CN106051484A - High-power heat dissipation LED lamp - Google Patents
High-power heat dissipation LED lamp Download PDFInfo
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- CN106051484A CN106051484A CN201610473922.3A CN201610473922A CN106051484A CN 106051484 A CN106051484 A CN 106051484A CN 201610473922 A CN201610473922 A CN 201610473922A CN 106051484 A CN106051484 A CN 106051484A
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- heat
- plate body
- led lamp
- fixed plate
- conducting substrate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/104—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using feather joints, e.g. tongues and grooves, with or without friction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
- F21V29/673—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for intake
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention relates to a high-power heat dissipation LED lamp which comprises a heat conducting substrate, an LED light source assembly and a radiator. Two side faces of the heat conducting substrate are respectively provided with a mounting face and a heat dissipation face. The LED light source assembly comprises a plurality of LED sub light sources. The radiator comprises a plurality of groups of heat dissipation modules which are arranged on the heat dissipation face by forming a rectangular array, each heat dissipation module comprises cooling fin assemblies and a plurality of main radiating pipes, the plurality of main radiating pipes are arranged on the mounting face, each main radiating pipe is provided with an embedded part and a mounting part, a bent structure is arranged at the joint of each embedded part and the corresponding mounting part, the embedded parts are at least partially embedded into the heat conducting substrate, the mounting parts are arranged on the cooling fin assemblies in a penetrating manner, and each cooling fin assembly comprises a plurality of cooling fins sequentially arranged at intervals. The heat conducting substrate comprises a fixed plate and a mounting plate. The high-power heat dissipation LED lamp can meet the requirement for high-power heat dissipation and is relatively good in heat dissipation effect.
Description
Technical field
The present invention relates to high-power heat-dissipation technical field of structures, particularly relate to a kind of high-power heat-dissipation LED lamp.
Background technology
It is known that LED light source is widely used at present as one and develops rapid new type light source, with conventional light source phase
The advantage such as more energy-conservation, efficient than having, volume is little, the life-span is long, fast response time, driving voltage are low, shock resistance is remarkable, it is thus possible to
Develop expansion industry size and market share rapidly, industry tendency leads under, its technology is also being constantly updated and deep
Change.
But, the maximum technology barriers of restriction LED light source development are exactly the heat dissipation problem of LED at present.LED sets as light source
Standby, it usually needs continuous firing for a long time, substantial amounts of thermal accumlation can be produced simultaneously, this is accomplished by by radiator heat-dissipation.
Although, occur in that some radiators the most on the market, it is possible to the heating solving to produce during major part LED luminescence is asked
Topic, but for the lighting of high-power and big wattage LED, it is when normal luminous, and the heat of generation is the hugest, tradition
The radiating requirements of the most difficult competent high-power high heat of radiator, it is more difficult to solve light decay problem during LED luminescence.
Summary of the invention
Based on this, it is necessary to provide the high-power heat-dissipation LED lamp of a kind of good heat dispersion performance.
A kind of high-power heat-dissipation LED lamp, including:
Heat-conducting substrate, the two sides of described heat-conducting substrate are respectively provided with installed surface and radiating surface；
LED light source component, described LED light source component includes that multiple LED sub-light source, multiple described LED sub-light sources are installed on
On described installed surface；
Radiator, described radiator includes organizing heat radiation module more, and the described heat radiation module rectangular array of many groups is arranged at institute
Stating on radiating surface, described heat radiation module includes heat sink assembly and many main radiating tubes, many described main radiating tube spread configurations
On described installed surface, described main radiating tube has the portion of setting and installation portion, described in set portion and the junction of described installation portion
Be provided with bending structure, described in the portion of setting at least partly be embedded in described heat-conducting substrate, described installation portion wears described heat radiation
Chip module, described heat sink assembly includes the most spaced multiple fin；
Wherein, described heat-conducting substrate includes fixed plate body and installs plate body, and described fixed plate body fits in described installing plate
On body, described installed surface is positioned at the described installation plate body side away from described fixed plate body, and described main radiating tube is positioned at described solid
Determine the plate body side away from described installation plate body, described in the portion of setting at least partly be embedded in described fixed plate body, described fixing
Plate body is provided with chute towards the side opening of described installation plate body, and described installation plate body is provided with towards the side opening of described fixed plate body
Slide rail, described slide rail slides and is embedded in described chute.
