CN205159358U - LED packaging structure - Google Patents
LED packaging structure Download PDFInfo
- Publication number
- CN205159358U CN205159358U CN201520959027.3U CN201520959027U CN205159358U CN 205159358 U CN205159358 U CN 205159358U CN 201520959027 U CN201520959027 U CN 201520959027U CN 205159358 U CN205159358 U CN 205159358U
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- China
- Prior art keywords
- led
- support
- injecting glue
- cup
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title abstract description 7
- 239000003292 glue Substances 0.000 claims abstract description 30
- 238000005538 encapsulation Methods 0.000 claims abstract description 18
- 239000011521 glass Substances 0.000 claims abstract description 9
- 241000218202 Coptis Species 0.000 claims abstract description 8
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 22
- 239000005357 flat glass Substances 0.000 claims description 15
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 8
- 239000000843 powder Substances 0.000 abstract description 7
- 239000012141 concentrate Substances 0.000 abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000000741 silica gel Substances 0.000 abstract description 2
- 229910002027 silica gel Inorganic materials 0.000 abstract description 2
- 238000009434 installation Methods 0.000 abstract 1
- 238000012856 packing Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 239000000084 colloidal system Substances 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000004643 material aging Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a LED packaging structure, this LED packaging structure include the support, and the support is the square, support bowl cup center department is provided with the LED chip, and the electrode of LED chip passes through the gold thread with the positive negative pole of support to be connected, is provided with the step on the bowl wall of cup of support, respectively is provided with an injecting glue hole on four angles of this step, and every injecting glue hole feeds through bowl bottom of cup portion, installation glass piece on the step, the coating of the one side of glass piece has phosphor powder, and the glass piece scribbles the ventricumbent of phosphor powder. The utility model discloses the yellow circle problem of LED white light is not only solved to LED packaging structure and encapsulation method, also solves the problem of LED white light brightness decay simultaneously, will encapsulate in silica gel injects support bowl cup into through the injecting glue hole, and convenient operation, phosphor powder can not concentrate on near LED chip or support bowl bottom of cup portion, consequently, have avoided the LED chip to be heated for a long time and brightness decay can appear, have improved the LED life -span from on the other hand.
Description
Technical field
The utility model relates to LED technology field, relates to a kind of LED encapsulation structure specifically.
Background technology
Light-emitting diode (LED) is a kind of semiconductor light sources, and LED has lot of advantages compared with other light source such as incandescent lamp, and LED has longer life-span, preferably stability, faster switching characteristic and lower energy consumption usually.Along with LED to go deep into the life of people day by day as light source of new generation, its application is also more and more extensive.In synthesize white light, the most frequently used mode places material for transformation of wave length in the LED wafer of blue light-emitting, such as yellow fluorescent powder, material for transformation of wave length layer in LED wafer can absorb the photon that some LED send, and they are changed the light that (down-convert) is visible wavelength downwards, thus produce the double-colored light source with blue and yellow wavelengths light.If the gold-tinted produced and blue light have correct ratio, so human eye can experience white light.
In the prior art, the packaging technology of LED generally comprises the steps such as die bond, bonding wire, gluing, baking, wherein fluorescent material is blended in silica gel by glue application step usually according to a certain percentage, with crossing spot gluing equipment, the mixture of fluorescent material and glue is coated in LED wafer, but, the problem of fluorescent material sedimentation is easily there is in Large stone fluorescent material in a glue process, make the skewness of fluorescent material in colloid, causing the white light LEDs encapsulated out to occur misalignment thus, is exactly usually said Huang circle phenomenon.In other technical scheme, gluing also can by the very uniform phosphor powder layer of guarantor's type paint-on technique LED wafer surface-coated, but, because the luminous intensity of blue LED wafers itself has the feature of non-equivalence for the coating of guarantor's type in the distribution in space, the blue light that intensity level is larger is short by the distance of fringe region phosphor powder layer by the distance ratio of central area phosphor powder layer, cause that central area color temperature value is high thus and fringe region color temperature value is low, there will be the problem of misalignment equally.And phosphor substance major part concentrates on bottom rack groove and LED chip annex, being heated for a long time there will be brightness decay, affects the LED life-span.
