CN104205289A - Wafer map management device and die mounting method of die mounting system - Google Patents
Wafer map management device and die mounting method of die mounting system Download PDFInfo
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- CN104205289A CN104205289A CN201280071970.XA CN201280071970A CN104205289A CN 104205289 A CN104205289 A CN 104205289A CN 201280071970 A CN201280071970 A CN 201280071970A CN 104205289 A CN104205289 A CN 104205289A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Together with reference being made to a wafer map, and good-quality dies being sequentially picked up from a wafer and mounted on a substrate, the statuses of pickup-completed die positions from within the wafer map are rewritten from "good-quality die" to "pickup completed", whereas the statuses of die positions at which an image processing error or a pickup mistake has occurred are rewritten to "image processing error" or "pickup mistake". A die pickup device is equipped with a wafer map revision function, and an operator, on a screen of a display device of the die pickup device, revises the statuses of the die positions that have been rewritten to "image processing error" or "pickup mistake" from within the wafer map to "good-quality die", refers to the post-revision wafer map, and re-executes the pickup of dies that have been left behind due to an image processing error or a pickup mistake.
Description
Technical field
The present invention relates to use wafer map and pick up successively qualified nude film and be arranged on wafer map management devices and the nude film installation method of the nude film installation system substrate from wafer.
Background technology
Generally speaking, wafer sticks on cutting blade and is cut, and is split into multiple nude films (semiconductor chip).In a wafer, contain defective nude film, so whether check in operation at nude film qualified to each nude film inspection, utilize ink to the additional bad mark of defective nude film, in nude film installation procedure, by camera, each nude film is taken and identified by image and have or not bad mark, only pick up successively qualified nude film (qualified chip) and be arranged on substrate from wafer.
But, in the method, for whole nude films of wafer, must be taken each nude film by camera and identify by image and have or not bad mark, there is the poor such shortcoming of production efficiency.
Therefore, in recent years, following method becomes main flow: as recorded in patent documentation 1 (TOHKEMY 2001-250834 communique), check in operation at nude film, generate the whether qualified wafer map of nude film of the each position that represents the wafer after cutting, in nude film installation procedure, with reference to wafer map, only pick up successively qualified nude film (qualified chip) and be arranged on substrate from wafer by suction nozzle.In the method, only take qualified nude film and only identify the position of qualified nude film by image by camera, can omit image recognition for defective nude film, so have advantages of and can shorten the required time of image recognition.
Patent documentation 1: TOHKEMY 2001-250834 communique
Summary of the invention
But, in nude film installation procedure, in the time picking up qualified nude film with reference to wafer map from wafer, the state of the nude film position of having picked up in wafer map is rewritten into " picking up " from " qualified nude film ", but sometimes because some is former thereby cause the image of qualified nude film to be processed unsuccessfully the picking up unsuccessfully of (image processing mistake) or nude film (picking up mistake).In this case, process state wrong or that pick up wrong nude film position and be rewritten into " image is processed wrong " or " picking up mistake " from " qualified nude film " having there is image, can distinguish with the state of " picking up ", " qualified nude film ".
Processing mistake, pick up the remaining nude film of mistake because of image was not " defective nude film " originally, was confirmed to be " qualified nude film ", so even if be arranged on substrate without any problem in inspection yet.In addition, in nude film, higher-priced nude film is also more, thus also want not remain requirement wrong using processing because of image, that pick up user's side that the remaining nude film of mistake uses up as " qualified nude film " also more.
In the nude film installation system of use wafer map, the nude film that cannot become to state " image is processed wrong ", " picking up mistake " picks up, so in the case of picking up because of image processing mistake, pick up the remaining nude film of mistake, generate state wrong by processing because of image, that pick up the remaining nude film position of mistake by the wafer map generating apparatus of equipment outer (production line is outer) and be made as the new wafer map that " qualified nude film " forms, utilize this new wafer map to upgrade the wafer map data of the server of nude film installation system.
But the operation that is generated new wafer map by the wafer map generating apparatus outside equipment bothers, become the reason that production efficiency is reduced.
Therefore, problem to be solved by this invention is, using in the nude film installation system of wafer map, can reuse simply because image processing is wrong or pick up the remaining nude film of mistake as " qualified nude film ".
In order to solve above-mentioned problem, the invention provides a kind of wafer map management devices of nude film installation system, in the storing mechanism of above-mentioned nude film installation system, store the whether qualified wafer map of nude film of the each position that represents the cut wafer of the mode to be divided into multiple nude films, the above-mentioned wafer map of reference in nude film installation procedure, pick up successively qualified nude film and be arranged on substrate from above-mentioned wafer, and in the time picking up qualified nude film, the state of the nude film position of having picked up in above-mentioned wafer map is rewritten into " picking up " from " qualified nude film ", on the other hand, process state wrong or that pick up wrong nude film position and be rewritten into " image is processed wrong " or " picking up mistake " from " qualified nude film " having there is image, wherein, in above-mentioned nude film installation system, be provided with wafer map correction mechanism, this wafer map correction mechanism is " qualified nude film " by the state revision of the nude film position of being rewritten in above-mentioned wafer map " image is processed wrong " or " picking up mistake ".
So, operator can be " qualified nude film " by the state revision of the nude film position of being rewritten in wafer map " image is processed wrong " or " picking up mistake " to being located at that the wafer map correction mechanism of nude film installation system operates, in this nude film installation system, with reference to revised wafer map, again carry out because image processing is wrong or pick up picking up of the remaining nude film of mistake.Thus, can be modified to simply " qualified nude film " and reuse processing mistake because of image or picking up the remaining nude film of mistake.
In this case, can in nude film installation system, be provided with the display unit of the state of the each nude film position that shows wafer map, be configured to, operator can operate wafer map correction mechanism in the state by visual each nude film position of confirming wafer map on the picture of this display unit, and is " qualified nude film " by " image is processed wrong " or the state revision of " picking up mistake ".So, can prevent in advance in the time that the state revision of " image is processed wrong " or " picking up mistake " is " qualified nude film " being " qualified nude film " by the state revision of wrong nude film position, and on can the picture in display unit by visual confirm to process because of image wrong, pick up in fact the remaining nude film of mistake cannot use for some reason, can end the state revision of this nude film is " qualified nude film ", and does not produce defective substrate.
In this case, wafer map correction mechanism can be modified to state " qualified nude film " one by one to being rewritten into " image is processed wrong " or each nude film position of " picking up mistake ", also can have the debugging functions in the lump that multiple nude film location statuss are modified in the lump to " qualified nude film ".Have advantages of and can improve operability by debugging functions in the lump.
Brief description of the drawings
Fig. 1 is the stereoscopic figure of the nude film pick device of one embodiment of the invention.
Fig. 2 is the stereoscopic figure of jack-up unit and peripheral part thereof.
Fig. 3 is the stereoscopic figure of chip tray.
Fig. 4 makes jack-up cylinder rise to the broken section enlarged drawing of the state after absorption position while being illustrated in jack-up action.
Fig. 5 is the broken section enlarged drawing that makes the state of jack-up pin from jack-up cylinder is outstanding while being illustrated in jack-up action.
Fig. 6 is the block diagram that represents the structure of the control system of nude film pick device.
Fig. 7 is the figure that represents to be presented at an example of the wafer map on the picture of display unit.
Fig. 8 (a) represents image to have occurred to process state wrong or that pick up wrong nude film position and be rewritten into from " qualified nude film " figure of the example on the picture that state " image is processed wrong " or " picking up mistake " is presented at display unit, and Fig. 8 (b) represents that by the state revision of nude film position that is rewritten into " image is processed wrong " or " picking up mistake " state after for " qualified nude film " is presented at the figure of the example on the picture of display unit.
Embodiment
Below, illustrate by for implement mode of the present invention specialize after an embodiment.
First, use the structure of Fig. 1 diagrammatic illustration nude film pick device 11.
Nude film pick device 11 possesses feed bin maintaining part 22 (Pan Ta), pallet pull-out platform 23, XY travel mechanism 25, jack-up unit 28 (with reference to Fig. 2) etc., is arranged to pallet to pull out platform 23 and be inserted in the state of component mounter (not shown).Although not shown, element assemble mounting system (nude film installation system) disposes one or more component mounter along the conveyance path of circuit substrate, is provided with nude film pick device 11 at least one component mounter.
In feed bin (not shown) in the feed bin maintaining part 22 that can be accommodated in up or down nude film pick device 11, the chip tray 32 that wafer 30 is installed loads multilayer, in production, from feed bin, chip tray 32 is pulled out to pallet pull-out platform 23.As shown in Figure 3, wafer open establish body 30 by be pasted with the nude film 31 that wafer cut with chessboard trellis and form can be flexible cutting blade 34 be installed on the chip mounting plate 33 (cutting frame) with circular peristome with the state launching, this chip mounting plate 33 is arranged on tray main body 35 by screw threads for fastening etc.
Jack-up unit 28 (with reference to Fig. 2) forms in the mode moving along XY direction in can the area of space below the cutting blade of chip tray 32 34.And, jack-up pin 39 (with reference to Fig. 4, Fig. 5) by utilizing jack-up cylinder 37 by the adhesive portion of the nude film that will pick up (absorption) 31 in cutting blade 34 from jack-up partly below it, the adhesive portion of this nude film 31 is peeled off partly from cutting blade 34, made nude film 31 float into the state easily picking up.
The mode that this jack-up unit 28 moves up and down with jack-up unit 28 entirety as drive source using servo motor (not shown) forms.In the time of nude film picking action, when jack-up unit 28 rise and the upper surface of jack-up cylinder 37 is risen to roughly contact with the cutting blade 34 of chip tray 32 predetermined sheet absorption position time, by stop mechanism (not shown), the rising of jack-up unit 28 is stopped, in the time further continuing to carry out vertical motion, jack-up pin 39 (with reference to Fig. 4, Fig. 5) are outstanding upward from the upper surface of jack-up cylinder 37, the adhesive portion of the nude film that will pick up 31 in jack-up cutting blade 34.In this case, by adjusting the rotation amount as the servo motor of power source, can adjust the jack-up height and position (jack-up amount) of jack-up pin 39.
As shown in Figure 1, in XY travel mechanism 25, be assembled with adsorption head 41 and camera 42, by this XY travel mechanism 25, adsorption head 41 and camera 42 moved integratedly along XY direction.On adsorption head 41, be provided with the suction nozzle 43 (with reference to Fig. 4, Fig. 5) of the nude film 31 on absorption cutting blade 34 in the mode moving up and down.Camera 42 is taken the nude film 31 cutting blade 34 and its photographed images is carried out to image processing from top, thereby can identify the position of the nude film 31 that will be adsorbed by suction nozzle 43.
The position of this nude film 31 is processed and identified to the image that the control device 51 (with reference to Fig. 6) of nude film pick device 11 obtains taking the nude film that will adsorb 31 in the nude film 31 on cutting blade 34 by camera 42, determine jack-up position and the absorption position of this nude film 31, as shown in Figure 5, the jack-up pin 39 that utilizes jack-up cylinder 37 by the adhesive portion of the nude film that will pick up (absorption) 31 in cutting blade 34 from jack-up partly below it, thereby the adhesive portion of this nude film 31 is peeled off partly from cutting blade 34, make nude film 31 float into the state easily picking up, and pick up this nude film 31 by suction nozzle 43 absorption.
Generally speaking, in a wafer, contain defective nude film, so in wafer manufacturing company, based on nude film check result, generate the whether qualified wafer map (with reference to Fig. 7) of nude film 31 of the each position that represents the wafer after cutting, sell nude film installation base plate manufacturing company by this wafer map together with wafer.In nude film installation base plate manufacturing company, memory chip figure in the storage device 52 (storing mechanism) of the control device 51 of nude film pick device 11, with reference to this wafer map,, only pick up successively qualified nude film and be arranged on substrate from the position of the qualified nude film of wafer identification (qualified chip) by the photographic images of camera 42.
At this moment, in the time picking up qualified nude film from wafer, the state of the nude film position of having picked up in wafer map is rewritten into " picking up " from " qualified nude film ", but sometimes because some is former thereby cause the image of qualified nude film to be processed unsuccessfully the picking up unsuccessfully of (image processing mistake) or nude film 31 (picking up mistake).In this case, as shown in Fig. 8 (a), process state wrong or that pick up wrong nude film position and be rewritten into " image is processed wrong " or " picking up mistake " from " qualified nude film " having there is image, can distinguish with the state of " picking up ", " qualified nude film ".
Processing mistake, pick up the remaining nude film of mistake because of image was not " defective nude film " originally, in inspection, be confirmed to be " qualified nude film ", even so be arranged on substrate also without any problem, but the nude film that in nude film pick device 11, cannot become to state " image is processed wrong ", " picking up mistake " picks up.
