CN104112673A - 芯片封装基板及其制作方法 - Google Patents
芯片封装基板及其制作方法 Download PDFInfo
- Publication number
- CN104112673A CN104112673A CN201310137349.5A CN201310137349A CN104112673A CN 104112673 A CN104112673 A CN 104112673A CN 201310137349 A CN201310137349 A CN 201310137349A CN 104112673 A CN104112673 A CN 104112673A
- Authority
- CN
- China
- Prior art keywords
- layer
- conducting wire
- wire layer
- glass
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 239000011521 glass Substances 0.000 claims abstract description 98
- 239000000758 substrate Substances 0.000 claims description 78
- 238000000034 method Methods 0.000 claims description 32
- 238000003466 welding Methods 0.000 claims description 32
- 229920002120 photoresistant polymer Polymers 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 238000009713 electroplating Methods 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 6
- 238000000059 patterning Methods 0.000 claims description 4
- 239000006071 cream Substances 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 5
- 238000009413 insulation Methods 0.000 abstract 3
- 229910000679 solder Inorganic materials 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 239000000945 filler Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
Abstract
Description
电路板芯板 | 10 |
绝缘基底 | 101 |
第一玻璃基底 | 20 |
第二玻璃基底 | 22 |
第一导电线路层 | 102 |
第二导电线路层 | 103 |
第一表面 | 104 |
第二表面 | 105 |
芯板单元 | 106 |
第一电性连接垫 | 107 |
第二电性连接垫 | 108 |
第一胶层 | 30 |
第二胶层 | 32 |
第一盲孔 | 24 |
第二盲孔 | 26 |
第三导电线路层 | 44 |
第四导电线路层 | 46 |
第一导盲孔 | 242 |
第二导盲孔 | 262 |
第三电性连接垫 | 442 |
第四电性连接垫 | 462 |
第一介电层 | 50 |
第五导电线路层 | 52 |
第二介电层 | 60 |
第六导电线路层 | 62 |
第三导盲孔 | 522 |
第四导盲孔 | 622 |
第五电性连接垫 | 524 |
第六电性连接垫 | 624 |
第一防焊层 | 70 |
第二防焊层 | 72 |
表面处理层 | 74 |
芯片封装基板 | 100 |
芯片 | 80 |
芯片封装结构 | 200 |
芯片本体 | 82 |
焊料凸块 | 84 |
焊球 | 526,528 |
底部填充剂 | 530 |
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310137349.5A CN104112673B (zh) | 2013-04-19 | 2013-04-19 | 芯片封装基板及其制作方法 |
TW102114782A TWI503941B (zh) | 2013-04-19 | 2013-04-25 | 晶片封裝基板及其製作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310137349.5A CN104112673B (zh) | 2013-04-19 | 2013-04-19 | 芯片封装基板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104112673A true CN104112673A (zh) | 2014-10-22 |
CN104112673B CN104112673B (zh) | 2017-06-23 |
Family
ID=51709416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310137349.5A Active CN104112673B (zh) | 2013-04-19 | 2013-04-19 | 芯片封装基板及其制作方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN104112673B (zh) |
TW (1) | TWI503941B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106505045A (zh) * | 2015-09-08 | 2017-03-15 | 艾马克科技公司 | 具有可路由囊封的传导衬底的半导体封装及方法 |
CN107305849A (zh) * | 2016-04-22 | 2017-10-31 | 碁鼎科技秦皇岛有限公司 | 封装结构及其制作方法 |
US12062588B2 (en) | 2015-09-08 | 2024-08-13 | Amkor Technology Singapore Holding Pte. Ltd. | Semiconductor package having routable encapsulated conductive substrate and method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002176258A (ja) * | 2000-12-08 | 2002-06-21 | Toshiba Chem Corp | プリント配線板の製造方法 |
TW200501343A (en) * | 2003-06-16 | 2005-01-01 | Advanced Semiconductor Eng | Semiconductor chip package, substrate thereof and method for making the substrate |
CN101286490A (zh) * | 2007-04-11 | 2008-10-15 | 全懋精密科技股份有限公司 | 基板表面处理结构及其制作方法 |
CN101542719A (zh) * | 2007-03-30 | 2009-09-23 | 住友电木株式会社 | 倒装芯片半导体封装件用接合体、积层材料、密封树脂组合物和电路基板 |
US20110097850A1 (en) * | 2009-10-22 | 2011-04-28 | Unimicron Technology Corporation | Method of fabricating a packaging structure |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2265101B1 (en) * | 1999-09-02 | 2012-08-29 | Ibiden Co., Ltd. | Printed circuit board and method of manufacturing printed circuit board |
TWI229435B (en) * | 2002-06-18 | 2005-03-11 | Sanyo Electric Co | Manufacture of semiconductor device |
JP4342174B2 (ja) * | 2002-12-27 | 2009-10-14 | 新光電気工業株式会社 | 電子デバイス及びその製造方法 |
JP5095113B2 (ja) * | 2005-03-25 | 2012-12-12 | 富士フイルム株式会社 | 固体撮像装置の製造方法、及び固体撮像装置 |
-
2013
- 2013-04-19 CN CN201310137349.5A patent/CN104112673B/zh active Active
- 2013-04-25 TW TW102114782A patent/TWI503941B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002176258A (ja) * | 2000-12-08 | 2002-06-21 | Toshiba Chem Corp | プリント配線板の製造方法 |
TW200501343A (en) * | 2003-06-16 | 2005-01-01 | Advanced Semiconductor Eng | Semiconductor chip package, substrate thereof and method for making the substrate |
CN101542719A (zh) * | 2007-03-30 | 2009-09-23 | 住友电木株式会社 | 倒装芯片半导体封装件用接合体、积层材料、密封树脂组合物和电路基板 |
CN101286490A (zh) * | 2007-04-11 | 2008-10-15 | 全懋精密科技股份有限公司 | 基板表面处理结构及其制作方法 |
US20110097850A1 (en) * | 2009-10-22 | 2011-04-28 | Unimicron Technology Corporation | Method of fabricating a packaging structure |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106505045A (zh) * | 2015-09-08 | 2017-03-15 | 艾马克科技公司 | 具有可路由囊封的传导衬底的半导体封装及方法 |
CN106505045B (zh) * | 2015-09-08 | 2021-10-29 | 艾马克科技公司 | 具有可路由囊封的传导衬底的半导体封装及方法 |
US11508635B2 (en) | 2015-09-08 | 2022-11-22 | Amkor Technology Singapore Holding Pte. Ltd. | Semiconductor package having routable encapsulated conductive substrate and method |
US12062588B2 (en) | 2015-09-08 | 2024-08-13 | Amkor Technology Singapore Holding Pte. Ltd. | Semiconductor package having routable encapsulated conductive substrate and method |
CN107305849A (zh) * | 2016-04-22 | 2017-10-31 | 碁鼎科技秦皇岛有限公司 | 封装结构及其制作方法 |
CN107305849B (zh) * | 2016-04-22 | 2020-05-19 | 碁鼎科技秦皇岛有限公司 | 封装结构及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201442181A (zh) | 2014-11-01 |
CN104112673B (zh) | 2017-06-23 |
TWI503941B (zh) | 2015-10-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20161128 Address after: 066004 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Applicant after: Acer Qinhuangdao Ding Technology Co. Ltd. Applicant after: Zhending Technology Co., Ltd. Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210716 Address after: 518105 area B, Room 403, block B, Rongchao Binhai building, No. 2021, haixiu Road, n26 District, Haiwang community, Xin'an street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Liding semiconductor technology (Shenzhen) Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Address before: No.18, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province 066004 Patentee before: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |