CN104135814A - 印刷电路板 - Google Patents

印刷电路板 Download PDF

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Publication number
CN104135814A
CN104135814A CN201310157708.3A CN201310157708A CN104135814A CN 104135814 A CN104135814 A CN 104135814A CN 201310157708 A CN201310157708 A CN 201310157708A CN 104135814 A CN104135814 A CN 104135814A
Authority
CN
China
Prior art keywords
circuit board
printed circuit
installation region
via hole
heat radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310157708.3A
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English (en)
Inventor
赖超荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN201310157708.3A priority Critical patent/CN104135814A/zh
Priority to US14/265,475 priority patent/US20140326486A1/en
Publication of CN104135814A publication Critical patent/CN104135814A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0591—Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种印刷电路板，包括一基板。所述基板上设置一安装区域，用于安装一QFN封装芯片。所述安装区域周围设置若干用于连接所述QFN封装芯片引脚的引脚焊盘，所述安装区域上设置若干散热过孔，每一散热过孔的周围设置阻焊剂。所述安装区域的其余部分设置铜箔。上述印刷电路板可防止散热过孔在电路板回流焊时会发生漏锡现象。

Description

印刷电路板
技术领域
本发明涉及一种印刷电路板。
背景技术
QFN（Quad Flat No-lead）封装的电子零件由于其体积小、重量轻、加上杰出的电性能和热性能，被广泛应用于手机，数码相机、平板及其他便携小型电子设备的高密度印刷电路板上。
QFN封装的芯片底部中央位置有一大面积散热焊盘用来导热，通常将散热焊盘直接焊接在印刷电路板上，并且通过印刷电路板上的散热过孔将热量扩散到内层的散热层（通常为地层）中，从而吸收多余的热量。但这些散热过孔在电路板回流焊时会发生漏锡现象，影响美观，甚至造成短路。
发明内容
鉴于以上内容，有必要提供一种印刷电路板，以防止印刷电路板在过回流焊时散热过孔发生漏锡现象。
一种印刷电路板，包括一基板，所述基板上设置一安装区域，用于安装一QFN封装芯片，所述安装区域周围设置若干用于连接所述QFN封装芯片引脚的引脚焊盘，所述安装区域上设置若干散热过孔，每一散热过孔的周围设置阻焊剂，所述安装区域的其余部分设置铜箔。
相对于现有技术，本发明所提供的印刷电路板通过在其过孔周围印刷阻焊剂以在回流焊时隔离锡料，进而防止过孔漏锡。
附图说明
图1是本发明印刷电路板的较佳实施方式的结构图。
主要元件符号说明
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
下面结合附图及较佳实施方式对本发明作进一步详细描述：
请参考图1，本发明印刷电路板1包括一基板100。所述基板100上设置一安装区域20用于安装一QFN封装芯片。所述安装区域20的周围设置若干引脚焊盘12，所述安装区域20上还设有若干散热过孔22，每一散热过孔22周围设置一圆环形绿油2。所述圆环形绿油2与所对应的散热过孔22形成半径相差为L的同心圆。所述绿油2为阻焊剂。所述安装区域20的其余部分设置铜箔。所述绿油2的形状不限定为本实施方式中的圆环形，可以根据需要在所述散热过孔22的周围设置任何形状的绿油，且每一散热过孔22周围的绿油的面积可以根据需要进行设置。
所述引脚焊盘12用于与所述芯片的引脚（图未示）一一连接，实现电性导通。
所述安装区域20用于与所述芯片底部连接，所述安装区域20上设有的若干散热过孔22，用于将该芯片产生的热量扩散到所述印刷电路板1的接地层。本实施方式中，所述散热过孔22的数量为8个，所述安装区域20的四个角分别设有一散热过孔22，每相邻两个散热过孔22之间设有一散热过孔22，以保证所述芯片能有效散热。
当所述印刷电路板过回流焊时，焊锡通过芯片与所述安装区域20之间的缝隙进入所述安装区域20，由于安装区域20的散热过孔22的周围设置有绿油2，所述绿油2呈圆环状，隔绝了圆环外的焊锡和位于圆环中心的散热过孔22，阻止了焊锡流入散热过孔22，从而避免造成漏锡而引起印刷电路板1短路。
本发明印刷电路板1通过在散热过孔22周围设置绿油2以在印刷电路板1通过回流焊时隔离焊锡，以防止散热过孔22漏锡而引起印刷电路板1短路。所述绿油2起到阻焊作用，其他实施方式中，可用其他阻焊剂替代绿油2。

Claims (3)

1.一种印刷电路板，包括一基板，所述基板上设置一安装区域，用于安装一QFN封装芯片，所述安装区域周围设置若干用于连接所述QFN封装芯片引脚的引脚焊盘，所述安装区域上设置若干散热过孔，每一散热过孔的周围设置阻焊剂，所述安装区域的其余部分设置铜箔。
2.如权利要求1所述的印刷电路板，其特征在于：每一散热过孔周围的阻焊剂为圆环形，且与所述散热过孔为同心圆。
3.如权利要求2所述的印刷电路板，其特征在于：所述阻焊剂为绿油。
CN201310157708.3A 2013-05-02 2013-05-02 印刷电路板 Pending CN104135814A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201310157708.3A CN104135814A (zh) 2013-05-02 2013-05-02 印刷电路板
US14/265,475 US20140326486A1 (en) 2013-05-02 2014-04-30 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310157708.3A CN104135814A (zh) 2013-05-02 2013-05-02 印刷电路板

Publications (1)

Publication Number Publication Date
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US (1) US20140326486A1 (zh)
CN (1) CN104135814A (zh)

Cited By (7)

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CN105228375A (zh) * 2015-08-21 2016-01-06 深圳崇达多层线路板有限公司 一种软硬结合线路板树脂塞孔的制作方法
WO2017008545A1 (zh) * 2015-07-14 2017-01-19 中兴通讯股份有限公司 功率放大结构
CN108099407A (zh) * 2016-11-25 2018-06-01 东芝泰格有限公司 液体喷射装置
CN109104810A (zh) * 2017-06-20 2018-12-28 罗伯特·博世有限公司 车辆的控制器的电路板、制造车辆的电路板的方法以及制造车辆的控制器的方法
CN111148341A (zh) * 2020-01-11 2020-05-12 苏州浪潮智能科技有限公司 一种在器件e-pad区域增加背钻的pcb板及其制作方法
CN111263506A (zh) * 2018-11-30 2020-06-09 浙江宇视科技有限公司 一种电路板及电子设备
CN113056089A (zh) * 2021-03-11 2021-06-29 Oppo广东移动通信有限公司 Pcb板及元器件

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CN105228375A (zh) * 2015-08-21 2016-01-06 深圳崇达多层线路板有限公司 一种软硬结合线路板树脂塞孔的制作方法
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CN108099407A (zh) * 2016-11-25 2018-06-01 东芝泰格有限公司 液体喷射装置
CN108099407B (zh) * 2016-11-25 2019-11-19 东芝泰格有限公司 液体喷射装置
CN109104810A (zh) * 2017-06-20 2018-12-28 罗伯特·博世有限公司 车辆的控制器的电路板、制造车辆的电路板的方法以及制造车辆的控制器的方法
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CN111263506A (zh) * 2018-11-30 2020-06-09 浙江宇视科技有限公司 一种电路板及电子设备
CN111263506B (zh) * 2018-11-30 2021-06-01 浙江宇视科技有限公司 一种电路板及电子设备
CN111148341A (zh) * 2020-01-11 2020-05-12 苏州浪潮智能科技有限公司 一种在器件e-pad区域增加背钻的pcb板及其制作方法
CN113056089A (zh) * 2021-03-11 2021-06-29 Oppo广东移动通信有限公司 Pcb板及元器件

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Application publication date: 20141105