CN104201167B - A kind of welding pad structure and display device - Google Patents
A kind of welding pad structure and display device Download PDFInfo
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- CN104201167B CN104201167B CN201410373897.2A CN201410373897A CN104201167B CN 104201167 B CN104201167 B CN 104201167B CN 201410373897 A CN201410373897 A CN 201410373897A CN 104201167 B CN104201167 B CN 104201167B
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- 238000003466 welding Methods 0.000 title claims abstract description 154
- 238000001514 detection method Methods 0.000 claims abstract description 74
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- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 238000002788 crimping Methods 0.000 abstract description 7
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Abstract
The invention discloses a kind of welding pad structure and display device，The welding pad structure includes realizing the first pad unit and the second pad unit that electrically connect by crimping mode，As the first pad unit is divided at least two welding regions，At least two welding regions are divided into equivalent to by welding pad structure，And detector unit is provided with for each welding region，Detection welding pad and comparison circuit in by detector unit，It is estimated that the contact resistance in corresponding welding region between the first welding pad and the second welding pad，Such that it is able to be adjusted to the electric current of different welding regions according to estimation result，Such that it is able to improve due to uneven the brought impact to signal transmission of the contact resistance of the different welding regions of welding pad structure，And then when above-mentioned welding pad structure is applied to display device，Can improve due to the bad problem of the uneven caused display product of the contact resistance of the different welding regions of welding pad structure.
Description
Technical Field
The present invention relates to the field of semiconductor technologies, and in particular, to a pad structure and a display device.
Background
With the development of the electronic and communication industries, there is an increasing demand for flat panel Display devices such as Light Emitting Diodes (LEDs), Organic Light Emitting Diodes (OLEDs), Plasma Display Panels (PDPs), and Liquid Crystal Displays (LCDs). The development trend of flat panel display devices is light, thin, short, and small, and a packaging technology having characteristics of high density, small volume, high degree of freedom of mounting, etc. is required to meet the above requirements, and thus, a Chip On Glass (COG) packaging technology has been developed.
The COG is to fix a driving chip on a display panel, and to use the display panel as a carrier for packaging the driving chip, and to bond the driving chip with a circuit of the display panel. In the conventional COG structure, as shown in fig. 1, a part of bonding pads of a driver chip 1 and a part of bonding pads on a non-display area of a display panel 4 are electrically connected to each other to serve as a signal input terminal 2 of the driver chip 1, and another part of bonding pads of the driver chip 1 and another part of bonding pads on the non-display area of the display panel 4 are electrically connected to each other to serve as a signal output terminal 3 of the driver chip 1, wherein the signal input terminal 2 is used for inputting signals to the driver chip 1, and the signal output terminal 3 is used for outputting signals input to the driver chip 1 to the display panel 4 after being processed by the driver chip 1.
In the COG structure, as shown in fig. 2a and fig. 2b, the pad 11 on the driving chip 1 is electrically connected to the pad 41 on the display panel 4 by using an Anisotropic Conductive Film (ACF) through a pressure welding method, so that the driving chip 1 transmits a driving signal to each signal line in the display panel 4. Two groups of bonding pads electrically connected by means of crimping are referred to as a bonding pad structure, for example, both the signal input terminal and the signal output terminal are a bonding pad structure, where fig. 2a is a bonding pad structure before crimping, and fig. 2b is a bonding pad structure after crimping.
Based on some problems existing in the current COG process, for example, in the COG structure, the problems of poor flatness of the pad structure, abnormal ACF, alignment deviation of two electrically connected pads, and the like can cause uneven contact resistance of different welding areas of the pad structure, thereby affecting signal transmission, causing a hidden trouble of abnormal display in subsequent use of a display product, and the contact resistance of the pad structure can change along with accumulation of time, temperature, and humidity.
Therefore, how to improve the display product defects caused by the non-uniform contact resistance of different welding areas of the welding pad structure is a technical problem that needs to be solved urgently by those skilled in the art.
Disclosure of Invention
In view of the above, embodiments of the present invention provide a pad structure and a display device, so as to improve the display product defect caused by the non-uniform contact resistance of different welding areas of the pad structure.
Therefore, an embodiment of the present invention provides a pad structure, including a first pad unit and a second pad unit, which are electrically connected by a compression joint, where the first pad unit has a plurality of first pads arranged side by side, the second pad unit has a plurality of second pads arranged side by side, and each of the second pads is electrically connected to a corresponding first pad; the first welding pad unit is divided into at least two welding areas, and a plurality of groups of electrically connected second welding pads and first welding pads are arranged in each welding pad area; a detection unit for estimating contact resistance between a first bonding pad piece and a second bonding pad piece in the welding area is arranged aiming at each welding area; wherein the detection unit includes:
the two first detection bonding pads are positioned in the welding area, arranged side by side with the first bonding pads and positioned between the two adjacent first bonding pads at intervals, and the structures of the first detection bonding pads are the same as those of the first bonding pads;
the second detection welding gasket is positioned on the second welding pad unit and in the area corresponding to the first detection welding gasket, and the second detection welding gasket is connected with the two first detection welding gaskets in series; and
and the comparison circuit is electrically connected with the two first detection bonding pads which are connected in series and is used for determining the resistance value range of the two first detection bonding pads which are connected in series.
Preferably, in order to facilitate implementation, in the pad structure provided in the embodiment of the present invention, the structure of the second detection pad is a planar structure.
Preferably, in order to make the detection result more accurate, in the pad structure provided in the embodiment of the present invention, a surface area of the second detection pad is greater than twice a surface area of the second pad.
Preferably, in order to facilitate the implementation, in the pad structure provided in the embodiment of the present invention, the comparison circuit is a multi-stage comparison circuit; wherein,
the first-stage comparison sub-circuit is used for comparing the resistance values of the two first detection bonding pads which are connected in series with a reference resistance corresponding to the first-stage comparison sub-circuit, and outputting a first output signal if the resistance values are smaller than the reference resistance; if the reference resistance is larger than the reference resistance, outputting a second output signal;
the other comparison sub-circuits at each stage except the first comparison sub-circuit are used for comparing the resistance values of the two first detection bonding pads connected in series with the reference resistance corresponding to the comparison sub-circuit at the current stage after receiving a second output signal sent by the comparison sub-circuit at the previous stage, and outputting a first output signal if the resistance values are smaller than the reference resistance; if the reference resistance is larger than the reference resistance, outputting a second output signal;
except the last stage of comparison sub-circuit, the rest of comparison sub-circuits at each stage are also used for outputting a second output signal to the next stage of comparison sub-circuit when the comparison sub-circuit at the current stage outputs the second output signal;
the resistance value of the reference resistor corresponding to each stage of the comparison sub-circuit increases along with the increase of the stage number.
Preferably, in order to make the structure of the comparison circuit simpler, in the pad structure provided in the embodiment of the present invention, the comparison circuit is a two-stage comparison circuit.
Specifically, in a possible implementation manner, in the pad structure provided in the embodiment of the present invention, the first-stage comparator circuit; the method specifically comprises the following steps: the circuit comprises a first reference voltage end, a second reference voltage end, a positive power supply, a negative power supply, a first reference resistor and a first voltage comparator; wherein,
a positive phase input end of the first voltage comparator is connected with a first end of the first reference resistor, a negative phase input end of the first voltage comparator is connected with a first reference voltage end, a first power supply input end of the first voltage comparator is connected with a positive power supply, a second power supply input end of the first voltage comparator is connected with a negative power supply, and an output end of the first voltage comparator is respectively connected with a first output signal end and a second-stage comparison sub-circuit;
two first detection bonding pads connected in series are connected between the second reference voltage end and the first end of the first reference resistor, and the second end of the first reference resistor is grounded;
the voltage of the second reference voltage terminal is equal to twice the voltage of the first reference voltage terminal.
