CN104220914B - 用于光电组件的晶圆级封装的模制玻璃盖 - Google Patents
用于光电组件的晶圆级封装的模制玻璃盖 Download PDFInfo
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Abstract
提供了一种光电组件,该光学组件包括用于支持多个相互连接的光学和电气元件的基底20(通常为硅或玻璃)。密封材料层22被设置成勾勒基底的限定周边区域的轮廓。模制玻璃盖10被设置在基底上并与基底结合,其中模制玻璃盖被配置为产生与基底的限定周边区域相匹配的占用区。模制玻璃盖的底表面包括与基底的密封材料层相接触的结合材料层,一旦接触,则产生结合组件。在一种形式中,提出了一种晶圆级组装工艺,其中多个光电组件被设置在硅晶圆上,且多个玻璃盖被模制在之后被结合到硅晶圆的单片玻璃上。
Description
相关申请的交叉引用
本申请要求2011年10月19日提交的美国临时申请61/548,974的优先权,且以引用方式并入本文。
技术领域
本公开一般涉及光电组件的晶圆级封装,具体地,涉及在制造过程中模制玻璃盖的利用。
背景技术
许多类型的光电模块包括多个需要相对于彼此精确放置的单独的光学和电气元件。硅(或玻璃)载体基底(有时被称为中介层)通常用作支持结构以固定元件的位置,且有时还可提供所选元件之间所需的电气或光学信号路径。当元件被组装到中介层上时,可能需要进行主动光学对准来确保维持光学信号路径的完整性。在大多数情况下,这些光电模块被构建为单个单元,且因此,在逐个单元基础上执行主动光学对准的需求是昂贵且费时的。
实际上,随着对光电模块的需求持续增加,单个单元组装方法已成为问题。晶圆级封装被认为是一种更有效且划算的方法,其中2012年5月3日提交的序列号为13/463,408的我们的共同未决申请中公开了一种晶圆级封装的示例性布置且以通过引用方式结合于此。
在我们的共同未决申请中,硅晶圆被用作在其上安装或集成多个光电模块的所有元件的“平台”(即中介层),其中硅中介层的顶表面用作限定单独的光学元件之间的光学信号路径的参考平面。使用单个硅晶圆作为大量单独模块的平台允许晶圆级组装工艺在相对较短的时间段内高效地组装大量模块。一些现有技术布置描述了使用玻璃中介层来代替硅晶圆中介层,同时保留同时组装多个光电模块的能力。参见,例如,由授权给V.V.Sundaram并于2012年5月3日公开的美国专利公开2012/0106117,其公开了基于玻璃中介层的三维互连结构。
在大多数情况下,“盖子”需要被放置并附连到填充的中介层元件上。在示例性的现有技术布置中,盖子被形成为两个独立的零部件,即附连到中介层顶表面上的“侧壁”部分,和结合到侧壁部分上的平坦的“顶”部。侧壁的高度通常由设置在中介层上的元件所需的空间,以及用于将侧壁结合到中介层上的粘结材料层限定。在其他情况下,侧壁由在中介层上形成的“边缘”与在盖子上形成的“边缘”的组合限定,其中两个边缘稍后连接以形成侧壁。迄今为止,制造设置有边缘的盖子被认为是昂贵的并且需要对玻璃板进行机械加工。这种消减技术是昂贵的并且不适于晶圆级组装工艺。
附图说明
包括在本公开中并构成本公开的一部分的附图图示说明本发明的各种实施例。在附图中:
图1是光电模块组件的等距视图,示出了根据本发明可用于封装组件的模制玻璃盖;
图2是图1的布置的视图,其中模制玻璃盖被适当安装在光电模块上;
图3是根据本发明形成的示例性模制玻璃盖的等距视图;
图4是图3的盖子的视图,在此例中涂覆抗反射材料;
图5示出了可以用于晶圆级加工以同时产生多个模制玻璃盖的示例性玻璃基底;
图6是图5的基底的一部分的放大视图,示出了在每个单独的管芯位置内形成的模制部件;以及
图7(a)-(c)示出了根据本发明用于形成模制玻璃基底以包括多个玻璃盖的一组示例性步骤。
具体实施方式
概述