As shown in Figure 1, Conventional white LED is arranged in the bowl cup of the first support 12 by the first LED chip 11, be connected with support pin realizing circuit by the first gold thread 13, then packing colloid 14 on chip surface covers, packing colloid, generally by exciting yellow wavelengths fluorescent material and packaging plastic to mix, adding sometimes and exciting orange red or green wavelength fluorescent material.After fluorescent material absorption portion blue light, discharge the gold-tinted that wavelength is longer, then unabsorbed blue light becomes white light with yellow light mix.In prior art, white light LEDs mixed light is even not, and brightness is also lower, and phosphor substance major part concentrates on bottom rack groove and LED chip annex, is heated for a long time and there will be brightness decay, affect the LED life-span.
Utility model content
For deficiency of the prior art, the technical problems to be solved in the utility model there are provided a kind of LED encapsulation structure, and the utility model LED encapsulation structure can solve the yellow circle problem of LED white light, with the problem solving the decay of LED white brightness.
For solving the problems of the technologies described above, the utility model is realized by following scheme: a kind of LED encapsulation structure, this LED encapsulation structure comprises support, support is square, described support bowl cup center is provided with LED chip, the electrode of LED chip is connected by gold thread with the both positive and negative polarity of support, the cup and bowl wall of support is provided with step, four angles of this step are respectively provided with a hole for injecting glue, each hole for injecting glue is communicated to bottom bowl cup, mounting glass sheet on step, the one side of described sheet glass is coated with fluorescent material, and sheet glass scribbles one of fluorescent material and faces down.
Further, described hole for injecting glue top, the hole for injecting glue diameter namely on step plane is greater than the hole for injecting glue diameter under step plane, and the hole for injecting glue on top is provided with breach, and this breach is communicated with step.
Further, described step is square step, and it is highly greater than the thickness of sheet glass.
Relative to prior art, the beneficial effects of the utility model are: the utility model LED encapsulation structure and method for packing not only solve the yellow circle problem of LED white light, also solve the problem of LED white brightness decay simultaneously, by hole for injecting glue, packaging silicon rubber is injected in support bowl cup, easy to operate, on the first coated glass sheet of fluorescent material, after installing sheet glass, carry out injecting glue again, fluorescent material would not concentrate near LED chip or bottom support bowl cup, therefore, avoid LED chip and be heated for a long time and there will be brightness decay, improve the LED life-span from another point of view.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is LED encapsulation structure schematic diagram in prior art.
Fig. 2 is the utility model supporting structure schematic diagram.
Fig. 3 is the utility model supporting structure cutaway view.
Fig. 4 is the utility model LED step 1 schematic diagram.
Fig. 5 is the utility model LED step 2, step 3 schematic diagram.
Fig. 6 is that the utility model LED step 4 illustrates that I schemes.
Fig. 7 is that the utility model LED step 4 illustrates II figure.
Fig. 8 is the utility model LED step 5 schematic diagram.
Mark in accompanying drawing: the first LED chip 11, first support 12, first gold thread 13, packing colloid 14, support 1-1, step 1-2, hole for injecting glue 1-3, gold thread 2-2, LED chip 2-3, sheet glass 2-4.
Embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described in detail, to make advantage of the present utility model and feature can be easier to be readily appreciated by one skilled in the art, thus more explicit defining is made to protection range of the present utility model.
Please refer to accompanying drawing 2 ~ 3, a kind of LED encapsulation structure of the present utility model, this LED encapsulation structure comprises support 1-1, support 1-1 is square, described support 1-1 bowl cup center is provided with LED chip 2-3, the electrode of LED chip 2-3 is connected by gold thread 2-2 with the both positive and negative polarity of support 1-1, the cup and bowl wall of support 1-1 is provided with step 1-2, four angles of this step 1-2 are respectively provided with a hole for injecting glue 1-3, each hole for injecting glue 1-3 is communicated to bottom bowl cup, mounting glass sheet 2-4 on step 1-2, the one side of described sheet glass 2-4 is coated with fluorescent material, sheet glass 2-4 scribbles one of fluorescent material and faces down.Described hole for injecting glue 1-3 top, the hole for injecting glue diameter namely on step 1-2 plane is greater than the hole for injecting glue diameter under step 1-2 plane, and the hole for injecting glue on top is provided with breach, and this breach is communicated with step 1-2.Stating step 1-2 is square step, and it is highly greater than the thickness of sheet glass 2-4, and this thickness is at least wanted can placing glass sheet 2-4.
