CN104219883B - 具有内埋元件的电路板及其制作方法 - Google Patents
具有内埋元件的电路板及其制作方法 Download PDFInfo
- Publication number
- CN104219883B CN104219883B CN201310204368.5A CN201310204368A CN104219883B CN 104219883 B CN104219883 B CN 104219883B CN 201310204368 A CN201310204368 A CN 201310204368A CN 104219883 B CN104219883 B CN 104219883B
- Authority
- CN
- China
- Prior art keywords
- layer
- copper
- film
- opening
- blind hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 238000004891 communication Methods 0.000 claims abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 119
- 239000010949 copper Substances 0.000 claims description 62
- 229910052802 copper Inorganic materials 0.000 claims description 62
- 239000011889 copper foil Substances 0.000 claims description 57
- 238000000034 method Methods 0.000 claims description 39
- 229920002120 photoresistant polymer Polymers 0.000 claims description 24
- 238000009713 electroplating Methods 0.000 claims description 20
- 239000013078 crystal Substances 0.000 claims description 13
- 238000007747 plating Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 7
- 238000005516 engineering process Methods 0.000 claims description 7
- 230000003628 erosive effect Effects 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000007800 oxidant agent Substances 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 182
- 239000011241 protective layer Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 7
- 239000000084 colloidal system Substances 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002362 mulch Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0353—Making conductive layer thin, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (6)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310204368.5A CN104219883B (zh) | 2013-05-29 | 2013-05-29 | 具有内埋元件的电路板及其制作方法 |
TW102119491A TWI478642B (zh) | 2013-05-29 | 2013-05-31 | 具有內埋元件的電路板及其製作方法 |
US14/153,059 US20140353006A1 (en) | 2013-05-29 | 2014-01-12 | Multilayer circuit board and method for manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310204368.5A CN104219883B (zh) | 2013-05-29 | 2013-05-29 | 具有内埋元件的电路板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104219883A CN104219883A (zh) | 2014-12-17 |
CN104219883B true CN104219883B (zh) | 2017-08-11 |
Family
ID=51983834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310204368.5A Active CN104219883B (zh) | 2013-05-29 | 2013-05-29 | 具有内埋元件的电路板及其制作方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20140353006A1 (zh) |
CN (1) | CN104219883B (zh) |
TW (1) | TWI478642B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015185564A (ja) * | 2014-03-20 | 2015-10-22 | イビデン株式会社 | プリント配線板及びプリント配線板の製造方法 |
JP2015220281A (ja) * | 2014-05-15 | 2015-12-07 | イビデン株式会社 | プリント配線板 |
US20150366067A1 (en) * | 2014-05-20 | 2015-12-17 | Edward Herbert | Peripherally Mounted Components in Embedded Circuits |
TWI672982B (zh) * | 2016-03-22 | 2019-09-21 | 慧榮科技股份有限公司 | 印刷電路板組裝物 |
CN111199922A (zh) | 2018-11-20 | 2020-05-26 | 奥特斯科技(重庆)有限公司 | 部件承载件及其制造方法 |
CN111629513B (zh) * | 2019-02-27 | 2023-06-27 | 同泰电子科技股份有限公司 | 同时具有贯孔及盲孔的多层电路板结构及其制法 |
CN109788644A (zh) * | 2019-03-25 | 2019-05-21 | 浙江万正电子科技有限公司 | 具有安装槽的局部镶嵌高频材料多层线路板及其制作方法 |
CN113498633B (zh) * | 2020-01-21 | 2023-09-15 | 鹏鼎控股(深圳)股份有限公司 | 内埋电子元件的电路板及制作方法 |
CN114521055A (zh) * | 2020-11-20 | 2022-05-20 | 庆鼎精密电子(淮安)有限公司 | 内埋式电路板及其制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI305479B (en) * | 2006-02-13 | 2009-01-11 | Advanced Semiconductor Eng | Method of fabricating substrate with embedded component therein |
TW201206266A (en) * | 2010-07-30 | 2012-02-01 | Lg Innotek Co Ltd | Printed circuit board and method of manufacturing the same |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6512182B2 (en) * | 2001-03-12 | 2003-01-28 | Ngk Spark Plug Co., Ltd. | Wiring circuit board and method for producing same |
DE10200569A1 (de) * | 2001-10-12 | 2003-05-08 | Multitape Gmbh | Chipkarte und Herstellungsverfahren |
KR100999531B1 (ko) * | 2008-10-20 | 2010-12-08 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
KR101077410B1 (ko) * | 2009-05-15 | 2011-10-26 | 삼성전기주식회사 | 방열부재를 구비한 전자부품 내장형 인쇄회로기판 및 그 제조방법 |
KR20110054348A (ko) * | 2009-11-17 | 2011-05-25 | 삼성전기주식회사 | 전자소자 내장형 인쇄회로기판 및 그 제조방법 |
CN102256450A (zh) * | 2010-05-20 | 2011-11-23 | 深南电路有限公司 | 埋入式无源器件的电路板及其制造方法 |
JP5411362B2 (ja) * | 2010-07-06 | 2014-02-12 | 株式会社フジクラ | 積層配線基板及びその製造方法 |
-
2013
- 2013-05-29 CN CN201310204368.5A patent/CN104219883B/zh active Active
- 2013-05-31 TW TW102119491A patent/TWI478642B/zh active
-
2014
- 2014-01-12 US US14/153,059 patent/US20140353006A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI305479B (en) * | 2006-02-13 | 2009-01-11 | Advanced Semiconductor Eng | Method of fabricating substrate with embedded component therein |
TW201206266A (en) * | 2010-07-30 | 2012-02-01 | Lg Innotek Co Ltd | Printed circuit board and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
TW201446100A (zh) | 2014-12-01 |
US20140353006A1 (en) | 2014-12-04 |
CN104219883A (zh) | 2014-12-17 |
TWI478642B (zh) | 2015-03-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20161226 Address after: 066004 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Applicant after: Qi Ding Technology Qinhuangdao Co.,Ltd. Applicant after: Zhen Ding Technology Co.,Ltd. Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Applicant before: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co.,Ltd. Applicant before: Zhen Ding Technology Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20231012 Address after: 066004 No. 18-2, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province Patentee after: Liding semiconductor technology Qinhuangdao Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Address before: No.18, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province 066004 Patentee before: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |