CN104159397A - Pressing structure and method of cavity PCB - Google Patents
Pressing structure and method of cavity PCB Download PDFInfo
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- CN104159397A CN104159397A CN201410437213.0A CN201410437213A CN104159397A CN 104159397 A CN104159397 A CN 104159397A CN 201410437213 A CN201410437213 A CN 201410437213A CN 104159397 A CN104159397 A CN 104159397A
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Abstract
The invention relates to a pressing structure and method of a cavity PCB. The pressing structure of the cavity PCB comprises a first copper foil layer, first centrifugal film, a first aluminum sheet layer, a first core board, a first NF PP, a second core board, a second NF PP, a third core board, a second aluminum sheet, second centrifugal film and a second copper foil layer in a pressed mode from top to bottom. A cavity which penetrates through the first NF PP, the second core board and the second NF PP is further formed in the pressing structure of the cavity PCB. Due to the use of a compound layer of the copper foil, the centrifugal film and the aluminum sheets, the rigidity of materials is guaranteed, a steel plate can be replaced for overcoming the defect that a large cavity is sunken, the good buffering performance of materials such as a pressing mat or a combination of a pressing mat and an auxiliary board is achieved, when wiring is carried out in a cavity layer, the NF PPs and wires can be well combined only by one-time pressing, and the defects of insufficient glue filling and the like are overcome.
Description
Technical field
The present invention relates to circuit board technology field.
Background technology
Along with electronics and information industry technological progress, communication apparatus, to high speed, high-frequency transmission future development, has also impelled the variation of communication PCB manufacturing technology assembling mode.Extraordinary PCB and extraordinary components and parts (as: metal substrate, microwave radio device etc.) as a kind of high-speed functions module in the time assembling with motherboard PCB for fixing and reduce to take equipment cabinets space object, often on PCB motherboard, make ladder position and make components and parts " embedding " motherboard, for example Embedded capacitance, the design of resistance printed wiring board, stepped plate, cavity plate etc.
Cavity plate, as the term suggests realize at substrate internal production closed cavity in the time making pcb board, is optionally holed in the upper and lower both sides of cavity, conducting sound, or at cavity plate both sides pasting chip, can realize better electric property.
Cavity plate make require good cavity shape, good filler performance, good reliability energy, electric property strengthen, applicable to thin plate.After cavity completes by laser drill by cavity and extraneous conducting, be usually used in the electronic equipments such as microphone.
Current cavity PCB plate manufacture craft has following defect: the cavity shape of conventional steel plate laminates is good, but NF-PP filler is bad; The cavity plate filler of pressing pad laminates is good, but that cavity has is recessed; Pressing pad is in conjunction with accessory plate lamination mode, and accessory plate need identically with cavity be windowed, to reduce the stressed of lamination process cavity, meet the making of areola plate but cannot improve the recessed problem of large cavity plate, and due to laser milling NF-PP, can produce carbonization residue at edge, cause micro-short problem.
Cavity plate make require good cavity shape, good filler performance, good reliability energy, electric property strengthen, applicable to thin plate.After cavity completes by laser drill by cavity and extraneous conducting, be usually used in the electronic equipments such as microphone.
Summary of the invention
One of object of the present invention is to propose a kind of pressing structure of cavity PCB plate, and it can solve recessed problem.
Two of object of the present invention is to propose a kind of compression method of cavity PCB plate, and it can solve recessed and carbonization residue problem.
One of in order to achieve the above object, the technical solution adopted in the present invention is as follows:
A pressing structure for cavity PCB plate, it comprises the first copper foil layer, the first centrifugal rete, the first aluminium flake layer, the first central layer, a NF PP, the second central layer, the 2nd NF PP, the 3rd central layer, the second aluminium flake, the second centrifugal film and second copper foil layer of pressing from top to bottom; In the pressing structure of described cavity PCB plate, be also formed with a cavity that runs through a NF PP, the second central layer and the 2nd NF PP.
Preferably, described the first central layer comprises the one one insulating barrier and the one one copper foil layer that is positioned at described the one one insulating barrier upper surface and lower surface; Described the 3rd central layer comprises the 31 insulating barrier and is positioned at the 31 copper foil layer of described the 31 insulating barrier upper surface and lower surface.
Further preferred, the 31 copper foil layer that is positioned at the one one copper foil layer of the one one insulating barrier lower surface and is positioned at the 31 insulating barrier upper surface is all formed with line pattern.
Preferably, described the second central layer comprises the 21 insulating barrier and the 21 copper foil layer that is positioned at described the 21 insulating barrier upper surface and lower surface.
In order to achieve the above object two, the technical solution adopted in the present invention is as follows:
A compression method for cavity PCB plate, it comprises the following steps:
Step 1, by die-cut mode or the gong plate mode of windowing of windowing, the one NF PP, the second central layer and the 2nd NF PP are windowed respectively;
Step 2, the NF PP after windowing, the second central layer and the 2nd NF PP are built up to cavity plate from top to bottom successively, wherein, the equal conducting in the position of windowing of a NF PP, the second central layer and the 2nd NF PP is to form a cavity that runs through a NF PP, the second central layer and the 2nd NF PP;
Step 3, the first copper foil layer, the first centrifugal rete, the first aluminium flake layer, the first central layer, cavity plate, the 3rd central layer, the second aluminium flake, the second centrifugal film and the second copper foil layer is superimposed and carry out lamination treatment successively from top to bottom, to obtain the pressing structure of cavity PCB plate.
Preferably, described the first central layer comprises the one one insulating barrier and the one one copper foil layer that is positioned at described the one one insulating barrier upper surface and lower surface; Described the 3rd central layer comprises the 31 insulating barrier and is positioned at the 31 copper foil layer of described the 31 insulating barrier upper surface and lower surface.
Further preferred, the 31 copper foil layer that is positioned at the one one copper foil layer of the one one insulating barrier lower surface and is positioned at the 31 insulating barrier upper surface is all formed with line pattern.
Preferably, described the second central layer comprises the 21 insulating barrier and the 21 copper foil layer that is positioned at described the 21 insulating barrier upper surface and lower surface.
The present invention has following beneficial effect:
For the pressing structure of cavity PCB plate, use the composite bed of Copper Foil+centrifugal film+aluminium flake, both ensured material stiffness, can replace steel plate to solve concave defect under large cavity, there is again the comfort cushioning performance of the material such as pressing pad or pressing pad+accessory plate, in the time that cavity layer connects up, can make NF PP be combined well with circuit, avoid the defects such as filler deficiency.
For the manufacture method of cavity circuit plate, NF PP (the no flowprepreg of empty cavity position, illiquidity prepreg) and the central layer mode of windowing use the die-cut or gong plate mode of punch press, replace laser ablation to window, the carbonization residue of avoiding laser ablation to produce causes micro-shortage to fall into; The composite bed that uses Copper Foil+centrifugal film+aluminium flake, both can replace steel plate, solved concave defect under large cavity, can replace again the padded coamings such as pressing pad, while wiring on cavity top layer, only need pressing once, can solve the reliability defect causing because of the not enough defect of circuit filler.
Brief description of the drawings
Fig. 1 is the structural representation of the pressing structure of the cavity PCB plate of preferred embodiment of the present invention.
Embodiment
Below, by reference to the accompanying drawings and embodiment, the present invention is described further.
As shown in Figure 1, a pressing structure for cavity PCB plate, it comprises the first copper foil layer 13, the first centrifugal rete 14, the first aluminium flake layer 1, the first central layer, a NF PP 4, the second central layer, the 2nd NF PP 8, the 3rd central layer, the second aluminium flake 11, the second centrifugal film 15 and second copper foil layer 16 of pressing from top to bottom.In the pressing structure of described cavity PCB plate, be also formed with a cavity 12 that runs through a NF PP 4, the second central layer and the 2nd NF PP 8.
Described the first central layer comprises the one one insulating barrier 3 and is positioned at the one one copper foil layer 2 of described the one one insulating barrier 3 upper surfaces and lower surface.Described the 3rd central layer comprises the 31 insulating barrier 9 and is positioned at the 31 copper foil layer 10 of described the 31 insulating barrier 9 upper surfaces and lower surface.Described the second central layer comprises the 21 insulating barrier 6 and is positioned at the 21 copper foil layer 5,7 of described the 21 insulating barrier 6 upper surfaces and lower surface.
Shown in Fig. 1, the compression method of the cavity PCB plate of the present embodiment is as follows:
Step 1, by die-cut mode or the gong plate mode of windowing of windowing, the one NF PP 4, the second central layer and the 2nd NF PP 8 are windowed respectively;
Step 2, a NF PP 4, the second central layer and the 2nd NF PP 8 after windowing are built up to cavity plate from top to bottom successively, wherein, the equal conducting in the position of windowing of a NF PP 4, the second central layer and the 2nd NF PP 8 is to form a cavity 12 that runs through a NF PP 4, the second central layer and the 2nd NF PP 8;
Step 3, the first copper foil layer 13, the first centrifugal rete 14, the first aluminium flake layer 1, the first central layer, cavity plate, the 3rd central layer, the second aluminium flake 11, the second centrifugal film 15 and the second copper foil layer 16 is superimposed and carry out lamination treatment successively from top to bottom, to obtain the pressing structure of cavity PCB plate of the present embodiment.
Then the pressing structure of the cavity PCB plate of step 3 gained is normally produced to the postorder operation of pcb board, can be obtained the final circuit board using.
In addition,, in the present embodiment, the 31 copper foil layer that is positioned at the one one copper foil layer of the one one insulating barrier lower surface and is positioned at the 31 insulating barrier upper surface all can also be formed with line pattern, thereby makes cavity surface have circuit.
Cavity is made maximum difficult point and is to meet the stereochemical structure of cavity, needs again internal layer circuit to have good filler effect simultaneously, ensures the reliability requirement of cavity wiring board.
In the time of pressing cavity plate, laminates uses the cavity plate filler of pressing pad good, but that cavity has is recessed; Use pressing pad in conjunction with accessory plate lamination mode, accessory plate need identically with cavity be windowed, and to reduce the stressed of lamination process cavity, meets the making of areola plate but cannot improve the recessed problem of large cavity plate, and having increased the cost that uses accessory plate; And adopt steel plate lamination, and in the time that cavity layer connects up, NF PP is cannot filler good, is prone to line layer starved problem, and needing cavity top layer circuit first to carry out one step press could solve.
And empty cavity position adopts the die-cut or gong plate mode of punch press to window, solve the ablation micro-short problem of cavity of windowing; And use the composite bed of Copper Foil+centrifugal film+aluminium flake, no matter whether cavity needs wiring, only need a lamination, cavity plate and NF-PP filler are good, and cavity three-dimensional shape is good, and sidewall is neat, solve the recessed problem of large cavity, met the making requirement of large cavity plate.
For a person skilled in the art, can be according to technical scheme described above and design, make other various corresponding changes and distortion, and these all changes and distortion all should belong to the protection range of the claims in the present invention within.
Claims (8)
1. the pressing structure of cavity PCB plate, it is characterized in that, comprise the first copper foil layer, the first centrifugal rete, the first aluminium flake layer, the first central layer, a NF PP, the second central layer, the 2nd NF PP, the 3rd central layer, the second aluminium flake, the second centrifugal film and second copper foil layer of pressing from top to bottom; In the pressing structure of described cavity PCB plate, be also formed with a cavity that runs through a NFPP, the second central layer and the 2nd NF PP.
2. the pressing structure of cavity PCB plate as claimed in claim 1, is characterized in that, described the first central layer comprises the one one insulating barrier and is positioned at the one one copper foil layer of described the one one insulating barrier upper surface and lower surface; Described the 3rd central layer comprises the 31 insulating barrier and is positioned at the 31 copper foil layer of described the 31 insulating barrier upper surface and lower surface.
3. the pressing structure of cavity PCB plate as claimed in claim 2, is characterized in that, the 31 copper foil layer that is positioned at the one one copper foil layer of the one one insulating barrier lower surface and is positioned at the 31 insulating barrier upper surface is all formed with line pattern.
4. the pressing structure of cavity PCB plate as claimed in claim 1, is characterized in that, described the second central layer comprises the 21 insulating barrier and is positioned at the 21 copper foil layer of described the 21 insulating barrier upper surface and lower surface.
5. the compression method of cavity PCB plate, is characterized in that, comprises the following steps:
Step 1, by die-cut mode or the gong plate mode of windowing of windowing, the one NF PP, the second central layer and the 2nd NF PP are windowed respectively;
Step 2, the NF PP after windowing, the second central layer and the 2nd NF PP are built up to cavity plate from top to bottom successively, wherein, the equal conducting in the position of windowing of a NF PP, the second central layer and the 2nd NF PP is to form a cavity that runs through a NF PP, the second central layer and the 2nd NF PP;
Step 3, the first copper foil layer, the first centrifugal rete, the first aluminium flake layer, the first central layer, cavity plate, the 3rd central layer, the second aluminium flake, the second centrifugal film and the second copper foil layer is superimposed and carry out lamination treatment successively from top to bottom, to obtain the pressing structure of cavity PCB plate.
6. compression method as claimed in claim 4, is characterized in that, described the first central layer comprises the one one insulating barrier and is positioned at the one one copper foil layer of described the one one insulating barrier upper surface and lower surface; Described the 3rd central layer comprises the 31 insulating barrier and is positioned at the 31 copper foil layer of described the 31 insulating barrier upper surface and lower surface.
7. the pressing structure of cavity PCB plate as claimed in claim 6, is characterized in that, the 31 copper foil layer that is positioned at the one one copper foil layer of the one one insulating barrier lower surface and is positioned at the 31 insulating barrier upper surface is all formed with line pattern.
8. compression method as claimed in claim 4, is characterized in that, described the second central layer comprises the 21 insulating barrier and is positioned at the 21 copper foil layer of described the 21 insulating barrier upper surface and lower surface.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410437213.0A CN104159397B (en) | 2014-08-29 | 2014-08-29 | The pressing structure of cavity PCB plate and the compression method of cavity PCB plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410437213.0A CN104159397B (en) | 2014-08-29 | 2014-08-29 | The pressing structure of cavity PCB plate and the compression method of cavity PCB plate |
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| CN104159397A true CN104159397A (en) | 2014-11-19 |
| CN104159397B CN104159397B (en) | 2018-02-06 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996506A (en) * | 2019-12-31 | 2020-04-10 | 昆山沪利微电有限公司 | Embedded type magnetic material PCB and manufacturing process thereof |
| CN111757614A (en) * | 2020-07-03 | 2020-10-09 | 广东兴达鸿业电子有限公司 | Cushion pad for laminating multilayer board and laminating method of multilayer board |
| CN115003011A (en) * | 2022-06-10 | 2022-09-02 | 苏州浪潮智能科技有限公司 | PCB wiring structure, PCB and manufacturing method thereof |
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| CN101784164A (en) * | 2010-02-08 | 2010-07-21 | 沪士电子股份有限公司 | Making method of groove type printed circuit board |
| CN102595789A (en) * | 2011-01-08 | 2012-07-18 | 上海美维电子有限公司 | Production method of cavity PCB plate |
| US20130199829A1 (en) * | 2010-04-22 | 2013-08-08 | Schweizer Electronic Ag | Printed circuit board with cavity |
| CN204180376U (en) * | 2014-08-29 | 2015-02-25 | 广州美维电子有限公司 | The pressing structure of cavity PCB plate |
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2014
- 2014-08-29 CN CN201410437213.0A patent/CN104159397B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101784164A (en) * | 2010-02-08 | 2010-07-21 | 沪士电子股份有限公司 | Making method of groove type printed circuit board |
| US20130199829A1 (en) * | 2010-04-22 | 2013-08-08 | Schweizer Electronic Ag | Printed circuit board with cavity |
| CN102595789A (en) * | 2011-01-08 | 2012-07-18 | 上海美维电子有限公司 | Production method of cavity PCB plate |
| CN204180376U (en) * | 2014-08-29 | 2015-02-25 | 广州美维电子有限公司 | The pressing structure of cavity PCB plate |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996506A (en) * | 2019-12-31 | 2020-04-10 | 昆山沪利微电有限公司 | Embedded type magnetic material PCB and manufacturing process thereof |
| CN111757614A (en) * | 2020-07-03 | 2020-10-09 | 广东兴达鸿业电子有限公司 | Cushion pad for laminating multilayer board and laminating method of multilayer board |
| CN115003011A (en) * | 2022-06-10 | 2022-09-02 | 苏州浪潮智能科技有限公司 | PCB wiring structure, PCB and manufacturing method thereof |
| CN115003011B (en) * | 2022-06-10 | 2023-08-11 | 苏州浪潮智能科技有限公司 | PCB wiring structure, PCB and manufacturing method thereof |
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| CN104159397B (en) | 2018-02-06 |
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