CN104235663B - A kind of production technology of flexible LED lamp bar - Google Patents
A kind of production technology of flexible LED lamp bar Download PDFInfo
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- CN104235663B CN104235663B CN201410491307.6A CN201410491307A CN104235663B CN 104235663 B CN104235663 B CN 104235663B CN 201410491307 A CN201410491307 A CN 201410491307A CN 104235663 B CN104235663 B CN 104235663B
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Abstract
The invention discloses a kind of production technology of flexible LED lamp bar, by LED chip being directly packaged on strip substrate, decrease the operation of later stage Reflow Soldering, avoid high temperature, improve the stability of LED chip, and LED chip is direct and strip substrate contacts, improve heat transference efficiency, improve the integral heat sink effect of flexible LED lamp bar, and The present invention reduces the operations such as LED lamp bead individual packages and Reflow Soldering, simplify the production technology of flexible LED lamp band, reduce the cost of manufacture, and make the production technology of flexible LED lamp band of the present invention more be suitable for automated production, improve the efficiency of producing.
Description
Technical field
The present invention relates to a kind of production technology of flexible LED lamp bar.
Background technology
LED is a kind of solid state light emitter, and its basic structure is electroluminescent semi-conducting material, and it changes the principle of the luminescence of incandescent lamp tungsten filament and electricity-saving lamp three-color light-emitting, and electrical-optical conversion efficiency is very high, has the advantage such as energy-saving and environmental protection, long service life.These characteristics determined it be optimal conventional light source substitute, its theoretical conversion efficiencies is higher than conventional light source light extraction efficiency 5 ~ 20 times.
Flexible LED lamp bar has good Installation Flexibility, therefore be widely used in various LED lamp and decorative illumination lamp bar, packaged LED lamp bead is normally soldered on FPC plate (flexible base board) by the production of current flexible LED lamp bar, be soldered on FPC plate by welding manners such as Reflow Solderings after LED lamp bead outsourcing or individual packages, high temperature can be produced in welding process, the LED chip in LED lamp bead can be had influence on, easily cause LED chip, there is dislocation in nation's alignments etc., fault, reduce the stability of LED lamp bead, and LED lamp bead only can rely on the support heat radiation carried, its heat produced is difficult to conduct on FPC plate, cause the problem of radiating effect difference, and in traditional flexible LED lamp bar production, LED lamp bead individual packages, technological process is complicated, manufacturing cost is high.
Summary of the invention
In order to overcome the deficiencies in the prior art, the invention provides a kind of production technology of flexible LED lamp bar, flexible LED lamp bar production procedure can be simplified by this technique, reducing costs, and improve stability and the radiating effect of flexible LED lamp bar.
The technical solution adopted for the present invention to solve the technical problems is:
A production technology for flexible LED lamp bar, comprises the following steps:
Step 1, cut substrate, substrate cut into strip substrate, and on this strip substrate printed circuit;
Step 2, on strip substrate, be provided with multiple LED chip support for placing LED chip along its length, LED chip support arranges the cathode contact corresponding with circuit and cathode contact;
Step 3, die bond, glue enclosed by LED chip support, LED chip to be placed on LED chip support and to be fixed by glue;
Step 4, oven dry, solidify drying adhesive;
Step 5, nation are fixed, determine bonding wire the cathode contact on the both positive and negative polarity of LED chip and support and cathode contact are carried out bridge joint by nation;
Step 6, encapsulation, determine the glue spots being mixed with fluorescent material on bonding wire in LED chip and nation, and the drying adhesive being mixed with fluorescent material solidify to form fluorescent colloid, with fixing protection LED chip and Bang Ding bonding wire.
As preferably, described step 2 comprises the following steps:
Step 2.1, strip substrate arranges several be used as the convex position of LED chip support;
Step 2.2, arrange chip groove for placing LED chip at this convex position place, described cathode contact and cathode contact are arranged on this chip groove both sides.
As preferably, in described step 6, LED chip support arranges light guide support, in this light guide support, is provided with the light-conductive hole corresponding with LED chip and Bang Ding bonding wire, described in be mixed with the glue spots of fluorescent material in this light-conductive hole.
As preferably, described strip substrate is flexible base board, and it comprises heat-conducting metal layer, insulating barrier, is provided with the metal foil electrode layers as circuit on which insulating layer.
Described heat-conducting metal layer is copper coin or aluminium sheet.
As preferably, in step 1, one square substrate is cut many strip substrates, and between adjacent strip substrate, leave connecting plate for connecting adjacent strip substrate, in step 6, after being mixed with the glue curing of fluorescent material, connecting plate severing is formed the flexible LED lamp bar of wall scroll.
As preferably, the circuit of strip substrate is provided with resistance.
Described electric resistance welding is fixed on LED chip support, and in step 6, the described glue spots being mixed with fluorescent material is determined on bonding wire, resistance in LED chip, nation, determines bonding wire and resistance with fixing protection LED chip, nation.
Described light guide support lower end is provided with the groove corresponding with strip substrate.
Described strip substrate is provided with some interval troughs, and described light guide support lower end is provided with some concavo-convex screens corresponding with interval trough.
The invention has the beneficial effects as follows: the present invention is by above-mentioned technique, LED chip is directly packaged on strip substrate, decrease the operation of later stage Reflow Soldering, avoid high temperature, improve the stability of LED chip, and LED chip is direct and strip substrate contacts, improve heat transference efficiency, improve the integral heat sink effect of flexible LED lamp bar, and The present invention reduces the operations such as LED lamp bead individual packages and Reflow Soldering, simplify the production technology of flexible LED lamp band, reduce the cost of manufacture, and make the production technology of flexible LED lamp band of the present invention more be suitable for automated production, improve the efficiency of producing.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is one of topology example of the flexible LED lamp bar of being produced by the present invention;
Fig. 2 is the decomposing schematic representation of LED part in Fig. 1;
Fig. 3 is the topology example two of the flexible LED lamp bar of being produced by the present invention;
Fig. 4 is the decomposing schematic representation of LED part in Fig. 3; .
Detailed description of the invention
With reference to Fig. 1, Fig. 2, Fig. 1, Fig. 2 are one of topology examples of the flexible LED lamp bar of being produced by the present invention, and its production technology includes following steps:
Step 1, cut substrate, substrate cut into strip substrate 1, and on this strip substrate 1 printed circuit;
Step 2, on strip substrate 1, be provided with multiple LED chip support for placing LED chip 2 along its length, LED chip support arranges the cathode contact corresponding with circuit and cathode contact;
Step 3, die bond, glue enclosed by LED chip support, LED chip 2 to be placed on LED chip support and to be fixed by glue;
Step 4, oven dry, solidify drying adhesive;
Step 5, nation are fixed, determine bonding wire 3 cathode contact on the both positive and negative polarity of LED chip 2 and support and cathode contact are carried out bridge joint by nation;
Step 6, encapsulation, determine the glue spots being mixed with fluorescent material on bonding wire 3 in LED chip 2 and nation, and the drying adhesive being mixed with fluorescent material solidify to form fluorescent colloid 4, with fixing protection LED chip 2 and Bang Ding bonding wire 3.
As preferably, described step 2 comprises the following steps:
Step 2.1, strip substrate 1 arranges several be used as the convex position 11 of LED chip support, this convex position 11 plays the role of positioning;
Step 2.2, arrange chip groove 12 for placing LED chip 2 at this convex position 11 place, described cathode contact and cathode contact are arranged on this chip groove 12 both sides.
In step 3, by point gum machine, glue is clicked and entered to chip groove 12, then by bonder, LED chip 2 is placed in this chip groove 12, fixing LED chip 2 can be completed after step 4 baking and curing until glue, this glue preferably adopts the heat-conducting glue with silver powder to improve heat transfer efficiency, certainly also can adopt typical thermal-conductive glue or insulating cement.
The nation adopted in above-mentioned step 5 determines bonding wire 3 and can be gold thread, aluminum steel etc.
In above-mentioned steps 6, LED chip support arranges light guide support 5, the light-conductive hole 51 corresponding with LED chip 2 and Bang Ding bonding wire 3 is provided with in this light guide support 5, the described glue being mixed with fluorescent material by point gum machine point in this light-conductive hole 51, the luminous intensity distribution of LED chip 2 can be realized by this light-conductive hole 51, to reach required illumination effect, and described light guide support 5 lower end is provided with the groove 51 corresponding with strip substrate 1, the groove 51 of light guide support 5 is buckled in strip substrate 1, the location of light guide support 5 can be completed, improve the steadiness of encapsulating structure.
As preferably, described strip substrate 1 is flexible base board, it comprises copper coin or aluminium sheet heat-conducting metal layer, insulating barrier, be provided with the metal foil electrode layers as circuit on which insulating layer, described heat-conducting metal layer is copper coin or the aluminium sheet with higher heat conduction and radiating effect, improves the radiating effect of LED chip 2.
The present invention is by above-mentioned technique, LED chip 2 is directly packaged on strip substrate 1, decrease the operation of later stage Reflow Soldering, avoid high temperature, improve the stability of LED chip 2, and LED chip 2 directly contacts with strip substrate 1, improve heat transference efficiency, improve the integral heat sink effect of flexible LED lamp bar, and The present invention reduces the operations such as LED lamp bead individual packages and Reflow Soldering, simplify the production technology of flexible LED lamp band, reduce the cost of manufacture, and flexible LED lamp band production technology of the present invention operates without the need to human weld, more be suitable for automated production, improve the efficiency of producing.
As preferably, in step 1, select the square substrate that is larger, this square substrate is cut many strip substrates 1, and between adjacent strip substrate 1, leave connecting plate 13 for connecting adjacent strip substrate 1, in production process, the operation such as some glue, die bond, encapsulation of LED chip on many strip substrates 1 is completed by point gum machine, bonder, in step 6, after being mixed with the glue curing of fluorescent material, connecting plate 13 severing is formed the flexible LED lamp bar of wall scroll, further improve the efficiency of producing.
As preferably, also by being provided with resistance on the circuit of strip substrate 1, this resistance plays choked flow hypotensive effect, make can be suitable for high pressure by the flexible LED lamp bar of the production of production technology of the present invention to use, as preferably, described electric resistance welding is fixed on LED chip support, and in step 6, the described glue spots being mixed with fluorescent material is in LED chip 2, nation determines bonding wire 3, on resistance, with fixing protection LED chip 2, nation determines bonding wire 3 and resistance, hidden resistance can be set, what make flexible LED lamp band seem more is succinctly attractive in appearance, and stability is better, certainly, in specific implementation process, this resistance can externally be arranged on circuit.
With reference to Fig. 3, Fig. 4, Fig. 3, Fig. 4 are the topology examples two of the flexible LED lamp bar of being produced by the present invention, in this example, described strip substrate 1 is provided with some interval troughs 14, described light guide support 5 lower end is provided with some concavo-convex screens 52 corresponding with interval trough 14, during production, and described concavo-convex screens 52 and interval trough 14 corresponding matching on strip substrate 1, the steadiness of further raising light guide support 5, makes the encapsulation of LED chip more reliable.
Above better enforcement of the present invention is illustrated; certainly; the present invention can also adopt form different from the embodiment described above; the equivalent conversion that those of ordinary skill in the art do under the prerequisite without prejudice to spirit of the present invention or change accordingly, all should belong in protection scope of the present invention.
Claims (10)
1. a production technology for flexible LED lamp bar, is characterized in that: comprise the following steps:
Step 1, cut substrate, substrate cut into strip substrate, and on this strip substrate printed circuit;
Step 2, on strip substrate, be provided with multiple LED chip support for placing LED chip along its length, LED chip support arranges the cathode contact corresponding with circuit and cathode contact;
Step 3, die bond, glue enclosed by LED chip support, LED chip to be placed on LED chip support and to be fixed by glue;
Step 4, oven dry, solidify drying adhesive;
Step 5, nation are fixed, determine bonding wire the cathode contact on the both positive and negative polarity of LED chip and support and cathode contact are carried out bridge joint by nation;
Step 6, encapsulation, determine the glue spots being mixed with fluorescent material on bonding wire in LED chip and nation, and the drying adhesive being mixed with fluorescent material solidify to form fluorescent colloid, with fixing protection LED chip and Bang Ding bonding wire.
2. the production technology of a kind of flexible LED lamp bar according to claim 1, is characterized in that: described step 2 comprises the following steps:
Step 2.1, strip substrate arranges several be used as the convex position of LED chip support;
Step 2.2, arrange chip groove for placing LED chip at this convex position place, described cathode contact and cathode contact are arranged on this chip groove both sides.
3. the production technology of a kind of flexible LED lamp bar according to claim 1, it is characterized in that: in described step 6, LED chip support arranges light guide support, be provided with the light-conductive hole corresponding with LED chip and Bang Ding bonding wire in this light guide support, described in be mixed with the glue spots of fluorescent material in this light-conductive hole.
