CN104197220A - Integrated LED lamp - Google Patents
Integrated LED lamp Download PDFInfo
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- CN104197220A CN104197220A CN201410453284.XA CN201410453284A CN104197220A CN 104197220 A CN104197220 A CN 104197220A CN 201410453284 A CN201410453284 A CN 201410453284A CN 104197220 A CN104197220 A CN 104197220A
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Abstract
The invention relates to an integrated LED lamp which comprises a radiator, a plurality of LED chips and a scatter plate. The radiator comprises a substrate and a plurality of cooling fins, the substrate is provided with a first side face and a second side face, the first side face and the second side face are opposite to each other, the first side face is provided with installation positions and fixation positions, and the cooling fins are arranged on the second side face. Each LED chip is correspondingly installed on one installation position. The scatter plate is fixedly arranged on the substrate through the fixation positions. According to the integrated LED lamp, the LED chips are directly arranged on the radiator, so that the structure is simple, an integrated structure is achieved, the heat dissipation effect is good, and the requirement for use of high-power LED lamps can be met. In addition, compared with a traditional LED lamp needing a radiator additionally arranged on a shell, the radiator of the integrated LED lamp can be directly used as the shell and has excellent heat conduction and heat dissipation effects; the manufacturing difficulty is low, and cost is low.
Description
Technical field
The present invention relates to LED lamp radiator field, particularly relate to a kind of LED light fixture of integral type.
Background technology
LED (Light Emitting Diode, light emitting diode), it can directly become visible ray by electric energy conversion efficiently, and have and reach tens thousand of hours～service life of 100,000 hours, thereby be widely used in the fields such as view, safety, special type and general lighting, market potential is beyond measure.
The basic structure of LED is a semi-conductive P-N knot, and when electric current flows through LED element, the temperature of P-N knot will rise, and the temperature in P-N interface is called the junction temperature of LED, conventionally because element chip all has very little size, therefore, also the temperature of LED chip is called to the junction temperature of LED chip.
Adopt LED light fixture that LED makes to be called as the most frequently used lighting with the advantage such as of fine quality, durable, energy-conservation.
Yet the drawback that LED light fixture self exists is, LED light fixture light efficiency is subject to the impact of junction temperature of LED larger, and higher junction temperature of chip will cause light efficiency to occur obviously declining, and can have influence on the service life of LED light fixture.Because LED lamp is when luminous, the temperature of himself can constantly raise, and in lasting illumination work, if the heat that LED lamp produces can not exhale in time, will cause the damage of LED lamp, affects the service life of LED lamp.Therefore, the heat dissipation problem of solution LED lamp is most important for the performance that promotes LED lamp.
For the problems referred to above, the heat energy producing when some LED light fixtures are generally luminous by LED is directly delivered to aluminium alloy or various metal shell dispels the heat, or by heat conductive silica gel transferring heat energy, thereby the high temperature producing while reducing LED illumination, reduce LED light decay, extend LED and throw light on service life.
But, for the larger LED light fixture of luminous power, due to the radiating effect of shell and the heat-conducting effect of heat conductive silica gel is poor can not meet heat radiation requirement, therefore can not well realize the high temperature producing while reducing LED illumination.If set up again in addition heat abstractor on shell, can increase manufacture difficulty, and cost be also higher.
Summary of the invention
Based on this, be necessary to provide the LED light fixture that a kind of good heat dissipation effect, structure are simple and have the integral type of integral structure.
A LED light fixture for integral type, it comprises: radiator, several LED chips and scatter plate;
Described radiator comprises substrate and some radiating fins, described substrate has the first relative side and the second side, on described the first side, be provided with several installation positions and several fixed bits, some described radiating fins are arranged on described the second side;
Described in each LED chip correspondence be installed on one described on installation position;
Described scatter plate is fixedly installed on described substrate by fixed bit described in each;
Described substrate is metal substrate.
In one of them embodiment, described fixed bit is screw, described scatter plate be spirally connected be fixedly installed on described described in each on fixed bit.
In one of them embodiment, described fixed bit is cylinder.
In one of them embodiment, described cylindrical height is 1 to 5 millimeter.
In one of them embodiment, described cylinder is copper post.
In one of them embodiment, described copper post is bolted in and is fixed on described substrate.
In one of them embodiment, described copper post is bolted in described scatter plate away from one end of described substrate, and described scatter plate and described substrate close contact.
In one of them embodiment, described substrate is aluminium base, and described radiating fin is copper sheet.
In one of them embodiment, some described radiating fins are arranged at intervals on described the second side successively.
In one of them embodiment, on described radiating fin, offer several heat radiation through holes.
The LED light fixture of above-mentioned integral type is by being set directly at LED chip on radiator, and structure is simpler, has realized integral structure, and radiating effect is better, can meet high-power LED light fixture and use.In addition, tradition, in traditional LED light fixture, need to be set up heat abstractor at shell relatively, and the radiator of the LED light fixture of above-mentioned integral type can be directly used as shell and use, and has fabulous heat conduction and radiating effect, and manufacture difficulty is lower, and cost is lower.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED light fixture of an embodiment of the present invention;
Fig. 2 is the structural representation of the LED light fixture with flat radiator of an embodiment of the present invention;
Fig. 3 is the structural representation of the flat radiator shown in Fig. 2;
Fig. 4 is the structural representation of the other direction of the flat radiator shown in Fig. 3;
Fig. 5 is the structural representation of the another direction of the flat radiator shown in Fig. 2;
Fig. 6 is the structural representation of the LED light fixture with panel radiator of an embodiment of the present invention;
Fig. 7 is the structural representation of the aluminium base shown in Fig. 6;
Fig. 8 is the structural representation of the thermal column shown in Fig. 6;
Fig. 9 is the structural representation of LED light fixture of the integral type of an embodiment of the present invention;
Figure 10 is the structural representation of the scatter plate shown in Fig. 9.
The specific embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.A lot of details have been set forth in the following description so that fully understand the present invention.But the present invention can implement to be much different from alternate manner described here, and those skilled in the art can do similar improvement without prejudice to intension of the present invention in the situation that, so the present invention is not subject to the restriction of following public specific embodiment.
Refer to Fig. 1, the LED light fixture 10 of integral type comprises radiator 70, several LED chips 80 and scatter plate 90.Several LED chips 80 and scatter plate 90 are installed on radiator 70, and by LED chip 80 is directly arranged on radiator 70, radiating effect is better, can meet high-power LED light fixture and use.In addition, tradition, in traditional LED light fixture, need to be set up heat abstractor at shell relatively, and the radiator 70 of above-mentioned LED light fixture 10 can be directly used as shell and use, and has fabulous heat conduction and radiating effect, and manufacture difficulty is lower, and cost is lower.
Be specific embodiment part below.
Embodiment 1
Refer to Fig. 2, the LED light fixture of integral type is the LED light fixture 20 with flat radiator, and it comprises flat radiator 400, several LED chips (Chip) 500 and scatter plate 600.Several LED chips 500 and scatter plate 600 all arrange on flat radiator 400.By LED chip 500 is directly arranged on flat radiator 400, radiating effect is better, can meet high-power LED light fixture and use.In addition, tradition, in traditional LED light fixture, need to be set up heat abstractor at shell relatively, the flat radiator 400 of the LED light fixture 20 of above-mentioned flat radiator can be directly used as shell and use, and have fabulous heat conduction and radiating effect, manufacture difficulty is lower, and cost is lower.
Refer to Fig. 3 to Fig. 5, it is the structural representation of three different directions of the flat radiator 400 shown in Fig. 2.Flat radiator 400 comprises several heat-conducting substrates 410, two heat radiation wing plates 420, two fixedly radiating fin 430, several main radiating fins 440 and several auxiliary radiating fins 450.Heat radiation wing plate 420, fixedly radiating fin 430 and main radiating fin 440 are all fixedly installed on heat-conducting substrate 410, and auxiliary radiating fin 450 is arranged at and dispels the heat on wing plate 420.And for example, heat-conducting substrate 410, two heat radiation wing plates 420, two fixing radiating fin 430, several main radiating fins 440 and several auxiliary radiating fins 450 structures that are formed in one.Wherein, as shown in Figure 3, Figure 4, the flat design of heat-conducting substrate 410, for example, its thickness is 3 to 5 millimeters, like this, can effectively reduce the integral thickness of flat radiator 400, reaches whole flat effect.
Several heat-conducting substrates 410 successively interval are fixedly installed on fixedly radiating fin 430, one side of main radiating fin 440 and heat radiation wing plate 420, that is to say, the bearing of trend of several heat-conducting substrates 410 is parallel, fixedly radiating fin 430, main radiating fin 440 and the vertical of the bearing of trend of wing plate 420 and the bearing of trend of heat-conducting substrate 410 that dispel the heat, like this, can improve the hollow out degree of flat radiator 400, be convenient at the more heat-dissipating space of flat radiator 400 inner formation, thereby improve the cooling surface area of flat radiator 400, and then improve the radiating effect of flat radiator 400.
In order to increase the cooling surface area of flat radiator 400, simultaneously, what be beneficial to the both sides heat radiation wing plate 420 of flowing through takes away compared with cold air the heat that heat-conducting substrate 410 passes to heat radiation wing plate 420, formation cross-ventilation conducts heat, thereby can further improve the radiating effect of flat radiator 400, for example, refer to Fig. 3, one side of heat radiation wing plate 420 is fixedly installed on the end, one end of several heat-conducting substrates 410, and heat radiation wing plate 420 forms angle with the plane at several heat-conducting substrate 410 places, for example, the angle of described angle is 30 degree to 90 degree.Be appreciated that, heat radiation wing plate 420 is incline direction away from a side of heat-conducting substrate 410 and stretches into extraneous air, like this, can increase the cooling surface area of flat radiator 400, in addition, what be also beneficial to the both sides heat radiation wing plate 420 of flowing through takes away compared with cold air the heat that heat-conducting substrate 410 passes to heat radiation wing plate 420, forms cross-ventilation heat transfer, thereby can further improve the radiating effect of flat radiator 400.And for example, heat radiation wing plate 420 is square platy structure, and and for example, heat radiation wing plate 420 is arc platy structure.
In order further to increase the cooling surface area of flat radiator 400, for example, refer to Fig. 4, several auxiliary radiating fins 450 successively interval are fixedly installed on heat radiation wing plate 420, the bearing of trend of several auxiliary radiating fins 450 is identical, and the bearing of trend of the bearing of trend of several auxiliary radiating fins 450 and heat-conducting substrate 410 is vertical, like this, the cooling surface area of flat radiator 400 can be further increased, thereby the radiating effect of flat radiator 400 can be further improved.
For flat radiator 400 is installed better, for example, refer to Fig. 5, fixedly a side of radiating fin 430 is fixedly installed on the medium position of several heat-conducting substrates 410, fixedly another side edge bending of radiating fin 430 arranges buckle installation portion 431, like this, flat radiator 400 can be directly installed on outside support by buckle installation portion 431, thereby flat radiator 400 can be installed better.For example, be arranged on floor body of wall.
In order further to increase the cooling surface area of flat radiator 400, for example, refer to Fig. 5, one side of main radiating fin 440 is fixedly installed on two side positions of several heat-conducting substrates 410, the bearing of trend of several main radiating fins 440 is identical, and the bearing of trend of the bearing of trend of several main radiating fins 440 and heat-conducting substrate 410 is vertical, like this, the cooling surface area of flat radiator 400 can be further increased, thereby the radiating effect of flat radiator 400 can be further improved.
For flat radiator 400 is installed better, simultaneously, be beneficial to the structure of optimizing flat radiator 400, improve better radiating effect, for example, refer to Fig. 5, two fixing radiating fins 430, several main radiating fins 440 and several auxiliary radiating fins 450 are fixedly installed the rear formation sector structure of heat-conducting substrate 410, i.e. two fixing height of radiating fin 430, the height of the height of main radiating fin 440 and auxiliary radiating fin 450 successively decreases successively, like this, can avoid on the one hand 450 pairs of main radiating fin 440 and auxiliary radiating fins that the interference that fixedly radiating fin 430 produces is installed, pass through better fixedly radiating fin 430 flat radiator 400 is installed, simultaneously, can also play the effect of the structure of optimizing flat radiator 400, improve better heat dispersion.
For more progressive the heat dispersion that improves described flat radiator, for example, described flat radiator is metal flat flat radiator, and and for example, described flat radiator is the flat radiator of alloy.
For example, the flat radiator of an embodiment comprises each component of following mass percent:
The aluminium of 0.4 part～0.5 part of silicon, 0.5 part～0.6 part of iron, 0.05 part～0.3 part of copper, 0.3 part～0.4 part, manganese, 2.1 parts～2.9 parts, magnesium, 0.18 part～0.28 part of chromium, 5.1 parts～6.1 parts, zinc, 0.2 part～0.3 part of titanium and surplus.Be appreciated that, by adopting zinc and the magnesium of above-mentioned mass percent, can form the significant MgZn2 of strengthening effect, make the thermal effectiveness of flat radiator far better than a zinc bianry alloy, tensile strength will be greatly improved, and the ability of stress corrosion resistant and anti-strip corrosion also can increase, and heat-conductive characteristic is also larger, i.e. the good heat dispersion performance of flat radiator.
Refer to Fig. 2, heat-conducting substrate 410 fixedly arranges several installation positions 411 in a side of radiating fin 430, several main radiating fins 440 and several auxiliary radiating fins 450 away from two heat radiation wing plates 420, two, for LED chip 500 is installed.
In order to be arranged on better LED chip and protection LED chip; for example; described installation position is hemispherical; described LED chip is arranged on the side of described heat-conducting substrate; and described LED chip is fixedly placed in described installation position; like this, can be arranged on better LED chip and protection LED chip.
In order further to increase the radiating effect of heat-conducting substrate 410, for example, refer to Fig. 2, some through holes 412 are set on heat-conducting substrate 410, through hole 412 can increase the cooling surface area of heat-conducting substrate 410, and heat-conducting substrate 410 is positioned at can being flowed into two heat radiation wing plates 420 are installed by expand via through holes 412 of own vol compared with hot-air an of side that LED chip 500 is installed, two fixing radiating fins 430, the opposite side of several main radiating fins 440 and several auxiliary radiating fins 450, like this, by above-mentioned cold and hot air circulation, circulate, can further increase the radiating effect of heat-conducting substrate 410.
In order further to increase the radiating effect of heat-conducting substrate 410, take away more quickly the heat that LED chip 500 produces, for example, refer to Fig. 2, through hole 412 is array setting, and installation position 411 is array setting.And for example, each installation position 411 is arranged at the center of the rectangle that four through holes 412 surround.And for example, the aperture of through hole 412 be installation position 411 spacing 20% to 40%.And for example, the aperture of through hole 412 is less than the spacing of installation position 411.
Refer to Fig. 2, scatter plate 600 is fixedly installed on heat-conducting substrate 410, and LED chip 500 is between heat-conducting substrate 410 and scatter plate 600, and the light of LED chip 500 transmittings sees through scatter plate 600 and exposes to outside.
The above-mentioned LED light fixture 20 with flat radiator is by being set directly at LED chip 500 on flat radiator 400, and structure is simpler, has realized integral structure, and radiating effect is better, can meet high-power LED light fixture and use.In addition, tradition, in traditional LED light fixture, need to be set up heat abstractor at shell relatively, the above-mentioned flat radiator 400 with the LED light fixture 20 of flat radiator can be directly used as shell and use, and have fabulous heat conduction and radiating effect, manufacture difficulty is lower, and cost is lower.
Embodiment 2
Refer to Fig. 6 and Fig. 7, the LED light fixture of integral type is the LED light fixture 30 with panel radiator, and it comprises panel radiator 700, several LED chips 800 and scatter plate 900.Several LED chips 800 and scatter plate 900 all arrange on panel radiator 700.By LED chip 800 is directly arranged on panel radiator 700, radiating effect is better, can meet high-power LED light fixture and use.In addition, tradition, in traditional LED light fixture, need to be set up heat abstractor at shell relatively, the panel radiator 700 of the LED light fixture 30 of above-mentioned panel radiator can be directly used as shell and use, and have fabulous heat conduction and radiating effect, manufacture difficulty is lower, and cost is lower
Refer to Fig. 6, panel radiator 700 comprises an aluminium base 710, two heat-dissipating fins 720, several fixedly thermal column 730, several main thermal columns 740 and several auxiliary thermal columns 750.Heat-dissipating fin 720, fixedly thermal column 730 and main thermal column 740 are all fixedly installed on aluminium base 710, and auxiliary thermal column 750 is arranged on heat-dissipating fin 720.
Several fixedly thermal column 730 be array and be arranged on aluminium base 710, for example, several fixedly thermal column 730 distribute and be two rows and be arranged on aluminium base 710, and the line of the fixedly thermal column 730 in every row is straight line.Several main thermal columns 740 are array and are arranged on aluminium base 710, and for example, several main thermal columns 740 are some rows and are arranged on aluminium base 710, and the line of the main thermal column 740 in every row is straight line.Several auxiliary thermal columns 750 are array and are arranged on heat-dissipating fin 720, and for example, several auxiliary thermal columns 750 are some rows and arrange on heat-dissipating fin 720, and the line of the auxiliary thermal column 750 in every row is straight line.Like this, can improve the hollow out degree of panel radiator 700, be convenient at the more heat-dissipating space of panel radiator 700 inner formation, thus the cooling surface area of raising panel radiator 700, and then the radiating effect of raising panel radiator 700.
In order to increase the cooling surface area of panel radiator 700, simultaneously, what be beneficial to the both sides heat-dissipating fin 720 of flowing through takes away compared with cold air the heat that aluminium base 710 passes to heat-dissipating fin 720, formation cross-ventilation conducts heat, thereby can further improve the radiating effect of panel radiator 700, for example, refer to Fig. 6, one side of heat-dissipating fin 720 is fixedly installed on a side of aluminium base 710, and heat-dissipating fin 720 forms angle with the plane at aluminium base 710 places, for example, the angle of described angle is 30 degree to 90 degree.Be appreciated that, heat-dissipating fin 720 is incline direction away from a side of aluminium base 710 and stretches into extraneous air, like this, can increase the cooling surface area of panel radiator 700, in addition, what be also beneficial to the both sides heat-dissipating fin 720 of flowing through takes away compared with cold air the heat that aluminium base 710 passes to heat-dissipating fin 720, forms cross-ventilation heat transfer, thereby can further improve the radiating effect of panel radiator 700.And for example, heat-dissipating fin 720 is square laminated structure, and and for example, heat-dissipating fin 720 is arc-shaped flaky structure.
In order further to increase the cooling surface area of panel radiator 700, for example, refer to Fig. 6, several auxiliary thermal columns 750 successively interval are fixedly installed on heat-dissipating fin 720, and for example, several auxiliary thermal columns 750 are array and are arranged on heat-dissipating fin 720, and for example, several auxiliary thermal columns 750 are some rows and arrange on heat-dissipating fin 720, and the line of the auxiliary thermal column 750 in every row is straight line.Like this, the cooling surface area of panel radiator 700 can be further increased, thereby the radiating effect of panel radiator 700 can be further improved.
For mounting plate type radiator 700 better, for example, refer to Fig. 6, several fixedly thermal column 730 be array and be arranged on aluminium base 710, for example, several fixedly thermal column 730 distribute and be two rows and be arranged on aluminium base 710, and the line of the fixedly thermal column 730 in every row is straight line.And for example, fixedly one end of thermal column 730 is fixedly installed on the medium position of several aluminium bases 710, fixedly the bending of the other end end of thermal column 730 arranges buckle installation portion 731, like this, panel radiator 700 can be directly installed on outside support by buckle installation portion 731, thus mounting plate type radiator 700 better.For example, be arranged on floor body of wall.
In order further to increase the cooling surface area of panel radiator 700, for example, refer to Fig. 6, one end of main thermal column 740 is fixedly installed on two side positions of several aluminium bases 710, and for example, several main thermal columns 740 are array and are arranged on aluminium base 710, for example, several main thermal columns 740 are some rows and are arranged on aluminium base 710, and the line of the main thermal column 740 in every row is straight line, like this, the cooling surface area of panel radiator 700 can be further increased, thereby the radiating effect of panel radiator 700 can be further improved.
For mounting plate type radiator 700 better, simultaneously, be beneficial to the structure of optimizing panel radiator 700, improve better radiating effect, for example, refer to Fig. 6, two fixing thermal columns 730, several main thermal columns 740 and several auxiliary thermal columns 750 are fixedly installed the rear formation bow-shaped structural of aluminium base 710, like this, can avoid on the one hand 750 pairs of main thermal column 740 and auxiliary thermal columns that the interference that fixedly thermal column 730 produces is installed, pass through better fixedly thermal column 730 mounting plate type radiators 700, simultaneously, can also play the effect of the structure of optimizing panel radiator 700, improve better heat dispersion.
In order further to improve the heat dispersion of described panel radiator, for example, described panel radiator is metal plate type radiator, and and for example, described panel radiator is alloy plate type radiator.
For example, the panel radiator of an embodiment comprises each component of following mass percent:
The aluminium of 0.7 part～0.5 part of silicon, 0.5 part～0.6 part of iron, 0.05 part～0.3 part of copper, 0.3 part～0.7 part, manganese, 2.1 parts～2.9 parts, magnesium, 0.18 part～0.28 part of chromium, 5.1 parts～6.1 parts, zinc, 0.2 part～0.3 part of titanium and surplus.Be appreciated that, by adopting zinc and the magnesium of above-mentioned mass percent, can form the significant MgZn2 of strengthening effect, make the thermal effectiveness of panel radiator far better than a zinc bianry alloy, tensile strength will be greatly improved, and the ability of stress corrosion resistant and anti-strip corrosion also can increase, and heat-conductive characteristic is also larger, i.e. the good heat dispersion performance of panel radiator.
And for example, or the different setting identical with described thermal column material of described aluminium base, and for example, described aluminium base is aluminium alloy base plate, described thermal column is copper post.And for example, described thermal column specifically comprises described fixedly thermal column, described main thermal column and described auxiliary thermal column.
In order further to strengthen the radiating effect of described thermal column, for example, described thermal column is copper post, and and for example, described copper post is hollow tubular structure, and for example, refers to Fig. 8, offers several louvres 910a on the sidewall of copper post 900a.And for example, 2 times to 5 times of the thickness that the height of described copper post is described aluminium base; 3.2 times of the thickness that for example height of described copper post is described aluminium base.And for example, described thermal column is array setting.Like this, can further increase the radiating effect that strengthens described thermal column.
Please refer to Fig. 6 and Fig. 7, aluminium base 710 away from two heat-dissipating fins 720, several fixedly arrange several installation positions 711 in a side of thermal column 730, several main thermal columns 740 and several auxiliary thermal columns 750, for LED chip 800 is installed.
For LED chip and protection LED chip are installed better; for example; described installation position is hemispherical; described LED chip is arranged on the side of described aluminium base; and described LED chip is fixedly placed in described installation position; like this, can be arranged on better LED chip and protection LED chip.
In order further to increase the radiating effect of aluminium base 710, for example, refer to Fig. 7, some through holes 712 are set on aluminium base 710, through hole 712 can increase the cooling surface area of aluminium base 710, and aluminium base 710 is positioned at can being flowed into two heat-dissipating fins 720 are installed by expand via through holes 712 of own vol compared with hot-air an of side that LED chip 800 is installed, several are thermal column 730 fixedly, the opposite side of several main thermal columns 740 and several auxiliary thermal columns 750, like this, by above-mentioned cold and hot air circulation, circulate, can further increase the radiating effect of aluminium base 710.
In order further to increase the radiating effect of aluminium base 710, take away more quickly the heat that LED chip 800 produces, for example, refer to Fig. 7, through hole 712 is array setting, and installation position 711 is array setting.And for example, each installation position 711 is arranged at the center of the rectangle that four through holes 712 surround.And for example, the aperture of through hole 712 be installation position 711 spacing 30% to 70%.And for example, the aperture of through hole 712 is less than the spacing of installation position 711.
Refer to Fig. 6, scatter plate 900 is fixedly installed on aluminium base 710, and LED chip 800 is between aluminium base 710 and scatter plate 900, and the light of LED chip 800 transmittings sees through scatter plate 900 and exposes to outside.
For example, on described panel radiator, be provided with several installation positions and several thermal columns; Described panel radiator comprises aluminium base and thermal column, and described aluminium base has the first relative side and the second side, and described installation position is positioned on described the first side, and described thermal column is arranged on described the second side.And for example, described in each, installation position is corresponding install one described in LED chip; Described installation position is array setting.The radius of described copper post be described installation position spacing 10% to 20%.And for example, described scatter plate is fixedly installed on described first side of described aluminium base, and the light of described LED chip transmitting sees through described scatter plate.
The above-mentioned LED light fixture 30 with panel radiator is by being set directly at LED chip 800 on panel radiator 700, and structure is simpler, has realized integral structure, and radiating effect is better, can meet high-power LED light fixture and use.In addition, tradition, in traditional LED light fixture, need to be set up heat abstractor at shell relatively, the above-mentioned panel radiator 700 with the LED light fixture 30 of panel radiator can be directly used as shell and use, and have fabulous heat conduction and radiating effect, manufacture difficulty is lower, and cost is lower.
Embodiment 3
Refer to Fig. 9, the LED light fixture 50 of integral type comprises radiator 100, several LED chips 200 and scatter plate 300.Several LED chips 200 and scatter plate 300 all arrange on radiator 100.By LED chip 200 is directly arranged on radiator 100, radiating effect is better, can meet high-power LED light fixture and use.In addition, tradition, in traditional LED light fixture, need to be set up heat abstractor at shell relatively, and the radiator 100 of the LED light fixture 20 of above-mentioned radiator can be directly used as shell and use, and has fabulous heat conduction and radiating effect, and manufacture difficulty is lower, and cost is lower.
Refer to Fig. 9, radiator 100 comprises several substrates 110, two heat radiation wing plates 120, two fixedly radiating fin 130, several main radiating fins 140 and several auxiliary radiating fins 150.Heat radiation wing plate 120, fixedly radiating fin 130 and main radiating fin 140 are all fixedly installed on substrate 110, and auxiliary radiating fin 150 is arranged at and dispels the heat on wing plate 120.
Several substrates 110 successively interval are fixedly installed on a fixedly side of radiating fin 130, main radiating fin 140 and heat radiation wing plate 120, that is to say, the bearing of trend of several substrates 110 is parallel, fixedly radiating fin 130, main radiating fin 140 and the heat radiation bearing of trend of wing plate 120 and the bearing of trend of substrate 110 is vertical, like this, can improve the hollow out degree of radiator 100, be convenient at the more heat-dissipating space of radiator 100 inner formation, thereby improve the cooling surface area of radiator 100, and then improve the radiating effect of radiator 100.
In order to increase the cooling surface area of radiator 100, simultaneously, what be beneficial to the both sides heat radiation wing plate 120 of flowing through takes away compared with cold air the heat that substrate 110 passes to heat radiation wing plate 120, formation cross-ventilation conducts heat, thereby can further improve the radiating effect of radiator 100, for example, refer to Fig. 9, one side of heat radiation wing plate 120 is fixedly installed on the end, one end of several substrates 110, and heat radiation wing plate 120 forms angle with the plane at several substrate 110 places, for example, the angle of described angle is 30 degree to 90 degree.Be appreciated that, heat radiation wing plate 120 is incline direction away from a side of substrate 110 and stretches into extraneous air, like this, can increase the cooling surface area of radiator 100, in addition, what be also beneficial to the both sides heat radiation wing plate 120 of flowing through takes away compared with cold air the heat that substrate 110 passes to heat radiation wing plate 120, forms cross-ventilation heat transfer, thereby can further improve the radiating effect of radiator 100.And for example, heat radiation wing plate 120 is square platy structure, and and for example, heat radiation wing plate 120 is arc platy structure.
In order further to increase the cooling surface area of radiator 100, for example, refer to Fig. 9, several auxiliary radiating fins 150 successively interval are fixedly installed on heat radiation wing plate 120, the bearing of trend of several auxiliary radiating fins 150 is identical, and the bearing of trend of the bearing of trend of several auxiliary radiating fins 150 and substrate 110 is vertical, like this, the cooling surface area of radiator 100 can be further increased, thereby the radiating effect of radiator 100 can be further improved.
For installation of heat radiator 100 better, for example, refer to Fig. 9, fixedly a side of radiating fin 130 is fixedly installed on the medium position of several substrates 110, fixedly another side edge bending of radiating fin 130 arranges buckle installation portion 131, like this, radiator 100 can be directly installed on outside support by buckle installation portion 131, thus installation of heat radiator 100 better.For example, be arranged on floor body of wall.
In order further to increase the cooling surface area of radiator 100, for example, refer to Fig. 9, one side of main radiating fin 140 is fixedly installed on two side positions of several substrates 110, the bearing of trend of several main radiating fins 140 is identical, and the bearing of trend of the bearing of trend of several main radiating fins 140 and substrate 110 is vertical, like this, the cooling surface area of radiator 100 can be further increased, thereby the radiating effect of radiator 100 can be further improved.
For installation of heat radiator 100 better, simultaneously, be beneficial to the structure of optimizing radiator 100, improve better radiating effect, for example, refer to Fig. 9, two fixing radiating fins 130, several main radiating fins 140 and several auxiliary radiating fins 150 are fixedly installed the rear formation sector structure of substrate 110, i.e. two fixing height of radiating fin 130, the height of the height of main radiating fin 140 and auxiliary radiating fin 150 successively decreases successively, like this, can avoid on the one hand 150 pairs of main radiating fin 140 and auxiliary radiating fins that the interference that fixedly radiating fin 130 produces is installed, pass through better fixedly radiating fin 130 installation of heat radiators 100, simultaneously, can also play the effect of the structure of optimizing radiator 100, improve better heat dispersion.
For more progressive the heat dispersion that improves described radiator, for example, described radiator is metal heat sink, and and for example, described radiator is alloy radiator.And for example, described substrate is metal substrate, and and for example, described substrate is aluminium base, and and for example, described radiating fin is copper sheet, and for example, or the different setting identical with described radiating fin material of described substrate.And for example, described radiating fin specifically comprises described fixedly radiating fin, described main radiating fin and described auxiliary radiating fin, and for example, and the identical or different setting of described fixedly radiating fin, described main radiating fin and described auxiliary radiating fin material.And for example, described in some described radiating fins, on radiating fin, offer several heat radiation through holes.And for example, described in several, dispel the heat radiating wire is set between through hole.And for example, described radiating wire forms network structure.
For example, the radiator of an embodiment comprises each component of following mass percent:
The aluminium of 0.4 part～0.5 part of silicon, 0.5 part～0.6 part of iron, 0.05 part～0.3 part of copper, 0.3 part～0.4 part, manganese, 2.1 parts～2.9 parts, magnesium, 0.18 part～0.28 part of chromium, 5.1 parts～6.1 parts, zinc, 0.2 part～0.3 part of titanium and surplus.Be appreciated that, by adopting zinc and the magnesium of above-mentioned mass percent, can form the significant MgZn2 of strengthening effect, make the thermal effectiveness of radiator far better than a zinc bianry alloy, tensile strength will be greatly improved, and the ability of stress corrosion resistant and anti-strip corrosion also can increase, and heat-conductive characteristic is also larger, i.e. the good heat dispersion performance of radiator.
Refer to Fig. 9, substrate 110 fixedly arranges several installation positions 111 and fixed bit 113 in a side of radiating fin 130, several main radiating fins 140 and several auxiliary radiating fins 150 away from two heat radiation wing plates 120, two.Installation position 111 is for installing LED chip 200, for example, described in each LED chip correspondence arrange one described in installation position.Fixed bit 113 is for installing scatter plate 300.
In order to be arranged on better LED chip and protection LED chip; for example; described installation position is hemispherical; described LED chip is arranged on the side of described substrate; and described LED chip is fixedly placed in described installation position; like this, can be arranged on better LED chip and protection LED chip.