The method for packing of LED encapsulation structure of the present utility model, this method for packing comprises the following steps:
Step 1, as shown in Figure 4, bottom the bowl cup of support 1-1, carry out die bond bonding wire, be arranged on support bowl cup bottom centre position by LED chip 2-3, then the electrode of LED chip 2-3 is connected by gold thread 2-2 with the both positive and negative polarity of support;
Step 2, as shown in Figure 5, the one side of sheet glass 2-4 coats fluorescent material;
Step 3, as shown in Figure 5, sheet glass 2-4 is arranged on the step 2-3 place on support 1-1 bowl cup, has one of fluorescent material to face down;
Step 4, as shown in Figure 6,7, notes silicone fluid by hole for injecting glue 1-3, the cavity of support 1-1 bowl cup inside is filled full;
Step 5, as shown in Figure 8, flanging is carried out to support 1-1 the rim of a bowl edge, sheet glass 2-4 is fixed;
Step 6, until silicone fluid solidification after, complete encapsulation.
The utility model LED encapsulation structure and method for packing not only solve the yellow circle problem of LED white light, also solve the problem of LED white brightness decay simultaneously, by hole for injecting glue, packaging silicon rubber is injected in support bowl cup, easy to operate, on the first coated glass sheet of fluorescent material, after installing sheet glass, carry out injecting glue again, fluorescent material would not concentrate near LED chip or bottom support bowl cup, therefore, avoid LED chip to be heated for a long time and to there will be brightness decay, improve the LED life-span from another point of view.
The foregoing is only preferred implementation of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model specification and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present utility model.
Claims (3)
1. a LED encapsulation structure, this LED encapsulation structure comprises support (1-1), support (1-1) is square, described support (1-1) bowl cup center is provided with LED chip (2-3), the electrode of LED chip (2-3) is connected by gold thread (2-2) with the both positive and negative polarity of support (1-1), it is characterized in that: on the cup and bowl wall of support (1-1), be provided with step (1-2), four angles of this step (1-2) are respectively provided with a hole for injecting glue (1-3), each hole for injecting glue (1-3) is communicated to bottom bowl cup, at the upper mounting glass sheet (2-4) of step (1-2), the one side of described sheet glass (2-4) is coated with fluorescent material, sheet glass (2-4) scribbles one of fluorescent material and faces down.
2. a kind of LED encapsulation structure according to claim 1, it is characterized in that: described hole for injecting glue (1-3) top, namely the hole for injecting glue diameter on step (1-2) plane is greater than the hole for injecting glue diameter under step (1-2) plane, the hole for injecting glue on top is provided with breach, and this breach is communicated with step (1-2).
3. a kind of LED encapsulation structure according to claim 1, is characterized in that: described step (1-2) is square step, and it is highly greater than the thickness of sheet glass (2-4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520959027.3U CN205159358U (en) | 2015-11-27 | 2015-11-27 | LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520959027.3U CN205159358U (en) | 2015-11-27 | 2015-11-27 | LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205159358U true CN205159358U (en) | 2016-04-13 |
Family
ID=55695019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520959027.3U Active CN205159358U (en) | 2015-11-27 | 2015-11-27 | LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205159358U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105336835A (en) * | 2015-11-27 | 2016-02-17 | 宏齐光电子(深圳)有限公司 | LED packaging structure and packaging method thereof |
-
2015
- 2015-11-27 CN CN201520959027.3U patent/CN205159358U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105336835A (en) * | 2015-11-27 | 2016-02-17 | 宏齐光电子(深圳)有限公司 | LED packaging structure and packaging method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |