CN104178048A - Ultrathin heat-conducting adhesive tape - Google Patents
Ultrathin heat-conducting adhesive tape Download PDFInfo
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- CN104178048A CN104178048A CN201410440357.1A CN201410440357A CN104178048A CN 104178048 A CN104178048 A CN 104178048A CN 201410440357 A CN201410440357 A CN 201410440357A CN 104178048 A CN104178048 A CN 104178048A
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- adhesive tape
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Abstract
The invention provides an ultrathin heat-conducting adhesive tape. The adhesive tape is a single-sided adhesive tape or a double-sided adhesive tape with or without a base material; when the adhesive tape is an adhesive tape without the base material, the adhesive tape is composed of heat-conducting glue with the thickness of 0.5-2mu m; and when the adhesive tape is an adhesive tape with the base material, the adhesive tape is composed of a base material with the thickness of 1-5mu m and single-sided or double-sided heat-conducting glue with the total thickness of 0.5-2mu m, and the heat-conducting glue is prepared by adding nano ceramic heat-conducting filler, nano metal heat-conducting filler and carbon nano tubes or graphene into a high polymer. According to the ultrathin heat-conducting adhesive tape provided by the invention, with the adoption of the heat-conducting glue, the adhesive tape which is thinned to the thickness of 0.5mu m and has a heat-conducting coefficient of over 20W/(m.k) can be manufactured, and the adhesive tape with the thickness of 0.5mu m can have higher mechanical strength compared with an existing heat-conducting adhesive tape and has better mechanical property.
Description
Technical field
The present invention relates to a kind of ultrathin heat conduction adhesive tape with heat conduction function for radiating element, described heat conduction adhesive tape can be double sticky tape or one side adhesive tape.
Background technology
The heat radiation of the electronicss such as current mobile phone mainly adopts the mode of pasting radiating element on the components and parts of needs heat radiation, these radiating elements are generally the flaky radiator part of the fin material such as graphite, copper carbon body or other type, for meeting the fashion trend needs of ultrathin electronics.
Although these radiating elements of today are rather considerable on heat conductivility, but these radiating elements still need to be connected with the components and parts that needs dispel the heat by modes such as bonding glue or adhesive tapes (double sticky tape or one side adhesive tape), therefore the heat conductivility of existing bonding glue or adhesive tape becomes the bottleneck of heat dispersion raising gradually.
Popular along with electronics ultrathin trend, employing is smeared the mode of the glue that possesses heat conduction function and is pasted radiating element, exists glue to smear inhomogeneous, is difficult to standardized defect, and because electronic equipment internal space is more and more narrower and small, in reality, be difficult to so operate.On the other hand, adopt heat conduction adhesive tape sticking radiating element to can be good at solving the defect of glue, but existing heat conduction adhesive tape or thermal conductivity is little is difficult to meet the needs of heat radiation; Be exactly to be difficult to do very thinly, mainly due in order to improve adhesive tape thermal conductivity, need to add mass filler, and heat conduction adhesive tape does thin words and can cause intensity very low by mass filler, cause operational difficulty and cohesive force very poor, radiating element firmly cannot be bonded to need heat radiation components and parts on, once and heat conduction adhesive tape is done thick, heat conduction adhesive tape can sharply reduce again at the thermal conductivity of thickness direction, and is also difficult to meet the needs of electronics ultrathin.
The another kind of usage of heat-conducting glue is sprayed directly on the components and parts that need heat radiation, but it exists coating thickness too large equally, the shortcoming that thermal conductivity is little.Because it is conventionally rarer to can be used for the heat-conducting glue of spraying, heat conductive filler content is wherein relatively low, causes it to improve thermal conductivity by the mode that increases coating thickness; Or improve thermal conductivity by add various fillers in heat conduction adhesive tape, more improve thus viscosity, it is powdered that consequently filler makes glue mixture too much, the viscosity of glue mixture is lost, have no idea ultra-thin for doing, thermal conductivity is higher, mechanical property good heat conduction adhesive tape again.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of ultrathin heat conduction adhesive tape, to reduce or to avoid problem noted earlier.
For solving the problems of the technologies described above, a kind of ultrathin heat conduction adhesive tape, described adhesive tape is to have base material or one side adhesive tape or double sticky tape without base material; In the time that described adhesive tape is the adhesive tape without base material, the heat-conducting glue that described adhesive tape is 0.5-2 μ m by thickness forms; When described adhesive tape is while having the adhesive tape of base material, described adhesive tape is that 1-5 μ m base material and single or double total thickness are that the heat-conducting glue of 0.5-2 μ m forms by thickness, and described heat-conducting glue is made by adding nano ceramics heat conductive filler, nano metal heat conductive filler and carbon nanotube or Graphene in high molecular polymer.
Preferably, described heat-conducting glue is made up of the raw material of following weight part: high molecular polymer, 35-45 weight part; Nano ceramics heat conductive filler, 5-10 weight part; Nano metal heat conductive filler, 5-10 weight part; Carbon nanotube or Graphene 20-30 weight part.
Preferably, described nano ceramics heat conductive filler is one of nano zircite, nano aluminium oxide, Nano diamond, nm-class boron nitride or its mixture.
Preferably, described nano metal is one of nano-metal particle, nano metal sheet, nano metal line or its mixture.
Preferably, described nano metal is one of nanometer gold and silver, copper, aluminum metal or its mixture.
Preferably, described high molecular polymer is one of polyethylene, poly-the third ethene, epoxy resin, polyethylene terephthalate, polyvinyl chloride or its mixture.
Preferably, described base material is PET sheet material or non-woven fabrics, can be also the metal sheet of copper or other material.
Ultrathin heat conduction adhesive tape of the present invention is owing to having adopted above-mentioned heat-conducting glue, it can be made and be as thin as the thickness of 0.5 μ m and have the above thermal conductivity of 20 W/ (mk), and the heat conduction adhesive tape under this thickness can possess the larger mechanical strength of relatively existing heat conduction adhesive tape, possesses better mechanical property.
Embodiment
Just as described in the background section, existing heat-conducting glue is pasted radiating element by the mode of smearing and is had certain defect, and in addition, the another kind of usage of heat-conducting glue is sprayed directly on the components and parts that need heat radiation, but it exists coating thickness too large equally, the shortcoming that thermal conductivity is little.Because it is conventionally rarer to can be used for the heat-conducting glue of spraying, heat conductive filler content is wherein relatively low, causes it to improve thermal conductivity by the mode that increases coating thickness.
Therefore, the invention provides a kind of heat-conducting glue that can be used for making ultrathin heat conduction adhesive tape, in order to the above-mentioned defect of customer service prior art.Specifically, the present invention proposes a kind of ultrathin heat conduction adhesive tape, it can be a kind of adhesive tape with base material, or can be also a kind of adhesive tape without base material.Above-mentioned have base material or can be that (two sides of adhesive tape all possesses viscosity to double sticky tape without the adhesive tape of base material, without all toughness of adhesive tape two sides of base material, belong to double sticky tape), also can be that (adhesive tape only has one side to possess viscosity to one side adhesive tape, the adhesive tape that has base material can be one side adhesive tape, can be also double sticky tape).
In the time that described adhesive tape is the adhesive tape without base material, its heat-conducting glue that can be only 0.5-2 μ m by thickness forms.When described adhesive tape is while having the adhesive tape of base material, it can be that 1-5 μ m base material and single or double total thickness are that the heat-conducting glue of 0.5-2 μ m forms by thickness.Wherein, described base material can be PET sheet material or non-woven fabrics, can be also the metal sheet of copper or other material.
Inventive point of the present invention is to provide a kind of heat-conducting glue of property, it can be made and be as thin as the thickness of 0.5 μ m and have the above thermal conductivity of 20 W/ (mk), and the heat conduction adhesive tape under this thickness can possess the larger mechanical strength of relatively existing heat conduction adhesive tape, possesses better mechanical property.
Specifically, the heat-conducting glue that heat conduction adhesive tape of the present invention adopts is made by adding nano ceramics heat conductive filler, nano metal heat conductive filler and carbon nanotube or Graphene in high molecular polymer.In a preferred embodiment, described heat-conducting glue is made up of the raw material of following weight part: high molecular polymer, 35-45 weight part; Nano ceramics heat conductive filler, 5-10 weight part; Nano metal heat conductive filler, 5-10 weight part; Carbon nanotube or Graphene 20-30 weight part.
In existing heat-conducting glue, conventionally there is the case of adding carbon nanotube or Graphene in high molecular polymer, but carbon nanotube or Graphene cost are higher, and there is a very large problem to be, the carbon nanotube that can add in high molecular polymer or the amount of Graphene have its limit, that is to say, when carbon nanotube or Graphene addition are when excessive, the mixture of high molecular polymer and carbon nanotube or Graphene can become a kind of floury structure, thereby its viscosity is reduced, cannot be applied to heat conduction adhesive tape of the present invention.In addition, in prior art, also there is the case of adding ceramic filler or metallic stuffing in high molecular polymer, but can there is equally the limited problem of filler addition, thereby heat conduction composition is inadequate in the heat-conducting glue that causes making thus, thereby exist because the thermal conductivity of heat-conducting glue is compared with low and cannot obtain the problem of the very high very thin heat conduction adhesive tape of thermal conductivity.
The present inventor finds through research, heat-conducting glue composition in existing heat-conducting glue can be used in combination, in high molecular polymer, add nano ceramics heat conductive filler, nano metal heat conductive filler and carbon nanotube or Graphene and make Novel heat-conducting glue, the heat-conducting glue being obtained by the raw material of above-mentioned weight part can beat allly hold more substantial heat conduction composition filler, and can foregoing such its viscosity that reduces.On the other hand, the heat-conducting glue being obtained by the raw material of above-mentioned weight part can also have thermal conductivitys more than 20 W/ (mk) under the thickness that is as thin as 0.5 μ m, and the heat conduction adhesive tape under this thickness can possess the larger mechanical strength of relatively existing heat conduction adhesive tape, possess better mechanical property, this is also one of beat all technique effect of the present invention.Above-mentioned technique effect is applied to heat conduction adhesive tape of the present invention, is that those skilled in the art cannot be obtained in the situation of any technology enlightenment and be obtained by prior art, thereby causes ultrathin heat conduction adhesive tape of the present invention to possess the creativeness that surmounts prior art.
In addition, in preferred embodiment as described below, described nano ceramics heat conductive filler can be one of nano zircite, nano aluminium oxide, Nano diamond, nm-class boron nitride or its mixture.Described nano metal can be one of nano-metal particle, nano metal sheet, nano metal line or its mixture.Preferably, described nano metal can be one of nanometer gold, silver, copper, aluminum metal or its mixture.Described high molecular polymer can be one of polyethylene, poly-the third ethene, epoxy resin, polyethylene terephthalate, polyvinyl chloride or its mixture.
In sum, ultrathin heat conduction adhesive tape of the present invention is owing to having adopted above-mentioned heat-conducting glue, it can be made and be as thin as the thickness of 0.5 μ m and have the above thermal conductivity of 20 W/ (mk), and the heat conduction adhesive tape under this thickness can possess the larger mechanical strength of relatively existing heat conduction adhesive tape, possesses better mechanical property.
Although it will be appreciated by those skilled in the art that the present invention is described according to the mode of multiple embodiment, be not that each embodiment only comprises an independently technical scheme.For the purpose of in specification sheets, so narration is only used to know; those skilled in the art should make specification sheets as a wholely to be understood, and regard technical scheme related in each embodiment as the mode that can mutually be combined into different embodiment understand protection scope of the present invention.