In order further to increase the radiating effect of substrate 110, for example, refer to Fig. 9, some through holes 112 are set on substrate 110, through hole 112 can increase the cooling surface area of substrate 110, and substrate 110 is positioned at can being flowed into two heat radiation wing plates 120 are installed by expand via through holes 112 of own vol compared with hot-air an of side that LED chip 200 is installed, two fixing radiating fins 130, the opposite side of several main radiating fins 140 and several auxiliary radiating fins 150, like this, by above-mentioned cold and hot air circulation, circulate, can further increase the radiating effect of substrate 110.
In order further to increase the radiating effect of substrate 110, take away more quickly the heat that LED chip 200 produces, for example, refer to Fig. 9, through hole 112 is array setting, and installation position 111 is array setting.And for example, each installation position 111 is arranged at the center of the rectangle that four through holes 112 surround.And for example, the aperture of through hole 112 be installation position 111 spacing 20% to 10%.And for example, the aperture of through hole 112 is less than the spacing of installation position 111.
In order further to increase the radiating effect of substrate 110, for example, refer to Fig. 9, between two adjacent substrates 110, form a radiating groove 115, radiating groove 115 is beneficial to cross-ventilation and conducts heat, and like this, can further increase the radiating effect of substrate 110.
Please refer to Fig. 9 and Figure 10, scatter plate 300 is fixedly installed on substrate 110 by fixed bit 112, and LED chip 200 is between substrate 110 and scatter plate 300, and the light of LED chip 200 transmittings sees through scatter plate 300 and exposes to outside.For example, the both sides of scatter plate 300 are provided with strip bulge portion 310, and strip bulge portion 310 is fixedly installed on substrate 110, and for example, offer several fixing holes 311 in strip bulge portion 310, for fixedly scatter plate 300 and substrate 110 are installed.
For fixedly scatter plate is installed better, for example, described substrate has the first relative side and the second side, on described the first side, be provided with several installation positions and several fixed bits, some described radiating fins are arranged on described the second side, and for example, described fixed bit is screw, described scatter plate be spirally connected be fixedly installed on described described in each on fixed bit, and for example, described fixed bit is cylinder, described cylindrical height is 1 to 5 millimeter, and for example, described cylinder is copper post, described copper post is bolted in and is fixed on described substrate, and for example, described copper post is bolted in described scatter plate away from one end of described substrate, and described scatter plate and described substrate close contact.
The LED light fixture 50 of above-mentioned integral type is by being set directly at LED chip 200 on radiator 100, and structure is simpler, has realized integral structure, and radiating effect is better, can meet high-power LED light fixture and use.In addition, tradition, in traditional LED light fixture, need to be set up heat abstractor at shell relatively, and the radiator 100 of the LED light fixture 50 of above-mentioned integral type can be directly used as shell and use, and has fabulous heat conduction and radiating effect, and manufacture difficulty is lower, and cost is lower.
It should be noted that, other embodiment of the present invention also comprise, the LED light fixture of the integral type that the technical characterictic in the various embodiments described above mutually combines is formed, can implement, like this, can reach the simple and integral type technique effect of good heat dissipation effect, structure.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a LED light fixture for integral type, is characterized in that, comprising: radiator, several LED chips and scatter plate;
Described radiator comprises substrate and some radiating fins, described substrate has the first relative side and the second side, on described the first side, be provided with several installation positions and several fixed bits, some described radiating fins are arranged on described the second side;
Described in each LED chip correspondence be installed on one described on installation position;
Described scatter plate is fixedly installed on described substrate by fixed bit described in each;
Described substrate is metal substrate.
2. LED light fixture according to claim 1, is characterized in that, described fixed bit is screw, described scatter plate be spirally connected be fixedly installed on described described in each on fixed bit.
3. LED light fixture according to claim 1, is characterized in that, described fixed bit is cylinder.
4. LED light fixture according to claim 3, is characterized in that, described cylindrical height is 1 to 5 millimeter.
5. LED light fixture according to claim 4, is characterized in that, described cylinder is copper post.
6. LED light fixture according to claim 5, is characterized in that, described copper post is bolted in and is fixed on described substrate.
7. LED light fixture according to claim 6, is characterized in that, described copper post is bolted in described scatter plate away from one end of described substrate, and described scatter plate and described substrate close contact.
8. according to the arbitrary described LED light fixture of claim 1 to 7, it is characterized in that, described substrate is aluminium base, and described radiating fin is copper sheet.
9. LED light fixture according to claim 8, is characterized in that, some described radiating fins are arranged at intervals on described the second side successively.
10. LED light fixture according to claim 9, is characterized in that, offers several heat radiation through holes on described radiating fin.
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| CN109882749A (en) * | 2019-03-05 | 2019-06-14 | 严伯勤 | A kind of LED street lamp bulb shell and its production technology |
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| CN104197220B (en) | 2016-09-14 |
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