CN104160492B - Method for manufacturing sealing resin sheet - Google Patents
Method for manufacturing sealing resin sheet Download PDFInfo
- Publication number
- CN104160492B CN104160492B CN201380011555.XA CN201380011555A CN104160492B CN 104160492 B CN104160492 B CN 104160492B CN 201380011555 A CN201380011555 A CN 201380011555A CN 104160492 B CN104160492 B CN 104160492B
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- China
- Prior art keywords
- resin sheet
- sealing resin
- resinite
- sheet material
- pressing plate
- Prior art date
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- 229920005989 resin Polymers 0.000 title claims abstract description 117
- 239000011347 resin Substances 0.000 title claims abstract description 117
- 238000007789 sealing Methods 0.000 title claims abstract description 91
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims description 34
- 238000003825 pressing Methods 0.000 claims abstract description 92
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 83
- 238000007711 solidification Methods 0.000 claims description 6
- 230000008023 solidification Effects 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3164—Partial encapsulation or coating the coating being a foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
In order to manufacture a sealing resin sheet for insulating and sealing a plurality of electronic components mounted on a substrate at low cost and suppress mixing of air bubbles into the sealing resin sheet, in the first step, a resin body (22) in a semi-cured state is disposed in a space (26) surrounded by a pair of pressing plates (23, 25) facing each other and a side plate (24) provided on the outer peripheral side. In the second step, a vacuum is drawn into the space (26), and the resin body (22) is heated at a temperature lower than a curing temperature and extended by being pressed at a pressing speed of 0.004-0.06 mm/sec (inclusive) by the pressing plates (23, 25). Consequently, a sealing resin sheet (11) is produced.
Description
Technical field
The present invention relates to for the sealing resin that the multiple electronic devices and components being equipped on substrate are carried out with insulated enclosure
Sheet manufacturing method.
Background technology
The electronic component module being equipped with multiple electronic devices and components on substrate is wet in order to protect electronic devices and components not to be subject to
The impact of gas, external contact etc., forms sealing resin layer so that it covers substrate and electronic devices and components.This sealing resin layer is logical
Cross on the substrate be equipped with electronic devices and components the sealing resin sheet material of placing semi-cured state (B-stage) and to institute's placing
Sealing resin sheet material is heated and is pressed and formed.
Figure 10 (A) to Figure 10 (C) is represented and is manufactured electronic component module 200 using sealing resin sheet material 205
The figure of generic instance.As shown in Figure 10 (A), circuit pattern 202 is formed with circuit substrate 201, upper in circuit pattern 202
Side is equipped with electronic devices and components 204 via conductive adhesive 203.
As shown in Figure 10 (B), it is being equipped with configuration sealing resin above the circuit substrate 201 of electronic devices and components 204
Sheet material 205.Afterwards, using two flat boards 206, circuit substrate 201 and sealing resin sheet material 205 are clamped, to sealing resin
Sheet material 205 is heated and is pressed.Thus, electronic devices and components 204 are embedded in sealing resin sheet material 205, and seal use
Resin sheet 205 is solidified by heating, becomes sealing resin layer 209.
Shown in Figure 10 (C) is the electronic component module 200 being manufactured by said process, electronic devices and components 204 and electricity
The sealing resin layer 209 that base board 201 is cured covers so that it seals.
So far, illustrate the manufacture process of electronic component module 200.Then, to electronic component module 200
Used in manufacture process, the manufacture method of sealing resin sheet material 205 illustrates.
The manufacture method of above-mentioned sealing resin sheet material 205 is for example recorded in patent document 1 (Japanese Patent Laid-Open
2009-29930 publication).According to patent document 1, using the apparatus for coating 101 shown in Figure 11 by the resin combination of liquid
102 upper surfaces being coated on support membrane 103, the mold release film 105 sent from demoulding deflector roll 104 is overlapped resin combination 102
Upper surface, press resin combination 102 using pressing roller 106, thus manufacturing sealing resin sheet material 205.
Prior art literature
Patent document
Patent document 1：Japanese Patent Laid-Open 2009-29930 publication
Content of the invention
Invent technical problem to be solved
However, in the manufacture method of sealing resin sheet material 205 described in patent document 1, due to needing apparatus for coating
101st, the expensive equipment such as demoulding deflector roll 104, pressing roller 106, the manufacturing cost that therefore there is sealing resin sheet material 205 uprises
Problem.
In addition, as described in Patent Document 1, be coated with the resin combination of liquid in the upper surface of support membrane 103
In 102 method, due to the resin combination 102 infiltration extension of liquid, therefore, it is difficult to manufacturing the big sealing resin sheet of thickness
Material 205.
And, as described in Patent Document 1 as, the upper surface of support membrane 103 be coated with liquid resin combination
102 and the manufacture method of overlapping mold release film 105 in, can be in the inside entrained air bubbles of resin combination 102 during coating, can be by this gas
Bubble is enclosed between support membrane 103 and mold release film 105.From the viewpoint of moisture-proof, outside barrier property, preferably electronics unit device
Bubble is not had to be mixed in the sealing resin layer 209 of part module 200.For this reason, being preferably the manufacture in electronic component module 200
In sealing resin sheet material 205 used in journey, bubble is mixed into also less, but the manufacture method described in patent document 1
In, can be in the internal residual bubble of resin combination 102.
The problem to be solved in the present invention is to reduce the above-mentioned problem with regard to sealing resin sheet material manufacture method.
Solve the technical scheme of technical problem
The present invention is a kind of sealing resin sheet material manufacture method, for the multiple electronic devices and components being equipped on substrate
Carry out insulated enclosure, have：Resinite arrangement step, wherein using the semi-cured state of the material as sealing resin sheet material
Resinite configuration is in the space that the side plate by a pair of relative pressing plate and the outer circumferential side being arranged at pressing plate surrounds；And prolong
Exhibition operation, is wherein vacuumized in the space of encirclement, and with the temperature of the solidification temperature less than resinite to resinite
Heated, and with the pressing speed below above 0.06mm/ second 0.004mm/ second, resinite is pressed using pressing plate
So that its extension.
It is preferably, in resinite arrangement step, insertion between resinite and pressing plate implements the protection of demoulding process
Film, in extension operation, pressing resinite is so that it extends on diaphragm.
Or it is preferably, the demoulding is implemented to pressing plate and processes, in extension operation, pressing resinite is so that it is in pressing plate
Extend on the direction of face.
Invention effect
In accordance with the invention it is possible to be manufactured inexpensively the larger sealing resin sheet material of thickness, without expensive equipment.
In addition, the residual of the air entrapment of sealing resin sheet material can be suppressed.
Brief description
Fig. 1 is the sectional view observing sealing resin sheet material 11 from front.
Fig. 2 is the manufacturing process of the sealing resin sheet material 11 involved by first embodiment illustrating the present invention successively
Figure.
Fig. 3 is the brief figure of the press device 30 in the operation shown in Fig. 2 (C).
Fig. 4 is the relation between the number of bubbles confirming in pressing speed and sealing resin sheet material 11 when representing pressing
Figure.
Fig. 5 be represent change pressing plate when pressing speed in the case of the surface of sealing resin sheet material 11 photograph
Piece.
Fig. 6 is the figure of the neighbouring situation in periphery of the resinite 22 when illustrating that resinite 22 extends.
Fig. 7 is the figure representing the relation between the resin viscosity of sealing resin sheet material 11 and thickness deviation.
Fig. 8 is the figure representing the relation between the temperature of sealing resin sheet material 11 and viscosity.
Fig. 9 is the manufacturing process illustrating the sealing resin sheet material 11 involved by second embodiment of the present invention successively
Figure.
Figure 10 is the figure representing the generic instance manufacturing electronic component module 200 using sealing resin sheet material 205.
Figure 11 is the figure of the manufacture method representing sealing resin sheet material 205 of the prior art.
Specific embodiment
[first embodiment]
For the electronic component module that multiple electronic devices and components are equipped with substrate, using sealing resin sheet material with
For insulated enclosure is carried out to electronic devices and components.As shown in figure 1, sealing resin sheet material 11 be in tabular, thickness be 0.1mm～
3.5mm.The material of sealing resin sheet material 11 is insulating resin (for example, epoxy resin), for improve mechanical strength, exhausted
Such as silica or aluminum oxide is contained as filler in edge resin.
In two interareas of sealing resin sheet material 11, diaphragm 12 is installed for protection sealing resin sheet material 11
Surface.The material of diaphragm 12 is, for example, PET (polyethylene terephthalate), PTFE (polytetrafluoroethylene (PTFE)) etc..For guarantor
The surface of cuticula 12, implements to process using the demoulding of silicones etc., using sealing in the manufacture process of electronic component module
In the case of resin sheet 11, peel off diaphragm 12 to use.
With reference to Fig. 2 (A) to Fig. 2 (E) and Fig. 3, the manufacture method of sealing resin sheet material 11 is illustrated.
As shown in Fig. 2 (A), prepare columnar mould 20 with the end, liquid resin 21 is injected in mould 20, and passes through
Heat treatment becomes semi-cured state, to manufacture resinite 22.
Resinite 22 is the insulating resin containing filler, becomes the material of sealing resin sheet material 11.Semi-cured state is
Refer to the state in the interstage of curing reaction, also referred to as B-stage.In order that fluid resin 21 becomes semi-cured state, for
In the case of epoxy resin, with 40 DEG C～160 DEG C of temperature, heated 5 minutes～120 minutes using baking oven.
It is the resin of 120Pa s～1800Pa s that resinite 22 is usable in viscosity at a temperature of 60 DEG C.Now viscous
Degree be using TA Instruments company produce AR550, tool sizes φ 8mm, measure 550 μm of thickness, frequency 1Hz,
The value measuring under conditions of strain 0.1%.
As shown in Fig. 2 (B), prepare, for the pressing plate 23 to the downside that sealing resin sheet material 11 forms, pressing
The outer circumferential side configuration side plate 24 of the interarea of pressing plate 23.Side plate 24 both can for framework it is also possible to formed ring-type mode configure multiple
Sheet material.Meanwhile, configuration protection film 12 in region interarea, being surrounded by side plate 24 of pressing plate 23, and by Fig. 2's (A)
Manufactured resinite 22 in operation configures the central authorities on diaphragm 12.
Even if as long as the pressing of pressing plate 23, side plate 24 also can maintain the material of shape, for example can use stainless steel,
Aluminium.Side plate 24 is the component of the thickness for determining sealing resin sheet material 11 formed thereby, and the thickness of diaphragm 12 is also examined
Consider and set interior.In the case that the thickness of diaphragm 12 is 0.05mm, the thickness of side plate 24 adopt 0.2mm～
The scope of 3.6mm.
As shown in Fig. 2 (C), above resinite 22, configure the pressing plate 25 of another diaphragm 12 and upside successively,
So that it is relative with the diaphragm 12 being configured in the operation of Fig. 2 (B) and pressing plate 23.Thus, become by relative a pair
Pressing plate 23,25 and be arranged in the space 26 that the side plate 24 of side surrounds and be configured with the state of resinite 22.
Here, used in the manufacturing process to sealing resin sheet material 11, press device illustrates.Fig. 3 is Fig. 2 (C)
The brief figure of the press device 30 in shown operation.As shown in figure 3, resinite 22 and diaphragm 12 configure being pressed by a pair
Plate 23,25 and be arranged at side side plate 24 surround space 26 in.In this condition, using press device 30 in space 26
Reduced pressure, and resinite 22 is carried out heating, presses.
Increased pressure board 32 is set in the upside of pressing plate 25, compression plate 31 is set in the downside of pressing plate 23.Increased pressure board 32 He
Compression plate 31 built-in having heaters 33 respectively.Using this heater 33, heat via 23,25 pairs of resinites 22 of pressing plate.
In addition, setting vacuum mechanism 38 is so that it surrounds increased pressure board 32 and compression plate 31.Vacuum mechanism utilizes (not shown)
Vacuum source is vacuumized.Through hole (not shown) is had on side plate 24, by this through hole by space 26 in the horizontal direction
Inside also vacuumize, to become decompression state.
It is connected with the drive shaft of pressurized pilot mechanism 34 in the upside of increased pressure board 32.By making the drive of pressurized pilot mechanism 34
Moving axis declines, thus pressing increased pressure board 32 and pressing plate 25, its result is pressing resinite 22.Additionally, pressurized pilot mechanism 34
It is arranged at the central authorities of top board 36, top board 36 is fixed on pillar 37, this pillar 37 is erected in the substrate 35 of lower section.
Here referring again to Fig. 2, the manufacture method of sealing resin sheet material 11 is illustrated.Using above-mentioned by press-fiting
Put 30, such as shown in Fig. 2 (D), so that a pair of close direction of pressing plate 23,25 towards each other is moved.Thus, positioned at pressing plate 23,25
Between resinite 22 along diaphragm 12 face direction extend, sealing resin sheet material 11 is formed.
Heating-up temperature when resinite 22 extends is the temperature (such as 40 DEG C～160 of the solidification temperature less than resinite 22
℃).Utilization the formed pressure of decompression in the space 26 being surrounded by a pair of pressing plate 23,25 and side plate 24 be 5000Pa with
Under.The pressing speed of pressing plate 23,25 is above 0.06mm/ second 0.004mm/ second below.It is set to this for by pressing speed
The reasons why scope, it is illustrated later.
Resinite 22 is made to extend by the operation shown in Fig. 2 (D), thus by floor space 706.5mm2~
1962.5mm2, the resinite 22 of height 5mm～30mm be configured to area 16900mm2, the sealing tree of thickness 0.1mm～3.5mm
Fat sheet material 11.First embodiment is preferably applied within the range.
After operation shown in Fig. 2 (D), release pressing force produced by pressing plate 23,25, and make by pressing plate
23rd, 25 and side plate 24 surround space 26 to atmosphere opening.Thus, to manufacture as shown in Fig. 2 (E) two sides carry diaphragm
12 sealing resin sheet material 11.
In the operation of Fig. 2 (D), resinite 22 extends while heating, but its heating-up temperature is less than resinite 22
The temperature of solidification temperature, sealing resin sheet material 11 formed thereby also keeps semi-cured state.Thus, using sealing resin
In the manufacture process (with reference to Figure 10) of the electronic component module 200 of sheet material 11, electronic devices and components can be embedded in sealing
Sealed while with resin sheet 11.
Resinite 22 can extend in the state of how much entrainment of some bubbles, but due to now being taken out in space 26
Vacuum, therefore can make the power outwards shedding act on the bubble carried secretly, thus effectively removing bubble removing.
The pressing speed of the pressing plate 23,25 when resinite 22 extends is above 0.06mm/ second 0.004mm/ second below.Should
Pressing speed can be set exactly by mechanism's pressurized pilot 34.By pressing speed is set to this scope such that it is able to subtract
Residue in the bubble in sealing resin sheet material 11 less.
Fig. 4 is to represent pressing plate 23,25 with respect in the relative pressing speed and sealing resin sheet material 11 of resinite 22
The figure of the relation between the number of bubbles confirming.Sealing resin sheet material 1 to manufacture approximately through above-mentioned manufacture method.Bubble is
By for manufacture after sealing resin sheet material 11 heating reduced pressure atmosphere under (such as 100 DEG C of temperature, pressure 200Pa) make gas
Steep notableization and measure.Number of bubbles is the 100mm of sealing resin sheet material 112Present in diameter 0.1mm above size
Number of bubbles.Sample number n=10.As shown in figure 4, pressing speed be 0.09mm/ more than the second in the case of, number of bubbles averagely has 4
More than individual, and in the case of being below the 0.06mm/ second in pressing speed, number of bubbles stably tails off.
Fig. 5 (A) to Fig. 5 (E) is the photo representing the surface of sealing resin sheet material 11 when changing pressing speed.Each
The area of photo is 10000mm2.Photo is to heat under reduced pressure atmosphere (for example for the sealing resin sheet material 11 after manufacturing
100 DEG C of temperature, pressure 200Pa) make the figure after bubble notableization.The situation being 0.45mm/ second, 0.225mm/ second in pressing speed
Under, more bubble can be identified on surface, the situation being 0.06mm/ second, 0.009mm/ second, 0.004mm/ second in pressing speed
Under, number of bubbles reduces.
Accordingly understand, if the pressing speed of pressing plate 23,25 is set in 0.004mm/ second above 0.06mm/
In scope below second, then can reduce the number of bubbles residuing in sealing resin sheet material 11.Additionally, as under pressing speed
The 0.004mm/ second of limit value is set as that pressurized pilot mechanism 34 can stably export the pressing speed of pressing force.
