CN104167351A - 一种SiC外延片的化学机械清洗方法及专用工具 - Google Patents
一种SiC外延片的化学机械清洗方法及专用工具 Download PDFInfo
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- CN104167351A CN104167351A CN201410353373.7A CN201410353373A CN104167351A CN 104167351 A CN104167351 A CN 104167351A CN 201410353373 A CN201410353373 A CN 201410353373A CN 104167351 A CN104167351 A CN 104167351A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 99
- 238000000034 method Methods 0.000 title claims abstract description 64
- 239000000126 substance Substances 0.000 title claims abstract description 36
- 238000005498 polishing Methods 0.000 claims abstract description 28
- 239000008367 deionised water Substances 0.000 claims abstract description 13
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 4
- 239000002245 particle Substances 0.000 claims description 23
- 230000008569 process Effects 0.000 claims description 22
- 239000012530 fluid Substances 0.000 claims description 16
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 12
- 239000013078 crystal Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 10
- 230000007797 corrosion Effects 0.000 claims description 9
- 238000005260 corrosion Methods 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000013461 design Methods 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- 230000007547 defect Effects 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 238000010926 purge Methods 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 239000003344 environmental pollutant Substances 0.000 abstract description 3
- 231100000719 pollutant Toxicity 0.000 abstract description 3
- 230000003746 surface roughness Effects 0.000 abstract description 2
- 238000005034 decoration Methods 0.000 abstract 1
- 239000000356 contaminant Substances 0.000 description 6
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000012876 topography Methods 0.000 description 3
- 238000004506 ultrasonic cleaning Methods 0.000 description 3
- 238000005411 Van der Waals force Methods 0.000 description 2
- 239000013043 chemical agent Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
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- 238000003795 desorption Methods 0.000 description 1
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- 239000007788 liquid Substances 0.000 description 1
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- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- 238000005201 scrubbing Methods 0.000 description 1
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- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
- H01L21/0209—Cleaning of wafer backside
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02096—Cleaning only mechanical cleaning
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410353373.7A CN104167351B (zh) | 2014-07-23 | 2014-07-23 | 一种SiC外延片的化学机械清洗方法 |
Applications Claiming Priority (1)
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CN201410353373.7A CN104167351B (zh) | 2014-07-23 | 2014-07-23 | 一种SiC外延片的化学机械清洗方法 |
Publications (2)
Publication Number | Publication Date |
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CN104167351A true CN104167351A (zh) | 2014-11-26 |
CN104167351B CN104167351B (zh) | 2018-06-01 |
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CN201410353373.7A Active CN104167351B (zh) | 2014-07-23 | 2014-07-23 | 一种SiC外延片的化学机械清洗方法 |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105479318A (zh) * | 2015-11-25 | 2016-04-13 | 赣州澳克泰工具技术有限公司 | 硬质合金涂层刀具的后处理方法和硬质合金涂层刀具 |
CN106140660A (zh) * | 2015-03-31 | 2016-11-23 | 北大方正集团有限公司 | 陶瓷件上聚合物的清洗方法及装置 |
DE102016202523A1 (de) | 2016-02-18 | 2017-08-24 | Sicrystal Ag | Verfahren zur Reinigung eines einkristallinen SiC-Substrats sowie SiC-Substrat |
CN107112263A (zh) * | 2014-12-19 | 2017-08-29 | 应用材料公司 | 用于漂洗与干燥基板的***和方法 |
CN107470266A (zh) * | 2017-09-25 | 2017-12-15 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 一种化学机械抛光工艺中氧化物晶圆的后清洗方法 |
CN108648989A (zh) * | 2018-05-16 | 2018-10-12 | 福建北电新材料科技有限公司 | 一种单晶碳化硅衬底晶片清洗方法 |
CN109037035A (zh) * | 2018-07-31 | 2018-12-18 | 成都海威华芯科技有限公司 | 一种提高SiC基GaN晶圆背金粘附性的方法及*** |
CN110690104A (zh) * | 2019-10-08 | 2020-01-14 | 江苏晟驰微电子有限公司 | 一种去除硅腐蚀沟槽边缘氧化膜的改进方法 |
CN111663115A (zh) * | 2020-05-26 | 2020-09-15 | 东莞市天域半导体科技有限公司 | 一种SiC化学气相沉积设备反应腔配件清洁方法 |
CN111916342A (zh) * | 2017-08-10 | 2020-11-10 | 长江存储科技有限责任公司 | 晶圆键合方法及其结构 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1603015A (zh) * | 2003-09-29 | 2005-04-06 | 中芯国际集成电路制造(上海)有限公司 | 硅片清洗刷的清洗装置及其清洗方法 |
US20090305613A1 (en) * | 2008-06-10 | 2009-12-10 | Semes Co., Ltd | Single Type Substrate Treating Apparatus and Method |
CN101879699A (zh) * | 2009-05-05 | 2010-11-10 | 陈庆昌 | 循环渐进平坦化方法及用于该方法的半导体研磨清洁装置 |
CN101966689A (zh) * | 2010-09-27 | 2011-02-09 | 山东大学 | 一种大直径4H-SiC晶片碳面的表面抛光方法 |
-
2014
- 2014-07-23 CN CN201410353373.7A patent/CN104167351B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1603015A (zh) * | 2003-09-29 | 2005-04-06 | 中芯国际集成电路制造(上海)有限公司 | 硅片清洗刷的清洗装置及其清洗方法 |
US20090305613A1 (en) * | 2008-06-10 | 2009-12-10 | Semes Co., Ltd | Single Type Substrate Treating Apparatus and Method |
CN101879699A (zh) * | 2009-05-05 | 2010-11-10 | 陈庆昌 | 循环渐进平坦化方法及用于该方法的半导体研磨清洁装置 |
CN101966689A (zh) * | 2010-09-27 | 2011-02-09 | 山东大学 | 一种大直径4H-SiC晶片碳面的表面抛光方法 |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107112263A (zh) * | 2014-12-19 | 2017-08-29 | 应用材料公司 | 用于漂洗与干燥基板的***和方法 |
CN107112263B (zh) * | 2014-12-19 | 2020-10-27 | 应用材料公司 | 用于漂洗与干燥基板的***和方法 |
CN106140660A (zh) * | 2015-03-31 | 2016-11-23 | 北大方正集团有限公司 | 陶瓷件上聚合物的清洗方法及装置 |
CN106140660B (zh) * | 2015-03-31 | 2019-01-22 | 北大方正集团有限公司 | 陶瓷件上聚合物的清洗方法及装置 |
CN105479318A (zh) * | 2015-11-25 | 2016-04-13 | 赣州澳克泰工具技术有限公司 | 硬质合金涂层刀具的后处理方法和硬质合金涂层刀具 |
DE102016202523A1 (de) | 2016-02-18 | 2017-08-24 | Sicrystal Ag | Verfahren zur Reinigung eines einkristallinen SiC-Substrats sowie SiC-Substrat |
US11342185B2 (en) | 2017-08-10 | 2022-05-24 | Yangtze Memory Technologies Co., Ltd. | Wafer bonding method and structure thereof |
CN111916342B (zh) * | 2017-08-10 | 2021-04-16 | 长江存储科技有限责任公司 | 晶圆键合方法及其结构 |
CN111916342A (zh) * | 2017-08-10 | 2020-11-10 | 长江存储科技有限责任公司 | 晶圆键合方法及其结构 |
CN107470266A (zh) * | 2017-09-25 | 2017-12-15 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 一种化学机械抛光工艺中氧化物晶圆的后清洗方法 |
CN108648989B (zh) * | 2018-05-16 | 2020-12-25 | 福建北电新材料科技有限公司 | 一种单晶碳化硅衬底晶片清洗方法 |
CN108648989A (zh) * | 2018-05-16 | 2018-10-12 | 福建北电新材料科技有限公司 | 一种单晶碳化硅衬底晶片清洗方法 |
CN109037035A (zh) * | 2018-07-31 | 2018-12-18 | 成都海威华芯科技有限公司 | 一种提高SiC基GaN晶圆背金粘附性的方法及*** |
CN110690104A (zh) * | 2019-10-08 | 2020-01-14 | 江苏晟驰微电子有限公司 | 一种去除硅腐蚀沟槽边缘氧化膜的改进方法 |
CN111663115A (zh) * | 2020-05-26 | 2020-09-15 | 东莞市天域半导体科技有限公司 | 一种SiC化学气相沉积设备反应腔配件清洁方法 |
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CN104167351B (zh) | 2018-06-01 |
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GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Chemical mechanical cleaning method of SiC epitaxial wafer and special-purpose tools Effective date of registration: 20190715 Granted publication date: 20180601 Pledgee: China Co. truction Bank Corp Dongguan branch Pledgor: DONGGUAN TIANYU SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: 2019440000263 |
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CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 523000 second floor office building, No.5, Gongye North 1st Road, Hubei Industrial City, Songshan, Dongguan City, Guangdong Province Patentee after: Guangdong Tianyu Semiconductor Co.,Ltd. Address before: No. 5, Gongye North 1st Road, Songshan, Hubei, Dongguan, Guangdong 523000 Patentee before: DONGGUAN TIANYU SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
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Date of cancellation: 20230406 Granted publication date: 20180601 Pledgee: China Co. truction Bank Corp Dongguan branch Pledgor: DONGGUAN TIANYU SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: 2019440000263 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Denomination of invention: A Chemical Mechanical Cleaning Method for SiC Epitaxial Wafers Effective date of registration: 20230512 Granted publication date: 20180601 Pledgee: China Co. truction Bank Corp Dongguan branch Pledgor: Guangdong Tianyu Semiconductor Co.,Ltd. Registration number: Y2023980040499 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20180601 Pledgee: China Co. truction Bank Corp Dongguan branch Pledgor: Guangdong Tianyu Semiconductor Co.,Ltd. Registration number: Y2023980040499 |