CN104183583B - A kind of adjustable color temperature, the aobvious LED referred to - Google Patents
A kind of adjustable color temperature, the aobvious LED referred to Download PDFInfo
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- CN104183583B CN104183583B CN201410399363.7A CN201410399363A CN104183583B CN 104183583 B CN104183583 B CN 104183583B CN 201410399363 A CN201410399363 A CN 201410399363A CN 104183583 B CN104183583 B CN 104183583B
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- 235000012431 wafers Nutrition 0.000 claims abstract description 66
- 239000000463 material Substances 0.000 claims abstract description 51
- 241001640034 Heteropterys Species 0.000 claims abstract description 16
- 241000218202 Coptis Species 0.000 claims description 9
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 7
- 239000012141 concentrate Substances 0.000 claims description 5
- 230000037237 body shape Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 description 6
- 241001025261 Neoraja caerulea Species 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
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- 238000005192 partition Methods 0.000 description 1
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- 239000000243 solution Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
The present invention discloses a kind of adjustable color temperature, the aobvious LED referred to, include insulating body, three groups of independently-powered conducting terminals, red-light LED chip, first blue LED wafers, the fluorescent material glue-line of second blue LED wafers and two kinds of different ratios, the insulating body is separated out two reflectors by withe, the red-light LED chip and the first blue LED wafers are installed in a wherein reflector, second blue LED wafers are installed in another reflector, and two kinds of fluorescent material glue-lines of different ratio are injected in two reflectors, thereby, the red-light LED chip and the first blue LED wafers send a kind of indefinite white light of colour temperature through the mixing of the first fluorescent material glue-line, second blue LED wafers send the indefinite white light of another colour temperature through the mixing of the second fluorescent material glue-line；Powered again by each LED wafer by independent conducting end subgroup, any regulation voltage and current controls the luminosity of different chips, to adjust out, indefinite colour temperature, difference are aobvious to be referred to and the adjustable mixed light of light intensity.
Description
Technical field
The present invention relates to LED art, a kind of adjustable color temperature, the aobvious LED referred to are referred in particular to.
Background technology
Light emitting diode (LED or LEDS) is the solid-state devices for converting electrical energy into luminous energy, and service life length, colour developing refer to
Count height, energy-conserving and environment-protective, brightness is high, be widely used, every country all vigorously advocates development LED industries.Scientific and technological progress in recent years is
So that LED packaged lamps cup has smaller volume, complicated, photochromic diversified popular trend.Existing LED encapsulates Lamp cup
It is general using the structure that single LEDs chip is encapsulated in a Lamp cup, and by Lamp cup do it is relatively deep, and filled in Lamp cup
Glue is to fix LED chips, and the problems of the LED lamps of the structure are that Lamp cup volume is big, influence its performance, light
Diffusivity is also poor, and one Lamp cup of what is more important can only do single white light, photochromic single, can not meet some special
The use demand of occasion.
The content of the invention
In view of this, in view of the existing deficiencies of the prior art, its main purpose is to provide a kind of adjustable color temperature, shown the present invention
The LED of finger, it has the LED wafer in two reflectors, two reflectors different, and fluorescent material glue-line proportioning is different, each LED
The supply voltage and electric current of chip are freely adjustable, to adjust out varied different-colour, the different aobvious mixed lights referred to, mixed light
Effect is good.
To achieve the above object, the present invention is using following technical scheme：
A kind of adjustable color temperature, the aobvious LED referred to, including
One insulating body, the top surface of the insulating body is recessed a cup, and the center of the cup is provided with a nontransparent longitudinal direction
Partition wall, cup is divided into two to form the first reflector and the second reflector, and the volume of first reflector is anti-more than second
The volume of light cup；
Three groups of conducting terminals, are first group of conducting terminal, second group of conducting terminal, the 3rd group of conducting terminal, each group respectively
Conducting terminal is arranged in order and is integrally formed with the insulating body, wherein there is first, second group of conducting terminal die bond portion to expose
There is the bottom surface of first reflector, the 3rd group of conducting terminal die bond portion to expose the bottom surface of the second reflector；
Three LED wafers, are red-light LED chip, the first blue LED wafers and the second blue LED wafers, the feux rouges respectively
LED wafer and the first blue LED wafers are respectively positioned in the first reflector and are connected to first and second groups of conducting terminals,
Second blue LED wafers are located in the second reflector and are connected to the 3rd group of conducting terminal；
The first fluorescent material glue-line and the second fluorescent material glue-line with different ratio, the first fluorescent material glue-line injecting glue is in
In one reflector, the second fluorescent material glue-line injecting glue is in the second reflector, the red-light LED chip and the first blue LED wafers
A kind of white light of colour temperature is sent through the mixing of the first fluorescent material glue-line, second blue LED wafers pass through the second fluorescent material glue-line
Mixing sends the white light of another colour temperature.
As a kind of preferred scheme, the depth of first reflector is H1, and the depth of second reflector is H2, institute
The height for stating withe is H3, wherein, H1=H2, H3< H1.
It is described along concave station is equipped with the rim of a cup of first reflector and the second reflector as a kind of preferred scheme
Base face of the top surface of first, second fluorescent material glue-line parallel to the concave station.
As a kind of preferred scheme, described first to the 3rd group of conducting terminal is respectively provided with a positive terminal and a negative pole end
Son, each positive and negative electrode terminal is distributed in the opposite sides of insulating body；
Each positive and negative electrode terminal is respectively provided with die bond portion and leg portion；The positive terminal of first, the 3rd group of conducting terminal is consolidated
The length in brilliant portion is more than the length L1 in the die bond portion of its negative terminal>L1 ', L3> L3′；The negative pole of second group of conducting terminal
The length in the die bond portion of terminal is more than the length L2 ' in the die bond portion of its positive terminal>L2, each LED wafer be fixed on each length compared with
In big die bond portion.
As a kind of preferred scheme, the red-light LED chip is fixed on the die bond of the positive terminal of first group of conducting terminal
In portion, the positive and negative electrode terminal of the two ends gold thread of red-light LED chip and first group of conducting terminal is turned on；First blue-ray LED is brilliant
Piece is fixed in the die bond portion of the negative terminal of second group of conducting terminal, the two ends gold thread of the first blue LED wafers and second
The positive and negative electrode terminal conducting of group conducting terminal；The mixed light of the red-light LED chip and the first blue LED wafers concentrates on first
The center of reflector；
Second blue LED wafers are fixed in the die bond portion of the positive terminal of the 3rd group of conducting terminal, the second blue-ray LED
The positive and negative electrode terminal of the two ends gold thread of chip and the 3rd group of conducting terminal is turned on, and the light source of the second blue LED wafers is concentrated on
The center of second reflector.
As a kind of preferred scheme, each Leg portion of every group of conducting terminal does not stretch out insulating body both sides and reflexed
The curved bottom surface for being accommodated in insulating body.
As a kind of preferred scheme, the profile of the insulating body is square, and first, second reflector is long
Square structure, the first reflector Aspect Ratio is W1: W1′=1.7：1, the second reflector Aspect Ratio is W2: W2′=2.7：1.
As a kind of preferred scheme, the insulating body is integral type structure with withe.
The present invention has clear advantage and beneficial effect compared with prior art, specifically, by above-mentioned technical proposal
Understand,
Two reflectors mutually separated, and the installation red-light LED chip in the first reflector are set on insulating body
With the first blue LED wafers, the second blue LED wafers are installed in the second reflector, and inject different in two reflectors
The fluorescent material glue-line of proportioning, the red-light LED chip and the first blue LED wafers send one kind through the mixing of the first fluorescent material glue-line
The indefinite white light of colour temperature, second blue LED wafers mix through the second fluorescent material glue-line and send indefinite white of another colour temperature
Light；Nationality causes two kinds of fluorescent material can be with mutually isolated, so that a kind of fluorescent material will not pollute another by the setting of withe
Fluorescent material, and avoid photochromic cross pollution；Powered again by each LED wafer by independent conducting end subgroup, voltage and
Electric current, which is freely adjusted, does not influence the luminosity of other chips, can to adjust out varied indefinite colour temperature, different aobvious fingers, light intensity
The mixed light of tune, light mixing effect is good.