With reference to Fig. 6, the near the perimeter of situation of the resinite 22 when illustrating that resinite 22 extends.Fig. 6 (A) is to represent pressing
Speed is the figure of the situation of 0.45mm/ second, and Fig. 6 (B) is the figure of the situation representing that pressing speed is the 0.06mm/ second.
As shown in Fig. 6 (A) and Fig. 6 (B), towards when extending in arrow e direction, meeting is at the interface positioned at diaphragm 12 for resinite 22
The inside of neighbouring resinite 22 produces whirlpool w.In Fig. 6 (A), because pressing speed is larger, therefore not outer in resinite 22
Week and slightly by interior generation whirlpool w.Therefore, the near the perimeter of gas of resinite 22 becomes entrained in whirlpool w becomes bubble b,
Bubble b remains in the inside of resinite 22.In contrast to this, in Fig. 6 (B), because pressing speed is less, therefore can be in resin
The periphery of body 22 produces whirlpool w.Therefore, the bubble b carrying secretly near the periphery of resinite 22 passes through resinite 22 towards arrow e direction
Extension and the whirlpool w producing therewith movement, and be directed to the periphery front end of resinite 22.For being directed to periphery
The bubble b of front end, acts on, by vacuumizing of vacuum mechanism 38 (with reference to Fig. 3), the power discharged towards the outside, can suppress bubble b
Residual in the inside of resinite 22.
In addition, demoulding process is implemented on the surface for diaphragm used in first embodiment 12.By implementing the demoulding
Process, thus having the effect of the skin-friction force reducing diaphragm 12, sliding when therefore resinite 22 extends is preferable, energy
Enough reduce carrying secretly of bubble b.And, diaphragm 12 can be changed in each manufacture sealing resin sheet material 11, therefore no
The deterioration that the demoulding is processed must be considered, sliding mode when resinite 22 extends can be reproduced well.
In addition, according to first embodiment, as long as due to preparing press device 30 and predetermined mould 20, therefore can
Manufacture sealing resin sheet material 11 the enough equipment not using costliness.If in addition, using press device 30, can be by setting
The side plate 24 sealing resin sheet material 11 larger to manufacture Film Thickness Ratio.
Be preferably manufactured sealing resin sheet material 11 resin viscosity at a temperature of 60 DEG C be 120Pa s～
1800Pa·s.Viscosity now is the AR550 being produced using TA Instruments company, in tool sizes φ 8mm, mensure
550 μm of thickness, frequency 1Hz, strain 0.1% under conditions of measure value.The thickness of sealing resin sheet material 11 is to use in sealing
In the state of two interareas of resin sheet 11 carry diaphragm 12, it is measured from the upper side using reflection-type laser displacement gauge
Obtained from be worth.Fig. 7 is the figure representing the relation between the resin viscosity of sealing resin sheet material 11 and thickness deviation, in sealing
When resin viscosity with resin sheet 11 is 120Pa s～1800Pa s, the thickness deviation of sealing resin sheet material 11 is 10 μ
Below m, in contrast to this when resin viscosity is for 100Pa s, thickness deviation is more than 15 μm, and resin viscosity is
Thickness deviation during 6000Pa s even has more than 20 μm.Additionally, the thickness deviation of sealing resin sheet material 11 is the number of 3 σ
Value, sample number n=20.
In addition, Fig. 8 is the figure of an example representing the relation between the temperature of sealing resin sheet material 11 and viscosity.As
Shown in Fig. 8, if temperature uprises, viscosity has a declining tendency, and when temperature is 60 DEG C, viscosity is 1800Pa s, and in temperature
During for 120 DEG C, viscosity becomes 20Pa s.Thus, by improving temperature, the viscosity of resin is dropped to such as 20Pa s, and
Make its liquidation before sealing resin sheet material 11 solidification, thus as shown in Figure 10 (C), resin material can be filled into electronics
Between components and parts and substrate.
[second embodiment]
With reference to Fig. 9 (A) to Fig. 9 (E), the manufacture method of the sealing resin sheet material 11 involved by second embodiment is entered
Row explanation.Second embodiment is not use diaphragm 12 (with reference to Fig. 2) and directly manufacture sealing between pressing plate 23,25 and use
The method of resin sheet 11.Additionally, for the structure common with first embodiment, manufacturing condition, omitting detailed description.Separately
Outward, used in pressing process, press device 30 is identical with first embodiment, omits the description.
As shown in Fig. 9 (A), prepare columnar mould 20 with the end, liquid resin 21 is injected in mould 20, and passes through
Heat treatment becomes semi-cured state, to manufacture resinite 22.
As shown in Fig. 9 (B), prepare, for the pressing plate 23 to the downside that sealing resin sheet material 11 forms, pressing
The outer circumferential side configuration side plate 24 of the interarea of pressing plate 23.Meanwhile, in region interarea, being surrounded by side plate 24 of pressing plate 23
Central authorities, the resinite 22 manufacturing in the operation of configuration Fig. 9 (A).Side plate 24 is for determining sealing resin sheet material formed thereby
The component of 11 thickness.Wherein, in second embodiment, due to not using diaphragm 12, diaphragm 12 need not therefore be considered
Thickness.In addition, the surface for the pressing plate 23 abutting against with resinite 22 implements to process using the demoulding of silicones etc..
As shown in Fig. 9 (C), the pressing plate 25 of configuration upside above resinite 22, so that itself and configuration in Fig. 9 (B)
Pressing plate 23 relatively.Thus, become by relative a pair of pressing plate 23,25 be arranged at the sky that the side plate 24 of side surrounds
Between be configured with the state of resinite 22 in 26.In addition, profit is also implemented on the surface for the pressing plate 25 abutting against with resinite 22
Processed with the demoulding of silicones etc..
As shown in Fig. 9 (D), moved by making a pair of close direction of pressing plate 23,25 towards each other, thus being located at pressing plate
23rd, the resinite 22 between 25 extends along the face direction of pressing plate 23,25, and sealing resin sheet material 11 is formed.?
When resinite 22 extends, resinite 22 is heated to the temperature less than solidification temperature.For by relative a pair of pressing plate 23,25
The space 26 surrounding with the side plate 24 being arranged at side is vacuumized.The pressing speed of pressing plate 23,25 is the 0.004mm/ second
Below the above 0.06mm/ second.
After operation shown in Fig. 9 (D), release pressing plate 23,25 produced by pressing force, and by pressing plate 23,
25 and side plate 24 surround space 26 to atmosphere opening.Thus, manufacture the sealing resin sheet material 11 as shown in Fig. 9 (E).
Demoulding process is implemented on surface for pressing plate used in second embodiment 23,25.By implementing at the demoulding
Reason, thus having the effect of the skin-friction force reducing pressing plate 23,25, sliding when therefore resinite 22 extends is preferable,
Carrying secretly of bubble can be reduced.
According to second embodiment, diaphragm 12 ground can not be used to manufacture sealing resin sheet material 11.Therefore, it is possible to more
Plus it is manufactured inexpensively sealing resin sheet material 11.
Label declaration
11：Sealing resin sheet material
12：Diaphragm
20：Mould
21：Fluid resin
22：Resinite
23、25：Pressing plate
24：Side plate
31：Compression plate
32：Increased pressure board
33：Heater
34：Pressurized pilot mechanism
35：Substrate plate
36：Top board
37：Pillar
38：Vacuum mechanism
Claims (3)
1. a kind of sealing resin sheet material manufacture method, close for carrying out to the multiple electronic devices and components being equipped on substrate insulating
Envelope is it is characterised in that have：
Resinite arrangement step, wherein using the configuration of the resinite of the semi-cured state of the material as sealing resin sheet material by
In the space that the side plate of a pair of relative pressing plate and the outer circumferential side being arranged at described pressing plate surrounds；And
Extension operation, is wherein vacuumized in the space of described encirclement, and with the solidification temperature less than described resinite
Temperature described resinite is heated, and using described pressing plate with pressing below above 0.06mm/ second 0.004mm/ second
Described resinite is pressed pressure speed so that it extends.
2. sealing resin sheet material manufacture method as claimed in claim 1 it is characterised in that
In described resinite arrangement step, insertion between described resinite and described pressing plate implements the protection of demoulding process
Film,
In described extension operation, press described resinite so that it extends on the face direction of described diaphragm.
