CN104122990A - 动作传感器及其封装方法 - Google Patents

动作传感器及其封装方法 Download PDF

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CN104122990A
CN104122990A CN201310727571.0A CN201310727571A CN104122990A CN 104122990 A CN104122990 A CN 104122990A CN 201310727571 A CN201310727571 A CN 201310727571A CN 104122990 A CN104122990 A CN 104122990A
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light
substrate
light source
lens
sensing apparatus
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谢明勋
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Lite On Semiconductor Corp
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Dunnan Science And Tech Co Ltd
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Priority to US14/264,038 priority Critical patent/US9377354B2/en
Priority to EP14166305.4A priority patent/EP2799964A3/en
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Abstract

本发明公开了一种动作传感器及其封装方法，所述动作传感器包含有一基板，该基板包含复数层导线架及复数层陶瓷材料；一光源，设置于该基板上，用来发射一光线；一感测装置，设置于该基板上，用来接收该光线，以进行动作感测；一盖板，用来固定并保护该光源及该感测装置；以及一结合胶，用来将该盖板贴合于该基板上，该结合胶包含有阻挡该光线的成分；其中，该光线为红外光、可见光或紫外光。

Description

动作传感器及其封装方法
技术领域
本发明涉及一种动作传感器及其封装方法，尤其涉及一种具有陶瓷封装架构的动作传感器及其封装方法。 
背景技术
随着科技的进步，计算机***在日常生活中所扮演的角色，已从过去单纯的字处理、程序运算，到今天复杂的影音视讯、电玩娱乐，因而成为现代信息社会中最重要的工具的一。而担负起接口控制的输入设备的技术，也推陈出新的不断进化。 
许多计算机***皆配备有多元化的功能，因此，必须使用各种感测装置来进行周边环境的侦测，以进行相对应的应用。其中，动作传感器可将用户的动作转换成讯号，提供给具有运算能力的电子装置运用，以控制如显示设备上图形光标或指针的移动、搭配图形用户接口在显示设备上选取对象及执行控制的功能等，使得用户可以藉此装置与计算机***进行直接的互动。在此情形下，如何提高动作传感器的稳定性及导热性也就成为业界所努力的目标的一。 
发明内容
因此，本发明的主要目的即在于提供一种具有陶瓷封装架构的动作传感器及其封装方法，以提高动作传感器的稳定性及导热性。 
本发明揭露一种动作传感器，包含有一基板，该基板包含复数层导线架及复数层陶瓷材料；一光源，设置于该基板上，用来发射一光线；一感测装置，设置于该基板上，用来接收该光线，以进行动作感测；一盖板，用来固定并保护该光源及该感测装置；以及一结合胶，用来将该盖板贴合于该基板上，该结合胶包含有阻挡该光线的成分；其中，该光线为红外光、可见光或紫外光。 
本发明另揭露一种用于一动作传感器的封装方法，包含有迭合复数层导线架及复数层陶瓷材料，以产生一基板；将一光源设置于该基板上，该光源用来发射一光线；将一感测装置设置于该基板上，该感测装置用来接收该光线，以进行动作感测；铺设一结合胶，该结合胶包含有阻挡该光线的成分；以及铺设一盖板，藉 由该结合胶贴合于该基板上，用来保护该光源及该感测装置；其中，该光线为红外光、可见光或紫外光。 
附图说明
图1为本发明实施例一动作传感器的剖面示意图。 
图2A至2C分别为动作传感器的侧视图、上视图及下视图。 
图3为本发明实施例另一动作传感器的侧视图。 
图4A和4B分别为本发明实施例一动作传感器的侧视图及下视图。 
图5为本发明实施例复数个动作传感器的示意图。 
图6为本发明实施例一封装流程的示意图。 
【主要组件符号说明】 
10         动作传感器 
102        基板 
104        光源 
106        感测装置 
202        盖板 
204        结合胶 
206        接点 
30         动作传感器 
302        基板 
304        光源 
306        感测装置 
308        盖板 
310、312   透镜 
314        结合胶 
316        透光胶 
40         动作传感器 
50         动作传感器 
60         封装流程 
600～612   步骤 
具体实施方式
下面结合优选的实施方式对本发明作进一步说明。 
陶瓷材质已普遍应用于半导体制程中，例如陶瓷基板或陶瓷封装，其具有高机械强度、高绝缘性、耐热性高、化学稳定性高、电路图形附着力强等优点，使得陶瓷封装的高耐热性及导热性已普遍应用于发光二极管（Light Emitting Diode，LED）等制程。在此情形下，本发明将陶瓷封装的技术应用于动作传感器，以提高稳定性及导热性。 
请参考图1，图1为本发明实施例一动作传感器10的剖面示意图。动作传感器10包含一基板102、一光源104及一感测装置106。基板102由复数层导线架及复数层陶瓷材料所构成。光源104设置于基板102上，可用来发射光线。感测装置106亦设置于基板102上，可用来接收光线，以进行动作感测。感测装置106在图1中系绘示为芯片，其透过焊线（Bonding Wire）101连接至基板102上的接点（Pad）103，以进行讯号传送。详细来说，感测装置106主要用来控制整个动作传感器10的运作，其可能以芯片形式或其它形式设置于动作传感器10中，而不限于此。在一实施例中，光源104另透过一驱动装置来驱动其运作，同样地，驱动装置也可能为芯片形式，并透过焊线连接至基板102上的接点进行讯号传送。基板102上所有焊线与接点的材质皆可为金、铜或铝等导电材料。 
详细来说，进行动作感测的运作时，光源104会发送光线，光线经由外界物体反射，再由感测装置106接收。根据外界物体的位置和形状的不同，会取得不同的反射结果，藉以侦测物体的位移及动作。请参考图2A至图2C，图2A至图2C分别为动作传感器10的侧视图、上视图及下视图。如图2A所示，图2A以侧视角度绘示动作传感器10的基板102、光源104及感测装置106。由侧视图可看出，基板102系由复数层导线架及复数层陶瓷材料以逐层交错的方式迭合。在一实施例中，基板102具有N层导线架及N层陶瓷材料，其制作方式可先铺设第一层导线架作为基底，其上再铺设第一层陶瓷材料，接着铺上第二层导线架，再铺上第二层陶瓷材料，并以此类推，最后铺上第N层导线架，再铺上第N层陶瓷材料，接着透过热压结合的方式，将每一层材料迭合。 
请继续参考图2A搭配图2B所示。动作传感器10使用一盖板202覆盖于基板102上，盖板202具有固定并保护光源104及感测装置106的功能，其材质可 为陶瓷或陶瓷化合物。盖板202包含有二开孔，分别位于光源104及感测装置106上方，开孔处分别设置一透镜，其中，一透镜提供光源104发射光线的路径，并保护光源104，而另一透镜提供感测装置106接收反射光的路径，并保护感测装置106。 
值得注意的是，盖板202系透过一结合胶204贴合并固定于基板102上，而结合胶204须包含有阻挡光源104所发射的光线与其同波段光的成分。详细来说，感测装置106进行物体感测的运作是透过光线的侦测来完成，因此对于周围任何光线的变化皆十分敏感。在此情况下，结合胶204必须阻挡光源104的光线外泄，以避免干扰感测装置106的感测结果。在此实施例中，光源104所发射的光线可为任何波段的光线，如红外光、可见光或紫外光等，而不限于此。此外，位于开孔处的透镜可为塑料材质或其它可通过光源104所发射的光线的材质，透镜必须藉由可通过光线的透光胶贴合于光源104及感测装置106上，例如硅树脂（Silicone）、环氧化物（Epoxy）或紫外线硬化胶（UV Curable Adhesive）等。 
请参考图2C，图2C绘示动作传感器10的下视图。在动作传感器10下方布满了对外的接点206，接点206可连接至外部装置（如印刷电路板（Printed Circuit Board，PCB））以进行讯号传送。 
在一实施例中，透镜可内嵌于盖板中，藉由双料射出成型（Twinshot Injection Molding）的方式制成完整的盖板，以覆盖于动作传感器上。请参考图3，图3为本发明实施例另一动作传感器30的侧视图。如图3所示，动作传感器30包含一基板302、一光源304、一感测装置306、一盖板308及透镜310、312。如图3所示，基板302、光源304及感测装置306的材质及组成分别与基板102、光源104及感测装置106类似，于此不再赘述。盖板308与透镜310、312以双料射出成型的方式铺设于基板302上。盖板308的材质可为陶瓷或其化合物，藉由可阻挡光源304所发射的光线与其同波段光的结合胶314贴合于基板302上。透镜310及312的部分则藉由可通过光源304所发射的光线的透光胶316贴合于光源304及感测装置306上。 
值得注意的是，本发明提供一种具有陶瓷封装架构的动作传感器及其封装方法。本领域技术人员当可据以修饰或变化，而不限于此。举例来说，动作传感器的封装方式可使用球栅数组（Ball Grid Array，BGA）的封装技术，或者，可结 合芯片尺寸封装（Chip Scale Package，CSP）技术，以降低封装面积。另一方面，上述实施例中的透镜皆使用塑料透镜贴合于光源或感测装置上。在一实施例中，可在感测装置上使用晶圆级透镜（Wafer Level Lens），利用晶圆级制造技术来降低成本并提高生产效率。 
请参考图4A及图4B，图4A及图4B分别为本发明实施例一动作传感器40的侧视图及下视图。如图4A所示，动作传感器40的架构及组件配置方式与动作传感器10类似。动作传感器40与动作传感器10的主要差异在于，动作传感器40中使用晶圆级透镜402作为感测装置接收光线的媒介。此外，如图4A及图4B所示，动作传感器40使用芯片尺寸封装技术，并结合球栅数组封装，以实现更小的封装面积，图中404为球栅陈列，图中406采用芯片尺寸封装。 
在上述实施例中，皆以单颗动作传感器来描述其架构及封装方式。一般来说，厂商在制作动作传感器的封装体时，是一层一层地铺设整片封装材料，同时生产多个封装体，再逐一切割为个别的封装体。请参考图5，图5为本发明实施例复数个动作传感器的示意图。在动作传感器进行封装时，先铺设复数层导线架及复数层陶瓷材料以构成基板，再一一放入光源及感测装置，接着注入一层结合胶或固定胶，以进行固定及保护，再盖上盖板及透镜。在图5中，每一方格皆为一个封装体，经由切割而形成个别的动作传感器50。 
关于上述动作传感器的封装方式可归纳为一封装流程60，如图6所示。封装流程60包含以下步骤： 
步骤600：开始。 
步骤602：迭合复数层导线架及复数层陶瓷材料，以产生一基板。 
步骤604：将一光源设置于基板上，光源可用来发射一光线。 
步骤606：将一感测装置设置于基板上，感测装置可用来接收该光线，以进行动作感测。 
步骤608：铺设一结合胶，结合胶包含有阻挡该光线的成分。 
步骤610：铺设一盖板，藉由结合胶贴合于基板上，用来保护光源及感测装置。 
步骤612：结束。 
封装流程60的详细运作方式及变化可参考前述，于此不赘述。 
综上所述，对于需要高稳定性及导热性的动作传感器而言，本发明提供一种具有陶瓷封装架构的动作传感器及其封装方法。在部分实施例中，另可透过双料射出成型的方式来铺设透镜及盖板，同时结合芯片尺寸封装、球栅数组封装等架构，进而达成降低封装面积及提高生产效率等优点。 
以上所述仅为本发明的较佳实施例，凡依本发明申请专利范围所做的均等变化与修饰，皆应属本发明的涵盖范围。 

Claims (20)

1.一种动作传感器，包含有：
一基板，包含复数层导线架及复数层陶瓷材料；
一光源，设置于所述基板上，用来发射一光线；
一感测装置，设置于所述基板上，用来接收该光线，以进行动作感测；
一盖板，用来固定并保护所述光源及所述感测装置；以及
一结合胶，用来将所述盖板贴合于该基板上，所述结合胶包含有阻挡该光线的成分；
其中，所述光线为红外光、可见光或紫外光。
2.如权利要求1所述的动作传感器，其中所述复数层导线架及所述复数层陶瓷材料以逐层交错的方式迭合。
3.如权利要求1所述的动作传感器，其中该盖板为一陶瓷化合物，覆盖于该基板上，该光源及该感测装置上方分别形成一开孔，使光线通过。
4.如权利要求1所述的动作传感器，其中所述盖板是透过双料射出成型的方式覆盖于所述基板上。
5.如权利要求1所述的动作传感器，其中所述盖板包含有：
一陶瓷化合物，覆盖于该基板上；
一第一透镜，覆盖于所述光源上，用来保护所述光源，并使光线通过；以及
一第二透镜，覆盖于所述感测装置上，用来保护所述感测装置，并使光线通过。
6.如权利要求5所述的动作传感器，其中所述第一透镜为一塑料透镜。
7.如权利要求5所述的动作传感器，其中所述第二透镜为一塑料透镜或一晶圆级透镜。
8.如权利要求5所述的动作传感器，其中所述第一透镜及所述第二透镜分别透过一硅树脂、一环氧化物或一紫外线硬化胶贴合于该光源上。
9.如权利要求1所述的动作传感器，另包含一驱动装置，用来驱动所述光源的运作。
10.如权利要求1所述的动作传感器，其中所述感测装置实现于一芯片上，所述芯片并藉由一芯片尺寸封装的方式设置于所述基板上。
11.一种用于一动作传感器的封装方法，包含有：
迭合复数层导线架及复数层陶瓷材料，以产生一基板；
将一光源设置于所述基板上，所述光源用来发射一光线；
将一感测装置设置于所述基板上，所述感测装置用来接收该光线，以进行动作感测；
铺设一结合胶，所述结合胶包含有阻挡该光线的成分；以及
铺设一盖板，藉由所述结合胶贴合于该基板上，用来保护所述光源及所述感测装置；
其中，所述光线为红外光、可见光或紫外光。
12.如权利要求11所述的封装方法，其中迭合所述复数层导线架及所述复数层陶瓷材料，以产生该基板的步骤是以逐层交错的方式进行迭合。
13.如权利要求11所述的封装方法，其中铺设该盖板，藉由所述结合胶贴合于该基板上，用来保护所述光源及所述感测装置的步骤包含有：
覆盖一陶瓷化合物于所述基板上作为所述盖板，并在所述光源及所述感测装置上方分别形成一开孔，使光线通过。
14.如权利要求11所述的封装方法，其中所述盖板是透过双料射出成型的方式覆盖于所述基板上。
15.如权利要求11所述的封装方法，其中铺设所述盖板，藉由所述结合胶贴合于所述基板上，用来保护所述光源及所述感测装置的步骤包含有：
铺设一陶瓷化合物以覆盖于所述基板上；
铺设一第一透镜以覆盖于所述光源上，用来保护该光源，并使光线通过；以及
铺设一第二透镜以覆盖于所述感测装置上，用来保护所述感测装置，并使光线通过。
16.如权利要求15所述的封装方法，其中所述第一透镜为一塑料透镜。
17.如权利要求15所述的封装方法，其中所述第二透镜为一塑料透镜或一晶圆级透镜（Wafer Level Lens）。
18.如权利要求15所述的封装方法，其中所述第一透镜及所述第二透镜分别透过一硅树脂、一环氧化物或一紫外线硬化胶贴合于该光源上。
19.如权利要求11所述的封装方法，另包含驱动所述光源的运作。
20.如权利要求11所述的封装方法，其中所述感测装置实现于一芯片上，所述芯片并藉由一芯片尺寸封装的方式设置于所述基板上。
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