The foregoing is only the schematic embodiment of the present invention, not in order to limit scope of the present invention.Any those skilled in the art, not departing from equivalent variations, amendment and the combination done under the prerequisite of design of the present invention and principle, all should belong to the scope of protection of the invention.
Claims (7)
1. a ultrathin heat conduction adhesive tape, described adhesive tape is to have base material or one side adhesive tape or double sticky tape without base material; In the time that described adhesive tape is the adhesive tape without base material, the heat-conducting glue that described adhesive tape is 0.5-2 μ m by thickness forms; When described adhesive tape is while having the adhesive tape of base material, described adhesive tape is that 1-5 μ m base material and single or double total thickness are that the heat-conducting glue of 0.5-2 μ m forms by thickness, it is characterized in that, described heat-conducting glue is made by adding nano ceramics heat conductive filler, nano metal heat conductive filler and carbon nanotube or Graphene in high molecular polymer.
2. ultrathin heat conduction adhesive tape as claimed in claim 1, is characterized in that, described heat-conducting glue is made up of the raw material of following weight part: high molecular polymer, 35-45 weight part; Nano ceramics heat conductive filler, 5-10 weight part; Nano metal heat conductive filler, 5-10 weight part; Carbon nanotube or Graphene 20-30 weight part.
3. ultrathin heat conduction adhesive tape as claimed in claim 1 or 2, is characterized in that, described nano ceramics heat conductive filler is one of nano zircite, nano aluminium oxide, Nano diamond, nm-class boron nitride or its mixture.
4. ultrathin heat conduction adhesive tape as claimed in claim 1 or 2, is characterized in that, described nano metal is one of nano-metal particle, nano metal sheet, nano metal line or its mixture.
5. ultrathin heat conduction adhesive tape as claimed in claim 4, is characterized in that, described nano metal is one of nanometer gold and silver, copper, aluminum metal or its mixture.
6. the ultrathin heat conduction adhesive tape as described in one of claim 1-5, is characterized in that, described high molecular polymer is one of polyethylene, poly-the third ethene, epoxy resin, polyethylene terephthalate, polyvinyl chloride or its mixture.
7. ultrathin heat conduction adhesive tape as claimed in claim 1 or 2, is characterized in that, described base material is PET sheet material or non-woven fabrics, can be also the metal sheet of copper or other material.
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| CN201410440357.1A CN104178048B (en) | 2014-09-01 | 2014-09-01 | A kind of ultrathin heat conduction adhesive tape |
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| CN201410440357.1A CN104178048B (en) | 2014-09-01 | 2014-09-01 | A kind of ultrathin heat conduction adhesive tape |
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| CN104178048B CN104178048B (en) | 2015-11-18 |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104804673A (en) * | 2015-05-08 | 2015-07-29 | 南通天燕纺织器材有限公司 | Novel high-strength textile leather collar |
| CN105907349A (en) * | 2016-06-08 | 2016-08-31 | 蚌埠高华电子股份有限公司 | Nanometer zirconium oxide modified composite epoxy pouring sealant for LED display screen |
| CN106634763A (en) * | 2016-12-06 | 2017-05-10 | 苏州洛特兰新材料科技有限公司 | High-heat-conductivity electric-insulation adhesive material and preparation method thereof |
| CN107325742A (en) * | 2017-06-30 | 2017-11-07 | 闫晓琦 | A kind of heat-conducting glue band containing conducting high polymers thing |
| CN107446525A (en) * | 2017-08-01 | 2017-12-08 | 昆山德睿懿嘉电子材料科技有限公司 | Paste heat-conducting glue containing conducting high polymers thing |
| CN108084913A (en) * | 2017-12-08 | 2018-05-29 | 江苏伊诺尔新材料科技有限公司 | Superthin polyester double faced adhesive tape |
| CN109401648A (en) * | 2018-11-06 | 2019-03-01 | 苏州环明电子科技有限公司 | Ultra-thin bond plies and its preparation process |
| CN110698994A (en) * | 2019-09-12 | 2020-01-17 | 广州视源电子科技股份有限公司 | Heat-conducting insulating adhesive tape and preparation method thereof |
| CN113801603A (en) * | 2021-10-20 | 2021-12-17 | 福建友谊胶粘带集团有限公司 | Ultrathin heat-conducting adhesive tape and preparation method thereof |
| CN113954483A (en) * | 2021-10-19 | 2022-01-21 | 苏州翎慧材料科技有限公司 | Wireless charging receiving terminal wafer module structure |
| US11479694B2 (en) | 2020-10-23 | 2022-10-25 | Jiangsu Enoel New Material Technology Co., Ltd | High-performance ultra-thin double-sided adhesive tape |
| CN115362232A (en) * | 2020-04-01 | 2022-11-18 | 塞托普拉特胶带技术有限公司 | Adhesive tape, in particular cable-winding tape for winding cables in motor vehicles |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104804673A (en) * | 2015-05-08 | 2015-07-29 | 南通天燕纺织器材有限公司 | Novel high-strength textile leather collar |
| CN105907349A (en) * | 2016-06-08 | 2016-08-31 | 蚌埠高华电子股份有限公司 | Nanometer zirconium oxide modified composite epoxy pouring sealant for LED display screen |
| CN106634763A (en) * | 2016-12-06 | 2017-05-10 | 苏州洛特兰新材料科技有限公司 | High-heat-conductivity electric-insulation adhesive material and preparation method thereof |
| CN107325742A (en) * | 2017-06-30 | 2017-11-07 | 闫晓琦 | A kind of heat-conducting glue band containing conducting high polymers thing |
| CN107446525A (en) * | 2017-08-01 | 2017-12-08 | 昆山德睿懿嘉电子材料科技有限公司 | Paste heat-conducting glue containing conducting high polymers thing |
| CN108084913A (en) * | 2017-12-08 | 2018-05-29 | 江苏伊诺尔新材料科技有限公司 | Superthin polyester double faced adhesive tape |
| CN109401648A (en) * | 2018-11-06 | 2019-03-01 | 苏州环明电子科技有限公司 | Ultra-thin bond plies and its preparation process |
| CN110698994A (en) * | 2019-09-12 | 2020-01-17 | 广州视源电子科技股份有限公司 | Heat-conducting insulating adhesive tape and preparation method thereof |
| CN115362232A (en) * | 2020-04-01 | 2022-11-18 | 塞托普拉特胶带技术有限公司 | Adhesive tape, in particular cable-winding tape for winding cables in motor vehicles |
| US11479694B2 (en) | 2020-10-23 | 2022-10-25 | Jiangsu Enoel New Material Technology Co., Ltd | High-performance ultra-thin double-sided adhesive tape |
| CN113954483A (en) * | 2021-10-19 | 2022-01-21 | 苏州翎慧材料科技有限公司 | Wireless charging receiving terminal wafer module structure |
| CN113801603A (en) * | 2021-10-20 | 2021-12-17 | 福建友谊胶粘带集团有限公司 | Ultrathin heat-conducting adhesive tape and preparation method thereof |
| CN116239963A (en) * | 2021-10-20 | 2023-06-09 | 福建友谊胶粘带集团有限公司 | Heat conduction adhesive tape and preparation method thereof |
| CN116239963B (en) * | 2021-10-20 | 2024-05-28 | 福建友谊胶粘带集团有限公司 | Heat conduction adhesive tape and preparation method thereof |
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Effective date of registration: 20151214 Address after: 100176 prosperous industrial zone, No. 7, Tongji Road, Daxing District economic and Technological Development Zone, Beijing Patentee after: LOVEPAC CONVERTING (BEIJING) CO., LTD. Patentee after: Nolan mobile communication parts (Beijing) Co., Ltd. Address before: 100176 prosperous industrial zone, No. 7, Tongji Road, Daxing District economic and Technological Development Zone, Beijing Patentee before: LOVEPAC CONVERTING (BEIJING) CO., LTD. |