3. sealing resin sheet material manufacture method as claimed in claim 1 it is characterised in that
Implement the demoulding to described pressing plate to process,
In described extension operation, press described resinite so that it extends on the face direction of described pressing plate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012045575 | 2012-03-01 | ||
| JP2012-045575 | 2012-03-01 | ||
| PCT/JP2013/054749 WO2013129307A1 (en) | 2012-03-01 | 2013-02-25 | Method for manufacturing sealing resin sheet |
Publications (2)
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| CN104160492A CN104160492A (en) | 2014-11-19 |
| CN104160492B true CN104160492B (en) | 2017-02-08 |
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| JP (1) | JP5854125B2 (en) |
| CN (1) | CN104160492B (en) |
| TW (1) | TWI483830B (en) |
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| JP6143665B2 (en) * | 2013-12-26 | 2017-06-07 | Ｔｏｗａ株式会社 | Semiconductor sealing method and semiconductor sealing device |
| EP3723958A1 (en) | 2017-12-15 | 2020-10-21 | West Pharmaceutical Services, Inc. | Smooth film laminated elastomer articles |
| TWI656007B (en) * | 2017-12-28 | 2019-04-11 | 綠點高新科技股份有限公司 | A method for manufacturing a housing module and mold thereof and housing module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1424191A (en) * | 2001-11-30 | 2003-06-18 | 山田尖端技术株式会社 | Compression moulding machines |
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| JPH06291158A (en) * | 1993-03-31 | 1994-10-18 | Toshiba Corp | Method and device for manufacturing semiconductor |
| JPH08172146A (en) * | 1994-12-16 | 1996-07-02 | Toshiba Chem Corp | Method for manufacturing sheet-shaped resin for sealing semiconductor |
| JPH0966523A (en) * | 1995-08-30 | 1997-03-11 | Toshiba Chem Corp | Manufacture of semiconductor sealing resin molding |
| JP3397743B2 (en) * | 1996-07-12 | 2003-04-21 | 富士通株式会社 | Semiconductor device |
| JP3495913B2 (en) * | 1998-05-28 | 2004-02-09 | シャープ株式会社 | Resin sheet for mounting semiconductor devices |
| JP2003165130A (en) * | 2001-11-30 | 2003-06-10 | Apic Yamada Corp | Mold opening/closing control mechanism for compression molding machine and method for controlling mold opening/closing |
| JP2006256195A (en) * | 2005-03-18 | 2006-09-28 | Towa Corp | Compression-molding method of electronic component and resin material |
| JP4855329B2 (en) * | 2007-05-08 | 2012-01-18 | Ｔｏｗａ株式会社 | Electronic component compression molding method and apparatus |
| JP2009166415A (en) * | 2008-01-18 | 2009-07-30 | Sumitomo Heavy Ind Ltd | Resin for compression molding, resin sealing apparatus and resin sealing method |
| JP2010040939A (en) * | 2008-08-07 | 2010-02-18 | Sumitomo Heavy Ind Ltd | Preforming metal mold, preforming device, preforming method, and preforming resin |
| JP5382693B2 (en) * | 2009-02-04 | 2014-01-08 | アピックヤマダ株式会社 | Compression molding method |
| JP2011086745A (en) * | 2009-10-15 | 2011-04-28 | Sanyu Rec Co Ltd | Resin sealing method of electronic component |
| JP4935957B1 (en) * | 2010-11-17 | 2012-05-23 | 株式会社村田製作所 | Manufacturing method of resin sheet for sealing |
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- 2013-02-25 CN CN201380011555.XA patent/CN104160492B/en active Active
- 2013-02-25 WO PCT/JP2013/054749 patent/WO2013129307A1/en active Application Filing
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| CN1424191A (en) * | 2001-11-30 | 2003-06-18 | 山田尖端技术株式会社 | Compression moulding machines |
Also Published As
| Publication number | Publication date |
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| JP5854125B2 (en) | 2016-02-09 |
| TW201343368A (en) | 2013-11-01 |
| WO2013129307A1 (en) | 2013-09-06 |
| CN104160492A (en) | 2014-11-19 |
| JPWO2013129307A1 (en) | 2015-07-30 |
| TWI483830B (en) | 2015-05-11 |
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