提供了一种光电组件,其包括用于支持多个相互连接的光学和电气元件的基底(通常为硅或玻璃)。密封材料层被设置成勾勒基底的限定周边区域的轮廓。模制玻璃盖被设置在基底上并与基底结合,其中模制玻璃盖被配置为产生与基底的限定周边区域相匹配的占用区。模制玻璃盖的底表面包括与基底的密封材料层相接触的结合材料层,一旦接触,则产生结合组件。在一种形式中,提出了一种晶圆级组装工艺,其中多个光电组件被设置在硅(或玻璃)晶圆上并且多个玻璃盖被模制在之后被结合到硅晶圆的单片玻璃上。
示例实施例
以下详细描述参照附图。在任何可能的情况下,附图和以下描述中使用相同的参考数字以指代相同或相似的元件。尽管本发明的实施例被描述,但是修改、改写和其他实施方式也是可能的。例如,可以对附图中所示的元件进行替换、添加,或修改,并且本文所述的方法可以通过对所公开的方法进行替换、重新排序,或添加阶段进行修改。此外,以下详细描述并不限制本发明。相反,本发明的正确范围由所附权利要求限定。
图1是光电模块组件的等距视图,示出了根据本发明的可用于封装组件的模制玻璃盖10。在这种情况下,光电模块包括被设置成填充中介层(载体)基底20的多个光学和电气元件,其中中介层20可包括硅或玻璃材料。可使用各种众所周知的方法将光学和电气元件适当地固定到中介层20上的各自的开口/位置处。特别是,可以使用环氧基、共晶结合或其他布置可以被用来将元件永久地附接到其各自的位置上。应当理解的是,可能需要建立适当的温度等级以确保在其他潜在高温后处理操作过程中接合处的稳定性。
密封层22被示为围绕中介层20的周界形成。此密封层,其可包括玻璃粉材料、金锡(AuSn)焊料,或任何其它合适的材料,用于将模制玻璃盖10结合到填充的中介层20上。如图1所示,玻璃模制盖10被配置为沿着由密封层22的图案引导的中介层20的外周。另外,盖子10的底表面12被涂覆一种或多种特定材料以与密封层22结合并形成光电模块的不透水封装。在一个实施例中,表面12上可以涂覆钛、铜和金的多层布置。
在图1所示的特定实施例中,模制玻璃盖10被特别配置为还包括开口30,其允许光学输入和输出信号进入封装的光电模块。如图2所示,例如,开口30用于允许光学连接器40***。在这种情况下,玻璃盖10的侧壁14可能需要进行额外加工(诸如,抛光和/或蚀刻)以产生通过此障碍物传送由设置在中介层20上的光学元件接收的光学信号所需的“光学级”表面。有时,此玻璃盖10的侧壁14被称为“光学窗口”。
图2是图1的布置的视图,其中模制玻璃盖合适地安装在光电模块上。中介层20本身被示为设置在电路基底50(有时称为“有机基底”)上,其中球栅阵列(BGA)形式的电气互连体52设置在基底50的下面,并用来提供与电信号及电源(未示出)的接触。图2还示出光学连接器40,其设置在盖子10的开口30中且定位在中介层20的顶表面上。在此特定实施例中,纤维阵列元件42被附接到光学连接器40且用于支持光学信号的传输。
为了将光学信号从中介层20上的光学元件传输到光学连接器40,优选的是模制玻璃盖10的侧壁部分14是光学平滑的,且限制散射和其他类型的光学信号损失(有时称为“光学级”表面)。图3是根据本发明形成的示例性模制玻璃盖的等距视图。在此,图3示出光学级侧壁部14的位置。正如下面将要讨论的,模制玻璃盖10可由呈现出低熔化温度的任何合适的玻璃材料形成,从而允许玻璃被“软化”并被模制。硼硅酸盐玻璃是一种示例性类型的玻璃,其可用于形成根据本发明的模制玻璃盖。然后,在模制过程之后,可以加工(例如,抛光和/或蚀刻)侧壁光学窗口部14,以产生光学级表面。
在大多数情况下,希望控制封装在盖10内的元件和各种外部元件之间的光学信号的进入/输出。参照图2,准许的光学信号路径是沿着光学连接器40。在一些实施例中,模制玻璃盖10的外表面16涂覆抗反射(AR)材料,以防止杂散的光学信号干扰光电模块的操作。氟化镁是一种众所周知的可用于实现此目的的AR涂覆材料。图4是图3的盖子的视图,在此情况下涂覆抗反射材料。特别是,图4示出模制玻璃盖10,如图3所示,但在此例中,还包括被涂敷以覆盖模制玻璃盖10的外表面16的AR涂层18,除了侧壁部分14-被限定为光学窗口的区域之外。
如上面提到的,利用晶圆级组装技术,采用硅或玻璃晶圆作为载体基底(在本文中也称为中介层)提供制造效率方面的显著改善,而不牺牲各个元件之间的必要的精确光学对准的完整性,其中多个光电模块同时形成在载体基底上。由于典型的晶圆的直径大约为8英寸,此晶圆可以支持产生多个模块(例如,穿过晶圆表面的几十个管芯)。根据本发明,类似的优点可以通过利用晶圆尺寸的玻璃基底以形成在单个制造步骤中结合到在中介层晶圆上形成的多个模块上的多个盖子得到。实际上,通过利用能够被模制的低温玻璃材料,可以廉价加工玻璃基底以形成这些光电模块的盖子。
图5示出了可以在晶圆级加工中使用以同时产生多个模制玻璃盖的示例性的玻璃基底。图5示出玻璃基底100,其可以用作同时形成与光电模块20数目相同的多个模制玻璃盖10的结构。如图所示,大量单独盖子位置10被限定在晶圆100上。
图6是图5的基底的一部分的放大图,示出在每个单独的管芯位置内形成模制部件。为了清楚起见,只有三个这样的位置10被特别示出为具有模制盖的形式。
在本发明的优选实施例中,使用微模制过程来软化并模制玻璃基底100使其包括特定盖子结构所需的各种腔室和开口。图7(a)-(c)示出了根据本发明用于形成模制玻璃基底使其包括多个玻璃盖的一组示例性步骤。
首先形成模具200,使其包括限定特定盖子几何形状(诸如盖子10)所需的各种压痕。诸如金刚石车削机床(未示出)之类的设备被认为能够在必要的精度下形成模具压痕。参照图7(a),玻璃基底100被定位在固定平台或支持构件210上,并被加热到使玻璃开始软化的温度。在硼硅玻璃的情况下,软化温度是约450℃。一旦玻璃已经具有可塑性,模具200就在足以使玻璃重新成形的力下与玻璃基底100的上表面110接触,并产生模制盖所需的腔室,如图7(b)所示。一旦形成,模具200就被升高,如图7(c)所示,这样就产生了多个模制盖10。最终的模制玻璃基底100被冷却,使其可结合到包含上述光电模块的晶圆。
一旦模制玻璃基底100被连接到元件晶圆,结合结构就被切割以形成最终单独的光电模块。优选激光切割工艺,但是应该理解,也可以使用将结合晶圆分离成独立的收发器模块的任何其它合适的工艺。
虽然本发明已就不同的实施例进行了描述,但是本领域的技术人员将认识到,本发明可以利用被认为落入最好由所附的权利要求所限定的本发明的精神和范围内的各种修改来实施。此外,尽管本说明书已经以特定于结构特征和/或方法动作的语言进行了描述,但是权利要求并不限于上述特征或动作。相反,上述特定特征和动作被公开作为本发明的实施例的示例。
Claims (23)
1.一种光电组件,包括:
支持多个相互连接的光学和电气元件的基底,所述基底包括被设置成勾勒其顶表面的限定区域的轮廓的密封材料层;以及
被设置在所述基底上并与所述基底结合的模制玻璃盖,所述模制玻璃盖被配置为产生与所述基底的限定区域相匹配的占用区,且在底表面上包括结合材料层,一旦将所述模制玻璃盖放置在所述基底上,则该结合材料层与所述密封材料层相接触产生结合组件;其中所述模制玻璃盖具有侧壁,且所述侧壁的外表面与内表面相对并且平行,作为光学窗口的侧壁是光学平滑的;其中除了所述侧壁之外,所述模制玻璃盖被涂覆抗反射材料。
2.如权利要求1所述的光电组件,其中所述抗反射材料包括氟化镁。
3.如权利要求1所述的光电组件,其中所述模制玻璃盖的预定侧壁部分被限定为在所述基底上的光学元件与外部光学元件之间提供光传输的光学窗口。
4.如权利要求3所述的光电组件,其中除了所述光学窗口之外,所述模制玻璃盖的所有区域都被涂覆抗反射材料。
5.如权利要求1所述的光电组件,其中所述基底上的所述密封材料层包括金锡焊接材料。
6.如权利要求5所述的光电组件,其中所述模制玻璃盖上的所述结合材料层包括产生与金锡焊接材料的焊接密封的金属化合物。
7.如权利要求6所述的光电组件,其中所述金属化合物包括钛、铜和金。
8.如权利要求1所述的光电组件,其中所述基底包括硅基底。
9.如权利要求1所述的光电组件,其中所述基底包括玻璃基底。
10.一种晶圆级光电组件,包括:
在独立的管芯位置填充有多个光电模块的硅晶圆,其中独立的密封层被配置成围绕每个单个的光电模块;以及
玻璃基底,该玻璃基底被模制成包括在独立的管芯位置的多个盖封装,每个盖封装包括在其顶表面上的结合材料,使得当所述玻璃基底被倒转并附接至硅晶圆时,所述盖封装结合材料接触相关联的密封层,在其间产生结合并且形成多个封装的光电模块;其中所述盖封装具有侧壁,且所述侧壁的外表面与内表面相对并且平行,作为光学窗口的侧壁是光学平滑的;
其中除了所述侧壁之外,所述玻璃基底被涂覆抗反射材料。
11.如权利要求10所述的晶圆级光电组件,其中每个盖封装被配置成包括沿其一部分的光学窗口。
12.一种制造光电组件的模制玻璃盖的方法,包括:
将包括玻璃材料的基底加热至产生软化的基底的温度,其中所述软化的基底包括第一侧和与第一侧相对的第二侧;
使用所述软化的基底的第一侧的模具和所述软化的基底的第二侧的支持构件按压所述软化的基底以产生至少一个侧壁和在所述软化的基底内的由所述至少一个侧壁的内表面形成的压痕,其中所述至少一个侧壁的外表面与所述内表面相对并且平行,作为光学窗口的侧壁是光学平滑的,所述压痕限定预定盖子结构,并且所述压痕被配置为接收设置在中介层基底上的光电元件;
将所述模具从所述软化的基底上移除;
将所述软化的基底冷却至硬化状态,形成包括所述压痕的模制盖;以及
使用抗反射材料涂覆除了所述侧壁之外的所述基底;
其中光学区域包括所述内表面和所述外表面,所述内表面和所述外表面被配置为将设置在所述压痕外部的光学装置与所述压痕内接收的所述光电元件光学耦合。
13.如权利要求12所述的方法,其中所述基底包括低熔化温度的玻璃。
14.如权利要求12所述的方法,其中所述基底包括硼硅酸盐玻璃。
15.如权利要求12所述的方法,其中
加热所述基底包括加热具有晶圆尺寸主体的基底,
其中按压所述软化的基底被执行为按照产生压痕的晶圆级工艺执行,所述压痕包括多个压痕,所述多个压痕为包括多个独立的模制盖子的模制盖子定义所述预定盖子结构。
16.如权利要求15所述的方法,其中所述光电组件包括多个光电组件,所述方法进一步包括:
将所述基底结合到所述中介层基底以产生结合的布置,在所述结合的布置中,所述多个光电元件被接收在所述多个压痕内;以及
切割所述结合的布置以形成多个光电组件。
17.如权利要求12所述的方法,进一步包括执行表面处理操作以产生所述至少一个侧壁的光学区域。
18.如权利要求17所述的方法,其中执行表面处理操作包括抛光所述至少一个侧壁。
19.如权利要求12所述的方法,其中按压所述软化的基底包括在所述预定盖子结构中设置所述至少一个侧壁,其中当所述光学装置被光学耦合到所述模制盖子内接收的所述至少一个光电模块时,所述至少一个侧壁至少部分地围绕设置在所述压痕外部的所述光学装置。
20.如权利要求12所述的方法,其中所述光学装置包括光学连接器。
21.如权利要求12所述的方法,其中按压所述软化的基底包括使用所述模具接触所述光学区域的相对的表面,并且所述光学区域被配置为通过所述相对的表面将所述光学装置和所述光电元件光学耦合。
22.如权利要求12所述的方法,进一步包括使用结合材料涂覆所述模制盖子的至少一个侧壁的底表面。
23.如权利要求22所述的方法,其中涂覆所述底表面包括在所述底表面上沉积钛、铜和金的层。
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US9052445B2 (en) | 2015-06-09 |
EP2769253B1 (en) | 2020-07-15 |
US20130101250A1 (en) | 2013-04-25 |
CN104220914A (zh) | 2014-12-17 |
US20150277068A1 (en) | 2015-10-01 |
EP2769253A1 (en) | 2014-08-27 |
US9575266B2 (en) | 2017-02-21 |
WO2013059731A1 (en) | 2013-04-25 |
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