Therefore, in the present embodiment, in the control device 51 of nude film pick device 11, carry operator to mouse, keyboard, the input units such as touch pad 53 (wafer map correction mechanism) operate and the wafer map debugging functions that are " qualified nude film " by the state revision of the nude film position of being rewritten in wafer map " image process wrong " or " picking up mistake ", and as shown in Figure 8, on the picture of display unit 54, show the state of each nude film position of wafer map, operator can be by state the input device 53 of visual each nude film position of confirming wafer map on the picture of this display unit 54, and be " qualified nude film " by " image is processed wrong " or the state revision of " picking up mistake ".
In this case, wafer map debugging functions can be modified to state " qualified nude film " one by one to being rewritten into " image is processed wrong " or each nude film position of " picking up mistake ", also can have the debugging functions in the lump that multiple nude film location statuss are modified in the lump to " qualified nude film ".Have advantages of and can improve operability by debugging functions in the lump.
According to the present embodiment described above, owing to having carried the wafer map debugging functions that being rewritten in wafer map " image process wrong " or the nude film location status of " picking up mistake " are modified to " qualified nude film " in the control device 51 of nude film pick device 11, so operator can operate and is " qualified nude film " by the state revision of the nude film position of being rewritten in wafer map " image process wrong " or " picking up mistake " the input unit of nude film pick device 11 53, in this nude film pick device 11, with reference to revised wafer map, again carry out because image processing is wrong or pick up picking up of the remaining nude film of mistake.Therefore, do not need as in the past in the operation that generates new wafer map when process Status Change wrong or that pick up the remaining nude film of mistake for " qualified nude film " because of image with the wafer map generating apparatus outside equipment, can operate and the state of nude film is modified to simply to " qualified nude film " and reuses from " image is processed wrong " or " picking up mistake " by the input unit 53 to nude film pick device 11, can boost productivity and cost-effectivenes (rate of finished products of nude film).
And, in the present embodiment, can on the picture of display unit 54, show the state of each nude film position of wafer map, operator's state by visual each nude film position of confirming wafer map input unit 53 is operated on the picture of this display unit 54, and be " qualified nude film " by " image is processed wrong " or the state revision of " picking up mistake ", so can prevent in advance in the time that the state revision of " image is processed wrong " or " picking up mistake " is " qualified nude film " being " qualified nude film " by the state revision of wrong nude film position, and can on the picture of display unit 53 (should be: display unit 54), confirm to process mistake because of image by visual, pick up mistake and in situation that remaining nude film cannot use for some reason and in fact, can end the state revision of this nude film is " qualified nude film ", have advantages of and do not produce defective substrate.
In addition, in the present embodiment, in the control device 51 of nude film pick device 11, wafer map debugging functions are carried, but can in the control device of component mounter that is provided with nude film pick device 11, carry wafer map debugging functions, or also can be at the line management that the element assemble mounting system that comprises nude film pick device 11 (element hookup wire) entirety is managed with carrying wafer map debugging functions in computer.
In addition, the nude film pick device 11 of the present embodiment forms in the mode that adsorption head 41 and camera 42 is moved integratedly by YX travel mechanism 25 along XY direction, but also can form as follows: adsorption head 41 and camera 42 only move along directions X, and chip tray 32 moves along Y-direction on pallet pull-out platform 23, thereby move along XY direction as the position of the nude film 31 of reference object/absorption object.
In addition, the present invention also can carry out suitably changing etc. to the structure of the structure of nude film pick device 11, chip tray 32, certainly can in the scope that does not depart from purport, carry out various changes and is implemented.
Description of reference numerals
11 nude film pick devices
22 feed bin maintaining parts
23 pallet pull-out platforms
25 XY travel mechanisms
28 jack-up unit
30 wafers are opened and are established body
31 nude films
32 chip trays
33 chip mounting plates
34 cutting blades
37 jack-up cylinders
39 jack-up pins
41 adsorption heads
42 cameras
43 suction nozzles
51 control device
52 storage devices (storing mechanism)
53 input units (wafer map correction mechanism)
54 display unit
Claims (4)
1. the wafer map management devices of a nude film installation system, in the storing mechanism of described nude film installation system, store the whether qualified wafer map of nude film of the each position that represents the cut wafer of the mode to be divided into multiple nude films, the described wafer map of reference in nude film installation procedure, pick up successively qualified nude film and be arranged on substrate from described wafer, and, in the time picking up qualified nude film, the state of the nude film position of having picked up in described wafer map is rewritten into " picking up " from " qualified nude film ", on the other hand, process state wrong or that pick up wrong nude film position and be rewritten into " image is processed wrong " or " picking up mistake " from " qualified nude film " having there is image,
The wafer map management devices of described nude film installation system is characterised in that,
In described nude film installation system, be provided with wafer map correction mechanism, this wafer map correction mechanism is " qualified nude film " by the state revision of the nude film position of being rewritten in described wafer map " image is processed wrong " or " picking up mistake ".
2. the wafer map management devices of nude film installation system as claimed in claim 1, is characterized in that,
In described nude film installation system, be provided with the display unit of the state of the each nude film position that shows described wafer map,
Be configured to, operator can operate described wafer map correction mechanism in the state by visual each nude film position of confirming described wafer map on the picture of described display unit, and is " qualified nude film " by " image is processed wrong " or the state revision of " picking up mistake ".
3. the wafer map management devices of nude film installation system as claimed in claim 1 or 2, is characterized in that,
Described wafer map correction mechanism possesses the debugging functions in the lump that the multiple nude film location statuss that are rewritten into " image is processed wrong " or " picking up mistake " are modified in the lump to " qualified nude film ".
4. a nude film installation method, in the storing mechanism of nude film installation system, store the whether qualified wafer map of nude film of the each position that represents the cut wafer of the mode to be divided into multiple nude films, the described wafer map of reference in nude film installation procedure, pick up successively qualified nude film and be arranged on substrate from described wafer, and, in the time picking up qualified nude film, the state of the nude film position of having picked up in described wafer map is rewritten into " picking up " from " qualified nude film ", on the other hand, process state wrong or that pick up wrong nude film position and be rewritten into " image is processed wrong " or " picking up mistake " from " qualified nude film " having there is image,
Described nude film installation method is characterised in that,
Operator operates the wafer map correction mechanism of being located at described nude film installation system, be " qualified nude film " by the state revision of the nude film position of being rewritten in described wafer map " image is processed wrong " or " picking up mistake ", in described nude film installation system, with reference to revised wafer map, again carry out because image processing is wrong or pick up picking up of the remaining nude film of mistake.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2012/061394 WO2013161061A1 (en) | 2012-04-27 | 2012-04-27 | Wafer map management device and die mounting method of die mounting system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104205289A true CN104205289A (en) | 2014-12-10 |
| CN104205289B CN104205289B (en) | 2017-03-29 |
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| CN201280071970.XA Active CN104205289B (en) | 2012-04-27 | 2012-04-27 | The wafer map managing device and nude film installation method of nude film installation system |
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| JP (1) | JP6053195B2 (en) |
| CN (1) | CN104205289B (en) |
| WO (1) | WO2013161061A1 (en) |
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| KR100716552B1 (en) * | 2006-02-03 | 2007-05-09 | 삼성전자주식회사 | Die attach method |
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| JP2009105151A (en) * | 2007-10-22 | 2009-05-14 | Iwate Toshiba Electronics Co Ltd | Semiconductor test device |
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| JP2001250834A (en) * | 2000-03-06 | 2001-09-14 | Hitachi Ltd | Method of manufacturing semiconductor device |
| CN1987497A (en) * | 2005-12-19 | 2007-06-27 | 日东电工株式会社 | Error correction assistance system |
| KR20070090670A (en) * | 2006-03-03 | 2007-09-06 | 삼성테크윈 주식회사 | Method for correcting die pickup position |
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| CN110544666A (en) * | 2015-03-20 | 2019-12-06 | 罗茵尼公司 | Method for semiconductor device transfer |
| US11488940B2 (en) | 2015-03-20 | 2022-11-01 | Rohinni, Inc. | Method for transfer of semiconductor devices onto glass substrates |
| US11515293B2 (en) | 2015-03-20 | 2022-11-29 | Rohinni, LLC | Direct transfer of semiconductor devices from a substrate |
| US11562990B2 (en) | 2015-03-20 | 2023-01-24 | Rohinni, Inc. | Systems for direct transfer of semiconductor device die |
| US11462433B2 (en) | 2016-11-23 | 2022-10-04 | Rohinni, LLC | Direct transfer apparatus for a pattern array of semiconductor device die |
| US11728195B2 (en) | 2018-09-28 | 2023-08-15 | Rohinni, Inc. | Apparatuses for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013161061A1 (en) | 2013-10-31 |
| JPWO2013161061A1 (en) | 2015-12-21 |
| CN104205289B (en) | 2017-03-29 |
| JP6053195B2 (en) | 2016-12-27 |
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