Further, in a possible implementation manner, in the pad structure provided in an embodiment of the present invention, the second-stage comparison sub-circuit specifically includes: a second reference resistor and a second voltage comparator; wherein,
the positive phase input end of the second voltage comparator is connected with the first end of the second reference resistor and the first end of the first reference resistor respectively, the negative phase input end of the second voltage comparator is connected with the first reference voltage end, the first power supply input end of the second voltage comparator is connected with the output end of the first voltage comparator, the second power supply input end of the second voltage comparator is connected with the negative power supply, and the output end of the second voltage comparator is connected with the second output signal end.
Preferably, in the above pad structure provided in the embodiment of the present invention, for each of the welding regions, a current adjusting circuit is further included;
the current adjusting circuit is used for adjusting the current of the welding area according to the output result of the comparison circuit.
Correspondingly, the embodiment of the invention also provides a display device, which comprises at least one welding pad structure provided by the embodiment of the invention.
Further, in the display device provided in the embodiment of the present invention, the display device further includes a display panel and a driving chip, and the driving chip inputs a signal to the display panel through the pad structure; wherein,
the first welding pad unit of the welding pad structure is positioned on the display panel, and the second welding pad unit of the welding pad structure is positioned on the driving chip; or
The first welding pad unit of the welding pad structure is positioned on the driving chip, and the second welding pad unit of the welding pad structure is positioned on the display panel.
The welding pad structure and the display device provided by the embodiment of the invention comprise a first welding pad unit and a second welding pad unit which are electrically connected in a compression joint mode, because the first welding pad unit is divided into at least two welding areas, namely, the welding pad structure is divided into at least two welding areas, and a detection unit is arranged for each welding area, and through the detection welding pad and the comparison circuit in the detection unit, the contact resistance between the first bond pad and the second bond pad in the corresponding bond area can be estimated, thereby adjusting the current of different welding areas according to the estimation result, improving the influence on signal transmission caused by uneven contact resistance of different welding areas of the welding pad structure, when the welding pad structure is applied to a display device, the problem of poor display products caused by uneven contact resistance of different welding areas of the welding pad structure can be solved.
Drawings
FIG. 1 is a schematic structural diagram of a conventional COG structure;
fig. 2a is a schematic structural diagram of a conventional solder pad structure before compression bonding;
fig. 2b is a schematic structural diagram of a conventional bonding pad structure after being crimped;
fig. 3 is a schematic structural diagram of a pad structure according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a multi-stage comparison circuit according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a two-stage comparison circuit according to an embodiment of the present invention.
Detailed Description
The following describes in detail a specific embodiment of a pad structure and a display device according to an embodiment of the present invention with reference to the accompanying drawings.
A pad structure provided in an embodiment of the present invention, as shown in fig. 3, includes a first pad unit 100 and a second pad unit 200 that are electrically connected by a crimping method, where the first pad unit 100 has a plurality of first pads 101 arranged side by side, the second pad unit has a plurality of second pads 201 arranged side by side, and each second pad 201 is electrically connected to a corresponding first pad 101; the first pad unit 100 is divided into at least two bonding areas (the area surrounded by each dashed line frame in fig. 3 is a bonding area), and each bonding area is provided with a plurality of groups of electrically connected second bonding pads 201 and first bonding pads 101; a detection unit for estimating a contact resistance between first bonding pad piece 101 and second bonding pad piece 201 in each bonding region is provided for each bonding region; wherein, this detecting element includes:
two first detection bonding pads 301 which are positioned in the welding area, arranged side by side with the first bonding pads 101 and positioned between two adjacent first bonding pads 101 at intervals, wherein the structure of the first detection bonding pads 301 is the same as that of the first bonding pads 101;
a second detection bonding pad 302 located on the second bonding pad unit 200 and located in a region corresponding to the first detection bonding pad 301, the second detection bonding pad 302 being connected in series with the two first detection bonding pads 301; and
and a comparison circuit 303 electrically connected to the two first detection pads 301 connected in series, the comparison circuit 303 being configured to determine a range of resistance values of the two first detection pads 301 connected in series.
The welding pad structure provided by the embodiment of the invention comprises a first welding pad unit and a second welding pad unit which are electrically connected in a crimping mode, and because the first welding pad unit is divided into at least two welding areas, namely, the welding pad structure is divided into at least two welding areas, and a detection unit is arranged for each welding area, and through the detection welding pad and the comparison circuit in the detection unit, the contact resistance between the first bond pad and the second bond pad in the corresponding bond area can be estimated, thereby adjusting the current of different welding areas according to the estimation result, improving the influence on signal transmission caused by uneven contact resistance of different welding areas of the welding pad structure, when the welding pad structure is applied to a display device, the problem of poor display products caused by uneven contact resistance of different welding areas of the welding pad structure can be solved.
It should be noted that, in the above-mentioned pad structure provided in the embodiment of the present invention, the first pad unit is divided into at least two welding areas, and in practical implementation, the first pad unit can be specifically divided into several welding areas according to practical situations, such as the size of the whole pad structure, and the precision of detection. Moreover, the size of each welding area can be the same or different, depending on the actual situation.
Preferably, in a specific implementation, in the pad structure provided in the embodiment of the present invention, the first pad unit is divided into three parallel welding areas, and each welding area has the same size.
Preferably, in the above-mentioned pad structure provided in the embodiment of the present invention, as shown in fig. 3, the structure of the second detection pad 302 is a planar structure.
Preferably, in order to make the detection result more accurate, in the pad structure provided in the embodiment of the present invention, the surface area of the second detection pad is greater than twice the surface area of the second pad.
Further, in the above pad structure provided in the embodiment of the present invention, a width of the second detection pad in a direction along which the second detection pads are arranged side by side is equal to a width of two second pad along the direction plus a width of a gap between the two first detection pads; the length of the second detection bonding pad in the direction perpendicular to the side-by-side arrangement of the second bonding pads is equal to the length of the second bonding pads in the direction.
Preferably, for convenience of implementation, in the pad structure provided in the embodiment of the present invention, as shown in fig. 4, the comparison circuit 303 is a multi-stage comparison circuit; wherein,
the first-stage comparison sub-circuit 303_1 is configured to compare the resistance values of the two first detection pads 301 connected in series with a reference resistance corresponding to the first-stage comparison sub-circuit 303_1, and if the resistance values are smaller than the reference resistance, output a first output signal; if the reference resistance is larger than the reference resistance, outputting a second output signal;
in addition to the first-stage comparison sub-circuit 303_1, each of the remaining comparison sub-circuits 303_ N (N is 2, 3, and 4 … N, where N is the number of stages of the multi-stage comparison circuit) is configured to, upon receiving a second output signal sent by the previous-stage comparison sub-circuit 303_ N-1(N is 2, 3, and 4 … N, where N is the number of stages of the multi-stage comparison circuit), compare the resistance values of the two first detection pads connected in series with a reference resistance corresponding to the current-stage comparison sub-circuit, and if the second output signal is smaller than the reference resistance, output the first output signal; if the reference resistance is larger than the reference resistance, outputting a second output signal;
in addition to the last stage of the comparison sub-circuit 303_ N, each of the remaining stages of the comparison sub-circuits 303_ N (N is 1, 2, 3 … N-1, where N is the number of stages of the multi-stage comparison circuit) is further configured to output a second output signal to the next stage of the comparison sub-circuit 303_ N +1(N is 1, 2, 3 … N-1, where N is the number of stages of the multi-stage comparison circuit) when the present stage of the comparison sub-circuit outputs the second output signal;
the resistance value of the reference resistor corresponding to each stage of the comparison sub-circuit increases along with the increase of the stage number.
Specifically, in the above-mentioned pad structure provided by the embodiment of the present invention, the larger the number of stages of the comparison circuit is, the more accurate the detected resistance value range of the two first detection pads connected in series is, but the more complicated the structure of the comparison circuit is, the higher the cost is. Therefore, in practical implementation, the number of stages of the comparison circuit is determined according to actual conditions.
Preferably, in the pad structure provided by the embodiment of the present invention, the comparison circuit is selected as a second-stage comparison circuit.
Specifically, in a possible implementation manner, in the pad structure provided in the embodiment of the present invention, as shown in fig. 5, the first-stage comparison sub-circuit 303_ 1; the method specifically comprises the following steps: a first reference voltage terminal Vref1, a second reference voltage terminal Vref2, a positive power supply VDD, a negative power supply VDD, a first reference resistor 011, a first voltage comparator 012; wherein,
a positive phase input end of the first voltage comparator 012 is connected to a first end of the first reference resistor 011, a negative phase input end of the first voltage comparator 012 is connected to a first reference voltage terminal Vref1, a first power input end of the first voltage comparator 012 is connected to a positive power VDD, a second power input end of the first voltage comparator 012 is connected to a negative power-VDD, and an Output end of the first voltage comparator 012 is connected to a first Output signal terminal Output1 and a second-stage comparator sub-circuit 303_2, respectively;
two first detection bonding pads 301 connected in series are connected between a second reference voltage terminal Vref2 and a first terminal of a first reference resistor 011, and a second terminal of the first reference resistor 011 is grounded;
the voltage of the second reference voltage terminal Vref2 is equal to twice the voltage of the first reference voltage terminal Vref 1.
The above is merely an example of the specific structure of the first-stage comparison sub-circuit in the two-stage comparison circuit, and in the specific implementation, the specific structure of the first-stage comparison sub-circuit is not limited to the above structure provided in the embodiment of the present invention, and may also be other structures known to those skilled in the art, and is not limited herein.
Specifically, when the first-stage comparison sub-circuit in the two-stage comparison circuit provided in the embodiment of the present invention adopts the first reference resistor and the first voltage comparator as specific structures, the operating principle thereof is as follows: assume the voltage at the first reference signal terminal is V0The voltage of the second reference signal terminal is 2V0The first reference resistor has a resistance value of R1The two first detection bonding pads connected in series are connected between the second reference voltage end and the first end of the first reference resistor, and the second end of the first reference resistor is grounded; so if two first detections in seriesResistance R of the bonding pad is less than R1The voltage at the first terminal of the first reference resistor is greater than V0When the voltage at the positive phase input terminal of the first voltage comparator is lower than the voltage at the negative phase input terminal, the output terminal of the first voltage comparator outputs a first output signal, i.e., a low potential signal-U, to the first output signal terminal0The resistance ratio of the two first detection welding gaskets connected in series is smaller; if the resistance R of the two first detection bonding pads connected in series is larger than R1The voltage at the first terminal of the first reference resistor is smaller than V0At this time, the voltage at the positive phase input terminal of the first voltage comparator is greater than the voltage at the negative phase input terminal, and the output terminal of the first voltage comparator outputs a second output signal, i.e., a high-potential signal U, to the first output signal terminal0And a second output signal is output to the second-stage comparison sub-circuit, which shows that the resistance of the two first detection bonding pads connected in series is relatively large, and the second-stage comparison sub-circuit is required to determine the range of the resistance.
Further, in a possible implementation manner, in the pad structure provided in the embodiment of the present invention, as shown in fig. 5, the second-stage comparison sub-circuit 303_2 specifically includes: a second reference resistor 021 and a second voltage comparator 022; wherein,
a positive phase input end of the second voltage comparator 022 is connected to the first end of the second reference resistor 021 and the first end of the first reference resistor 011, a negative phase input end of the second voltage comparator 022 is connected to the first reference voltage terminal Vref1, a first power input end of the second voltage comparator 022 is connected to an Output end of the first voltage comparator 303_1, a second power input end of the second voltage comparator 022 is connected to the negative power supply-VDD, and an Output end of the second voltage comparator 022 is connected to the second Output signal terminal Output 2.
The above is merely an example of the specific structure of the second-stage comparison sub-circuit in the two-stage comparison circuit, and in the specific implementation, the specific structure of the second-stage comparison sub-circuit is not limited to the above structure provided in the embodiment of the present invention, and may also be other structures known to those skilled in the art, and is not limited herein.
Specifically, when the second-stage comparison sub-circuit in the two-stage comparison circuit provided in the embodiment of the present invention adopts the second reference resistor and the second voltage comparator as specific structures, the operating principle thereof is as follows: assuming that the resistance of the second reference resistor is R2And R is2>R1If the second-stage comparison sub-circuit receives a second output signal output by the first-stage comparison sub-circuit, two first detection bonding pads connected in series are connected between a second reference voltage end and a first end of a second reference resistor, and a second end of the second reference resistor is grounded; therefore, if the resistance R of the two first detection bonding pads connected in series is less than R2The voltage at the first terminal of the second reference resistor is greater than V0At this time, the voltage at the positive phase input terminal of the second voltage comparator is lower than the voltage at the negative phase input terminal, and the output terminal of the second voltage comparator outputs the first output signal, i.e., the low potential signal-U, to the second output signal terminal0The resistance R of the two first detection bonding pads connected in series is larger than R1And is less than R2(ii) a If the resistance of the two first detection bonding pads connected in series is greater than R2The voltage at the first terminal of the second reference resistor is smaller than V0At this time, the voltage at the positive phase input terminal of the second voltage comparator is greater than the voltage at the negative phase input terminal, and the output terminal of the second voltage comparator outputs a second output signal, i.e., a high-potential signal U, to the second output signal terminal0The resistance R ratio R of two first detection bonding pads connected in series is explained2Large, and if it is also necessary to determine what range is large, the number of stages of the comparison circuit needs to be increased.
Specifically, taking the two-stage comparison circuit of the first-stage comparison sub-circuit and the second-stage comparison sub-circuit of which specific structures are provided in the above-described embodiments as an example, the output results thereof are shown in table 1, and the range of the resistances of the two first detection pads connected in series can be determined according to table 1. In table 1, Output1 represents a first Output signal terminal of the second-stage comparator circuit, Output2 represents a second Output signal terminal of the second-stage comparator circuit, R represents resistance values of two first detection pads connected in series, and R represents resistance values of two first detection pads connected in series1Is shown asA resistance value of a reference resistor, R2Representing the resistance, U, of the second reference resistor0Indicating a second output signal, i.e. a high potential signal, -U0Representing the first output signal, i.e. the low potential signal.
TABLE 1
The above specific embodiment is only an example illustrated by a two-stage comparison circuit, if the comparison circuit has three or more stages, the two-stage comparison circuit may be implemented by adding a reference resistor and a voltage comparator on the basis of the two-stage comparison circuit, and each time a stage of comparison sub-circuit is added, a reference resistor and a voltage comparator need to be added, specifically, the connection between the added reference resistor and the voltage comparator may refer to the connection between a second reference resistor and a second voltage comparator in the second stage of comparison sub-circuit, which is not described herein again.
Further, in the pad structure provided in the embodiment of the present invention, in each comparison circuit, the resistance value of the reference resistor corresponding to each comparison sub-circuit is preset, and the specific setting size may be determined according to actual situations, which is not limited herein.
Specifically, in the above-described pad structure provided by the embodiment of the present invention, the detection unit is provided for each of the welding areas in order to estimate the contact resistance of each of the welding areas so as to compensate for the unevenness of the transmission signal due to the unevenness of the contact resistance between the areas according to the result of the estimation. Therefore, in the above pad structure provided by the embodiment of the present invention, it is preferable that the current adjusting circuit further includes, for each welding region;
the current adjusting circuit is used for adjusting the current of the welding area according to the output result of the comparison circuit, so that the compensation of the nonuniformity of the transmission signal caused by the nonuniformity of the contact resistance between the areas can be realized.
It should be noted that the pad structure provided in the embodiments of the present invention may be applicable to any device provided with a pad structure, and is particularly applicable to a device requiring high signal uniformity.
Based on the same inventive concept, embodiments of the present invention further provide a display device, including at least one of the above-mentioned pad structures provided in embodiments of the present invention. The display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. Specifically, the implementation of the display device can refer to the above embodiment of the pad structure, and repeated descriptions are omitted.
Specifically, the display device provided by the embodiment of the invention further comprises a display panel and a driving chip, wherein the driving chip inputs signals to the display panel through the pad structure; wherein,
the first welding pad unit of the welding pad structure is positioned on the display panel, and the second welding pad unit of the welding pad structure is positioned on the driving chip; or
The first welding pad unit of the welding pad structure is positioned on the driving chip, and the second welding pad unit of the welding pad structure is positioned on the display panel.
Further, in the display device provided in the embodiment of the present invention, if the pad structure does not include a current adjusting circuit, the display device further includes a current adjusting circuit to adjust the current of different welding areas according to the output result of the comparing circuit of the different welding areas of the pad structure, so as to improve the problem of poor display device caused by non-uniform contact resistance of the different welding areas of the pad structure. In particular, when embodied, the current regulating circuit may be integrated on the driver chip.
Specifically, in the display device provided in the embodiment of the present invention, the pad structure may be adopted only in a place where the driving chip inputs a signal to the display panel, and the pad structures in other places may adopt the existing pad structures. The pad structure may be used only at a place where a signal is input to the driving chip, and may be used at both a place where a signal is input to the display panel and a place where a signal is input to the driving chip, which is not limited herein.
Specifically, in the display device provided in the embodiment of the present invention, when the pad structure is used in a place where a signal is input to the driving chip, the display device further includes a pad structure for inputting a signal to the driving chip, and in order to distinguish from the pad structure for inputting a signal to the display panel, the pad structure for inputting a signal to the display panel is referred to as a first pad structure, and the pad structure for inputting a signal to the driving chip is referred to as a second pad structure. Specifically, the first pad unit of the second pad structure is located on the display panel, and the second pad unit of the second pad structure is located on the driving chip; or
The first welding pad unit of the second welding pad structure is positioned on the driving chip, and the second welding pad unit of the second welding pad structure is positioned on the display panel.
Further, in specific implementation, the display device provided in the embodiment of the present invention may perform a first estimation on contact resistance of welding areas with different welding structures and output an output result each time the display device is turned on, and then adjust currents of different welding areas according to the output result of the welding structures until the display device is turned off.
The embodiment of the invention provides a welding pad structure and a display device, the welding pad structure comprises a first welding pad unit and a second welding pad unit which are electrically connected in a crimping mode, because the first welding pad unit is divided into at least two welding areas, namely, the welding pad structure is divided into at least two welding areas, and a detection unit is arranged for each welding area, and through the detection welding pad and the comparison circuit in the detection unit, the contact resistance between the first bond pad and the second bond pad in the corresponding bond area can be estimated, thereby adjusting the current of different welding areas according to the estimation result, improving the influence on signal transmission caused by uneven contact resistance of different welding areas of the welding pad structure, when the welding pad structure is applied to a display device, the problem of poor display products caused by uneven contact resistance of different welding areas of the welding pad structure can be solved.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A welding pad structure comprises a first welding pad unit and a second welding pad unit which are electrically connected in a compression joint mode, wherein the first welding pad unit is provided with a plurality of first welding pads which are arranged side by side, the second welding pad unit is provided with a plurality of second welding pads which are arranged side by side, and each second welding pad is electrically connected with the corresponding first welding pad; the first welding pad unit is divided into at least two welding areas, and a plurality of groups of electrically connected second welding pads and first welding pads are arranged in each welding pad area; a detection unit for estimating contact resistance between a first bonding pad piece and a second bonding pad piece in the welding area is arranged aiming at each welding area; wherein the detection unit includes:
the two first detection bonding pads are positioned in the welding area, arranged side by side with the first bonding pads and positioned between the two adjacent first bonding pads at intervals, and the structures of the first detection bonding pads are the same as those of the first bonding pads;
the second detection welding gasket is positioned on the second welding pad unit and in the area corresponding to the first detection welding gasket, and the second detection welding gasket is connected with the two first detection welding gaskets in series; and
and the comparison circuit is electrically connected with the two first detection bonding pads which are connected in series and is used for determining the resistance value range of the two first detection bonding pads which are connected in series.
2. The bond pad structure of claim 1, wherein the second sensing bond pad structure is a planar structure.
3. The bond pad structure of claim 2, wherein the second sense bond pad has a surface area greater than twice the surface area of the second bond pad.
4. Bond pad structure as claimed in any one of claims 1 to 3, wherein the comparison circuit is a multi-stage comparison circuit; wherein,
the first-stage comparison sub-circuit is used for comparing the resistance values of the two first detection bonding pads which are connected in series with a reference resistance corresponding to the first-stage comparison sub-circuit, and outputting a first output signal if the resistance values are smaller than the reference resistance; if the reference resistance is larger than the reference resistance, outputting a second output signal;
the other comparison sub-circuits at each stage except the first comparison sub-circuit are used for comparing the resistance values of the two first detection bonding pads connected in series with the reference resistance corresponding to the comparison sub-circuit at the current stage after receiving a second output signal sent by the comparison sub-circuit at the previous stage, and outputting a first output signal if the resistance values are smaller than the reference resistance; if the reference resistance is larger than the reference resistance, outputting a second output signal;
except the last stage of comparison sub-circuit, the rest of comparison sub-circuits at each stage are also used for outputting a second output signal to the next stage of comparison sub-circuit when the comparison sub-circuit at the current stage outputs the second output signal;
the resistance value of the reference resistor corresponding to each stage of the comparison sub-circuit increases along with the increase of the stage number.
5. The bond pad structure of claim 4, wherein the comparison circuit is a two-stage comparison circuit.
6. The bond pad structure of claim 5, wherein the first stage comparator circuit; the method specifically comprises the following steps: the circuit comprises a first reference voltage end, a second reference voltage end, a positive power supply, a negative power supply, a first reference resistor and a first voltage comparator; wherein,
a positive phase input end of the first voltage comparator is connected with a first end of the first reference resistor, a negative phase input end of the first voltage comparator is connected with a first reference voltage end, a first power supply input end of the first voltage comparator is connected with a positive power supply, a second power supply input end of the first voltage comparator is connected with a negative power supply, and an output end of the first voltage comparator is respectively connected with a first output signal end and a second-stage comparison sub-circuit;
two first detection bonding pads connected in series are connected between the second reference voltage end and the first end of the first reference resistor, and the second end of the first reference resistor is grounded;
the voltage of the second reference voltage terminal is equal to twice the voltage of the first reference voltage terminal.
7. The bond pad structure of claim 6, wherein the second-level comparison sub-circuit specifically comprises: a second reference resistor and a second voltage comparator; wherein,
the positive phase input end of the second voltage comparator is connected with the first end of the second reference resistor and the first end of the first reference resistor respectively, the negative phase input end of the second voltage comparator is connected with the first reference voltage end, the first power supply input end of the second voltage comparator is connected with the output end of the first voltage comparator, the second power supply input end of the second voltage comparator is connected with the negative power supply, and the output end of the second voltage comparator is connected with the second output signal end.
8. The solder pad arrangement of claim 4, further comprising, for each of the soldering regions, a current regulating circuit;
the current adjusting circuit is used for adjusting the current of the welding area according to the output result of the comparison circuit.
9. A display device, comprising a bond pad structure as claimed in any one of claims 1 to 8.
10. The display device according to claim 9, further comprising a display panel and a driving chip, the driving chip inputting a signal to the display panel through the pad structure; wherein,
the first welding pad unit of the welding pad structure is positioned on the display panel, and the second welding pad unit of the welding pad structure is positioned on the driving chip; or
The first welding pad unit of the welding pad structure is positioned on the driving chip, and the second welding pad unit of the welding pad structure is positioned on the display panel.
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| CN106443192A (en) * | 2016-10-31 | 2017-02-22 | 昆山国显光电有限公司 | Detection device and detection method for binding impedance of display screen |
| KR102505862B1 (en) * | 2018-05-15 | 2023-03-07 | 삼성디스플레이 주식회사 | Display panel and display device including the same |
| CN113396450A (en) * | 2019-11-29 | 2021-09-14 | 京东方科技集团股份有限公司 | Side routing resistance detection method of display substrate and display substrate |
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