4. the production technology of a kind of flexible LED lamp bar according to claim 1, is characterized in that: described strip substrate is flexible base board, and it comprises heat-conducting metal layer, insulating barrier, is provided with the metal foil electrode layers as circuit on which insulating layer.
5. the production technology of a kind of flexible LED lamp bar according to claim 4, is characterized in that: described heat-conducting metal layer is copper coin or aluminium sheet.
6. the production technology of a kind of flexible LED lamp bar according to claim 1, it is characterized in that: in step 1, one square substrate is cut many strip substrates, and between adjacent strip substrate, leave connecting plate for connecting adjacent strip substrate, in step 6, after being mixed with the glue curing of fluorescent material, connecting plate severing is formed the flexible LED lamp bar of wall scroll.
7. the production technology of a kind of flexible LED lamp bar according to claim 1, is characterized in that: on the circuit of strip substrate, be provided with resistance.
8. the production technology of a kind of flexible LED lamp bar according to claim 7; it is characterized in that: described electric resistance welding is fixed on LED chip support; and in step 6; the described glue spots being mixed with fluorescent material is determined on bonding wire, resistance in LED chip, nation, determines bonding wire and resistance with fixing protection LED chip, nation.
9. the production technology of a kind of flexible LED lamp bar according to claim 3, is characterized in that: described light guide support lower end is provided with the groove corresponding with strip substrate.
10. the production technology of a kind of flexible LED lamp bar according to claim 3, is characterized in that: described strip substrate is provided with some interval troughs, and described light guide support lower end is provided with some concavo-convex screens corresponding with interval trough.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410491307.6A CN104235663B (en) | 2014-09-23 | 2014-09-23 | A kind of production technology of flexible LED lamp bar |
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| CN201410491307.6A CN104235663B (en) | 2014-09-23 | 2014-09-23 | A kind of production technology of flexible LED lamp bar |
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| CN104235663B true CN104235663B (en) | 2015-12-30 |
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| CN107559647A (en) * | 2017-08-22 | 2018-01-09 | 广东欧曼科技股份有限公司 | A kind of manufacture craft for being used to make LED |
| CN114669815B (en) * | 2022-04-01 | 2023-11-03 | 烟台鑫瑞半导体有限公司 | PPTC protector processing equipment for power type battery and production process |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN202195315U (en) * | 2011-08-23 | 2012-04-18 | 佛山市国星光电股份有限公司 | LED (light-emitting diode) surface light source device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101963296B (en) * | 2010-07-07 | 2013-03-20 | 杨东佐 | Manufacture method of LED integrated structure |
| TWI431218B (en) * | 2011-03-11 | 2014-03-21 | Lingsen Precision Ind Ltd | The manufacturing method and structure of LED light bar |
| TWI445899B (en) * | 2011-11-21 | 2014-07-21 | Lextar Electronics Corp | Assembly light bar structure |
| CN102759033B (en) * | 2012-05-21 | 2016-03-02 | 王定锋 | The LED module of direct packaging LED chips on soft or hard mating type wire line plate |
| CN102767707A (en) * | 2012-05-21 | 2012-11-07 | 王定锋 | LED (Light-Emitting Diode) module capable of directly forming LED support on wire circuit board, and manufacturing method of LED module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202195315U (en) * | 2011-08-23 | 2012-04-18 | 佛山市国星光电股份有限公司 | LED (light-emitting diode) surface light source device |
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Effective date of registration: 20161229 Address after: 528400 Guangdong Province, Zhongshan City Xiaolan Industrial Avenue South Road No. 20 Patentee after: GUANGDONG OML TECHNOLOGY CO., LTD. Address before: Longshan Industrial Park in Guangdong Province, Zhongshan City Xiaolan Town, 528400 Patentee before: Zhongshan Ouman Technology Lighting Co.,Ltd. |
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Address after: No.38 Hetong Road, Dongfeng Town, Zhongshan City, Guangdong Province, 528400 Patentee after: GUANGDONG OML TECHNOLOGY Co.,Ltd. Address before: 528400 No. 20, nanhuayuan Road, Xiaolan Industrial Avenue, Zhongshan City, Guangdong Province Patentee before: GUANGDONG OML TECHNOLOGY Co.,Ltd. |
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