Wherein in an embodiment, described slide rail has the cross section of " T " character form structure.
Wherein in an embodiment, described chute has the cross section of " T " character form structure.
Wherein in an embodiment, the thickness of described fixed plate body and described installation plate body is identical or different setting.
Wherein in an embodiment, described fixed plate body arranges multiple described chute, and described installation plate body is provided with many
Individual described slide rail, multiple described slide rail one_to_one corresponding slide and are embedded in chute described in.
Wherein in an embodiment, multiple described slide rails be arranged in parallel.
Wherein in an embodiment, multiple described chutes be arranged in parallel.
Wherein in an embodiment, the material of described fixed plate body is identical with the material of described installation plate body or different sets
Put.
The radiator of above-mentioned high-power heat-dissipation LED lamp is by arranging multiple heat radiation module, and each heat radiation module passes through
The high efficiency and heat radiation path of heat-conducting substrate-main radiating tube-fin, it is possible to meet the LED light source component to high-power and big wattage
Radiating requirements, good heat dispersion performance.
Accompanying drawing explanation
Fig. 1 is the structural representation of the high-power heat-dissipation LED lamp of an embodiment of the present invention；
Fig. 2 is the structural representation of another angle of the high-power heat-dissipation LED lamp of an embodiment of the present invention；
Fig. 3 is the structural representation of another angle of the high-power heat-dissipation LED lamp of an embodiment of the present invention；
Fig. 4 is the partial structurtes schematic diagram of the high-power heat-dissipation LED lamp of another embodiment of the present invention；
Fig. 5 is the partial structurtes schematic diagram of the high-power heat-dissipation LED lamp of another embodiment of the present invention；
Fig. 6 is the partial structurtes schematic diagram of the high-power heat-dissipation LED lamp of another embodiment of the present invention；
Fig. 7 is the partial structurtes schematic diagram of the high-power heat-dissipation LED lamp of another embodiment of the present invention；
Fig. 8 is the partial structurtes schematic diagram of the high-power heat-dissipation LED lamp of another embodiment of the present invention.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.In accompanying drawing
Give the better embodiment of the present invention.But, the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.On the contrary, providing the purpose of these embodiments is to make to understand the disclosure more
Add thorough comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, and it can be directly on another element
Or element placed in the middle can also be there is.When an element is considered as " connection " another element, and it can be to be directly connected to
To another element or may be simultaneously present centering elements.Term as used herein " vertical ", " level ", " left ",
For illustrative purposes only, being not offered as is unique embodiment for " right " and similar statement.
Unless otherwise defined, all of technology used herein and scientific terminology and the technical field belonging to the present invention
The implication that technical staff is generally understood that is identical.The term used the most in the description of the invention is intended merely to describe tool
The purpose of the embodiment of body, it is not intended that in limiting the present invention.Term as used herein " and/or " include one or more
Arbitrary and all of combination of relevant Listed Items.
Such as, a kind of high-power heat-dissipation LED lamp, including: heat-conducting substrate, the two sides of described heat-conducting substrate are respectively provided with
Installed surface and radiating surface；LED light source component, described LED light source component includes multiple LED sub-light source, multiple described LED sub-light sources
It is installed on described installed surface；Radiator, described radiator includes organizing heat radiation module more, the described rectangular battle array of heat radiation module of many groups
Row are arranged on described radiating surface, and described heat radiation module includes heat sink assembly and many main radiating tubes, many described main heat radiations
Bank of tubes row be arranged on described installed surface, described main radiating tube has the portion of setting and installation portion, described in set portion and described installation
The junction in portion is provided with bending structure, described in the portion of setting at least partly be embedded in described heat-conducting substrate, described installation portion is worn
If described heat sink assembly, described heat sink assembly includes the most spaced multiple fin；Wherein, described heat-conducting substrate
Including fixed plate body and installation plate body, described fixed plate body fits on described installation plate body, and described installed surface is positioned at described peace
Dress plate body is away from the side of described fixed plate body, and described main radiating tube is positioned at the described fixed plate body side away from described installation plate body
Face, described in the portion of setting at least partly be embedded in described fixed plate body, described fixed plate body is towards the side of described installation plate body
Offering chute, described installation plate body is provided with slide rail towards the side opening of described fixed plate body, and described slide rail slides and is embedded at institute
State in chute.
In order to be further appreciated by above-mentioned high-power heat-dissipation LED lamp, another example is, refers to Fig. 1, high-power heat-dissipation
LED lamp 10 includes: heat-conducting substrate 100, LED light source component 200 and radiator 300, LED light source component 200 and radiator 300
Being respectively arranged at two sides of heat-conducting substrate 100, the heat produced when LED light source component 200 normally works is by heat conduction base
Plate 100 conducts to radiator 300, radiator 300 scatter and disappear heat to external environment, to guarantee LED light source component 200
Normal luminous function.
Seeing also Fig. 1 and Fig. 2, the two sides of heat-conducting substrate 100 are respectively provided with installed surface 110 and radiating surface 120, i.e.
Installed surface 110 and radiating surface 120 lay respectively on two sides that heat-conducting substrate 100 is relative.Such as, described heat-conducting substrate has
Cuboid shape structure.Heat-conducting substrate 100 is for the warm quickly and in time powerful described LED light source component 200 produced
Amount absorbs, and is dispersed in the overall structure of described heat-conducting substrate 100, by described heat-conducting substrate 100 to described in part
Heat scatters and disappears, and is transferred in radiator 300, remaining major part heat by radiator 300 to remaining major part
Heat scatters and disappears, and is used for playing preferable radiating effect.
Referring to Fig. 1, LED light source component 200 includes that multiple LED sub-light source 210, multiple LED sub-light sources 210 are installed on peace
On dress face 110, LED sub-light source 210 is used for playing illuminating effect.Such as, described LED light source component is high-power and big wattage
LED light source component, e.g., described LED sub-light source is when normal luminous, and the heat of generation is more, for playing in special occasions
High intensity or the illuminating effect of high brightness.
Referring to Fig. 3, radiator 300 includes organizing heat radiation module 310 more, and many group heat radiation module 310 rectangular array are arranged
On radiating surface 120, such as, between two adjacent described heat radiation modules, it is provided with interval, for playing the effect of heat dissipation ventilation
Really.Such as, the integral heat sink effect of described radiator embodies with the summation of the radiating effect of multiple described heat radiation modules.
Referring to Fig. 3, heat radiation module 310 includes heat sink assembly 311 and many main radiating tubes 312, many main radiating tubes
312 spread configurations, on installed surface 120, are provided with interval between heat sink assembly 311 and described heat-conducting substrate 100.
Referring to Fig. 3, main radiating tube 312 has sets portion 312a and installation portion 312b, sets portion 312a and installation portion
The junction of 312b is provided with bending structure, and the portion 312a of setting at least partly is embedded in heat-conducting substrate 100, and installation portion 312b wears
If heat sink assembly 311, heat sink assembly 311 includes the most spaced multiple fin 311a.Such as, described fin
Offering perforation, described installation portion is fixing with the medial wall of described perforation to be connected.
The portion that the sets 312a of main radiating tube 312 is for quickly and in time by the heat on described heat-conducting substrate 100 carrying out
Absorb, and be transferred to rapidly in installation portion 312b, it should be noted that owing to the described portion 312a that sets at least partly is embedded at
In heat-conducting substrate 100, it is possible to increase described main radiating tube and the exposure level of described heat-conducting substrate, it is used for improving heat transfer efficiency.
When main radiating tube 312 is when carrying out the partial heat being transmitted to by described heat-conducting substrate scattering and disappearing, the installation of main radiating tube 312
Remaining heat is transferred in heat sink assembly 311 by portion 312b simultaneously, heat sink assembly 311 dissipate remaining heat
Heat operation.In the process, described main radiating tube 312 plays the conduction of heat of most critical, i.e. conductive force, it will be understood that
Owing to described main radiating tube 312 can play preferable heat-conducting effect, will heat on heat-conducting substrate 100 quickly and in time
It is transferred on heat sink assembly 311, therefore, between can making to be provided with between heat sink assembly 311 and described heat-conducting substrate 100
Every, so, both avoided heat-conducting substrate 100 and directly contacted with heat sink assembly 311, it is possible to increased described heat-conducting substrate simultaneously
100 and the cooling surface area of described heat sink assembly 311, described heat-conducting substrate 100 and heat sink assembly 311 is strengthened for simultaneously
Radiating effect, simultaneously as described main radiating tube 312 has preferable heat-conducting effect, it is possible to quickly and in time by described
On heat-conducting substrate 100, remaining heat is transferred on heat sink assembly 311, alleviates after-heat at described heat-conducting substrate 100
The problem of upper local accumulation, i.e. hot-spot occurs, and so, it is possible to be greatly enhanced the heat dispersion of described radiator.Additionally,
Owing to multiple described fin 311a are spaced setting successively, it is possible to the heat quickly and in time main radiating tube 312 being transmitted to
Amount is scattered and disappeared to the external world.
The radiator 300 of above-mentioned high-power heat-dissipation LED lamp 10 is by arranging multiple heat radiation module 310, and each heat radiation
The module 310 high efficiency and heat radiation path by heat-conducting substrate 100-main radiating tube 312-fin 311a, enables in particular to meet greatly
The radiating requirements of the LED light source component 200 of power and big wattage, good heat dispersion performance.
In order to improve the heat dispersion of described high-power heat-dissipation LED lamp further, such as, the extension side in portion is set described in
To identical with the bearing of trend of described heat-conducting substrate, that sets portion and described heat-conducting substrate described in improve further contacts journey
Degree, such as contact area, is used for improving heat transfer efficiency further, to improve the heat radiation of described high-power heat-dissipation LED lamp further
Performance.
In order to improve the heat dispersion of described high-power heat-dissipation LED lamp further, such as, adjacent two described fin
Distance successively decreased successively, in such manner, it is possible to fully take into account away from the direction of described radiating surface near described heat radiation by described
The overall heat distribution of described main radiating tube 312, assembles more position at described main radiating tube 312 heat, arranges intensive
The higher described fin of degree, e.g., near the position of described heat-conducting substrate, assembles relatively at described main radiating tube 312 heat
Few position, e.g., the described fin arranging dense degree less away from the position of described heat-conducting substrate can optimize scattered
Hot path, it is possible to improve the heat dispersion of described high-power heat-dissipation LED lamp further.
In order to improve described main radiating tube heat conduction and the uniformity of heat radiation, and alleviate described heat-conducting substrate localized heat further
The problem that amount is piled up occurs, and such as, the many main linear spread configurations of radiating tube 312 are on described installed surface, and for example, and every phase
Distance between adjacent two described main radiating tubes is equal, so, it is possible to improve described main radiating tube heat conduction and the uniformity of heat radiation,
Alleviate the problem generation that described heat-conducting substrate amount of localized heat is piled up further.
In order to further enhance the radiating effect of described fin, for improving the integral heat sink effect of described radiator,
Such as, referring to Fig. 4, described high-power heat-dissipation LED lamp also includes that auxiliary radiating device 400, auxiliary radiating device 400 include
Many radiating wires 410, described radiating wire 410 has spiral structure, and described radiating wire 410 is arranged at described in adjacent two
Between fin 311a, the first end of described radiating wire is connected with fin one of them described, the second end of described radiating wire
It is connected with fin another described；And for example, many described radiating wire rectangular array are distributed in the described heat radiation of adjacent two
Between sheet；And for example, many described radiating wires are that circular array is distributed between the described fin of adjacent two；And for example, institute
State radiating wire and include that dispel the heat female silk and the many sub-silks that dispel the heat, the many sub-silks of described heat radiation are wound around and are arranged on the female silk of described heat radiation；
And for example, the diameter of the female silk of described heat radiation is more than the diameter of the sub-silk of described heat radiation；And for example, the female silk of described heat radiation and the sub-silk of described heat radiation
Material is identical or different setting；And for example, described radiating wire has spiral of Archimedes structure；And for example, described radiating wire tool
There is involute structure, so, utilize conduction of heat and the radiating effect of described radiating wire, it is possible to further enhance described fin
Radiating effect, for improving the integral heat sink effect of described radiator.
In order to further enhance the radiating effect of described fin, for improving the integral heat sink effect of described radiator,
Such as, referring to Fig. 5, described high-power heat-dissipation LED lamp also includes that air-supply arrangement 500, air-supply arrangement 500 include ajutage
510 and air-supply assembly (not shown), described main radiating tube 312 is the hollow-core construction of both ends open, the first of described ajutage 510
The one end open setting portion 312a with described main radiating tube described in being positioned at is held to connect, for blowing to described main radiating tube, described
Air-supply assembly connects with the second end of described ajutage, blows for described ajutage；And for example, described air-supply assembly includes housing
And pressure fan, described pressure fan is installed on described enclosure interior, and the second end of described ajutage connects with described housing；And for example,
Described pressure fan includes that motor, flabellum and power supply module, described motor are electrically connected with described power supply module, described flabellum and institute
The rotary shaft stating motor connects, and described flabellum is towards the second end connection of described ajutage；And for example, described flabellum has circular arc
Structure；And for example, described ajutage has bending structure；And for example, described ajutage has the cross section of cirque structure；And for example,
At least partly be arrangeding in parallel with described main radiating tube of described ajutage, so, utilizes the air-supply of described air-supply arrangement 500 to imitate
Really, it is possible to strengthen the circulation degree of air, it is possible to further enhance the radiating effect of described fin, be used for improving described heat radiation
The integral heat sink effect of device.
The convenience of operation is installed to improve described heat-conducting substrate and described radiator further, i.e. mounts and dismounts behaviour
It is simpler convenient to make, and such as, refers to Fig. 6, and described heat-conducting substrate 100 includes fixed plate body 130 and installs plate body 140, institute
Stating fixed plate body 130 and fit on described installation plate body 140, described installed surface is positioned at described installation plate body away from described fixed plate
The side of body, described main radiating tube is positioned at the described fixed plate body side away from described installation plate body, described at least portion of the portion of setting
Dividing and be embedded in described fixed plate body, described fixed plate body 130 is provided with chute 131, institute towards the side opening of described installation plate body
Stating and install plate body 140 and be provided with slide rail 141 towards the side opening of described fixed plate body, described slide rail slides and is embedded at described chute
In；Described slide rail has the cross section of " T " character form structure；And for example, described chute has the cross section of " T " character form structure；And for example,
The thickness of described fixed plate body and described installation plate body is identical or different setting；And for example, described fixed plate body arranges multiple described
Chute, described installation plate body is provided with multiple described slide rail, and multiple described slide rail one_to_one corresponding slide and are embedded at chute described in
In；And for example, multiple described slide rails be arranged in parallel；And for example, multiple described chutes be arranged in parallel；And for example, the material of described fixed plate body
Matter is identical with the material of described installation plate body or different setting, so, by described slide rail and the cooperation of described chute, it is possible to enter
One step improves described heat-conducting substrate and installs, with described radiator, the convenience operated, i.e. installation and removal operation is simpler just
Prompt.
In order to improve the air circulation degree between multiple described fin further, it is used for improving described high-power heat-dissipation
The integral heat sink performance of LED lamp, such as, refers to Fig. 7, multiple described fin 311a and be arranged in parallel, described fin
311a is vertically arranged with described installation portion, and described fin 311a offers multiple louvre 311b, adjacent two described heat radiations
Described louvre 311b on sheet 311a shifts to install；And for example, described fin has rectangular sheet structure；And for example, described
Louvre has the cross section of polygonized structure；And for example, described louvre has the cross section of hexagonal structure；And for example, adjacent
The distance of two described fin is successively decreased away from the direction of described radiating surface near described heat radiation successively by described；And for example,
Multiple described louvre rectangular array are distributed on described fin；And for example, multiple described louvres are that circular array is divided
It is distributed on described fin；And for example, the edge of described louvre has arc-shaped structure, and so, it is described that utilization shifts to install
Louvre can improve the air circulation degree between multiple described fin, is used for improving described high-power heat-dissipation LED lamp
Integral heat sink performance.
In order to preferably enable described fin more be clamped securely on described main radiating tube, such as, refer to figure
8, described high-power heat-dissipation LED lamp also includes that limit assembly 600, limit assembly 600 include multiple spacing ring 610, spacing ring
610 are arranged between adjacent two described fin 311a, and described spacing ring is placed in described main radiating tube, described limit
First end of position ring is connected with fin one of them described, and the second end of described spacing ring is with another described fin even
Connect；And for example, described fin is provided with annular storage tank with the junction of described spacing ring, and the end of described spacing ring is set
Inside described storage tank；And for example, described spacing ring is coated with heat-conducting glue with the place of setting of described storage tank；And for example, lead described in
Hot glue is heat conductive silica gel；And for example, the internal diameter of described spacing ring is identical with the external diameter of described main radiating tube；And for example, described spacing ring
External diameter be gradually increased at its end position by its medium position；And for example, the outer surface of described spacing ring is provided with striped
Structure, so, utilizes the supporting role to adjacent two described fin of the described spacing ring, it is possible to preferably make described fin
Can more be clamped securely on described main radiating tube.
It is appreciated that it is for described heat conduction base in the heat dissipation path of described heat-conducting substrate-main radiating tube-fin
The heat conductivility of plate requires the highest, and owing to described main radiating tube is connected with described heat-conducting substrate, therefore, described main radiating tube also must
Must possess preferable heat conductivility, for described fin, it is as last ring in integral heat sink path, it should possess preferably
Heat dispersion.
Such as, described heat-conducting substrate includes each component of following mass parts:
Copper 90 parts～92 parts, 2 parts～4.5 parts of aluminum, 1 part～2.5 parts of magnesium, 0.5 part～0.8 part of nickel, ferrum 0.1 part～0.3 part,
Vanadium 1.5 parts～4.5 parts, 0.1 part～0.4 part of manganese, titanium 0.5 part～0.8 part, chromium 0.5 part～0.8 part, 0.5 part～0.8 part of magnesium, silicon
0.8 part～15 parts and 0.5 part～2 parts of Graphenes.
Use each component of following mass parts, it is possible to make described heat-conducting substrate possess good heat conductivility, such that it is able to
Heat quickly and is in time transferred to described heat radiation plate body, described heat-conducting medium and described radiator.
Such as, described main radiating tube includes each component of following mass parts:
Copper 95 parts～98 parts, 55 parts～60 parts of aluminum, silver 10 parts～15 parts, 0.8 part～1.2 parts of magnesium, 0.2 part～0.5 part of manganese,
Titanium 0.05 part～0.3 part, chromium 0.05 part～0.1 part, vanadium 0.05 part～0.3 part, silicon 0.3 part～0.5 part and 0.1 part～0.3 part
Graphene.
At least partly it is placed in inside described fin due to described main radiating tube, it is contemplated that need quickly and in time
Transfer heat in described fin, its heat conductivility can be significantly improved by adding the silver of 10 parts～15 parts.
Such as, described fin includes each component of following mass parts:
88 parts～93 parts of aluminum, silicon 5.5 parts～10.5 parts, 0.3 part～0.7 part of magnesium, copper 0.05 part～0.3 part, ferrum 0.2 part～
0.8 part, 0.2 part～0.5 part of manganese, titanium 0.05 part～0.3 part, chromium 0.05 part～0.1 part, vanadium 0.05 part～0.3 part and 5 parts～15
Part Graphene.
The fin using as above each component of mass parts can quickly and in time by described heat-conducting substrate be transmitted to
Heat carry out distributing or scattering and disappearing to the external world.
So, the described heat-conducting substrate of as above each component of mass parts, described main radiating tube and described heat radiation it are respectively adopted
Lamellar body can form conduction of heat gradient, optimizes heat conduction and heat dissipation path.
It should be noted that other embodiments of the present invention also include that the technical characteristic in the various embodiments described above be combined with each other
The high-power heat-dissipation LED lamp that can implement formed.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, not to above-mentioned reality
The all possible combination of each technical characteristic executed in example is all described, but, as long as the combination of these technical characteristics is not deposited
In contradiction, all it is considered to be the scope that this specification is recorded.
The above embodiment only have expressed the several embodiments of the present invention, and it describes more concrete and detailed, but
Therefore the restriction to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that, for the ordinary skill people of this area
For Yuan, without departing from the inventive concept of the premise, it is also possible to make some deformation and improvement, these broadly fall into the present invention's
Protection domain.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (8)
1. a high-power heat-dissipation LED lamp, it is characterised in that including:
Heat-conducting substrate, the two sides of described heat-conducting substrate are respectively provided with installed surface and radiating surface；
LED light source component, it is described that described LED light source component includes that multiple LED sub-light source, multiple described LED sub-light sources are installed on
On installed surface,
Radiator, described radiator includes organizing heat radiation module more, and the described heat radiation module rectangular array of many groups is arranged at described dissipating
On hot side, described heat radiation module includes heat sink assembly and many main radiating tubes, and many described main radiating tube spread configurations are in institute
Stating on installed surface, described main radiating tube has the portion of setting and installation portion, described in set portion and described installation portion junction arrange
Have bending structure, described in the portion of setting at least partly be embedded in described heat-conducting substrate, described installation portion wears described groups of fins
Part, described heat sink assembly includes the most spaced multiple fin；
Wherein, described heat-conducting substrate includes fixed plate body and installs plate body, and described fixed plate body fits on described installation plate body,
Described installed surface is positioned at the described installation plate body side away from described fixed plate body, and described main radiating tube is positioned at described fixed plate body
Away from the side of described installation plate body, described in the portion of setting at least partly be embedded in described fixed plate body, described fixed plate body court
Side opening to described installation plate body is provided with chute, and described installation plate body is provided with slide rail towards the side opening of described fixed plate body,
Described slide rail slides and is embedded in described chute.
High-power heat-dissipation LED lamp the most according to claim 1, it is characterised in that described slide rail has " T " character form structure
Cross section.
High-power heat-dissipation LED lamp the most according to claim 2, it is characterised in that described chute has " T " character form structure
Cross section.
High-power heat-dissipation LED lamp the most according to claim 1, it is characterised in that described fixed plate body and described installation
The thickness of plate body is identical or different setting.
High-power heat-dissipation LED lamp the most according to claim 1, it is characterised in that described fixed plate body arranges multiple institute
Stating chute, described installation plate body is provided with multiple described slide rail, and multiple described slide rail one_to_one corresponding slide to be embedded at described in one and slide
In groove.
High-power heat-dissipation LED lamp the most according to claim 5, it is characterised in that multiple described slide rails be arranged in parallel.
High-power heat-dissipation LED lamp the most according to claim 5, it is characterised in that multiple described chutes be arranged in parallel.
High-power heat-dissipation LED lamp the most according to claim 1, it is characterised in that the material of described fixed plate body and institute
State and install that the material of plate body is identical or different setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610473922.3A CN106051484A (en) | 2016-06-22 | 2016-06-22 | High-power heat dissipation LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610473922.3A CN106051484A (en) | 2016-06-22 | 2016-06-22 | High-power heat dissipation LED lamp |
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|---|---|
| CN106051484A true CN106051484A (en) | 2016-10-26 |
Family
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| CN201610473922.3A Pending CN106051484A (en) | 2016-06-22 | 2016-06-22 | High-power heat dissipation LED lamp |
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