circuit layer, and then add layers, the process is complicated; and the material of the resistance element mostly uses alloy layers such as NiCr, NiP, etc. The control of the material manufacturer leads to a higher manufacturing cost of the circuit board in which the resistance element is embedded.

有鑑於此，本發明提供一種成本低的電阻材料。In view of this, the present invention provides a low-cost resistance material.

一種電阻材料，用於製作電阻元件，該電阻材料為一種熱固化膠體，該電阻材料主要由樹脂、硬化劑、觸媒及導電填料組成，在該電阻材料中，該樹脂所占的重量百分比為19.5~35%，該硬化劑所占的重量百分比為10~17%，該觸媒所占的重量百分比為0~1%，該導電填料所占的重量百分比為46~69%。A resistance material is used to make a resistance element. The resistance material is a thermosetting gel. The resistance material is mainly composed of resin, hardener, catalyst and conductive filler. In the resistance material, the weight percentage of the resin is 19.5-35%, the weight percentage of the hardener is 10-17%, the weight percentage of the catalyst is 0-1%, and the weight percentage of the conductive filler is 46-69%.

與現有技術相比，本發明提供的製作電阻元件的電阻材料的製作成本低，採用上述電阻材料作為該電阻元件的製作材料，可以通過印刷的方式將電阻元件形成兩個電路基板之間，並在增層的過程中固化成型，可以簡化電路板的制程。Compared with the prior art, the manufacturing cost of the resistance material for the resistance element provided by the present invention is low. By using the above resistance material as the material for the resistance element, the resistance element can be formed between two circuit substrates by printing, and Solidification during the build-up process can simplify the circuit board manufacturing process.

為能進一步闡述本發明達成預定發明目的所採取的技術手段及功效，以下結合較佳實施方式，對本發明提供的電阻材料的具體實施方式、特徵及其功效，作出如下詳細說明。In order to further explain the technical means and effects adopted by the present invention to achieve the intended purpose of the present invention, the following describes in detail the specific embodiments, features, and effects of the resistance material provided by the present invention in combination with preferred embodiments.

本發明提供一種電阻材料30，該電阻材料30為一種熱固化膠體，該電阻材料30用於製作電阻元件31。該電阻材料30主要由樹脂、硬化劑、觸媒、導電填料及添加劑攪拌混合而成。The present invention provides a resistance material 30, which is a heat-curable gel. The resistance material 30 is used to make a resistance element 31. The resistance material 30 is mainly made of resin, hardener, catalyst, conductive filler, and additives.

在該電阻材料30中，該樹脂所占的重量百分比為19.5~35%，該硬化劑所占的重量百分比為10~17%，該觸媒所占的重量百分比為0~1%，該導電填料所占的重量百分比為46~69%，該添加劑所占的重量百分比為0.2~2%。In the resistive material 30, the weight percentage of the resin is 19.5 to 35%, the weight percentage of the hardener is 10 to 17%, and the weight percentage of the catalyst is 0 to 1%. The conductive The weight percentage of the filler is 46 to 69%, and the weight percentage of the additive is 0.2 to 2%.

該樹脂用於控制產品的特性，例如：粘度。This resin is used to control product characteristics such as viscosity.

該樹脂可以為單一樹脂，也可以為多種樹脂的混合物。The resin may be a single resin or a mixture of a plurality of resins.

在本實施例中，該樹脂包括環氧樹脂、二聚酸改性聚酯及聚丙二醇二縮水甘油基醚。其中，該環氧樹脂的結構式為：；該聚丙二醇二縮水甘油基醚的結構式為：。In this embodiment, the resin includes epoxy resin, dimer acid-modified polyester, and polypropylene glycol diglycidyl ether. The structural formula of the epoxy resin is: The structural formula of the polypropylene glycol diglycidyl ether is: .

在該電阻材料30中，該環氧樹脂的重量百分比為8.5~15%，該二聚酸改性聚酯的重量百分比為4~8%，該聚丙二醇二縮水甘油基醚的重量百分比為7~12%。In the resistive material 30, the weight percentage of the epoxy resin is 8.5-15%, the weight percentage of the dimer acid-modified polyester is 4-8%, and the weight percentage of the polypropylene glycol diglycidyl ether is 7 ~ 12%.

在其他實施例中，該樹脂還可以為環氧樹脂、二聚酸改性聚酯及聚丙二醇二縮水甘油基醚中的任意一種或任意兩種。In other embodiments, the resin may be any one or two of epoxy resin, dimer acid modified polyester, and polypropylene glycol diglycidyl ether.

當然，該樹脂的種類並不局限於上述提到的三種樹脂，只要保證樹脂的參與整體反應的官能團數目等於硬化劑活化基團數目即可。Of course, the type of the resin is not limited to the three resins mentioned above, as long as the number of functional groups participating in the overall reaction of the resin is equal to the number of activating groups of the hardener.

該硬化劑用於促進樹脂反應，以形成鏈狀結構。該硬化劑可以為脂肪胺固化劑、聚醯胺固化劑、脂環胺固化劑等常規硬化劑。在本實施例中，該硬化劑為聚醯胺固化劑。This hardener is used to promote the resin reaction to form a chain structure. The curing agent may be a conventional curing agent such as an aliphatic amine curing agent, a polyamine curing agent, and an alicyclic amine curing agent. In this embodiment, the curing agent is a polyamide curing agent.

該觸媒用於降低反應發生所需要的活化能，以促進反應的發生。該觸媒可以為咪唑類物質。The catalyst is used to reduce the activation energy required for the reaction to occur to promote the reaction. The catalyst may be an imidazole-based substance.

在本實施例中，該觸媒優選為2-十一烷基咪唑，該2-十一烷基咪唑的結構式為。In this embodiment, the catalyst is preferably 2-undecylimidazole, and the structural formula of the 2-undecylimidazole is .

該導電填料用於增強該電阻材料30的導電率。該導電填料在該電阻材料30中的重量百分比的大小決定該電阻元件31的整體電阻率的大小。The conductive filler is used to enhance the electrical conductivity of the resistive material 30. The weight percentage of the conductive filler in the resistive material 30 determines the overall resistivity of the resistive element 31.

該導電填料可以為表面包覆銀粉、金粉、鎳粉等的銅粒子中的一種或幾種。在本實施例中，該導電填料優選為表面包覆銀粉的銅粒子，即為銀包銅粉。The conductive filler may be one or more of copper particles coated with silver powder, gold powder, nickel powder, or the like. In this embodiment, the conductive filler is preferably copper particles whose surface is coated with silver powder, that is, silver-coated copper powder.

該添加劑用於增強該電阻材料30的粘度，以符合印刷要求。The additive is used to increase the viscosity of the resistive material 30 to meet printing requirements.

在本實施例中，該添加劑為矽烷增粘劑，其結構式為：。In this embodiment, the additive is a silane tackifier, and its structural formula is: .

在其他實施例中，該添加劑也可以選用有機高分子型的防沉劑，該防沉劑優選聚醯胺蠟防沉劑。In other embodiments, the additive may also be an organic polymer type anti-settling agent. The anti-settling agent is preferably a polyamidowax anti-settling agent.

下麵通過實施例來對本發明進行具體說明。 實施例1The following specifically describes the present invention through examples. Example 1

將重量百分比為9.24%的環氧樹脂、重量百分比為4.62%的二聚酸改性聚酯、重量百分比為9.24%的聚丙二醇二縮水甘油基醚及重量百分比為0.46%的添加劑加入到一攪拌容器中，攪拌4小時後，加入重量百分比為64.68%的導電填料，再攪拌2小時，再加入重量百分比為11.55%的硬化劑及重量百分比為0.21%的觸媒，經三滾筒分散後得到該電阻材料30。Add 9.24% by weight epoxy resin, 4.62% by weight dimer acid modified polyester, 9.24% by weight polypropylene glycol diglycidyl ether, and 0.46% by weight additives to a stirring In the container, after stirring for 4 hours, add 64.68% by weight of conductive filler, stir for another 2 hours, then add 11.55% by weight of hardener and 0.21% by weight of catalyst, which is obtained after dispersion by three rollers Resistive material 30.

經由實施例1的配比得到的該電阻材料30在經過熱壓後得到的電阻元件的電阻率為0.001 歐姆.釐米(ohm.cm)。The resistivity of the resistive element obtained through the heat-pressing of the resistive material 30 obtained in the ratio of Example 1 was 0.001 ohm.cm.

與現有技術相比，本發明提供的製作電阻元件的電阻材料的製作成本低。Compared with the prior art, the manufacturing cost of the resistance material for manufacturing the resistance element provided by the present invention is low.

另外，採用上述電阻材料作為該電阻元件的製作材料，可以通過印刷的方式將電阻元件形成兩個電路基板中間，並在增層的過程中固化成型，可以簡化電路板的制程。In addition, by using the above-mentioned resistive material as a manufacturing material of the resistive element, the resistive element can be formed in the middle of two circuit substrates by printing, and solidified during the build-up process, which can simplify the manufacturing process of the circuit board.

綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。In summary, the present invention has indeed met the requirements for an invention patent, and a patent application was filed in accordance with the law. However, the above are only preferred embodiments of the present invention, and the scope of patent application in this case cannot be limited by this. For example, those who are familiar with the skills of this case and equivalent modifications or changes made according to the spirit of the present invention should be covered by the following patent applications.

無。no.

無。no.

無。no.

Claims (10)

一種電阻材料，其中，該電阻材料為一種熱固化膠體，該電阻材料主要由樹脂、硬化劑、觸媒及導電填料組成，在該電阻材料中，該樹脂所占的重量百分比為19.5~35%，該硬化劑所占的重量百分比為10~17%，該觸媒所占的重量百分比為0~1%，該導電填料所占的重量百分比為46~69%。A resistive material, wherein the resistive material is a thermosetting gel, the resistive material is mainly composed of a resin, a hardener, a catalyst, and a conductive filler. In the resistive material, the weight percentage of the resin is 19.5 ~ 35% The weight percentage of the hardener is 10-17%, the weight percentage of the catalyst is 0-1%, and the weight percentage of the conductive filler is 46-69%. 如請求項第1項所述的電阻材料，其中，該電阻材料中還含有添加劑，該添加劑所占的重量百分比為0.2~2%。The resistance material according to item 1 of the claim, wherein the resistance material further contains an additive, and the weight percentage of the additive is 0.2 to 2%. 如請求項第1項所述的電阻材料，其中，該樹脂由環氧樹脂、二聚酸改性聚酯及聚丙二醇二縮水甘油基醚中的一種或兩種組成。The resistance material according to claim 1, wherein the resin is composed of one or two of epoxy resin, dimer acid-modified polyester, and polypropylene glycol diglycidyl ether. 如請求項第1項所述的電阻材料，其中，该树脂包括环氧树脂、二聚酸改性聚酯及聚丙二醇二缩水甘油基醚，該環氧樹脂的結構式為：；該聚丙二醇二縮水甘油基醚的結構式為：。The resistance material according to claim 1, wherein the resin includes an epoxy resin, a dimer acid-modified polyester, and a polypropylene glycol diglycidyl ether, and the structural formula of the epoxy resin is: The structural formula of the polypropylene glycol diglycidyl ether is: . 如請求項第4項所述的電阻材料，其中，在該電阻材料中，該環氧樹脂的重量百分比為8.5~15%，該二聚酸改性聚酯的重量百分比為4~8%，該聚丙二醇二縮水甘油基醚的重量百分比為7~12%。The resistance material according to item 4 of the claim, wherein in the resistance material, the weight percentage of the epoxy resin is 8.5-15%, and the weight percentage of the dimer acid-modified polyester is 4-8%. The weight percentage of the polypropylene glycol diglycidyl ether is 7-12%. 如請求項第1項所述的電阻材料，其中，該硬化劑為脂肪胺固化劑、聚醯胺固化劑、脂環胺固化劑中的至少一種。The resistance material according to claim 1, wherein the curing agent is at least one of an aliphatic amine curing agent, a polyamine curing agent, and an alicyclic amine curing agent. 如請求項第1項所述的電阻材料，其中，該觸媒為咪唑類物質。The resistance material according to item 1 of the claim, wherein the catalyst is an imidazole substance. 如請求項第7項所述的電阻材料，其中，該觸媒優選為2-十一烷基咪唑，該2-十一烷基咪唑的結構式為。The resistance material according to item 7 of the claim, wherein the catalyst is preferably 2-undecylimidazole, and the structural formula of the 2-undecylimidazole is . 如請求項第1項所述的電阻材料，其中，該導電填料為表面包覆銀粉、金粉、鎳粉的銅粒子中的一種或幾種。The resistance material according to item 1 of the claim, wherein the conductive filler is one or more of copper particles whose surface is coated with silver powder, gold powder, and nickel powder. 如請求項第1項所述的電阻材料，其中，該添加劑為矽烷增粘劑、有機高分子型的防沉劑中的一種或兩種。The resistance material according to claim 1, wherein the additive is one or two of a silane thickener and an organic polymer type anti-settling agent.
TW106116323A 2017-01-19 2017-05-17 Resistance material TW201828307A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710044062.6A CN108329654B (en) 2017-01-19 2017-01-19 Resistance material, circuit board and manufacturing method of circuit board
??201710044062.6 2017-01-19

Publications (1)

Publication Number Publication Date
TW201828307A true TW201828307A (en) 2018-08-01

Family

ID=62922939

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106116323A TW201828307A (en) 2017-01-19 2017-05-17 Resistance material

Country Status (2)

Country Link
CN (1) CN108329654B (en)
TW (1) TW201828307A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI822517B (en) * 2022-12-14 2023-11-11 慧榮科技股份有限公司 Method and computer program product and apparatus for executing host write commands
TWI822516B (en) * 2022-12-14 2023-11-11 慧榮科技股份有限公司 Method and computer program product and apparatus for executing host write commands

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109640520B (en) * 2018-12-10 2021-07-23 江门崇达电路技术有限公司 Manufacturing method of buried resistance circuit board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE40947E1 (en) * 1997-10-14 2009-10-27 Ibiden Co., Ltd. Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
GB201116240D0 (en) * 2011-09-20 2011-11-02 Henkel Ag & Co Kgaa Electrically conductive adhesives comprising silver-coated particles
CN103881300B (en) * 2012-12-22 2016-08-24 富葵精密组件(深圳)有限公司 Epoxy resin composite material and circuit board and preparation method thereof
TWI695657B (en) * 2015-03-30 2020-06-01 日商則武股份有限公司 Flexible wiring board and its utilization

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI822517B (en) * 2022-12-14 2023-11-11 慧榮科技股份有限公司 Method and computer program product and apparatus for executing host write commands
TWI822516B (en) * 2022-12-14 2023-11-11 慧榮科技股份有限公司 Method and computer program product and apparatus for executing host write commands

Also Published As

Publication number Publication date
CN108329654A (en) 2018-07-27
CN108329654B (en) 2021-04-20

Similar Documents

Publication Publication Date Title
KR102058747B1 (en) Conductive adhesive layer and electromagnetic wave shield material for fpc
JP5707216B2 (en) Electromagnetic wave shielding material for FPC
TWI488280B (en) Electromagnetic wave shielding structure and method for fabricating the same
KR20190104131A (en) Electronic shielding film and its manufacturing method
JP4972955B2 (en) Conductive paste and printed wiring board using the same
CN109642130B (en) Adhesive composition
CN101538397A (en) Epoxy resin composition, glue film made of same and preparation method
TW201828307A (en) Resistance material
KR20090047328A (en) Conductive paste and printed circuit board using the same
KR101295801B1 (en) Conductive adhesive material composition
CN104106182B (en) Anisotropic conductive connecting material, connection structural bodies, the manufacturing method of connection structural bodies and connection method
JP2009096851A5 (en)
TWI701279B (en) Resin composition, bonded body and semiconductor device
TW201840767A (en) Adhesive film
TW201933964A (en) Connection structure and method for producing same
CN102378482B (en) Circuit board substrate and manufacturing method thereof
JP2014114420A (en) Conductive resin composition, conductive cured product, wiring, electronic component
JP6488156B2 (en) Conductive paste
CN104371616A (en) Preparation method of phenolic resin conductive adhesive
CN105491788A (en) Graphene heat radiation type shielding film and preparation method thereof
JP2017115152A (en) Conductive adhesive layer and electromagnetic wave shielding material for FPC
TWI550650B (en) Conductive sheet and electonic parts
KR101764220B1 (en) Conductive composition for nano imprint, and method for manufacturing touch panel using the same
CN103680764A (en) Manufacturing method of conductive combined body
CN103881300A (en) Epoxy resin composite material and circuit board and producing methods thereof