More clearly to illustrate the architectural feature and effect of the present invention, come below in conjunction with the accompanying drawings with specific embodiment to this hair
It is bright to be described in detail.
Brief description of the drawings
Fig. 1 is the non-sealing of reflector in the assembling schematic perspective view of the first embodiment of the present invention, figure；
Fig. 2 is Fig. 1 bottom views figure；
Fig. 3 is Fig. 1 front view；
Fig. 4 is the non-sealing of reflector in the sectional view of the first embodiment of the present invention, figure；
Fig. 5 be in Fig. 4 A to front view；
Fig. 6 is the schematic diagram after injection fluorescent material glue-line in Fig. 5；
Fig. 7 is the non-sealing of reflector in the assembling schematic perspective view of the second embodiment of the present invention, figure.
Accompanying drawing identifier declaration：
10th, insulating body 11, withe
12nd, the first reflector 13, the second reflector
14th, concave station 21, first group of conducting terminal
22nd, second group of conducting terminal 23, the 3rd group of conducting terminal
211st, 212,221,222,231,232, die bond portion
213rd, 214,223,224,233,234, leg portion
31st, red-light LED chip 32, the first blue LED wafers
33rd, the second blue LED wafers 41, the first fluorescent material glue-line
42nd, the first fluorescent material glue-line.
Embodiment
It refer to shown in Fig. 1 to Fig. 6, that show the concrete structure of the first embodiment of the present invention.The color-adjustable
The LED of warm adjustable aobvious finger includes insulating body 10, three groups of conducting terminals 21,22,23, three and of LED wafer 31,32,33
The fluorescent material glue-line 41,42 of two kinds of different ratios.
Wherein, the insulating body 10 is made of plastic material, sees Fig. 3, and the profile of the insulating body 10 is square.
The top surface of the insulating body 10 is recessed a cup, and the center of the cup is provided with a nontransparent withe 11, by cup one
It is divided into two formation the first reflectors 12 and the second reflector 13.Described two fluorescent material glue-lines refer respectively to the of different ratio
One fluorescent material glue-line 41 and the second fluorescent material glue-line 42, the injecting glue of the first fluorescent material glue-line 41 is in the first reflector 12, and this
The injecting glue of two fluorescent material glue-line 42 is in the second reflector 13.Nationality causes two reflectors 12,13 by the design of withe 11
Two kinds of fluorescent material glue-lines 41,42 are mutually isolated, will not mix, so that a kind of fluorescent material will not be made to another fluorescent material
Into pollution.
In the present embodiment, the withe 11 is integral type structure with insulating body 10, is gone out so as to one-shot forming, nothing
Need assembling.As shown in figure 3, first, second reflector 12,13 is square structure, the Aspect Ratio of the first reflector 12 is W1:
W1′=1.7：1, the Aspect Ratio of the second reflector 13 is W2: W2′=2.7：1.It is more than second by by the volume of the first reflector
The volume of reflector so that the first reflector 12 can accommodate two kinds of different LED wafers, and the second reflector 13 only accommodates one
Plant LED wafer.
In the present embodiment, Fig. 5 is seen, the depth of the first reflector 12 of the insulating body 10 is H1, and described second is reflective
The depth of cup 13 is H2, and the height of the withe 11 is H3, wherein, H1=H2, H3< H1.By withe 11 by two
Individual reflector 12,13 is obstructed so that two kinds of different fluorescent material glue-lines 41,42 are not mixed mutually, so that a kind of fluorescent material will not
Pollute another fluorescent material.The ratio that nationality is set by this height by the withe 11 again is relatively low, and therefore, first and second is anti-
LED wafer in light cup 12,13 can be more easily from the position of the height difference H 4 progress mixed light at the top of withe 11.
In addition, along concave station 14 is equipped with the rim of a cup of the reflector 13 of the first reflector 12 and second, this first, second
Base face of the top surface of fluorescent material glue-line 41,42 parallel to the concave station 14.On the one hand traditional reflector without concave station can be avoided,
After injection fluorescent material glue-line, the week of colloid causes the surface irregularity of fluorescent material glue-line along climbing, and influences light-out effect；Separately
On the one hand, the concave station 14 may insure after shaping blanking that the rim of a cup of reflector 12,13 will not be unedged；The third aspect, concave station 14
Also so that reflector 12, the area of 13 rims of a cup increase, so that the light mixing effect of two reflectors is more preferable.
Three groups of conducting terminals are first group of conducting terminal 21, second group of conducting terminal 22, the 3rd group of conducting end respectively
Son 23.Each group conducting terminal is arranged in order and is integrally formed with the insulating body 10.Described first to the 3rd group of conducting terminal 21,
22nd, 23 a positive terminal and a negative terminal are respectively provided with, each positive and negative electrode terminal is distributed in the opposite sides of insulating body 10；Respectively
Positive and negative electrode terminal be respectively provided with die bond portion 211,212,221,222,231,232 and leg portion 213,214,223,224,233,
234；Each Leg portion of every group of conducting terminal does not stretch out the both sides of insulating body 10 and the curved insulating body 10 that is accommodated in of reflexed
Bottom surface.
Wherein first, second group conducting terminal 21,22 has die bond portion 211,212；221st, 222 expose the first reflector 12
Bottom surface, there is die bond portion 231,232 to expose the bottom surface of the second reflector 13 the 3rd group of conducting terminal 23,24.
It is brilliant that three LED wafers include red-light LED chip 31, the first blue LED wafers 32, the second blue-ray LED respectively
Piece 33.The red-light LED chip 31 is fixed on the die bond portion 211 of first group of conducting terminal 21, and first blue LED wafers 32 are fixed
In the die bond portion 222 of second group of conducting terminal 22, second blue LED wafers 33 are fixed on the die bond of the 3rd group of conducting terminal 23
Portion 231.
In addition, the length in the die bond portion 211,231 of the positive terminal of first, the 3rd group of conducting terminal 21,23 is more than it
The length L1 in the die bond portion 212,232 of negative terminal>L1 ', L3> L3′；The negative terminal of second group of conducting terminal 22
The length in die bond portion 222 is more than the length L2 ' in the die bond portion 221 of its positive terminal> L2 .Each LED wafer 31,32,33 is consolidated
Due to that in the larger die bond portion 211,222,231 of length, on the one hand there can be larger area to fix LED wafer, on the other hand make
Obtain each LED wafer arrangement uniform, obtain more preferable light mixing effect.
Specifically, the red-light LED chip 31 is fixed on the die bond portion 211 of the positive terminal of first group of conducting terminal 21
On, the positive and negative electrode terminal of the two ends gold thread of red-light LED chip 31 and first group of conducting terminal 21 is turned on.First blue-ray LED
Chip 32 is fixed in the die bond portion 222 of the negative terminal of second group of conducting terminal 22, and the two ends of the first blue LED wafers 32 are used
The positive and negative electrode terminal of gold thread and second group of conducting terminal 22 is turned on.Second blue LED wafers 33 are fixed on the 3rd group of conducting end
In the die bond portion 231 of the positive terminal of son 23, the two ends gold thread of the second blue LED wafers 33 and the 3rd group of conducting terminal 23
Positive and negative electrode terminal is turned on.So as to which position of the blue LED wafers 32 of red-light LED chip 31 and first in the first reflector 12 has
It is slightly mispositioned, but can guarantee that the mixed light after the two combination concentrates on the center of the first reflector 12.Likewise, second blue light
LED wafer 33 also concentrates on the center of the second reflector 13.
By three LED wafers 31,32,33 provided by four groups of separate conducting end subgroups 21,22,23 respectively
Power supply, therefore the electric current and voltage of every group of conducting terminal 21,22,23 can be according to each self-adjusting be needed, to strengthen or weaken light
By force, without influenceing the luminous intensity of other LED wafers, modulability is very strong.Coordinate different color LED wafer 31,32,33 with
And the fluorescent material glue-line 41,42 of different ratio, can adjust out varied different-colour, it is different aobvious refer to, different light extraction efficiencies,
Different luminous fluxes, the mixed light in not homochromy area, user can freely adjust the most suitable according to different environment, mood
Tone, implements very simple.
As shown in fig. 7, which show the concrete structure of the second embodiment of the present invention.This second embodiment is implemented with first
Example is essentially identical, and difference is the concave station 14 for eliminating insulating body 10, due to other each parts of the second embodiment
Structure it is identical with usage and first embodiment, will not be repeated here.
In summary, design focal point of the invention is, two reflectors mutually separated are set on insulating body 10,
And red-light LED chip 31 and the first blue LED wafers 32 are installed in the first reflector 12, the is installed in the second reflector 13
Two blue LED wafers, and the fluorescent material glue-line 41,42 of different ratio is injected in two reflectors 12,13, the red-light LED is brilliant
The blue LED wafers 32 of piece 31 and first send a kind of indefinite white light of colour temperature through the mixing of the first fluorescent material glue-line 41, and this second
Blue LED wafers 33 send the indefinite white light of another colour temperature through the mixing of the second fluorescent material glue-line 42；Nationality is by withe 11
Setting cause two kinds of fluorescent material 41,42 photochromic with mutually isolated, so that a kind of fluorescent material will not pollute another fluorescent material
Will not cross pollution, then powered by each LED wafer 31,32,33 by independent conducting end subgroup 21,22,23, voltage and
Electric current, which is freely adjusted, does not influence the luminosity of other chips, can to adjust out varied indefinite colour temperature, different aobvious fingers, light intensity
The mixed light of tune, light mixing effect is good.
The above described is only a preferred embodiment of the present invention, be not intended to limit the scope of the present invention,
Therefore any subtle modifications, equivalent variations and modifications that every technical spirit according to the present invention is made to above example, still
Belong in the range of technical solution of the present invention.
Claims (7)
1. a kind of adjustable color temperature, the aobvious LED referred to, it is characterised in that：Including
One insulating body, the top surface of the insulating body is recessed a cup, and the center of the cup is provided with a nontransparent withe,
The first reflector and the second reflector are formed so that cup to be divided into two, the volume of first reflector is more than the second reflector
Volume；
Three groups of conducting terminals, are first group of conducting terminal, second group of conducting terminal, the 3rd group of conducting terminal respectively, and each group is conductive
Terminal is arranged in order and is integrally formed with the insulating body, wherein there is first, second group of conducting terminal die bond portion to expose first
There is the bottom surface of reflector, the 3rd group of conducting terminal die bond portion to expose the bottom surface of the second reflector；
Three LED wafers, are red-light LED chip, the first blue LED wafers and the second blue LED wafers, the red-light LED respectively
Chip and the first blue LED wafers are respectively positioned in the first reflector and are connected to first and second groups of conducting terminals, and this
Two blue LED wafers are located in the second reflector and are connected to the 3rd group of conducting terminal；
The first fluorescent material glue-line and the second fluorescent material glue-line with different ratio, the first fluorescent material glue-line injecting glue are anti-in first
In light cup, the second fluorescent material glue-line injecting glue is in the second reflector, and the red-light LED chip and the first blue LED wafers are passed through
The mixing of first fluorescent material glue-line sends a kind of white light of colour temperature, and second blue LED wafers are mixed through the second fluorescent material glue-line
Send the white light of another colour temperature；
Described first to the 3rd group of conducting terminal is respectively provided with a positive terminal and a negative terminal, and each positive and negative electrode terminal is distributed in
The opposite sides of insulating body；
Each positive and negative electrode terminal is respectively provided with die bond portion and leg portion；The die bond portion of the positive terminal of first, the 3rd group of conducting terminal
Length be more than its negative terminal die bond portion length L1>L1 ', L3> L3′；The negative terminal of second group of conducting terminal
Die bond portion length be more than its positive terminal die bond portion length L2 '>L2, it is larger that each LED wafer is fixed on each length
In die bond portion.
2. a kind of adjustable color temperature according to claim 1, the aobvious LED referred to, it is characterised in that：First reflector
Depth is H1, and the depth of second reflector is H2, and the height of the withe is H3, wherein, H1=H2, H3< H1.
3. a kind of adjustable color temperature according to claim 1, the aobvious LED referred to, it is characterised in that：First reflector and
Along being equipped with concave station in the rim of a cup of second reflector, the bottom of the top surface of the first, second fluorescent material glue-line parallel to the concave station
Side face.
4. a kind of adjustable color temperature according to claim 1, the aobvious LED referred to, it is characterised in that：
The red-light LED chip is fixed in the die bond portion of the positive terminal of first group of conducting terminal, the two ends of red-light LED chip
Turned on the positive and negative electrode terminal of gold thread and first group of conducting terminal；First blue LED wafers are fixed on second group of conducting terminal
Negative terminal die bond portion on, the positive and negative electrode terminal of the two ends gold thread of the first blue LED wafers and second group of conducting terminal
Conducting；The mixed light of the red-light LED chip and the first blue LED wafers concentrates on the center of the first reflector；
Second blue LED wafers are fixed in the die bond portion of the positive terminal of the 3rd group of conducting terminal, the second blue LED wafers
Two ends gold thread and the positive and negative electrode terminal of the 3rd group of conducting terminal turn on, the light source of the second blue LED wafers concentrates on second
The center of reflector.
5. a kind of adjustable color temperature according to claim 1, the aobvious LED referred to, it is characterised in that：Every group of conducting terminal it is each
Individual Leg portion does not stretch out insulating body both sides and the curved bottom surface for being accommodated in insulating body of reflexed.
6. a kind of adjustable color temperature according to claim 1, the aobvious LED referred to, it is characterised in that：Outside the insulating body
Shape is square, and first, second reflector is rectangle structure, and the first reflector Aspect Ratio is W1: W1′=1.7：
1, the second reflector Aspect Ratio is W2: W2′=2.7：1.
7. a kind of adjustable color temperature according to claim 1, the aobvious LED referred to, it is characterised in that：The insulating body with
Withe is integral type structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410399363.7A CN104183583B (en) | 2014-08-14 | 2014-08-14 | A kind of adjustable color temperature, the aobvious LED referred to |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410399363.7A CN104183583B (en) | 2014-08-14 | 2014-08-14 | A kind of adjustable color temperature, the aobvious LED referred to |
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| Publication Number | Publication Date |
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| CN104183583A CN104183583A (en) | 2014-12-03 |
| CN104183583B true CN104183583B (en) | 2017-08-11 |
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| CN105489738B (en) * | 2016-02-16 | 2018-11-30 | 惠州雷曼光电科技有限公司 | Colour temperature is aobvious to refer to adjustable white light LED part, preparation method and regulation method |
| CN106252337B (en) * | 2016-08-10 | 2019-05-17 | 华南师范大学 | A kind of LED integrated optical source of colour rendering index and adjustable color |
| CN106328642A (en) * | 2016-10-18 | 2017-01-11 | 深圳成光兴光电技术股份有限公司 | Chip LED for mixed light source |
| CN115273681B (en) * | 2022-07-05 | 2023-12-12 | 深圳市森鹏兴科技有限公司 | RGB lamp bead structure of patch type LED virtual display screen |
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| CN204102896U (en) * | 2014-08-14 | 2015-01-14 | 东莞市欧思科光电科技有限公司 | A kind of adjustable color temperature, the aobvious LED referred to |
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| TWI476961B (en) * | 2010-10-12 | 2015-03-11 | 友達光電股份有限公司 | Led apparatus |
| CN102903803B (en) * | 2011-07-29 | 2015-03-25 | 展晶科技(深圳)有限公司 | Forming method of light-emitting diode packaging structure and forming method of light-emitting diode packaging structure pedestal |
| CN203607407U (en) * | 2013-11-08 | 2014-05-21 | 北京宇极科技发展有限公司 | White light LED structure with adjustable color temperature |
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| CN204102896U (en) * | 2014-08-14 | 2015-01-14 | 东莞市欧思科光电科技有限公司 | A kind of adjustable color temperature, the aobvious LED referred to |
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